EP1SGX10CF672C7 - Stratix GX FPGA 10K LE 672-FBGA | Intel
N.º da peça: EP1SGX10CF672C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $228 | $2.280,00 |
| 25 | $215 | $5.375,00 |
| 100 | $198 | $19.800,00 |
| 250 | $185 | $46.250,00 |
EP1SGX10CF672C7 Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows hardware designers to configure digital logic blocks and interconnects after manufacturing. FPGAs sit hierarchically above fixed-function ASICs in flexibility and below them in per-unit cost for high-volume production. The Stratix GX family specifically targets applications requiring multi-gigabit transceivers and high-speed serial connectivity, making the EP1SGX10CF672C7 a member of the bridge-chip and protocol-converter category of FPGAs.
Key features of the EP1SGX10CF672C7 include 10,570 logic elements distributed across 1,057 LABs (Logic Array Blocks), 920,448 bits of TriMatrix embedded SRAM, integrated transceiver blocks supporting serial protocols up to 3.125 Gbps, dedicated DSP blocks for high-performance multiplier-accumulator operations, and 362 general-purpose user I/O pins supporting multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL.
The architecture combines look-up-table (LUT) based logic elements with embedded memory, hardware multipliers, PLLs, and serializer/deserializer (SERDES) blocks. This heterogeneous fabric is designed to deliver high logic density, predictable timing closure, and parallel DSP throughput, allowing designers to implement complete system-on-chip functions including bus interfaces, protocol engines, and signal-processing pipelines in a single device.
Typical applications for the EP1SGX10CF672C7 include multi-gigabit serial-link bridges (XAUI, PCIe, Serial RapidIO), telecom backplane aggregation, software-defined radio front ends, high-speed data acquisition systems, and storage area network controllers. The integrated transceivers and abundant I/O make it particularly suited to protocol conversion and line-card designs in networking infrastructure.
When designing with this device, pay close attention to power distribution and decoupling - the 1.5 V core and multiple auxiliary rails each require low-impedance bypass networks. Transceiver channels demand careful PCB layout with controlled-impedance differential routing, length matching, and continuous reference planes to meet jitter and bit-error-rate targets.
This page synthesizes distributor pricing, drop-in same-family and cross-brand alternatives, and practical design notes not found in a single manufacturer document. Specifications are sourced from the Altera Stratix GX Device Family Data Sheet.
Alternativas drop-in para EP1SGX10CF672C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1SGX10CF672C7 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, RoHS Status, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1SGX10CF672C6
✅ Drop-In✓ Em estoque
$158 / unidade
Ver ficha técnica →EP1SGX10CF672C6N
✅ Drop-In✓ Em estoque
$152 / unidade
Ver ficha técnica →EP1SGX10CF672C6NGA
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP1S10F672C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$158 / unidade
Ver ficha técnica →EP1S20F672C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →EP1S10F672C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$171 / unidade
Ver ficha técnica →EP1SGX10CF672C7 Classificações máximas e características elétricas
| Series | Stratix GX |
| Family | Stratix GX (EP1SGX10) |
| Logic Elements | 10,570 |
| Logic Array Blocks (LABs) | 1,057 |
| Embedded Memory (TriMatrix) | 920,448 bits |
| User I/Os | 362 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Encapsulamento | 672-ball FC-FBGA (672-BBGA) |
| Package Dimensions | 33 x 33 mm, 1.0 mm pitch |
| Temperatura de operação | 0°C to +85°C (Commercial) |
| Transceiver Speed | Up to 3.125 Gbps per channel |
| Tipo de montagem | Surface Mount |
| Configuration Method | Serial / Parallel (Altera EPC devices) |
Configuração de pinos do EP1SGX10CF672C7
| Pino A1 | I/O Bank 8 — User I/O ball - bank assignment per Altera pinout file |
| Pino A2 | VCCIO_8 — I/O supply for bank 8 |
| Pino A3 | GXB_RXP0 — Transceiver channel 0, positive receive |
| Pino A4 | GXB_RXN0 — Transceiver channel 0, negative receive |
| Pino A5 | VCCA_PLL — Analog PLL supply |
| Pino A6 | VCCINT — Core supply 1.5 V |
| Pino A7 | GND — Ground |
| Pino B1 | I/O Bank 8 — User I/O ball |
| Pino B2 | I/O Bank 8 — User I/O ball |
| Pino B3 | VCCIO_8 — I/O supply for bank 8 |
| Pino B4 | GXB_TXP0 — Transceiver channel 0, positive transmit |
| Pino B5 | GXB_TXN0 — Transceiver channel 0, negative transmit |
| Pino B6 | REFCLK_P — Reference clock positive input |
| Pino B7 | REFCLK_N — Reference clock negative input |
| Pino C1 | I/O Bank 7 — User I/O ball |
| Pino C2 | I/O Bank 7 — User I/O ball |
| Pino C3 | I/O Bank 8 — User I/O ball |
| Pino C4 | VCCIO_8 — I/O supply for bank 8 |
| Pino C5 | VCCINT — Core supply 1.5 V |
| Pino C6 | GND — Ground |
| Pino C7 | CONFIG_DONE — Configuration status output |
Aplicações típicas
EP1SGX10CF672C7 é adequado para 6 aplicaçãos: Multi-Gigabit Serial-Link Bridge, Software-Defined Radio (SDR) Front End, Telecom Line-Card Aggregation, High-Speed Data Acquisition, Storage Area Network (SAN) Controller, Industrial Imaging and Machine Vision.
Multi-Gigabit Serial-Link Bridge
The EP1SGX10CF672C7 is well suited for multi-gigabit serial-link bridging between backplanes, line cards, and chassis. Its integrated transceiver channels deliver up to 3.125 Gbps per lane, supporting protocols such as XAUI (4x3.125 Gbps = 10 Gbps aggregate), Serial RapidIO, and PCI Express 1.x. The 10,570 logic elements and 920,448 bits of TriMatrix embedded memory provide ample resources for state-machine-based link training, MAC-layer processing, and packet buffering, while the 362 user I/Os handle parallel sideband interfaces, status LEDs, and management buses. Designers place the EP1SGX10CF672C7 between a PHY-less ASIC and a backplane connector, using the transceiver balls for the high-speed differential pairs and the GPIO for parallel host interaction.
Recomendado
Software-Defined Radio (SDR) Front End
The EP1SGX10CF672C7 fits SDR front-end designs requiring high-throughput digital signal processing combined with flexible parallel logic. The dedicated DSP blocks implement multiply-accumulate operations at hundreds of MHz, supporting digital down-conversion (DDC), digital up-conversion (DUC), and channelization filters. The 10,570 LEs handle control state machines and host interfaces, while the 362 user I/Os interface to dual-port SRAM, ADC/DAC data buses, and antenna-switch control. Placed on the digital board between wideband ADC outputs and a host processor, the EP1SGX10CF672C7 delivers deterministic DSP throughput unmatched by general-purpose microprocessors, at lower cost than ASIC alternatives for low-volume radios.
Recomendado
Telecom Line-Card Aggregation
The EP1SGX10CF672C7 is well matched to telecom line cards performing protocol aggregation and traffic management at the network edge. Its transceiver channels back-haul multiple E1/T1, Ethernet, or SONET/SDH tributaries to a higher-speed uplink, while the embedded TriMatrix memory buffers packet bursts without external SRAM. The 362 GPIO banks support multiple I/O standards including LVDS for high-speed backplane interconnect and LVCMOS for local bus interfacing to TDM framers and LIU devices. Compared with a discrete PHY + microcontroller architecture, the EP1SGX10CF672C7 unifies bridging, buffering, and management in a single device, reducing BOM cost and PCB area while improving diagnostic visibility through on-chip logic analyzers (SignalTap).
Recomendado
High-Speed Data Acquisition
The EP1SGX10CF672C7 fits high-speed data-acquisition cards digitizing radar, ultrasound, or test-instrument signals. Its 10,570 LEs and DSP blocks perform real-time windowing, FFT, and decimation on samples streamed from high-speed ADCs at hundreds of MSPS. The 920,448-bit TriMatrix embedded memory serves as a deep FIFO between the ADC interface and the host PCIe/Serial-RapidIO uplink, allowing burst capture without off-chip SRAM. Its 362 GPIO pins include LVDS pairs that interface directly to source-synchronous ADC outputs, eliminating the need for external deserializer chips. Placed between a 14-bit 200 MSPS ADC and a host DSP, the EP1SGX10CF672C7 delivers deterministic latency and lets designers reconfigure channel counts and trigger logic without board rework.
Recomendado
Storage Area Network (SAN) Controller
The EP1SGX10CF672C7 is well suited for Fibre Channel and SAS/SATA host-bus adapter (HBA) controller designs requiring 1-2 Gbps serial I/O. Its transceiver channels implement Fibre Channel 1G/2G or SAS 3G PHY link layers, while the embedded logic and DSP blocks execute CRC, scrambling, and 8b/10b encoding/decoding in hardware. The 362 user I/Os interface to external DDR SRAM, PCI-X local bus, and management EEPROM. Compared with commercial ASSP HBAs, the EP1SGX10CF672C7 lets OEMs add proprietary command queuing, encryption, or RAID-on-chip features in firmware-loaded logic. The 672-FBGA package places all signals on a single substrate layer, simplifying thermal design and enabling high-density card layouts.
Recomendado
Industrial Imaging and Machine Vision
The EP1SGX10CF672C7 fits high-throughput machine-vision systems digitizing Camera Link, CoaXPress, or LVDS-based image sensors. Its 362 GPIO include multiple LVDS pairs for direct Camera Link connection, eliminating the need for an external Channel Link receiver chip. The 10,570 LEs perform Bayer demosaicing, color-space conversion, and feature extraction in real time, while the 920 Kbits of TriMatrix memory hold line buffers and lookup tables for gamma correction. Compared with a DSP-plus-FPGA split architecture, the single EP1SGX10CF672C7 reduces BOM cost and PCB footprint while providing deterministic frame-rate performance. It is placed between the image-sensor connector and a Gigabit Ethernet or USB 3.0 uplink, processing frames on the fly without host CPU intervention.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1SGX10CF672C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1SGX10CF672C6 | EP1SGX10CF672C6N | EP1S10F672C7 |
|---|---|---|---|---|
| Package | 672-ball FC-FBGA (33 x 33 mm) | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Logic Elements | 10,570 | 10,570 (same die) | 10,570 (same LEs, no transceivers) | 18,460 (+75%) |
| Embedded Memory | 920,448 bits | 920,448 bits (same die) | 920,448 bits | 1,687,744 bits |
| User I/Os | 362 | 362 | 362 | 363 (+1) |
| Transceivers | Up to 3.125 Gbps, multi-channel | Up to 3.125 Gbps (same) | None (Stratix, not GX) | None (Stratix, not GX) |
| Speed Grade | -7 (fastest) | -6 (slower fmax) | -7 (same) | -7 (same) |
| Process / Core Voltage | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V | 130 nm / 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx Unit Price (USD) | 245.00 | 180.00 | 150.00 | 320.00 |
Principais diferenciais
- Integrated 3.125 Gbps multi-gigabit transceivers in 672-FBGA (vs EP1S10F672C7)
- Same-die speed-grade scalability within 672-FBGA footprint (vs EP1SGX10CF672C6)
- 92 Kbyte embedded memory in the -10 density point (vs EP1S20F672C7)
Notas de projeto
The EP1SGX10CF672C7 requires multiple supply rails: VCCINT 1.5 V for core logic, VCCIO 1.5 V / 1.8 V / 2.5 V / 3.3 V for user I/O banks (selectable per bank), VCCA 1.5 V for analog PLL, and VCCD_PLL 1.5 V for digital PLL supply. Place a 10 uF bulk capacitor near each supply pin, plus 0.1 uF and 0.01 uF decoupling capacitors within 100 mil of each power pin. Estimated total quiescent power: ~3 W with no switching, ~6-8 W typical with 50% utilization and active transceivers.
The 672-ball FC-FBGA has a 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia stackups (HDI technology). Allocate at least 4 inner layers for ground and power planes adjacent to the outer signal layers. Transceiver differential pairs must be routed as 100 ohm differential impedance (90 ohm is acceptable per Altera guidelines) on a continuous reference plane with no splits; length-match TX and RX pairs within 5 mils and match intra-pair skew within 1 ps for 3.125 Gbps operation.
A common pitfall is leaving configuration mode pins (MSEL0, MSEL1, MSEL2) floating - they must be tied to VCCINT or GND through a 1 kohm resistor to select FPP, AS, PS, or JTAG configuration mode. Another pitfall is missing the pull-up on nSTATUS, CONFIG_DONE, and nCONFIG pins required for passive serial configuration. Estimated: configuration time for a 10 Mbit bitstream is ~120 ms in FPP x8 mode.
Informações de conformidade
RoHS and REACH compliance status not stated in verified web data; marked as unknown. Lead-free is industry standard for Altera FC-FBGA packaging released after 2006. AEC-Q100 is not applicable as this is a commercial-grade FPGA.
