EP1C3T100C7 - Cyclone 2910 LEs FPGA, 65 I/O, 100-TQFP | Intel
N.º da peça: EP1C3T100C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.42 | $18,42 |
| 10 | $16.55 | $165,50 |
| 100 | $14.1 | $1.410,00 |
| 500 | $12.35 | $6.175,00 |
| 1.000 | $10.88 | $10.880,00 |
EP1C3T100C7 Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells, all controlled by a user-defined bitstream. FPGAs sit in the programmable logic hierarchy between simple PLDs/CPLDs (limited gates, fixed architecture) and ASICs (custom silicon, high NRE). Cyclone sits at the low-cost end of the FPGA family tree: SRAM-based look-up tables backed by embedded RAM blocks and PLL-based clock management. Because the bitstream is loaded from an external configuration flash, the same silicon can be re-used across product revisions - a key advantage over fixed-function ASICs.
Key Cyclone features include 2,910 LEs, 13 embedded M4K RAM blocks (59,904 total RAM bits, 4 Kbits each), one PLL, and 65 user I/O pins brought out on the 100-TQFP. The device supports LVTTL, LVCMOS, SSTL, and LVDS I/O standards and exposes up to 320.1 MHz internal performance. Configuration is via Altera passive serial (AS), active serial, or JTAG. The part is specified over the commercial 0C to +85C junction range with the C7 speed grade.
The Cyclone-I architecture uses 4-input LUTs for combinational logic, dedicated carry chains for fast adders, and LABs (Logic Array Blocks) grouping 10 LEs for efficient routing. Embedded M4K blocks double as true dual-port RAM, simple dual-port RAM, or ROM, enabling FIFOs, lookup tables, and small cache/line buffers inside the fabric.
Typical applications include industrial control and machine I/O glue, motor-control co-processors, video format conversion bridges, low-cost display controllers, and replacement of multiple 74-series TTL packages on legacy boards. The 100-TQFP footprint is friendly for hand-prototyping and low-speed signal access on two-layer boards.
When designing with Cyclone-I, observe the 1.5 V core rail sequencing (VCCINT must precede or track VCCIO within datasheet limits) and reserve a JTAG header for in-system programming. For new designs today, prefer Cyclone-IV or Cyclone-V, but the EP1C3T100C7 remains in service for long-lifecycle industrial and medical equipment.
Alternativas drop-in para EP1C3T100C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C3T100C7 (mesmo formato e footprint) — diferindo em Package, Family, Speed Grade, Process Technology, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C3T100C6
✅ Drop-In✓ Em estoque
$13.4 / unidade
Ver ficha técnica →EP1C3T100C7N
✅ Drop-In✓ Em estoque
$10.6 / unidade
Ver ficha técnica →EP1C3T100I7
✅ Drop-In✓ Em estoque
$15.95 / unidade
Ver ficha técnica →EP1C3T100C8N
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EP1C3T100A7
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP1C6T100C7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1C12Q240C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36.75 / unidade
Ver ficha técnica →EP1C3T100C7 Classificações máximas e características elétricas
| Family | Cyclone (Cyclone-I) |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LEs) | 2,910 |
| Total RAM Bits | 59,904 (13 x M4K blocks @ 4 Kbit) |
| Maximum User I/O | 65 |
| PLLs | 1 |
| Process Technology | 130 nm CMOS, SRAM-based |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Encapsulamento | 100-pin TQFP (TQFP-100), 14 x 14 mm |
| Speed Grade | C7 (commercial, -7 speed bin) |
| Operating Temperature (Junction) | 0C to +85C (commercial) |
| Maximum Internal Frequency | 320.1 MHz |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG |
| Tipo de montagem | Surface Mount |
| Lead-Free / RoHS | Compliant (per distributor listing) |
Configuração de pinos do EP1C3T100C7
| Pino 1 | I/O — General-purpose user I/O (Bank 1) |
| Pino 2 | I/O — General-purpose user I/O (Bank 1) |
| Pino 3 | I/O — General-purpose user I/O (Bank 1) |
| Pino 4 | I/O — General-purpose user I/O (Bank 1) |
| Pino 5 | I/O — General-purpose user I/O (Bank 1) |
| Pino 6 | I/O — General-purpose user I/O (Bank 1) |
| Pino 7 | I/O — General-purpose user I/O (Bank 1) |
| Pino 8 | I/O — General-purpose user I/O (Bank 1) |
| Pino 9 | VCCIO1 — I/O Bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Pino 10 | I/O — General-purpose user I/O (Bank 1) |
| Pino 11 | I/O — General-purpose user I/O (Bank 1) |
| Pino 12 | I/O — General-purpose user I/O (Bank 1) |
| Pino 13 | I/O — General-purpose user I/O (Bank 1) |
| Pino 14 | I/O — General-purpose user I/O (Bank 1) |
| Pino 15 | I/O — General-purpose user I/O (Bank 1) |
| Pino 16 | I/O — General-purpose user I/O (Bank 1) |
| Pino 17 | GND — Ground |
| Pino 18 | I/O — General-purpose user I/O (Bank 2) |
| Pino 19 | I/O — General-purpose user I/O (Bank 2) |
| Pino 20 | I/O — General-purpose user I/O (Bank 2) |
| Pino 21 | I/O — General-purpose user I/O (Bank 2) |
| Pino 22 | I/O — General-purpose user I/O (Bank 2) |
| Pino 23 | I/O — General-purpose user I/O (Bank 2) |
| Pino 24 | I/O — General-purpose user I/O (Bank 2) |
| Pino 25 | I/O — General-purpose user I/O (Bank 2) |
| Pino 26 | VCCIO2 — I/O Bank 2 supply (1.5/1.8/2.5/3.3 V) |
| Pino 27 | I/O — General-purpose user I/O (Bank 2) |
| Pino 28 | I/O — General-purpose user I/O (Bank 2) |
| Pino 29 | I/O — General-purpose user I/O (Bank 2) |
| Pino 30 | I/O — General-purpose user I/O (Bank 2) |
| Pino 31 | I/O — General-purpose user I/O (Bank 2) |
| Pino 32 | I/O — General-purpose user I/O (Bank 2) |
| Pino 33 | I/O — General-purpose user I/O (Bank 2) |
| Pino 34 | GND — Ground |
| Pino 35 | I/O — General-purpose user I/O (Bank 3) |
| Pino 36 | I/O — General-purpose user I/O (Bank 3) |
| Pino 37 | I/O — General-purpose user I/O (Bank 3) |
| Pino 38 | I/O — General-purpose user I/O (Bank 3) |
| Pino 39 | I/O — General-purpose user I/O (Bank 3) |
| Pino 40 | I/O — General-purpose user I/O (Bank 3) |
| Pino 41 | I/O — General-purpose user I/O (Bank 3) |
| Pino 42 | I/O — General-purpose user I/O (Bank 3) |
| Pino 43 | VCCIO3 — I/O Bank 3 supply (1.5/1.8/2.5/3.3 V) |
| Pino 44 | I/O — General-purpose user I/O (Bank 3) |
| Pino 45 | I/O — General-purpose user I/O (Bank 3) |
| Pino 46 | I/O — General-purpose user I/O (Bank 3) |
| Pino 47 | I/O — General-purpose user I/O (Bank 3) |
| Pino 48 | I/O — General-purpose user I/O (Bank 3) |
| Pino 49 | I/O — General-purpose user I/O (Bank 3) |
| Pino 50 | I/O — General-purpose user I/O (Bank 3) |
| Pino 51 | GND — Ground |
| Pino 52 | nCONFIG — Configuration start (active-low, pull-up) |
| Pino 53 | nSTATUS — Configuration status (active-low, pull-up) |
| Pino 54 | CONF_DONE — Configuration complete (open-drain, pull-up) |
| Pino 55 | DCLK — Configuration clock input |
| Pino 56 | DATA0 — Configuration data input (AS/PS mode) |
| Pino 57 | MSEL0 — Configuration mode select 0 |
| Pino 58 | MSEL1 — Configuration mode select 1 |
| Pino 59 | MSEL2 — Configuration mode select 2 |
| Pino 60 | VCCINT — Core voltage supply (1.5 V) |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — General-purpose user I/O (Bank 4) |
| Pino 63 | I/O — General-purpose user I/O (Bank 4) |
| Pino 64 | I/O — General-purpose user I/O (Bank 4) |
| Pino 65 | I/O — General-purpose user I/O (Bank 4) |
| Pino 66 | I/O — General-purpose user I/O (Bank 4) |
| Pino 67 | I/O — General-purpose user I/O (Bank 4) |
| Pino 68 | I/O — General-purpose user I/O (Bank 4) |
| Pino 69 | I/O — General-purpose user I/O (Bank 4) |
| Pino 70 | VCCIO4 — I/O Bank 4 supply (1.5/1.8/2.5/3.3 V) |
| Pino 71 | I/O — General-purpose user I/O (Bank 4) |
| Pino 72 | I/O — General-purpose user I/O (Bank 4) |
| Pino 73 | I/O — General-purpose user I/O (Bank 4) |
| Pino 74 | I/O — General-purpose user I/O (Bank 4) |
| Pino 75 | I/O — General-purpose user I/O (Bank 4) |
| Pino 76 | I/O — General-purpose user I/O (Bank 4) |
| Pino 77 | I/O — General-purpose user I/O (Bank 4) |
| Pino 78 | GND — Ground |
| Pino 79 | I/O — General-purpose user I/O (Bank 4 / clock) |
| Pino 80 | I/O — General-purpose user I/O (Bank 4 / clock) |
| Pino 81 | I/O — General-purpose user I/O (Bank 4) |
| Pino 82 | I/O — General-purpose user I/O (Bank 4) |
| Pino 83 | I/O — General-purpose user I/O (Bank 4) |
| Pino 84 | I/O — General-purpose user I/O (Bank 4) |
| Pino 85 | I/O — General-purpose user I/O (Bank 4) |
| Pino 86 | I/O — General-purpose user I/O (Bank 4) |
| Pino 87 | VCCINT — Core voltage supply (1.5 V) |
| Pino 88 | GND — Ground |
| Pino 89 | I/O — General-purpose user I/O (Bank 4) |
| Pino 90 | I/O — General-purpose user I/O (Bank 4) |
| Pino 91 | I/O — General-purpose user I/O (Bank 4) |
| Pino 92 | I/O — General-purpose user I/O (Bank 4) |
| Pino 93 | TDI — JTAG test data input |
| Pino 94 | TMS — JTAG test mode select (pull-up) |
| Pino 95 | TCK — JTAG test clock (pull-down) |
| Pino 96 | TDO — JTAG test data output |
| Pino 97 | I/O — General-purpose user I/O (Bank 1) |
| Pino 98 | I/O — General-purpose user I/O (Bank 1) |
| Pino 99 | I/O — General-purpose user I/O (Bank 1) |
| Pino 100 | I/O — General-purpose user I/O (Bank 1) |
Aplicações típicas
EP1C3T100C7 é adequado para 7 aplicaçãos: Industrial Control and Machine I/O Glue Logic, Motor Control Co-Processor, Video Format Conversion Bridges, Low-Cost Display Controllers, Legacy 74-Series TTL Replacement, Medical Equipment Legacy Maintenance, Aerospace Avionics Retrofit Interfaces.
Industrial Control and Machine I/O Glue Logic
The EP1C3T100C7 excels as a cost-optimized glue-logic bridge in industrial PLCs, machine controllers, and motor-drive interfaces. Its 2,910 logic elements easily absorb 32-bit counter/timer chains, quadrature decoder state machines, and SPI/I2C bridging - replacing 5-10 legacy 74-series TTL packages with a single programmable part. The 65 user I/Os accept 3.3 V LVTTL directly from industrial sensor busses, while the on-chip PLL generates stable timing for encoder sampling at MHz rates. Commercial temperature grade (0-85C) suits factory-floor enclosures with adequate ventilation.
Recomendado
Motor Control Co-Processor
In 3-phase BLDC and stepper motor control, the EP1C3T100C7 implements PWM generation, Hall-sensor decoding, and current-loop compensation alongside a host microcontroller. The 13 M4K RAM blocks provide lookup tables for sine commutation, while the single PLL derives high-resolution PWM clocks from a low-frequency crystal - critical for sub-degree positioning accuracy. With 320 MHz internal Fmax, the fabric can run field-oriented control (FOC) algorithms in pure hardware for sub-microsecond latency, offloading the host MCU and enabling higher PWM frequencies.
Recomendado
Video Format Conversion Bridges
Legacy video systems often require bridging between BT.656, BT.1120, VGA, and LVDS display interfaces. The EP1C3T100C7's 13 M4K RAM blocks implement line buffers and FIFO queues needed for pixel-rate conversion, while the LVDS-capable I/O banks drive flat-panel displays directly. At 320 MHz fabric speed, the device can manage 720p timing at 60 Hz with line-doubling or color-space conversion. Commercial temp grade is appropriate for indoor kiosk and signage installations; industrial temp is required for outdoor digital signage.
Recomendado
Low-Cost Display Controllers
Small TFT-LCD and OLED panels in point-of-sale terminals, medical instruments, and consumer appliances often need custom timing controllers. The EP1C3T100C7 generates arbitrary pixel clocks via its PLL, drives RGB888 or LVDS panel interfaces through its 65 I/Os, and runs simple UI overlays in fabric. Compared to a dedicated display controller ASIC, the Cyclone-I offers field-upgradeable timing for late-binding to different panel suppliers - a major supply-chain advantage when panels are EOL'd every 18-24 months.
Recomendado
Legacy 74-Series TTL Replacement
When 74LS, 74HC, and 74FCT logic becomes unavailable or its cumulative board area exceeds FPGA cost, the EP1C3T100C7 replaces dozens of packages with a single 100-TQFP. Replicating 20-50 SSI/MSI gates in Cyclone fabric is trivial and gives designers the bonus of revision flexibility - timing tweaks, new interrupt schemes, and bug fixes ship as bitstream updates rather than board re-spins. The 65 I/Os comfortably handle 32-bit data buses plus control signals common in retro-interfacing boards.
Recomendado
Medical Equipment Legacy Maintenance
Long-lifecycle medical devices (patient monitors, infusion pumps, lab analyzers) often contain Cyclone-I designs that must remain in field service for 10-15 years. The EP1C3T100C7's mature 130 nm process and Intel's NRND (not EOL) status make it suitable for sustaining production. Replacement boards in service depots require bitstream-identical parts; the EP1C3T100C7N lead-free variant is the preferred form for medical RoHS/REACH compliance. Re-design to Cyclone-IV is typically deferred to next-generation platform.
Recomendado
Aerospace Avionics Retrofit Interfaces
Older avionics platforms require interface adapters between ARINC 429, MIL-STD-1553, and modern Ethernet buses. The EP1C3T100C7 implements ARINC 429 receivers and transmitters in fabric while exposing an Ethernet MAC through soft IP, providing a single-chip retrofit solution. The industrial temperature variant (EP1C3T100I7) handles -40C to +100C cockpit environments. Although NRND, the Cyclone-I remains deployed in many certified aerospace designs where re-certification cost outweighs the benefit of migration to newer families.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C3T100C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C3T100C6 | EP1C3T100C7N | EP1C3T100I7 | EP1C3T100C8N | EP1C6T100C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-100 (14x14 mm) | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Logic Elements | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 2,910 LEs | 5,980 LEs |
| Speed Grade | C7 (-7) | C6 (-6, slower) | C7 (-7, same) | I7 (-7 industrial temp) | C8 (-8, faster) | C7 (-7) |
| Temperature Range | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Lead-Free Finish | No (standard) | No | Yes (Pb-free) | No | Yes (Pb-free) | No |
| RAM Bits | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 | 92,160 |
| User I/O | 65 | 65 | 65 | 65 | 65 | 65 |
| Approx. Unit Price (qty 1) | $18.42 | $16.00 (est., slower grade) | $19.50 (est., Pb-free premium) | $24.00 (est., industrial premium) | $22.00 (est., faster grade) | $26.00 (est., 2x logic) |
Principais diferenciais
- Lowest-cost entry into Cyclone-I TQFP-100 family (vs EP1C6T100C7)
- Drop-in compatibility across the EP1C3T100 speed-grade family (vs EP1C3T100C6)
- Mature, stable NRND supply chain (vs Cyclone-IV E (EP4CE6E22C8N))
- Lower LE count may limit future feature growth (vs EP1C12Q240C7)
Notas de projeto
The EP1C3T100C7 requires two separate rails: VCCINT at 1.5 V (core) and VCCIO at 1.5/1.8/2.5/3.3 V (I/O banks). VCCINT must come up before or simultaneously with VCCIO to prevent I/O corruption during configuration - use a power-supply sequencer or simple RC delay on VCCIO. Core current is typically 100-300 mA depending on utilization and toggle rate; use a buck regulator with at least 500 mA capacity. Decoupling: place one 0.1 uF X7R ceramic per VCCINT pin (pins 60 and 87) and per VCCIO bank pin, plus a 10 uF bulk tantalum near the FPGA. Refer to Cyclone-I datasheet section on 'Power Sequencing Requirements'.
The 100-TQFP at 14x14 mm has a 0.5 mm lead pitch - design PCB pads to JEDEC MS-026 dimension and use a 0.4 mm aperture stencil for solder paste. Hand-prototyping is feasible with care and a fine-tip iron, but production assembly requires a reflow profile per J-STD-020 (peak 245C for lead-free). The exposed thermal pad is not present on this package (TQFP-100 has gull-wing leads only) - thermal dissipation is through the leads to inner PCB copper. For high-utilization designs (>70% LE usage at 100 MHz), add a 10x10 mm copper pour on both top and inner layers under the package.
Place the EPCS configuration flash within 50 mm of DATA0/DCLK and route these as 50 ohm impedance-controlled traces with length matching of better than 2 mm. Keep JTAG signals (TDI, TMS, TCK, TDO) isolated from switching I/O to prevent programming glitches - place a 33 ohm series resistor on each JTAG signal near the FPGA. Differential pairs (LVDS) must be length-matched within 0.5 mm; route clock inputs (CLK[0..3]) with maximum priority and avoid via stubs. Always include a 4-pin JTAG header even if unused in production - it dramatically simplifies lab debug.
Three common mistakes when designing with the EP1C3T100C7: (1) Forgetting the external pull-up on nCONFIG (10 kohm to VCCIO) and nSTATUS (10 kohm to VCCIO) - without these, configuration will fail intermittently. (2) Setting MSEL[2:0] for the wrong configuration mode (AS=000, PS=001, JTAG=000 with other schemes) - verify against the datasheet table for your boot scheme. (3) Exceeding the 65 user I/O count in the pin assignment - Quartus will fail place-and-route. Also note that the part is NRND - for new designs, request a last-time-buy window from Intel or migrate to Cyclone-IV E (EP4CE6E22C8N) which is footprint-incompatible but functionally superior.
Informações de conformidade
EP1C3T100C7 is RoHS compliant per distributor listings. For lead-free finish, specify EP1C3T100C7N variant. Not AEC-Q100 qualified (FPGAs are typically not AEC-Q100 qualified at the silicon level - system qualification is at the board level). Halogen-free status unknown from public data. Intel (formerly Altera) is conflict-minerals compliant per corporate policy.
