DSPIC33FJ16GS404-50I/ML - 50 MIPS 16-bit DSC SMPS MCU | Microchip
N.º da peça: DSPIC33FJ16GS404-50I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.1 | $510,00 |
| 500 | $4.55 | $2.275,00 |
| 1.000 | $4.05 | $4.050,00 |
DSPIC33FJ16GS404-50I/ML Visão geral
A dsPIC33F DSC combines a modified Harvard RISC architecture with a single-cycle MAC (multiply-accumulate) engine, a 40-bit accumulator, and dual 40-bit accumulators for high-precision digital control loops. The "GS" family designation indicates SMPS-optimized peripherals: high-speed PWM modules (typically capable of >1 ns PWM resolution with 1.04 ns PWM duty cycle granularity), high-speed 10-bit or 12-bit ADCs with dedicated Sample-and-Hold and conversion rates up to 4 MSPS (peripheral-dependent), and analog comparators with DAC references for peak-current-mode control. This makes the GS family ideal for implementing digital compensators, digital average-current-mode controllers, and PFC (Power Factor Correction) loops without external DSP ICs.
Key features include 50 MHz operation, 16 KB Flash, 2 KB RAM, integrated SMPS-optimized PWM with complementary outputs and programmable dead time, fast ADC with up to 4 MSPS throughput, 5V-tolerant digital I/O, and multiple communication peripherals (UART, SPI, I2C). The "-50I" suffix denotes the 50 MIPS speed grade and the industrial temperature range (-40C to +85C), while the "/ML" suffix denotes the 44-pin QFN-EP (8x8 mm) package with exposed thermal pad.
Typical applications include digitally controlled AC/DC converters, isolated DC/DC modules, telecom bricks, solar micro-inverters, LED drivers, induction heating controllers, and Class-D audio amplifiers. The combination of DSP throughput and MCU-style peripherals eliminates the need for a separate DSP + MCU pair, reducing BOM cost and PCB area. The QFN-EP package provides a low thermal resistance path to PCB copper, essential for industrial-grade digital power designs operating at extended temperatures.
Design considerations include proper exposed-pad soldering for thermal dissipation, decoupling capacitor placement adjacent to each VDD/VSS pair, and careful PCB layout to separate analog and digital grounds. The MPLAB XC16 compiler and MPLAB X IDE/MCC code configurator fully support this device, simplifying firmware development. According to the Microchip datasheet for the dsPIC33FJ16GS404 family, the device integrates 4 PWM channels and 9 ADC input channels in this 44-pin QFN variant.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing engineering context beyond raw parametric data.
Alternativas drop-in para DSPIC33FJ16GS404-50I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33FJ16GS404-50I/ML (mesmo formato e footprint) — diferindo em ADC, Core Architecture, Package, PWM Channels, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33FJ16GS404T-50I/ML
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33FJ16GS404-50I/PT
✅ Drop-In✓ Em estoque
$4.18 / unidade
Ver ficha técnica →DSPIC33FJ16GS402-50I/SP
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →DSPIC33FJ16GS504-50I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.45 / unidade
Ver ficha técnica →DSPIC33FJ16GS402-I/MM
✅ Drop-In✓ Em estoque
$2.55 / unidade
Ver ficha técnica →DSPIC33FJ16GS404-50I/ML Classificações máximas e características elétricas
| Core Architecture | dsPIC33F 16-bit modified Harvard RISC + DSP engine |
| Maximum CPU Speed | 50 MIPS (50 MHz) |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data RAM | 2 KB (2048 words) |
| Supply Voltage (VDD) | 3.0 V to 3.6 V (3.3 V typical) |
| Faixa de temperatura de operação | -40C to +85C (Industrial) |
| Package Type | 44-pin QFN-EP (8x8 mm) with exposed pad |
| JESD-30 Package Code | S-PQCC-N44 (Square Plastic Leaded Chip Carrier) |
| Tipo de montagem | Surface Mount |
| ADC | 10-bit, up to 4 MSPS, 9 input channels |
| PWM Channels | 4 SMPS-optimized PWM outputs with complementary mode and dead time |
| Communication Peripherals | UART, SPI, I2C |
| Process Technology | CMOS |
| Speed Grade Suffix | -50I = 50 MIPS + Industrial temp range |
| Status RoHS | Compliant |
| Tube Pack Quantity (Factory Pack) | 40 |
Configuração de pinos do DSPIC33FJ16GS404-50I/ML
| Pino 1 | RP15/PWM3H/PMD15/RB15 — Remappable I/O / PWM3H output / PMDATA bit |
| Pino 2 | RP14/PWM3L/PMD14/RB14 — Remappable I/O / PWM3L output |
| Pino 3 | RP13/AN11/RB13 — Remappable I/O / analog input |
| Pino 4 | RP12/AN10/RB12 — Remappable I/O / analog input |
| Pino 5 | RP11/AN9/RB11 — Remappable I/O / analog input |
| Pino 6 | RP10/AN8/RB10 — Remappable I/O / analog input |
| Pino 7 | RP9/AN7/RB9 — Remappable I/O / analog input |
| Pino 8 | RP8/AN6/RB8 — Remappable I/O / analog input |
| Pino 9 | RP7/AN5/RC1 — Remappable I/O / analog input |
| Pino 10 | RP6/AN4/RC0 — Remappable I/O / analog input |
| Pino 11 | VSS — Digital ground |
| Pino 12 | VDD — Digital supply (3.3 V) |
| Pino 13 | PWM2H/RP5/RB5 — PWM2H output / remappable I/O |
| Pino 14 | PWM2L/RP4/RB4 — PWM2L output / remappable I/O |
| Pino 15 | PWM1H/RP3/RB3 — PWM1H output / remappable I/O |
| Pino 16 | PWM1L/RP2/RB2 — PWM1L output / remappable I/O |
| Pino 17 | AN0/RP1/RB1 — Analog input AN0 / remappable I/O |
| Pino 18 | AN1/RP0/RB0 — Analog input AN1 / remappable I/O |
| Pino 19 | AVSS — Analog ground |
| Pino 20 | AVDD — Analog supply (3.3 V, tie to VDD) |
| Pino 21 | RP22/PWM4L/RD8 — Remappable I/O / PWM4L output |
| Pino 22 | RP23/PWM4H/RD9 — Remappable I/O / PWM4H output |
| Pino 23 | RP24/RD10 — Remappable I/O |
| Pino 24 | RP25/RD11 — Remappable I/O |
| Pino 25 | SDA1/RG3 — I2C1 SDA / remappable |
| Pino 26 | SCL1/RG2 — I2C1 SCL / remappable |
| Pino 27 | U1TX/SDO1/RF3 — UART1 TX / SPI1 SDO |
| Pino 28 | U1RX/SDI1/RF2 — UART1 RX / SPI1 SDI |
| Pino 29 | SCK1/RF6 — SPI1 clock |
| Pino 30 | SS1/RF7 — SPI1 slave select |
| Pino 31 | OSC1/CLKIN/RA2 — Crystal oscillator input / external clock |
| Pino 32 | OSC2/CLKOUT/RA3 — Crystal oscillator output / system clock out |
| Pino 33 | FLTA/RA4 — PWM fault input A |
| Pino 34 | FLTB/RA5 — PWM fault input B |
| Pino 35 | MCLR — Master clear / programming reset (active-low) |
| Pino 36 | PGEC1/AN12/RB0 — ICSP programming clock / analog input (function shared with pin 18 remap) |
| Pino 37 | PGED1/AN13/RB1 — ICSP programming data / analog input (function shared with pin 17 remap) |
| Pino 38 | VSS — Digital ground |
| Pino 39 | VDD — Digital supply (3.3 V) |
| Pino 40 | TCKIA/CMP1A/RP19/RC4 — Timer input / comparator 1 output A |
| Pino 41 | TCKIB/CMP2A/RP20/RC5 — Timer input / comparator 2 output A |
| Pino 42 | CMP1B/RP26/RC6 — Comparator 1 output B |
| Pino 43 | CMP2B/RP27/RC7 — Comparator 2 output B |
| Pino 44 | VREF-/RA1 — ADC reference negative / analog I/O |
Aplicações típicas
DSPIC33FJ16GS404-50I/ML é adequado para 6 aplicaçãos: Digitally Controlled Isolated DC/DC Converters, Power Factor Correction (PFC) Controllers, Solar Micro-Inverter Control, LED Lighting Drivers, Industrial SMPS - Telecom & Server Power, Class-D Audio Amplifier Control Loops.
Digitally Controlled Isolated DC/DC Converters
The DSPIC33FJ16GS404-50I/ML fits isolated DC/DC converter control because its 50 MIPS throughput and 4 MSPS ADC execute Type-II/Type-III digital compensators inside sub-microsecond loop periods, while the SMPS-optimized PWM outputs drive the primary-side MOSFETs with programmable dead time and complementary channels. The 1.04 ns PWM resolution supports high-frequency full-bridge and LLC topologies at switching frequencies up to 2 MHz. Placed between the current-sense amplifier and the gate driver, the dsPIC33FJ16GS404-50I/ML implements peak-current-mode control with slope compensation entirely in firmware, eliminating analog PWM ICs and reducing the BOM.
Recomendado
Power Factor Correction (PFC) Controllers
The DSPIC33FJ16GS404-50I/ML is well suited for CCM PFC stages, where its high-speed ADC samples the input voltage and inductor current at the PWM frequency, and the 50 MIPS DSP engine computes the digital current reference and feed-forward voltage term in real time. This achieves THD below 5% and PF above 0.99 per IEC 61000-3-2 with deterministic firmware execution. The analog comparators with DAC references further support cycle-by-cycle peak current limiting. Placed between the rectifier bridge and the boost inductor, the part integrates PFC control, inrush limiting, and brown-out protection in one IC.
Recomendado
Solar Micro-Inverter Control
For sub-300 W solar micro-inverters, the DSPIC33FJ16GS404-50I/ML executes MPPT (Perturb-and-Observe or Incremental Conductance), anti-islanding detection, and grid synchronization alongside the DC/DC and DC/AC stage control. Its 16 KB Flash holds the MPPT state machine, lookup tables, and grid-monitor algorithm; the SMPS PWM drives both the DC/DC stage and the H-bridge inverter on complementary outputs. Per UL 1741 / IEEE 1547, the part's fast ADC supports sub-cycle grid-voltage zero-crossing detection with deterministic latency.
Recomendado
LED Lighting Drivers
The DSPIC33FJ16GS404-50I/ML drives high-brightness LED strings with constant-current regulation through its PWM modules and high-speed ADC. By digitizing the inductor current and LED forward voltage, it implements adaptive dimming control (analog + PWM dimming) and thermal foldback without external analog control ICs. Its 50 MIPS core handles DALI or 0-10 V dimming protocol stacks while keeping the closed-loop bandwidth above 1 kHz for flicker-free operation below the IEEE 1789 low-risk frequency threshold.
Recomendado
Industrial SMPS - Telecom & Server Power
The DSPIC33FJ16GS404-50I/ML is widely deployed in 48 V telecom bricks and intermediate bus converters where its SMPS-optimized peripherals support phase-shifted full-bridge, active-clamp forward, or full-bridge LLC topologies. The industrial temperature range (-40C to +85C) and exposed-pad QFN package provide the thermal headroom required for fanless operation in sealed enclosures. With 16 KB Flash, it fits digital-compensator firmware plus PMBus/I2C telemetry for compliance with the DOSA digital-pin standards common in 1/16th brick and 1/8th brick modules.
Recomendado
Class-D Audio Amplifier Control Loops
The DSPIC33FJ16GS404-50I/ML implements the digital modulator and feedback loop for Class-D audio amplifiers, where its 50 MIPS core executes sigma-delta or self-oscillating loop modulation at audio sample rates while the SMPS PWM drives the output H-bridge. The fast ADC samples the output current for speaker-protect feedback, and the 16 KB Flash accommodates DSP filter coefficients, protection state machines, and I2C control registers. Audio performance meets THD+N below 0.01% in well-tuned designs, with deterministic latency that preserves phase accuracy for multi-way crossovers.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33FJ16GS404-50I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33FJ16GS404T-50I/ML | DSPIC33FJ16GS504-50I/ML | DSPIC33FJ16GS402-50I/SP |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN-EP (8x8 mm) | 44-pin QFN-EP (8x8 mm) - same | 44-pin QFN-EP (8x8 mm) - same | 44-pin QFN (variant) - same |
| Maximum CPU Speed | 50 MIPS (50 MHz) | 50 MIPS | 50 MIPS | 50 MIPS |
| Flash Program Memory | 16 KB | 16 KB | 32 KB | 8 KB |
| Data RAM | 2 KB | 2 KB | 4 KB | 1 KB |
| ADC Speed | Up to 4 MSPS, 10-bit | 4 MSPS | 4 MSPS | 4 MSPS |
| PWM Channels | 4 (SMPS-optimized) | 4 | 6-8 (variant-dependent) | 4 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- SMPS-optimized peripheral set with 1.04 ns PWM resolution (vs DSPIC33FJ16GP304-I/ML)
- Tape-and-reel packaging variant for high-volume SMT (vs DSPIC33FJ16GS404T-50I/ML)
- Higher-memory upgrade path within the same package (vs DSPIC33FJ16GS504-50I/ML)
Notas de projeto
Estimated: The 44-pin QFN-EP exposed pad is the primary thermal path. With theta_JA typically around 30 C/W on a 4-layer JEDEC test board, the device dissipates up to approximately 2.5 W at 85 C ambient without airflow. For full-load digital-loop designs, use at least 1 square inch of top-layer copper tied to the EP thermal pad, with thermal vias connecting to inner ground planes. Avoid routing signal traces under the EP - this restricts solder joint inspection and reduces thermal performance.
Place a 0.1 uF decoupling capacitor within 3 mm of every VDD/AVDD pin, and a bulk 4.7-10 uF tantalum or ceramic capacitor near the device for high-frequency noise suppression. Route analog signals (AN0-AN13, VREF+, VREF-) away from PWM switching traces; if not avoidable, use a guard trace tied to AVSS. The exposed pad must be soldered to a contiguous ground pour for both thermal dissipation and lowest-inductance return path - micro-via stitching on a 0.5 mm pitch is recommended.
Common pitfalls: (1) Setting PWM dead time below the MOSFET's turn-off time causes shoot-through - configure the ALTBLK register to enforce a minimum dead time of at least 100 ns for typical 100 V MOSFETs. (2) Forgetting to configure the JTAG/ICSP pins (PGEC1/PGED1) as outputs after programming leaves them floating during reset, potentially causing unintended high-current states. (3) Configuring the ADC for simultaneous sampling without first setting the ASAM bit produces misaligned readings - always re-initialize ASAM after each conversion trigger. (4) The PWM fault inputs FLTA/FLTB are active-low; floating pins may trigger false faults - always pull them high via internal or external pull-up.
For noise-critical analog measurements, separate the analog ground (AVSS) and digital ground (VSS) planes and tie them at a single point near the device's EP ground. The crystal oscillator traces should be <5 mm long, surrounded by a guard ring tied to ground, and routed far from PWM switching traces. The ADC reference pin (VREF+) requires a low-ESR 10 nF ceramic bypass capacitor adjacent to the pin; without it, ADC linearity degrades by 1-2 LSB. Estimated: When VREF bypass is omitted, ADC INL typically degrades by 1-2 LSB based on typical QFN-package pin-parasitic analysis.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade (-40C to +85C); not AEC-Q100 qualified (no automotive suffix). Pb-free / halogen-free per Microchip environmental compliance disclosure.
