DSPIC33FJ09GS302-E/MX - 16-bit 40 MIPS SMPS DSC | Microchip
N.º da peça: DSPIC33FJ09GS302-E/MX ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.18 | $41,80 |
| 100 | $3.74 | $374,00 |
| 500 | $3.35 | $1.675,00 |
| 1.000 | $2.98 | $2.980,00 |
DSPIC33FJ09GS302-E/MX Visão geral
A Digital Signal Controller combines the compute architecture of a microcontroller with DSP features such as hardware multiply-accumulate and dual operand fetch. DSCs sit within the broader power management hierarchy: microcontroller -> digital signal controller -> embedded processor, and the dsPIC33FJ GS family is purpose-built for digital power conversion, integrating high-speed PWM modules, analog comparators, and ADCs specifically architected for switch-mode power supply (SMPS) control loops.
Key features include 40 MIPS of 16-bit RISC DSP performance, 9KB of self-programmable FLASH, and the SMPS peripheral set: high-resolution PWM with dedicated time bases suitable for multi-loop and interleaved topologies, fast analog-to-digital conversion, and on-chip comparators that close control loops without external analog circuitry. The exposed-pad UQFN package improves thermal dissipation and ground integrity for power electronics layouts.
The GS-family architecture pairs the dsPIC33F 16-bit core with DSP instructions, enabling execution of PID and predictive control algorithms at cycle-accurate sampling rates. Peripherals are tightly coupled to the core through the DMA and interrupt fabric, so ADC sampling-to-PWM-update latency stays deterministic - a critical requirement in current-mode control where loop delay erodes phase margin.
Typical applications include AC-to-DC converters, DC-to-DC converters, Power Factor Correction (PFC) stages, and uninterruptible power supplies (UPS). Microchip's interleaved PFC reference design, rated up to 350W from a universal input, demonstrates the family in production-grade digital power hardware.
Design consideration: budget the 3.3V core supply sequencing and always decouple the exposed pad as the primary ground return; the MCLR/VPP pin also doubles as the high-voltage programming input, so never omit the external programming header.
This page synthesizes verified distributor listings, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33FJ09GS302-E/MX — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33FJ09GS302-E/MX (mesmo formato e footprint) — diferindo em Core Architecture, Package, Packaging, Mounting Type, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33FJ09GS302-I/MX
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33FJ06GS202AT-I/TL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1.85 / unidade
Ver ficha técnica →DSPIC33FJ06GS102AT-E/TL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.18 / unidade
Ver ficha técnica →DSPIC33FJ06GS202A-I/SP
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33FJ09GS302-E/MX Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33F RISC DSC |
| Maximum CPU Speed | 40 MIPS |
| Program Memory (FLASH) | 9 KB (3K x 24) |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 28-UQFN (6x6 mm) with Exposed Pad |
| Temperature Grade | E: -40C to +125C |
| Qualification | AEC-Q100 (Automotive) |
| Packaging | Tube |
| Tipo de montagem | Surface Mount |
| Application Target | Digital SMPS and power conversion |
Guia de Configuração de Pinos do DSPIC33FJ09GS302-E/MX 28-uqfn (6x6 mm) with exposed pad
Configuração de pinos para DSPIC33FJ09GS302-E/MX (pacote 28-uqfn (6x6 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33FJ09GS302-E/MX.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33FJ09GS302-E/MX é adequado para 6 aplicaçãos: AC-to-DC Converters, DC-to-DC Converters, Power Factor Correction (PFC), Uninterruptible Power Supplies (UPS), Automotive Power Modules, Embedded Digital Power Development.
AC-to-DC Converters
The DSPIC33FJ09GS302-E/MX is purpose-built for digitally controlled AC-to-DC conversion, where its GS-family high-speed PWM and fast ADC close voltage and current loops with deterministic latency. In a typical offline converter, the ADC samples the output voltage each switching cycle while the DSC executes PID compensation at 40 MIPS, updating the PWM duty cycle cycle-by-cycle. The 3.3V core and -40C to +125C E-grade rating suit enclosed industrial power supplies with wide ambient swings, and AEC-Q100 qualification extends use into automotive onboard chargers. Compared with analog control, digital control enables adaptive compensation and soft-start profiles programmed in the 9KB FLASH.
Recomendado
DC-to-DC Converters
For DC-to-DC conversion, the DSPIC33FJ09GS302-E/MX leverages its SMPS-oriented PWM with independent duty-cycle and dead-time control, making it effective for synchronous buck, boost, and push-pull topologies in intermediate bus and point-of-load applications. The 40 MIPS core runs current-mode control loops fast enough for switching frequencies in the hundreds of kilohertz, while on-chip comparators provide hardware cycle-by-cycle overcurrent protection independent of software latency. The 28-UQFN exposed-pad package grounds through the PCB for low-noise analog sampling. Digital implementation in the 9KB FLASH also supports soft-start, phase shedding, and telemetry over a serial interface.
Recomendado
Power Factor Correction (PFC)
The DSPIC33FJ09GS302-E/MX is directly supported by Microchip's interleaved PFC reference design, which uses this GS-family controller to produce a single high-voltage DC output up to 350W from a universal AC input. Interleaved PFC requires precisely phased PWM outputs - the GS302's high-speed PWM provides phase-shifted channels with cycle-accurate dead time, while the fast ADC samples input current for average-current-mode shaping so line current tracks voltage for low THD. Running at 40 MIPS, the core executes the multiplier and compensator each switching cycle. The E-grade -40C to +125C range withstands the elevated ambient near power stages in telecom rectifiers and automotive chargers.
Recomendado
Uninterruptible Power Supplies (UPS)
In UPS systems the DSPIC33FJ09GS302-E/MX controls the bidirectional battery charger, inverter bridge, and transfer logic from a single 3.3V controller. The GS-family's multi-channel high-speed PWM drives half-bridge and full-bridge inverter legs with programmable dead time, while the ADC and comparators implement fast overcurrent trips in hardware - essential because UPS faults propagate faster than software can react. Its 9KB FLASH stores state machines for line/battery/transfer modes plus diagnostics logging. The AEC-Q100 qualification and -40C to +125C E-grade let the same controller serve both enterprise UPS and automotive onboard power-reserve modules without redesign.
Recomendado
Automotive Power Modules
With AEC-Q100 qualification and the -40C to +125C E temperature grade, the DSPIC33FJ09GS302-E/MX is suited to automotive digital power modules such as DC-DC converters for infotainment, LED headlamp drivers, and 48V-to-12V belt-starter supplies. The 28-UQFN 6x6 mm exposed-pad package provides both the thermal path and compact footprint demanded by dense automotive ECUs. The high-speed PWM and comparators perform the safety-relevant current limiting in hardware, supporting ISO functional-safety arguments through deterministic protection behavior. Firmware in the 9KB FLASH can implement cold-crank profile compensation and diagnostic reporting over the controller's serial interfaces to the vehicle network.
Recomendado
Embedded Digital Power Development
The DSPIC33FJ09GS302-E/MX serves as an ideal learning and prototyping platform for embedded digital power engineers, because Microchip supports the GS-family with the Digital Power Explorer-style development hardware, MPLAB X IDE, and the XC16 compiler at no tooling cost beyond a low-cost programmer. The 28-UQFN device mates with standard SMPS adapter boards, letting students and NPI teams iterate PID compensation, dead-time tuning, and ADC trigger placement on real converters. With 40 MIPS headroom and SMPS-specialized peripherals, code ported from this controller scales directly to the larger GS202/GS302 family members, preserving firmware investment from bench to production designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33FJ09GS302-E/MX — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33FJ09GS302-I/MX | DSPIC33FJ06GS202AT-I/TL | DSPIC33FJ06GS102AT-E/TL |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) - same footprint | 28-UQFN (6x6 mm) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| FLASH Program Memory | 9 KB (3K x 24) | 9 KB (3K x 24) | 6 KB | 6 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
| Application Focus | Digital SMPS / PFC / UPS | Digital SMPS / PFC / UPS | Digital SMPS / PFC | Digital SMPS / PFC |
Principais diferenciais
- Extended automotive temperature range (vs DSPIC33FJ09GS302-I/MX)
- Largest FLASH in the 28-pin GS drop-in group (vs DSPIC33FJ06GS202AT-I/TL)
- Trade-off: lower memory ceiling than newer families (vs DSPIC33EV64GM104-E/P8)
Notas de projeto
The 28-UQFN exposed pad is the primary ground return and thermal path - connect it to a solid ground plane through an array of at least 4x4 vias. Isolate AVDD/AVSS analog rails with an RC filter (for example 10 ohm + 1 uF) from the digital 3.3V rail so ADC reference noise stays low. During layout, route the MCLR/VPP, PGD, and PGC programming traces to a 5-pin header; omitting it forces desoldering the QFN for reprogramming. Estimated: keep the exposed-pad solder coverage above 80% for rated thermal performance.
Sequencing and decoupling matter for the GS302: place a 0.1 uF ceramic capacitor at every VDD pin plus one bulk 4.7-10 uF capacitor near the package. Do not apply MCLR voltage above the absolute maximum rating during ICSP without the recommended resistor network on the programming line. Estimated: with a 3.3V rail and typical SMPS-active core current in the tens-of-mA class, regulator headroom of 50% above measured peak current is a safe sizing rule; measure peak with the PWM channels fully loaded.
Do not substitute cross-brand MCUs onto this footprint - the PWM and ADC pin mapping is Microchip-specific, and a cross-brand swap forces PCB respin and loop re-verification. When substituting with the smaller-memory DSPIC33FJ06GS202A/GS102A in the same package, first compile your firmware for the target and confirm FLASH utilization fits; SMPS code with diagnostics routinely exceeds 6KB. The E-grade part is rated -40C to +125C ambient, but estimate junction temperature: TJ = TA + PD x theta_JA with the package-specific theta_JA from the data sheet before finalizing automotive derating.
Informações de conformidade
AEC-Q100 automotive qualification and E temperature grade (-40C to +125C) confirmed via DigiKey/Datasheets.com/Hotenda listings. RoHS/REACH/lead-free certificates must be obtained from the distributor at order time; XAIPART marks them unknown pending certificate verification.
