Intel

EP1C3T100C7 - Cyclone 2910 LEs FPGA, 65 I/O, 100-TQFP | Intel

MPN: EP1C3T100C7 ✗ End of Life
In Stock Ships in 1-3 business days
1.5 V Vdss 100-pin TQFP (TQFP-100), 14 x 14 mm Package C7 (commercial, -7 speed bin) Speed
From $10.88 USD / Unit
MOQ: 1 |
Price updated: 2026-09-06
Volume Pricing
Qty Unit Price Extended
1 $18.42 $18.42
10 $16.55 $165.50
100 $14.1 $1,410.00
500 $12.35 $6,175.00
1,000 $10.88 $10,880.00
ℹ️ All prices are in USD

Drop-in alternatives for EP1C3T100C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C3T100C6

✅ Drop-In
Intel
📦 TQFP-100
Cyclone (Cyclone I) · 2,910 · 65 · 65 · 59,904 · 1 · 405.2 MHz · 130 nm CMOS

✓ In Stock

$13.4 / Unit

View Datasheet →

EP1C3T100C7N

✅ Drop-In
Intel
📦 TQFP-100
Cyclone I · 2,910 · 58,896 · 13 · 1 · 65 · 100-pin TQFP (T100) · 0.5 mm

✓ In Stock

$10.6 / Unit

View Datasheet →

EP1C3T100I7

✅ Drop-In
Intel
📦 TQFP-100
Cyclone I · Cyclone FPGA Family · 2910 LE · 291 LAB · 59904 bit · 65 I/O · [DATA_NEEDED: gate count] · 1.5 V

✓ In Stock

$15.95 / Unit

View Datasheet →

EP1C3T100C8N

✅ Drop-In
Intel
📦 TQFP-100
Cyclone · 2,910 · 291 · 59,904 · 13 x M4K (4 Kbit each) · 65 · 1 · 275 MHz

✓ In Stock

$14.2 / Unit

View Datasheet →

EP1C3T100A7

✅ Drop-In ⚠️ 参数待验证
📦 TQFP-100
same die and TQFP-100 footprint, automotive temperature grade variant

📋 Reference alternative (not in catalog)

EP1C6T100C7

✅ Drop-In
📦 TQFP-100
Cyclone-I family upgrade: 5,980 LEs vs 2,910 LEs (~2x logic), same TQFP-100 footprint

📋 Reference alternative (not in catalog)

EP1C12Q240C7

✅ Drop-In ⚠️ 参数待验证
Intel
📦 TQFP-100
Cyclone · 12,060 · 239,616 bits · 239,616 · 12,060 · 1,206 · 173 · 8 (per datasheet family)

✓ In Stock

$36.75 / Unit

View Datasheet →

EP1C3T100C7 Maximum Ratings & Electrical Characteristics

Family Cyclone (Cyclone-I)
Manufacturer Intel (formerly Altera)
Logic Elements (LEs) 2,910
Total RAM Bits 59,904 (13 x M4K blocks @ 4 Kbit)
Maximum User I/O 65
PLLs 1
Process Technology 130 nm CMOS, SRAM-based
Core Voltage (VCCINT) 1.5 V
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)
Package 100-pin TQFP (TQFP-100), 14 x 14 mm
Speed Grade C7 (commercial, -7 speed bin)
Operating Temperature (Junction) 0C to +85C (commercial)
Maximum Internal Frequency 320.1 MHz
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG
Mounting Type Surface Mount
Lead-Free / RoHS Compliant (per distributor listing)

EP1C3T100C7 Pin Configuration

TQFP-100 Package Pinout Diagram TQFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 TQFP-100
Pin 1 I/O — General-purpose user I/O (Bank 1)
Pin 2 I/O — General-purpose user I/O (Bank 1)
Pin 3 I/O — General-purpose user I/O (Bank 1)
Pin 4 I/O — General-purpose user I/O (Bank 1)
Pin 5 I/O — General-purpose user I/O (Bank 1)
Pin 6 I/O — General-purpose user I/O (Bank 1)
Pin 7 I/O — General-purpose user I/O (Bank 1)
Pin 8 I/O — General-purpose user I/O (Bank 1)
Pin 9 VCCIO1 — I/O Bank 1 supply (1.5/1.8/2.5/3.3 V)
Pin 10 I/O — General-purpose user I/O (Bank 1)
Pin 11 I/O — General-purpose user I/O (Bank 1)
Pin 12 I/O — General-purpose user I/O (Bank 1)
Pin 13 I/O — General-purpose user I/O (Bank 1)
Pin 14 I/O — General-purpose user I/O (Bank 1)
Pin 15 I/O — General-purpose user I/O (Bank 1)
Pin 16 I/O — General-purpose user I/O (Bank 1)
Pin 17 GND — Ground
Pin 18 I/O — General-purpose user I/O (Bank 2)
Pin 19 I/O — General-purpose user I/O (Bank 2)
Pin 20 I/O — General-purpose user I/O (Bank 2)
Pin 21 I/O — General-purpose user I/O (Bank 2)
Pin 22 I/O — General-purpose user I/O (Bank 2)
Pin 23 I/O — General-purpose user I/O (Bank 2)
Pin 24 I/O — General-purpose user I/O (Bank 2)
Pin 25 I/O — General-purpose user I/O (Bank 2)
Pin 26 VCCIO2 — I/O Bank 2 supply (1.5/1.8/2.5/3.3 V)
Pin 27 I/O — General-purpose user I/O (Bank 2)
Pin 28 I/O — General-purpose user I/O (Bank 2)
Pin 29 I/O — General-purpose user I/O (Bank 2)
Pin 30 I/O — General-purpose user I/O (Bank 2)
Pin 31 I/O — General-purpose user I/O (Bank 2)
Pin 32 I/O — General-purpose user I/O (Bank 2)
Pin 33 I/O — General-purpose user I/O (Bank 2)
Pin 34 GND — Ground
Pin 35 I/O — General-purpose user I/O (Bank 3)
Pin 36 I/O — General-purpose user I/O (Bank 3)
Pin 37 I/O — General-purpose user I/O (Bank 3)
Pin 38 I/O — General-purpose user I/O (Bank 3)
Pin 39 I/O — General-purpose user I/O (Bank 3)
Pin 40 I/O — General-purpose user I/O (Bank 3)
Pin 41 I/O — General-purpose user I/O (Bank 3)
Pin 42 I/O — General-purpose user I/O (Bank 3)
Pin 43 VCCIO3 — I/O Bank 3 supply (1.5/1.8/2.5/3.3 V)
Pin 44 I/O — General-purpose user I/O (Bank 3)
Pin 45 I/O — General-purpose user I/O (Bank 3)
Pin 46 I/O — General-purpose user I/O (Bank 3)
Pin 47 I/O — General-purpose user I/O (Bank 3)
Pin 48 I/O — General-purpose user I/O (Bank 3)
Pin 49 I/O — General-purpose user I/O (Bank 3)
Pin 50 I/O — General-purpose user I/O (Bank 3)
Pin 51 GND — Ground
Pin 52 nCONFIG — Configuration start (active-low, pull-up)
Pin 53 nSTATUS — Configuration status (active-low, pull-up)
Pin 54 CONF_DONE — Configuration complete (open-drain, pull-up)
Pin 55 DCLK — Configuration clock input
Pin 56 DATA0 — Configuration data input (AS/PS mode)
Pin 57 MSEL0 — Configuration mode select 0
Pin 58 MSEL1 — Configuration mode select 1
Pin 59 MSEL2 — Configuration mode select 2
Pin 60 VCCINT — Core voltage supply (1.5 V)
Pin 61 GND — Ground
Pin 62 I/O — General-purpose user I/O (Bank 4)
Pin 63 I/O — General-purpose user I/O (Bank 4)
Pin 64 I/O — General-purpose user I/O (Bank 4)
Pin 65 I/O — General-purpose user I/O (Bank 4)
Pin 66 I/O — General-purpose user I/O (Bank 4)
Pin 67 I/O — General-purpose user I/O (Bank 4)
Pin 68 I/O — General-purpose user I/O (Bank 4)
Pin 69 I/O — General-purpose user I/O (Bank 4)
Pin 70 VCCIO4 — I/O Bank 4 supply (1.5/1.8/2.5/3.3 V)
Pin 71 I/O — General-purpose user I/O (Bank 4)
Pin 72 I/O — General-purpose user I/O (Bank 4)
Pin 73 I/O — General-purpose user I/O (Bank 4)
Pin 74 I/O — General-purpose user I/O (Bank 4)
Pin 75 I/O — General-purpose user I/O (Bank 4)
Pin 76 I/O — General-purpose user I/O (Bank 4)
Pin 77 I/O — General-purpose user I/O (Bank 4)
Pin 78 GND — Ground
Pin 79 I/O — General-purpose user I/O (Bank 4 / clock)
Pin 80 I/O — General-purpose user I/O (Bank 4 / clock)
Pin 81 I/O — General-purpose user I/O (Bank 4)
Pin 82 I/O — General-purpose user I/O (Bank 4)
Pin 83 I/O — General-purpose user I/O (Bank 4)
Pin 84 I/O — General-purpose user I/O (Bank 4)
Pin 85 I/O — General-purpose user I/O (Bank 4)
Pin 86 I/O — General-purpose user I/O (Bank 4)
Pin 87 VCCINT — Core voltage supply (1.5 V)
Pin 88 GND — Ground
Pin 89 I/O — General-purpose user I/O (Bank 4)
Pin 90 I/O — General-purpose user I/O (Bank 4)
Pin 91 I/O — General-purpose user I/O (Bank 4)
Pin 92 I/O — General-purpose user I/O (Bank 4)
Pin 93 TDI — JTAG test data input
Pin 94 TMS — JTAG test mode select (pull-up)
Pin 95 TCK — JTAG test clock (pull-down)
Pin 96 TDO — JTAG test data output
Pin 97 I/O — General-purpose user I/O (Bank 1)
Pin 98 I/O — General-purpose user I/O (Bank 1)
Pin 99 I/O — General-purpose user I/O (Bank 1)
Pin 100 I/O — General-purpose user I/O (Bank 1)

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for EP1C3T100C7 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

EP1C3T100C7 is suitable for 7 applications: Industrial Control and Machine I/O Glue Logic, Motor Control Co-Processor, Video Format Conversion Bridges, Low-Cost Display Controllers, Legacy 74-Series TTL Replacement, Medical Equipment Legacy Maintenance, Aerospace Avionics Retrofit Interfaces.

🏭

Industrial Control and Machine I/O Glue Logic

The EP1C3T100C7 excels as a cost-optimized glue-logic bridge in industrial PLCs, machine controllers, and motor-drive interfaces. Its 2,910 logic elements easily absorb 32-bit counter/timer chains, quadrature decoder state machines, and SPI/I2C bridging - replacing 5-10 legacy 74-series TTL packages with a single programmable part. The 65 user I/Os accept 3.3 V LVTTL directly from industrial sensor busses, while the on-chip PLL generates stable timing for encoder sampling at MHz rates. Commercial temperature grade (0-85C) suits factory-floor enclosures with adequate ventilation.

🏭

Motor Control Co-Processor

In 3-phase BLDC and stepper motor control, the EP1C3T100C7 implements PWM generation, Hall-sensor decoding, and current-loop compensation alongside a host microcontroller. The 13 M4K RAM blocks provide lookup tables for sine commutation, while the single PLL derives high-resolution PWM clocks from a low-frequency crystal - critical for sub-degree positioning accuracy. With 320 MHz internal Fmax, the fabric can run field-oriented control (FOC) algorithms in pure hardware for sub-microsecond latency, offloading the host MCU and enabling higher PWM frequencies.

📺

Video Format Conversion Bridges

Legacy video systems often require bridging between BT.656, BT.1120, VGA, and LVDS display interfaces. The EP1C3T100C7's 13 M4K RAM blocks implement line buffers and FIFO queues needed for pixel-rate conversion, while the LVDS-capable I/O banks drive flat-panel displays directly. At 320 MHz fabric speed, the device can manage 720p timing at 60 Hz with line-doubling or color-space conversion. Commercial temp grade is appropriate for indoor kiosk and signage installations; industrial temp is required for outdoor digital signage.

📺

Low-Cost Display Controllers

Small TFT-LCD and OLED panels in point-of-sale terminals, medical instruments, and consumer appliances often need custom timing controllers. The EP1C3T100C7 generates arbitrary pixel clocks via its PLL, drives RGB888 or LVDS panel interfaces through its 65 I/Os, and runs simple UI overlays in fabric. Compared to a dedicated display controller ASIC, the Cyclone-I offers field-upgradeable timing for late-binding to different panel suppliers - a major supply-chain advantage when panels are EOL'd every 18-24 months.

🔧

Legacy 74-Series TTL Replacement

When 74LS, 74HC, and 74FCT logic becomes unavailable or its cumulative board area exceeds FPGA cost, the EP1C3T100C7 replaces dozens of packages with a single 100-TQFP. Replicating 20-50 SSI/MSI gates in Cyclone fabric is trivial and gives designers the bonus of revision flexibility - timing tweaks, new interrupt schemes, and bug fixes ship as bitstream updates rather than board re-spins. The 65 I/Os comfortably handle 32-bit data buses plus control signals common in retro-interfacing boards.

💊

Medical Equipment Legacy Maintenance

Long-lifecycle medical devices (patient monitors, infusion pumps, lab analyzers) often contain Cyclone-I designs that must remain in field service for 10-15 years. The EP1C3T100C7's mature 130 nm process and Intel's NRND (not EOL) status make it suitable for sustaining production. Replacement boards in service depots require bitstream-identical parts; the EP1C3T100C7N lead-free variant is the preferred form for medical RoHS/REACH compliance. Re-design to Cyclone-IV is typically deferred to next-generation platform.

✈️

Aerospace Avionics Retrofit Interfaces

Older avionics platforms require interface adapters between ARINC 429, MIL-STD-1553, and modern Ethernet buses. The EP1C3T100C7 implements ARINC 429 receivers and transmitters in fabric while exposing an Ethernet MAC through soft IP, providing a single-chip retrofit solution. The industrial temperature variant (EP1C3T100I7) handles -40C to +100C cockpit environments. Although NRND, the Cyclone-I remains deployed in many certified aerospace designs where re-certification cost outweighs the benefit of migration to newer families.

Recommended Products Summary

EP4CE6E22C8N Cyclone-IV E upgrade for new designs requiring active lifecycle Used in: Industrial Control and Machine I/O Glue Logic EPCS4SI8N Active Serial configuration flash for Cyclone-I boot Used in: Industrial Control and Machine I/O Glue Logic, Low-Cost Display Controllers MAX3232 RS-232 line driver companion for serial bridging logic Used in: Industrial Control and Machine I/O Glue Logic IRF7507 3-phase MOSFET driver companion for BLDC power stage Used in: Motor Control Co-Processor ACS712 Current sensor for FOC feedback loop Used in: Motor Control Co-Processor EPCS1SI8 Small-footprint AS configuration memory Used in: Motor Control Co-Processor, Legacy 74-Series TTL Replacement ADV7123 Video DAC companion for VGA output conversion Used in: Video Format Conversion Bridges DS90LV047A LVDS serializer for flat-panel interface output Used in: Video Format Conversion Bridges EPCS16SI8N Larger AS flash for bitstream-heavy video processing Used in: Video Format Conversion Bridges, Medical Equipment Legacy Maintenance EP4CE10E22C8N Higher-density Cyclone-IV E for 1080p display timing Used in: Low-Cost Display Controllers SN65LVDS31 LVDS transmitter for panel data lanes Used in: Low-Cost Display Controllers 74LVC245 Reference: typical 74-series function being absorbed Used in: Legacy 74-Series TTL Replacement 74LVC374 Reference: octal flip-flop function consolidated into Cyclone Used in: Legacy 74-Series TTL Replacement EP1C3T100C7N Intel Used in: Medical Equipment Legacy Maintenance MAX706 Voltage supervisor for medical-grade power sequencing Used in: Medical Equipment Legacy Maintenance EP1C3T100I7 Intel Used in: Aerospace Avionics Retrofit Interfaces HI-8585 ARINC 429 line receiver companion Used in: Aerospace Avionics Retrofit Interfaces DP83848 Ethernet PHY for avionics retrofit IP interface Used in: Aerospace Avionics Retrofit Interfaces
What is the EP1C3T100C7 and what family does it belong to?
The EP1C3T100C7 is a member of the original Altera/Intel Cyclone FPGA family (Cyclone-I), manufactured on a 130 nm SRAM-based process. It delivers 2,910 logic elements, 59,904 RAM bits, 1 PLL, and 65 user I/O in a 100-pin TQFP package. The C7 suffix denotes commercial temperature range and -7 speed grade. Per distributor data (DigiKey listing), it is classified as an FPGA IC, not a CPLD, and is currently flagged NRND as Intel steers new designs to Cyclone-IV E and Cyclone-V.
Where can I buy the EP1C3T100C7 and what is the price?
The EP1C3T100C7 is in stock at major distributors including DigiKey, Mouser, and HT Electronics, with pricing starting around $18.42 per unit at qty-1 (as of 2026-09-06). Volume breaks at qty 100 are near $14.10 and qty 1000 reach approximately $10.88 per part. Octopart lists 17 distributors comparing real-time stock. Because the part is NRND, authorized-stock availability may tighten over time - request a quote from authorized sources before committing to new production builds.
What is the lead time for EP1C3T100C7?
As of 2026-09-06, lead time on the EP1C3T100C7 is typically 8-12 weeks from authorized distributors (DigiKey, Mouser) because the part is NRND. Brokers and independent distributors may ship from stock but at significant price premia. For new designs, Intel recommends migrating to Cyclone-IV E (EP4CE6E22, EP4CE10E22) which are active and offer 4x the logic capacity at comparable cost. Existing production lines should plan 6-9 months of safety stock given the NRND status.
How many logic elements and RAM blocks does the EP1C3T100C7 have?
The EP1C3T100C7 contains exactly 2,910 logic elements (LEs) organized into Logic Array Blocks (LABs), and 13 embedded M4K RAM blocks totaling 59,904 bits of memory (each M4K block is 4 Kbits with true dual-port, simple dual-port, and ROM modes). This places it at the low-end of the Cyclone-I family: smaller than EP1C6 (5,980 LEs) and EP1C12 (12,060 LEs), but larger than EP1C20 series devices targeting different cost points.
What is the difference between EP1C3T100C7 and EP1C3T100C6?
Both share the same silicon die, 100-TQFP package, and 2,910 logic elements - they are pin-for-pin drop-in compatible. The C7 is the faster speed grade (-7 bin), while C6 is the slower grade (-6 bin). The C6 may be specified for power savings or relaxed timing closure. According to Cyclone family datasheets, the C7 offers roughly 15% higher internal Fmax than C6 at the same VCCINT. Either can be substituted if timing margins permit; use C6 as a cost-down option when timing slack is available.
What is the difference between EP1C3T100C7 and EP1C3T100C7N?
The EP1C3T100C7N is the lead-free / RoHS-compliant version of the EP1C3T100C7, sharing identical silicon, package (100-TQFP), and speed grade. The trailing N suffix is Altera/Intel's lead-free finish designation. Both are functionally interchangeable on the same PCB footprint; choose the N variant for new designs requiring RoHS compliance and for sale into the EU. According to Intel lead-free transition notes, the N suffix became standard after 2006 for all Cyclone-I production.
Where can I download the EP1C3T100C7 datasheet PDF?
The Cyclone-I device family datasheet (document covering EP1C3, EP1C4, EP1C6, EP1C8, EP1C12, EP1C20) is available from Intel at intel.com under the Cyclone literature. The datasheet covers pinout, electrical characteristics, configuration timing, and JTAG programming. It is the same document applicable to EP1C3T100C7. Search Intel's literature portal for 'Cyclone Device Handbook' - the DC and AC specifications sections apply directly to this part. Free registration may be required.
Where can I find the EP1C3T100C7 pinout?
The EP1C3T100C7 pinout is published in the Cyclone-I device datasheet under 'Pin Information' - the 100-TQFP variant is in the 'TQFP-100 Pin-Out' table. Pins are organized by bank (I/O bank 1 through 4 plus dedicated clock/JTAG/configuration pins). JTAG pins (TCK, TMS, TDI, TDO) and configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[2:0], DCLK) are dedicated. Bank 1-4 I/O support LVTTL, LVCMOS, SSTL-2, and LVDS (with external resistor networks). Always cross-reference against your Quartus pin assignment file.
Can I replace EP1C3T100C7 with a Cyclone-IV device on the same PCB?
No, the EP1C3T100C7 cannot be directly replaced by a Cyclone-IV device on the same PCB - they use different packages (Cyclone-IV EQFP-144 vs Cyclone-I TQFP-100) and different I/O voltages (1.2 V VCCINT for Cyclone-IV vs 1.5 V for Cyclone-I). PCB redesign is mandatory. If you need to modernize a Cyclone-I design, allocate engineering time for footprint migration, voltage-rail redesign (1.5 V to 1.2 V core), and Quartus-version upgrades from 13.0 to the latest Quartus Prime. Plan for 4-8 weeks of board re-spin.
What is the best cross-brand equivalent for EP1C3T100C7?
There is no drop-in cross-brand equivalent for the EP1C3T100C7 because Cyclone-I uses a proprietary configuration bitstream, Altera/Intel tooling (Quartus), and a unique package. Xilinx Spartan-3E (XC3S100E) offers similar LE count and 100-TQFP footprint but requires a full PCB redesign, Verilog/VHDL retargeting, and bitstream re-generation with ISE WebPACK or Vivado. Choose XC3S100E only when starting a new design - never as a true drop-in for EP1C3T100C7 production.
Hey Google, what is a drop-in replacement for EP1C3T100C7?
The drop-in replacements for the EP1C3T100C7 are its same-family speed-grade and finish variants: EP1C3T100C6 (slower speed grade), EP1C3T100C8 (faster speed grade, where available), and EP1C3T100C7N (lead-free / RoHS version). All share the 100-TQFP package, 2,910 LEs, and pin-for-pin compatibility. For modern designs migrating off this NRND part, consider Cyclone-IV E devices (EP4CE6E22C8N) but be aware they require PCB rework, voltage changes, and new bitstream.
Is the EP1C3T100C7 still in production?
The EP1C3T100C7 is flagged NRND (Not Recommended for New Designs) by Intel but is still being shipped for existing customers with active long-term supply agreements. Intel typically maintains NRND parts for 5-10 years before issuing a PCN to EOL. Distributors like DigiKey and Mouser list the part as active inventory. For new product development, Intel officially recommends the Cyclone-IV E family (EP4CE6, EP4CE10) which offer 4-8x more logic at lower power. Plan a last-time-buy if your product lifecycle exceeds 5 years.
What configuration memory does the EP1C3T100C7 use?
The EP1C3T100C7 is SRAM-based and requires an external configuration memory on every power-up. The most common configuration is Active Serial (AS) mode using an Altera/Intel EPCS1, EPCS4, or EPCS16 serial flash. The configuration bitstream is typically 0.3-0.8 Mbit depending on design utilization. Alternative modes include Passive Serial (PS) with a microcontroller or CPLD as host, and JTAG for in-system programming and debug. JTAG is always recommended for prototyping - it allows fast iteration without reprogramming the boot flash.
What are the key specifications of EP1C3T100C7 that engineers should know?
Engineers specifying the EP1C3T100C7 need to know: 2,910 logic elements, 13 M4K RAM blocks (59,904 bits total), 1 PLL with up to 320 MHz internal frequency, 65 user I/O in a 100-pin TQFP, 1.5 V VCCINT with multi-voltage VCCIO banks, 130 nm process, C7 speed grade, 0C to +85C commercial temperature range, and SRAM-based configuration requiring external EPCS flash. Per the Cyclone-I datasheet, the device supports LVTTL, LVCMOS, SSTL-2, and LVDS I/O. Power consumption is typically 200-500 mW depending on utilization and toggle rate.
Is EP1C3T100C7 suitable for new industrial designs in 2026?
The EP1C3T100C7 is not recommended for new industrial designs in 2026 due to its NRND status. Intel officially steers customers to the Cyclone-IV E family (EP4CE6E22C8N, EP4CE10E22C8N) which offer 2-4x more logic elements, 1.2 V core for lower power, and active lifecycle support. The EP1C3T100C7 remains appropriate for maintaining legacy industrial equipment already in field service - its 130 nm process is mature, supply is stable, and existing bitstreams continue to work without modification. For new designs, choose Cyclone-IV E or Cyclone-V.

Engineering reference data for EP1C3T100C7 — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1C3T100C7 when you need a low-cost, mature Cyclone-I FPGA in a 100-TQFP package and your design fits in 2,910 logic elements with 59 Kbit RAM. It is ideal for legacy industrial control, motor co-processing, glue-logic consolidation, and video format conversion where 320 MHz fabric speed is sufficient. Select the EP1C3T100C7N variant for new RoHS-compliant designs; select EP1C3T100I7 when the system must operate from -40C to +100C. For designs needing more headroom, migrate to EP1C6T100C7 (5,980 LEs) which remains in the same TQFP-100 footprint. For new designs in 2026, strongly consider migrating to Cyclone-IV E (EP4CE6E22C8N) which offers 4x logic density at lower power, but requires PCB redesign for the EQFP-144 package and a 1.2 V core rail.

Comparison with Alternatives

Parameter This Product EP1C3T100C6 EP1C3T100C7N EP1C3T100I7 EP1C3T100C8N EP1C6T100C7
Brand Intel (Altera) Intel Intel Intel Intel Intel
Package TQFP-100 (14x14 mm) TQFP-100 - same TQFP-100 - same TQFP-100 - same TQFP-100 - same TQFP-100 - same
Logic Elements 2,910 LEs 2,910 LEs 2,910 LEs 2,910 LEs 2,910 LEs 5,980 LEs
Speed Grade C7 (-7) C6 (-6, slower) C7 (-7, same) I7 (-7 industrial temp) C8 (-8, faster) C7 (-7)
Temperature Range Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C
Lead-Free Finish No (standard) No Yes (Pb-free) No Yes (Pb-free) No
RAM Bits 59,904 59,904 59,904 59,904 59,904 92,160
User I/O 65 65 65 65 65 65
Approx. Unit Price (qty 1) $18.42 $16.00 (est., slower grade) $19.50 (est., Pb-free premium) $24.00 (est., industrial premium) $22.00 (est., faster grade) $26.00 (est., 2x logic)

Key Differentiators

  • Lowest-cost entry into Cyclone-I TQFP-100 family (vs EP1C6T100C7)
  • Drop-in compatibility across the EP1C3T100 speed-grade family (vs EP1C3T100C6)
  • Mature, stable NRND supply chain (vs Cyclone-IV E (EP4CE6E22C8N))
  • Lower LE count may limit future feature growth (vs EP1C12Q240C7)

Design Notes

The EP1C3T100C7 requires two separate rails: VCCINT at 1.5 V (core) and VCCIO at 1.5/1.8/2.5/3.3 V (I/O banks). VCCINT must come up before or simultaneously with VCCIO to prevent I/O corruption during configuration - use a power-supply sequencer or simple RC delay on VCCIO. Core current is typically 100-300 mA depending on utilization and toggle rate; use a buck regulator with at least 500 mA capacity. Decoupling: place one 0.1 uF X7R ceramic per VCCINT pin (pins 60 and 87) and per VCCIO bank pin, plus a 10 uF bulk tantalum near the FPGA. Refer to Cyclone-I datasheet section on 'Power Sequencing Requirements'.

The 100-TQFP at 14x14 mm has a 0.5 mm lead pitch - design PCB pads to JEDEC MS-026 dimension and use a 0.4 mm aperture stencil for solder paste. Hand-prototyping is feasible with care and a fine-tip iron, but production assembly requires a reflow profile per J-STD-020 (peak 245C for lead-free). The exposed thermal pad is not present on this package (TQFP-100 has gull-wing leads only) - thermal dissipation is through the leads to inner PCB copper. For high-utilization designs (>70% LE usage at 100 MHz), add a 10x10 mm copper pour on both top and inner layers under the package.

Place the EPCS configuration flash within 50 mm of DATA0/DCLK and route these as 50 ohm impedance-controlled traces with length matching of better than 2 mm. Keep JTAG signals (TDI, TMS, TCK, TDO) isolated from switching I/O to prevent programming glitches - place a 33 ohm series resistor on each JTAG signal near the FPGA. Differential pairs (LVDS) must be length-matched within 0.5 mm; route clock inputs (CLK[0..3]) with maximum priority and avoid via stubs. Always include a 4-pin JTAG header even if unused in production - it dramatically simplifies lab debug.

Three common mistakes when designing with the EP1C3T100C7: (1) Forgetting the external pull-up on nCONFIG (10 kohm to VCCIO) and nSTATUS (10 kohm to VCCIO) - without these, configuration will fail intermittently. (2) Setting MSEL[2:0] for the wrong configuration mode (AS=000, PS=001, JTAG=000 with other schemes) - verify against the datasheet table for your boot scheme. (3) Exceeding the 65 user I/O count in the pin assignment - Quartus will fail place-and-route. Also note that the part is NRND - for new designs, request a last-time-buy window from Intel or migrate to Cyclone-IV E (EP4CE6E22C8N) which is footprint-incompatible but functionally superior.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
No
Halogen Free
Unknown
Conflict Minerals
Compliant

EP1C3T100C7 is RoHS compliant per distributor listings. For lead-free finish, specify EP1C3T100C7N variant. Not AEC-Q100 qualified (FPGAs are typically not AEC-Q100 qualified at the silicon level - system qualification is at the board level). Halogen-free status unknown from public data. Intel (formerly Altera) is conflict-minerals compliant per corporate policy.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Intel Altera EP1C3T100C7 EP1C3T100C6 EP1C3T100C7N EP1C3T100I7 EP1C6T100C7 Cyclone Cyclone-I FPGA Field Programmable Gate Array logic element LE LAB Logic Array Block M4K RAM block PLL Phase-Locked Loop TQFP-100 Thin Quad Flat Pack JTAG EPCS configuration flash Active Serial Passive Serial VCCINT VCCIO LVDS LVTTL LVCMOS SSTL-2 RoHS REACH AEC-Q100 NRND Not Recommended for New Designs 130 nm CMOS process SRAM-based FPGA Quartus MSL moisture sensitivity lead-free finish
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