DSPIC33FJ09GS302-E/MX - 16-bit 40 MIPS SMPS DSC | Microchip
MPN: DSPIC33FJ09GS302-E/MX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.18 | $41.80 |
| 100 | $3.74 | $374.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $2.98 | $2,980.00 |
DSPIC33FJ09GS302-E/MX Overview
A Digital Signal Controller combines the compute architecture of a microcontroller with DSP features such as hardware multiply-accumulate and dual operand fetch. DSCs sit within the broader power management hierarchy: microcontroller -> digital signal controller -> embedded processor, and the dsPIC33FJ GS family is purpose-built for digital power conversion, integrating high-speed PWM modules, analog comparators, and ADCs specifically architected for switch-mode power supply (SMPS) control loops.
Key features include 40 MIPS of 16-bit RISC DSP performance, 9KB of self-programmable FLASH, and the SMPS peripheral set: high-resolution PWM with dedicated time bases suitable for multi-loop and interleaved topologies, fast analog-to-digital conversion, and on-chip comparators that close control loops without external analog circuitry. The exposed-pad UQFN package improves thermal dissipation and ground integrity for power electronics layouts.
The GS-family architecture pairs the dsPIC33F 16-bit core with DSP instructions, enabling execution of PID and predictive control algorithms at cycle-accurate sampling rates. Peripherals are tightly coupled to the core through the DMA and interrupt fabric, so ADC sampling-to-PWM-update latency stays deterministic - a critical requirement in current-mode control where loop delay erodes phase margin.
Typical applications include AC-to-DC converters, DC-to-DC converters, Power Factor Correction (PFC) stages, and uninterruptible power supplies (UPS). Microchip's interleaved PFC reference design, rated up to 350W from a universal input, demonstrates the family in production-grade digital power hardware.
Design consideration: budget the 3.3V core supply sequencing and always decouple the exposed pad as the primary ground return; the MCLR/VPP pin also doubles as the high-voltage programming input, so never omit the external programming header.
This page synthesizes verified distributor listings, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33FJ09GS302-E/MX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ09GS302-E/MX (same form factor and footprint) — differing in Core Architecture, Package, Packaging, Maximum CPU Speed, Operating Temperature.
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Request AlternativesDSPIC33FJ09GS302-E/MX Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F RISC DSC |
| Maximum CPU Speed | 40 MIPS |
| Program Memory (FLASH) | 9 KB (3K x 24) |
| Supply Voltage | 3.3 V |
| Package | 28-UQFN (6x6 mm) with Exposed Pad |
| Temperature Grade | E: -40C to +125C |
| Qualification | AEC-Q100 (Automotive) |
| Packaging | Tube |
| Mounting Type | Surface Mount |
| Application Target | Digital SMPS and power conversion |
DSPIC33FJ09GS302-E/MX 28-uqfn (6x6 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ09GS302-E/MX (28-uqfn (6x6 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ09GS302-E/MX.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ09GS302-E/MX is suitable for 6 applications: AC-to-DC Converters, DC-to-DC Converters, Power Factor Correction (PFC), Uninterruptible Power Supplies (UPS), Automotive Power Modules, Embedded Digital Power Development.
AC-to-DC Converters
The DSPIC33FJ09GS302-E/MX is purpose-built for digitally controlled AC-to-DC conversion, where its GS-family high-speed PWM and fast ADC close voltage and current loops with deterministic latency. In a typical offline converter, the ADC samples the output voltage each switching cycle while the DSC executes PID compensation at 40 MIPS, updating the PWM duty cycle cycle-by-cycle. The 3.3V core and -40C to +125C E-grade rating suit enclosed industrial power supplies with wide ambient swings, and AEC-Q100 qualification extends use into automotive onboard chargers. Compared with analog control, digital control enables adaptive compensation and soft-start profiles programmed in the 9KB FLASH.
Recommended
DC-to-DC Converters
For DC-to-DC conversion, the DSPIC33FJ09GS302-E/MX leverages its SMPS-oriented PWM with independent duty-cycle and dead-time control, making it effective for synchronous buck, boost, and push-pull topologies in intermediate bus and point-of-load applications. The 40 MIPS core runs current-mode control loops fast enough for switching frequencies in the hundreds of kilohertz, while on-chip comparators provide hardware cycle-by-cycle overcurrent protection independent of software latency. The 28-UQFN exposed-pad package grounds through the PCB for low-noise analog sampling. Digital implementation in the 9KB FLASH also supports soft-start, phase shedding, and telemetry over a serial interface.
Recommended
Power Factor Correction (PFC)
The DSPIC33FJ09GS302-E/MX is directly supported by Microchip's interleaved PFC reference design, which uses this GS-family controller to produce a single high-voltage DC output up to 350W from a universal AC input. Interleaved PFC requires precisely phased PWM outputs - the GS302's high-speed PWM provides phase-shifted channels with cycle-accurate dead time, while the fast ADC samples input current for average-current-mode shaping so line current tracks voltage for low THD. Running at 40 MIPS, the core executes the multiplier and compensator each switching cycle. The E-grade -40C to +125C range withstands the elevated ambient near power stages in telecom rectifiers and automotive chargers.
Recommended
Uninterruptible Power Supplies (UPS)
In UPS systems the DSPIC33FJ09GS302-E/MX controls the bidirectional battery charger, inverter bridge, and transfer logic from a single 3.3V controller. The GS-family's multi-channel high-speed PWM drives half-bridge and full-bridge inverter legs with programmable dead time, while the ADC and comparators implement fast overcurrent trips in hardware - essential because UPS faults propagate faster than software can react. Its 9KB FLASH stores state machines for line/battery/transfer modes plus diagnostics logging. The AEC-Q100 qualification and -40C to +125C E-grade let the same controller serve both enterprise UPS and automotive onboard power-reserve modules without redesign.
Recommended
Automotive Power Modules
With AEC-Q100 qualification and the -40C to +125C E temperature grade, the DSPIC33FJ09GS302-E/MX is suited to automotive digital power modules such as DC-DC converters for infotainment, LED headlamp drivers, and 48V-to-12V belt-starter supplies. The 28-UQFN 6x6 mm exposed-pad package provides both the thermal path and compact footprint demanded by dense automotive ECUs. The high-speed PWM and comparators perform the safety-relevant current limiting in hardware, supporting ISO functional-safety arguments through deterministic protection behavior. Firmware in the 9KB FLASH can implement cold-crank profile compensation and diagnostic reporting over the controller's serial interfaces to the vehicle network.
Recommended
Embedded Digital Power Development
The DSPIC33FJ09GS302-E/MX serves as an ideal learning and prototyping platform for embedded digital power engineers, because Microchip supports the GS-family with the Digital Power Explorer-style development hardware, MPLAB X IDE, and the XC16 compiler at no tooling cost beyond a low-cost programmer. The 28-UQFN device mates with standard SMPS adapter boards, letting students and NPI teams iterate PID compensation, dead-time tuning, and ADC trigger placement on real converters. With 40 MIPS headroom and SMPS-specialized peripherals, code ported from this controller scales directly to the larger GS202/GS302 family members, preserving firmware investment from bench to production designs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ09GS302-E/MX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ09GS302-I/MX | DSPIC33FJ06GS202AT-I/TL | DSPIC33FJ06GS102AT-E/TL |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) EP | 28-UQFN (6x6 mm) EP - same | 28-UQFN (6x6 mm) - same footprint | 28-UQFN (6x6 mm) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| FLASH Program Memory | 9 KB (3K x 24) | 9 KB (3K x 24) | 6 KB | 6 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) |
| Application Focus | Digital SMPS / PFC / UPS | Digital SMPS / PFC / UPS | Digital SMPS / PFC | Digital SMPS / PFC |
Key Differentiators
- Extended automotive temperature range (vs DSPIC33FJ09GS302-I/MX)
- Largest FLASH in the 28-pin GS drop-in group (vs DSPIC33FJ06GS202AT-I/TL)
- Trade-off: lower memory ceiling than newer families (vs DSPIC33EV64GM104-E/P8)
Design Notes
The 28-UQFN exposed pad is the primary ground return and thermal path - connect it to a solid ground plane through an array of at least 4x4 vias. Isolate AVDD/AVSS analog rails with an RC filter (for example 10 ohm + 1 uF) from the digital 3.3V rail so ADC reference noise stays low. During layout, route the MCLR/VPP, PGD, and PGC programming traces to a 5-pin header; omitting it forces desoldering the QFN for reprogramming. Estimated: keep the exposed-pad solder coverage above 80% for rated thermal performance.
Sequencing and decoupling matter for the GS302: place a 0.1 uF ceramic capacitor at every VDD pin plus one bulk 4.7-10 uF capacitor near the package. Do not apply MCLR voltage above the absolute maximum rating during ICSP without the recommended resistor network on the programming line. Estimated: with a 3.3V rail and typical SMPS-active core current in the tens-of-mA class, regulator headroom of 50% above measured peak current is a safe sizing rule; measure peak with the PWM channels fully loaded.
Do not substitute cross-brand MCUs onto this footprint - the PWM and ADC pin mapping is Microchip-specific, and a cross-brand swap forces PCB respin and loop re-verification. When substituting with the smaller-memory DSPIC33FJ06GS202A/GS102A in the same package, first compile your firmware for the target and confirm FLASH utilization fits; SMPS code with diagnostics routinely exceeds 6KB. The E-grade part is rated -40C to +125C ambient, but estimate junction temperature: TJ = TA + PD x theta_JA with the package-specific theta_JA from the data sheet before finalizing automotive derating.
Compliance Information
AEC-Q100 automotive qualification and E temperature grade (-40C to +125C) confirmed via DigiKey/Datasheets.com/Hotenda listings. RoHS/REACH/lead-free certificates must be obtained from the distributor at order time; XAIPART marks them unknown pending certificate verification.
