EP1S40F1508C6NGA - Stratix FPGA, 41250 LEs, 1508-BGA | Intel
N.º da peça: EP1S40F1508C6NGA ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $245.75 | $24.575,00 |
| 250 | $228.9 | $57.225,00 |
| 500 | $215.4 | $107.700,00 |
EP1S40F1508C6NGA Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit in the broader programmable-logic taxonomy between CPLDs (smaller, non-volatile glue logic) and ASICs (mask-programmed custom silicon), offering hardware-reconfigurable parallelism for compute-intensive workloads. The Stratix family is the high-performance, SRAM-based flagship of Altera (now Intel PSG) and uses the proprietary Quartus Prime toolchain for synthesis, place-and-route, and bitstream generation.
Key features of the EP1S40F1508C6NGA include 41,250 LEs, 3,423,744 embedded RAM bits, 822 user I/O, and 12 embedded DSP blocks for high-throughput multiply-accumulate operations. The "C6" speed grade targets commercial timing with a -40 °C to +85 °C ambient operating range, while the "N" suffix denotes lead-free / Pb-free assembly. The "GA" package suffix indicates a 1508-ball FineLine BGA with the specific die/pinout revision.
The architecture pairs the LE fabric with TriMatrix on-chip memory (three RAM block sizes per quadrant) and dedicated full-duplex high-speed LVDS I/O capable of DDR SDRAM interfaces. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVPECL, LVDS, and PCI/PCI-X, and includes up to 12 PLLs for clock synthesis and skew management. Stratix was the first Altera family with embedded DSP blocks containing hardware multipliers, making it well-suited to baseband signal processing.
Typical applications include telecom baseband processing, software-defined radio, high-speed digital test equipment, military/aerospace signal processing, medical imaging, and high-end ASIC prototyping. The combination of 822 I/O and 12.5 Gbps-class LVDS channels also suits parallel high-speed data acquisition back-ends.
Design consideration: the FCBGA-1508 substrate requires a multi-layer PCB with microvia stack-ups and matched-length routing on critical clocks; PCB designers must follow Intel/Altera's Stratix pin-out guidelines and reference Quartus II / Quartus Prime floorplan files for IO bank assignment, and must respect the supported I/O standards per bank.
This page synthesizes distributor pricing, FPGA family alternatives, and design notes not found on a single manufacturer datasheet page.
Alternativas drop-in para EP1S40F1508C6NGA — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1S40F1508C6NGA (mesmo formato e footprint) — diferindo em Process Technology, Operating Temperature, Package, Total RAM Bits, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1S40F1020C6N
✅ Drop-In✓ Em estoque
$695 / unidade
Ver ficha técnica →EP1S30F780C6N
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →EP1S25F1020C6N
✅ Drop-In✓ Em estoque
$450 / unidade
Ver ficha técnica →EP1S25F780C6N
✅ Drop-In✓ Em estoque
$780 / unidade
Ver ficha técnica →EP1S30F1020C6N
✅ Drop-In✓ Em estoque
$1015 / unidade
Ver ficha técnica →EP1S25F672C6N
✅ Drop-In✓ Em estoque
$192.75 / unidade
Ver ficha técnica →EP1S40F1508C6NGA Classificações máximas e características elétricas
| Family | Stratix |
| Logic Elements | 41,250 |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 822 |
| Number of LABs/CLBs | 4125 |
| DSP Blocks | 12 |
| Package Type | 1508-BGA, FCBGA |
| Package Pin Count | 1508 |
| Temperatura de operação | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 |
| Voltage - Supply | 1.5 V core (per Stratix family default) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Lead-free (N suffix) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
Guia de Configuração de Pinos do EP1S40F1508C6NGA 1508
Configuração de pinos para EP1S40F1508C6NGA (pacote 1508). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1S40F1508C6NGA.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1S40F1508C6NGA é adequado para 6 aplicaçãos: Telecom Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping and Emulation, High-Speed Data Acquisition, Industrial Imaging and Video Processing, Aerospace and Defense Signal Processing.
Telecom Baseband Processing
The EP1S40F1508C6NGA fits telecom baseband processing because its 41,250 logic elements and 12 dedicated DSP blocks deliver up to 2.7 GMACS of multiply-accumulate throughput, which is the datapath resource required for forward-error-correction (Turbo, Viterbi, Reed-Solomon) and channel-equalization engines. The 822 user I/O through the 1508-BGA also provide enough LVDS pairs for parallel CPRI/OBSAI framer interfaces to a baseband ASIC or DSP cluster, while multiple on-chip PLLs generate the precise clock trees that CPRI line-rate clocks (1.2288 / 3.072 / 4.9152 / 6.144 GHz and dividers) demand. Engineers typically place the EP1S40F1508C6NGA between the RF framer and the network processor, where its TriMatrix RAM buffers symbol streams between PHY and upper-layer stacks.
Recomendado
Software Defined Radio (SDR)
Software-defined-radio baseband cards benefit from the EP1S40F1508C6NGA because its 3,423,744 bits of TriMatrix on-chip RAM and 12 DSP blocks can implement wide-bandwidth digital down-conversion, FFT cores, and channelizer filter banks at IF sample rates above 100 MSPS. The 822 LVDS-capable I/O support direct interfacing to dual-channel 14/16-bit ADC front-ends such as the AD9680 family without external logic, and the Stratix PLL block enables low-jitter clock multiplication from a single-board reference oscillator. Compared with a GPU-based SDR approach, the EP1S40F1508C6NGA offers deterministic latency required for protocol timing in tactical and commercial SDR platforms.
Recomendado
ASIC Prototyping and Emulation
The EP1S40F1508C6NGA is widely deployed as a building block in multi-FPGA ASIC prototyping platforms because its 822 I/O through the 1508-BGA deliver enough high-speed differential channels to bridge neighbour FPGAs in a partitioned ASIC prototype at hundreds of MHz. Designers can partition an ASIC RTL design across multiple EP1S40F1508C6NGA devices and prototype at near-ASIC speeds using TDM-based pin multiplexing and time-stationary partitioning. The 12 embedded DSP blocks and 3.4 Mbit of block RAM together accommodate modest processor cores and on-chip trace buffers for hardware-assisted debug workflows before the ASIC tape-out.
Recomendado
High-Speed Data Acquisition
The EP1S40F1508C6NGA suits high-speed data-acquisition back-ends because its 822 I/O include sufficient LVDS pairs to interface to 8- or 16-channel simultaneous-sampling ADC arrays at 200+ MSPS, while the 3.4 Mbit TriMatrix RAM provides per-channel sample buffering between the ADC data-stream and the PCIe/DDR transfer engine. Engineers implement FIR/CIC decimation filters in DSP blocks to reduce the data-rate before DMA transfer, and the Stratix PLL block generates the low-jitter ADC sampling clock from an onboard crystal. Typical end-equipment includes oscilloscope acquisition ASICs, medical imaging front-ends, and radar digitiser cards.
Recomendado
Industrial Imaging and Video Processing
The EP1S40F1508C6NGA serves industrial imaging applications because its parallel LE fabric can process multiple Camera-Link or CoaXPress streams simultaneously, while 822 I/O and on-chip TriMatrix RAM deliver the buffering required for line-scan and area-scan machine-vision pipelines. The 12 DSP blocks accelerate 2D FIR filters, color-space conversion, and Bayer demosaicing, and the Stratix LVDS transceivers accept the high-speed serialiser-deserialiser outputs of modern CMOS image sensors at hundreds of MHz. Industrial cameras and inspection systems benefit from the deterministic-latency fabric compared with GPU approaches, particularly when integration with real-time PLC control is required.
Recomendado
Aerospace and Defense Signal Processing
The EP1S40F1508C6NGA (C6 commercial speed grade) has historically been deployed in aerospace and defense signal-processing systems because of its high LE/DSP density and its lead-free 1508-BGA assembly suitable for avionics and ground-based radar applications. The 822 I/O drive multiple synchronous LVDS links to ADC/DAC sub-arrays, while the 12 DSP blocks implement pulse-compression, MTI filtering, and digital beam-forming kernels that dominate radar and electronic-warfare compute budgets. Although the C6 commercial temperature grade limits deployment to controlled environments, the same Stratix EP1S40 die is also offered in industrial speed grades for wider environmental envelopes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1S40F1508C6NGA — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1S40F1020C6N | EP1S30F780C6N | EP1S25F1020C6N | EP1S25F780C6N | EP1S30F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA |
| Logic Elements | 41,250 | 41,250 | 32,470 | 25,660 | 25,660 | 32,470 |
| Embedded RAM (bits) | 3,423,744 | 3,423,744 | 2,215,104 | 1,944,576 | 1,944,576 | 2,215,104 |
| DSP Blocks | 12 | 12 | 10 | 10 | 10 | 10 |
| Speed Grade | C6 (commercial) | C6 | C6 | C6 | C6 | C6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest logic density in the Stratix EP1S40 family tier (vs EP1S30F780C6N)
- Maximum TriMatrix RAM density in the EP1S40 line (vs EP1S25F1020C6N)
- Highest user I/O count in the EP1S40 family (vs EP1S40F1020C6N)
- 12 dedicated DSP blocks for high-MACPU throughput (vs EP1S25F780C6N)
Notas de projeto
The 1508-ball FCBGA package of the EP1S40F1508C6NGA mandates an HDI PCB stack-up with microvias (typically 0.1 mm laser-drilled) or via-in-pad construction; the 1.0 mm ball pitch cannot be reliably breakout-routed with conventional through-hole vias. Top-layer ground pour directly under the BGA keeps the return-path inductance below 100 pH, and 0.1 µF plus 0.01 µF X7R decoupling capacitors must be placed within 100 mils of every VCCIO/VCCINT ball per the Stratix Device Handbook. For LVDS pairs targeting >500 Mbps, use 100 Ω differential stripline geometry with length-matching within ±10 mil across bytes.
Estimated: at maximum LE utilization (~80%) with the C6 commercial speed grade and 1.5 V VCCINT, the EP1S40F1508C6NGA draws roughly 1.5–2.5 W of core power plus I/O power that scales with toggle rate. The 1508-BGA exposes a thermal pad through the inner-row balls, so a continuous top-layer ground pour plus 4–6 thermal vias directly under the die region is essential to keep junction temperature below 100 °C. Without adequate thermal relief, the commercial 0 °C–85 °C ambient specification can be violated inside a sealed enclosure, particularly in fanless industrial designs.
Configuration mode pins MSEL[2:0] must be tied to defined logic levels (never floating) per the configuration scheme; floating MSEL pins are a common boot-failure root cause on Stratix EP1S40 boards. JTAG pins TCK, TMS, TDI, and TRST must follow the IEEE 1149.1 recommended termination, and nCONFIG must be tied to VCCIO through a 4.7 kΩ pull-up if left unused. Do not leave configuration-data pins DCLK floating in passive-serial mode — they need to be pulled to known states via the EPCS/EPC device. Also note that the EP1S40 does not support 1.2 V VCCINT; using the wrong core voltage permanently damages the die.
Informações de conformidade
Lead-free ball finish confirmed by trailing 'N' suffix per Altera/Intel ordering code convention. Halogen-free status and conflict-minerals compliance not stated in provided data — set to 'unknown' per data authenticity rules.
