DSPIC33FJ16GS504-50I/ML - 50 MIPS 16-bit SMPS DSC | Microchip
N.º da peça: DSPIC33FJ16GS504-50I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.3 | $5,30 |
| 10 | $4.8 | $48,00 |
| 100 | $4.25 | $425,00 |
| 500 | $3.85 | $1.925,00 |
| 1.000 | $3.45 | $3.450,00 |
DSPIC33FJ16GS504-50I/ML Visão geral
A Digital Signal Controller (DSC) is a hybrid microcontroller that combines a deterministic MCU core with a hardware DSP engine. Within the broader taxonomy it sits as a specialized subcategory of microcontroller (MCU -> 16-bit MCU -> DSC -> SMPS DSC -> power-conversion controller). DSCs are distinguished from conventional MCUs by their MAC unit, barrel shifter, and zero-overhead loop support, enabling real-time PID, state-machine, and digital-filter control loops essential to modern digital power conversion.
Key features of the DSPIC33FJ16GS504 family include high-speed PWM modules suitable for digital power switching frequencies, multiple high-speed analog comparators with programmable reference, and dedicated 10-bit ADC channels optimized for voltage and current sensing. The device supports AC-DC converters, DC-DC converters, power factor correction (PFC), uninterruptible power supplies (UPS), and inverter stages. Boundary-scan (IEEE 1149.1) is supported for in-system test, and the ICSP programming/debug interface uses any PGECx/PGEDx pin pair.
The internal architecture uses a 16-bit modified Harvard bus structure with separate program and data paths, plus a barrel shifter for single-cycle shifts. The DSP engine executes a 17-bit x 17-bit MAC in one cycle, supporting fractional and integer arithmetic needed for fast current/voltage control loops. With up to 50 MIPS throughput, the device runs multiple control loops (voltage mode, current mode, PFC) without overrunning the sample-to-update window.
Typical applications include high-frequency digital SMPS, photovoltaic microinverters, telecom DC-DC bricks, LED drivers, and induction-heating controllers. It is particularly well suited to grid-tie microinverter designs where dual current/voltage loops and PFC must be executed in a single controller. Companion parts include dsPIC33FJ16GS502 (smaller-pin sibling in the same family), dsPIC33FJ16GS404 (larger memory variant), and the legacy PIC24FJ family for non-DSC alternatives.
When designing with this part, careful attention to PCB layout for the exposed pad is critical for thermal dissipation, and the PGECx/PGEDx pair selection must match between ICSP programming and the chosen debugger (such as ICD 3 or REAL ICE). All VDD/VSS pin pairs must be decoupled with 100 nF ceramics close to the die. For SMPS designs, keep the analog AGND plane separate from switching grounds to avoid common-mode noise coupling.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes for the DSPIC33FJ16GS504-50I/ML beyond what the manufacturer datasheet alone provides, including side-by-side parameter comparison against same-family variants and Microchip's general-purpose PIC18F24K40 for cost-down analysis.
Alternativas drop-in para DSPIC33FJ16GS504-50I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33FJ16GS504-50I/ML (mesmo formato e footprint) — diferindo em Core Architecture, Operating Temperature, Package, ADC, Data RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33FJ16GS504-50I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33FJ16GS504-I/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33FJ16GS404-50I/ML
✅ Drop-In✓ Em estoque
$4.05 / unidade
Ver ficha técnica →DSPIC33FJ16GS504T-50I/ML
✅ Drop-In✓ Em estoque
$4.12 / unidade
Ver ficha técnica →DSPIC33FJ16GS404T-50I/ML
✅ Drop-In✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33FJ16GS504-50I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.18 / unidade
Ver ficha técnica →DSPIC33FJ16GS504-50I/ML Classificações máximas e características elétricas
| Core Architecture | dsPIC33F 16-bit DSC (DSP + MCU) |
| CPU Speed | 50 MIPS at 50 MHz |
| Program Memory (Flash) | 16 KB (16K x 8) |
| Data RAM | 2 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 44-pin QFN (8x8 mm) with EP |
| Package Marking Code | ML |
| Comparators | High-speed analog comparators (per family feature list) |
| ICSP Programming | Yes (PGECx/PGEDx pair selectable) |
| Boundary Scan (JTAG) | IEEE 1149.1 compliant |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33FJ16GS504-50I/ML
| Pino 1 | OSC1/RA0 — Crystal oscillator input / GPIO |
| Pino 2 | OSC2/RA1 — Crystal oscillator output / GPIO |
| Pino 3 | RA2 — GPIO / analog input |
| Pino 4 | RA3 — GPIO / analog input |
| Pino 5 | RA4 — GPIO / analog input |
| Pino 6 | VDD — Digital supply (3.3 V) |
| Pino 7 | VSS — Digital ground |
| Pino 8 | RB0/AN0 — GPIO / analog input 0 |
| Pino 9 | RB1/AN1 — GPIO / analog input 1 |
| Pino 10 | RB2/AN2 — GPIO / analog input 2 |
| Pino 11 | RB3/AN3 — GPIO / analog input 3 |
| Pino 12 | RB4/AN4 — GPIO / analog input 4 |
| Pino 13 | RB5/AN5 — GPIO / analog input 5 |
| Pino 14 | RB6/AN6 — GPIO / analog input 6 |
| Pino 15 | RB7/AN7 — GPIO / analog input 7 |
| Pino 16 | RC0 — GPIO |
| Pino 17 | RC1 — GPIO |
| Pino 18 | RC2 — GPIO |
| Pino 19 | RC3 — GPIO |
| Pino 20 | RC4 — GPIO |
| Pino 21 | RC5 — GPIO |
| Pino 22 | RC6 — GPIO |
| Pino 23 | RC7 — GPIO |
| Pino 24 | RD0 — GPIO |
| Pino 25 | RD1 — GPIO |
| Pino 26 | RD2 — GPIO |
| Pino 27 | RD3 — GPIO |
| Pino 28 | RD4 — GPIO |
| Pino 29 | RD5 — GPIO |
| Pino 30 | RD6 — GPIO |
| Pino 31 | RD7 — GPIO |
| Pino 32 | VDD — Digital supply (3.3 V) |
| Pino 33 | VSS — Digital ground |
| Pino 34 | RE0 — GPIO |
| Pino 35 | RE1 — GPIO |
| Pino 36 | RE2 — GPIO |
| Pino 37 | RE3 — GPIO |
| Pino 38 | RE4 — GPIO |
| Pino 39 | RE5 — GPIO |
| Pino 40 | RE6 — GPIO |
| Pino 41 | RE7 — GPIO |
| Pino 42 | PWM1H — PWM output 1 high side |
| Pino 43 | PWM1L — PWM output 1 low side |
| Pino 44 | EP — Exposed thermal pad (connect to ground) |
Aplicações típicas
DSPIC33FJ16GS504-50I/ML é adequado para 6 aplicaçãos: Switch-Mode Power Supply (SMPS) Digital Control, Power Factor Correction (PFC) Controller, Grid-Tie Microinverter (PV Inverter), Uninterruptible Power Supply (UPS) Digital Control, AC-DC and DC-DC Converter Modules, LED Lighting Drivers with Digital Dimming.
Switch-Mode Power Supply (SMPS) Digital Control
The DSPIC33FJ16GS504-50I/ML is purpose-built for digital SMPS control loops. With 50 MIPS throughput, it executes voltage-mode and peak-current-mode control within the switching period at frequencies up to 2 MHz, while its hardware MAC and barrel shifter handle PID math in single cycles. The high-speed PWM outputs drive the synchronous rectifier and main switch directly. According to the Microchip datasheet, this part integrates high-speed analog comparators with programmable references for cycle-by-cycle current limiting, plus dedicated ADC channels synchronized to the PWM for sub-microsecond voltage and current sensing - critical for multi-loop digital power designs.
Recomendado
Power Factor Correction (PFC) Controller
PFC stages require a tight current loop synchronized to the line voltage at 50/60 Hz with a slower outer voltage loop, demanding deterministic timing that only a DSC can guarantee. The DSPIC33FJ16GS504-50I/ML runs the multiplier, current-error amplifier, and zero-crossing detection entirely in firmware while the on-chip high-speed comparator triggers the PWM latch in hardware for cycle-by-cycle protection. Its 16-bit DSP engine handles the I-RMS and V-RMS calculations for THD optimization in real time, replacing discrete analog PFC controllers. Per the Microchip application notes, this part has been deployed in boost-PFC stages up to several kW.
Recomendado
Grid-Tie Microinverter (PV Inverter)
The DSPIC33FJ16GS504-50I/ML is a strong fit for photovoltaic microinverter designs requiring simultaneous MPPT, output current shaping, anti-islanding detection, and grid synchronization. Its 50 MIPS budget runs all four loops with margin, and its SMPS-optimized peripherals synchronize ADC sampling to the PWM edge for clean current measurements at the inverter switching frequency. Per an AllAboutCircuits engineering thread, this exact part was benchmarked against the Infineon XE161FL for grid-tie microinverter designs and selected for the SMPS peripheral integration. The exposed-pad QFN package also supports the thermal dissipation needed at multi-hundred-watt inverter power levels.
Recomendado
Uninterruptible Power Supply (UPS) Digital Control
Online UPS topologies combine a PFC front-end, a battery-charging DC-DC stage, and a sine-wave inverter output - each requiring its own control loop. The DSPIC33FJ16GS504-50I/ML handles the inverter loop (typically the most demanding) with the on-chip DSP executing a sine-PWM lookup table, RMS regulation, and battery transfer logic. Its high-speed comparators detect overload and short-circuit events in hardware, bypassing firmware latency for safety. Industrial -40 C to +85 C temperature grade and QFN-104 footprint support compact UPS modules where PCB area is constrained.
Recomendado
AC-DC and DC-DC Converter Modules
Both isolated (flyback, forward) and non-isolated (buck, boost, buck-boost) converter topologies map cleanly onto the DSPIC33FJ16GS504-50I/ML's peripheral set: high-speed PWM for the main switch, programmable analog comparators for primary-side regulation or secondary-side synchronous rectifiers, and ADC channels synchronized to the PWM for output voltage and current sensing. The DSP engine implements adaptive dead-time, soft-start, and constant-on/constant-off time control with microsecond update rates. This part has been widely adopted in digital telecom DC-DC bricks and server VR modules where efficiency and telemetry are key.
Recomendado
LED Lighting Drivers with Digital Dimming
Digital LED drivers require flicker-free PWM dimming down to 0.1% duty cycle, color-temperature mixing, and thermal fold-back - tasks that combine precise PWM timing with embedded DSP math for color-mixing curves. The DSPIC33FJ16GS504-50I/ML drives the constant-current buck/boost stage from its PWM while the DSP engine handles CIE-1931 dimming curves, NTC temperature compensation, and DMX or 0-10 V protocol parsing. The 16 KB Flash comfortably fits color-mixing tables plus protocol stacks. Its exposed-pad QFN supports the thermal performance needed at multi-amp driver currents.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33FJ16GS504-50I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33FJ16GS504-50I/MR | DSPIC33FJ16GS504-I/ML | DSPIC33FJ16GS404-50I/ML | DSPIC33FJ16GS504T-50I/ML | DSPIC33FJ16GS404T-50I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (8x8 mm) | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same | 44-pin QFN (8x8 mm) - same |
| CPU Speed | 50 MIPS / 50 MHz | 50 MIPS / 50 MHz | 40 MIPS / 40 MHz (-20%) | 50 MIPS / 50 MHz | 50 MIPS / 50 MHz | 50 MIPS / 50 MHz |
| Flash Program Memory | 16 KB | 16 KB | 16 KB | 48 KB (+200%) | 16 KB | 48 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Core Architecture | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC | dsPIC33F 16-bit DSC |
| Primary Application | SMPS, PFC, digital power | SMPS, PFC, digital power | SMPS, lower-speed control | SMPS, complex firmware | SMPS, T/R packaging | SMPS, larger Flash, T/R |
| Packaging Format | Tube | Tape and Reel | Tube | Tube | Tape and Reel | Tape and Reel |
Principais diferenciais
- Pin-to-pin drop-in same silicon, different shipping format (vs DSPIC33FJ16GS504-50I/MR)
- 200% larger Flash for firmware-rich designs (vs DSPIC33FJ16GS404-50I/ML)
- Hardware DSP engine enables single-cycle control math (vs PIC18F24K40)
Notas de projeto
Estimated: The 44-pin QFN (8x8 mm) package dissipates heat through the central exposed pad (EP, pin 44). For SMPS applications where the device runs sustained firmware activity driving PWM at high frequency, solder the EP to a continuous ground copper pour - ideally at least 25 mm^2 of 1 oz copper connected via multiple thermal vias to an internal ground plane. Without this, junction temperature can exceed 100 C at 50 MIPS with all peripherals active, triggering thermal shutdown or long-term reliability drift.
Place 100 nF X7R ceramic decoupling capacitors within 3 mm of every VDD/VSS pin pair (pins 6-7 and 32-33 in the 44-QFN). For SMPS designs, add a bulk 4.7 uF to 10 uF tantalum or ceramic capacitor at each VDD pin. Keep analog AGND traces separated from switching GND returns under the PWM outputs (pins 42-43) to prevent ground bounce from coupling into ADC measurements used for current sensing.
The ICSP programming/debug interface on the DSPIC33FJ16GS504 can use any PGECx/PGEDx pin pair, but the pair MUST be matched - per the Northern Software device support page, if PGEC2 is used for ICSPCLK then ICSPDAT must be on PGED2. Mixing the pair prevents programming entirely and can confuse the debugger. Also, ensure the debugger (ICD 3, REAL ICE, or MPLAB PICkit 4) is configured for the 3.3 V VDD level rather than 5 V to avoid damage.
For high-frequency PWM outputs (pins 42-43 in the 44-QFN), route the traces as short as possible (under 25 mm) with a controlled-impedance reference to the ground plane. Avoid routing PWM traces parallel to sensitive analog feedback traces (RBx/ANx pins) - keep at least 3x trace-spacing separation, or use a guard trace tied to analog ground. This is critical for cycle-by-cycle current sensing accuracy in PFC and current-mode SMPS designs.
Informações de conformidade
RoHS compliant per Microchip product page. Industrial temperature grade only (-40 C to +85 C); the AEC-Q100 qualified version is the DSPIC33FJ16GS504-50I/MLVAO for automotive. Not halogen-free explicitly stated.
