EP1S40F1508C6NGA - Stratix FPGA, 41250 LEs, 1508-BGA | Intel
MPN: EP1S40F1508C6NGA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245.75 | $24,575.00 |
| 250 | $228.9 | $57,225.00 |
| 500 | $215.4 | $107,700.00 |
Drop-in alternatives for EP1S40F1508C6NGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EP1S40F1020C6N
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View Datasheet →EP1S40F1508C6NGA Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Logic Elements | 41,250 |
| Total RAM Bits | 3,423,744 |
| Number of I/O | 822 |
| Number of LABs/CLBs | 4125 |
| DSP Blocks | 12 |
| Package Type | 1508-BGA, FCBGA |
| Package Pin Count | 1508 |
| Operating Temperature | 0 °C to 85 °C (commercial) |
| Speed Grade | C6 |
| Voltage - Supply | 1.5 V core (per Stratix family default) |
| Mounting Type | Surface Mount |
| RoHS Status | Lead-free (N suffix) |
| Process Technology | 0.13 µm CMOS, SRAM-based |
EP1S40F1508C6NGA 1508 Pin Configuration Guide
Complete pinout information for EP1S40F1508C6NGA (1508 package) with 1508 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S40F1508C6NGA.
Refer to the datasheet for full pin configuration.
Estimated pin count: 1508 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S40F1508C6NGA is suitable for 6 applications: Telecom Baseband Processing, Software Defined Radio (SDR), ASIC Prototyping and Emulation, High-Speed Data Acquisition, Industrial Imaging and Video Processing, Aerospace and Defense Signal Processing.
Telecom Baseband Processing
The EP1S40F1508C6NGA fits telecom baseband processing because its 41,250 logic elements and 12 dedicated DSP blocks deliver up to 2.7 GMACS of multiply-accumulate throughput, which is the datapath resource required for forward-error-correction (Turbo, Viterbi, Reed-Solomon) and channel-equalization engines. The 822 user I/O through the 1508-BGA also provide enough LVDS pairs for parallel CPRI/OBSAI framer interfaces to a baseband ASIC or DSP cluster, while multiple on-chip PLLs generate the precise clock trees that CPRI line-rate clocks (1.2288 / 3.072 / 4.9152 / 6.144 GHz and dividers) demand. Engineers typically place the EP1S40F1508C6NGA between the RF framer and the network processor, where its TriMatrix RAM buffers symbol streams between PHY and upper-layer stacks.
Recommended
Software Defined Radio (SDR)
Software-defined-radio baseband cards benefit from the EP1S40F1508C6NGA because its 3,423,744 bits of TriMatrix on-chip RAM and 12 DSP blocks can implement wide-bandwidth digital down-conversion, FFT cores, and channelizer filter banks at IF sample rates above 100 MSPS. The 822 LVDS-capable I/O support direct interfacing to dual-channel 14/16-bit ADC front-ends such as the AD9680 family without external logic, and the Stratix PLL block enables low-jitter clock multiplication from a single-board reference oscillator. Compared with a GPU-based SDR approach, the EP1S40F1508C6NGA offers deterministic latency required for protocol timing in tactical and commercial SDR platforms.
Recommended
ASIC Prototyping and Emulation
The EP1S40F1508C6NGA is widely deployed as a building block in multi-FPGA ASIC prototyping platforms because its 822 I/O through the 1508-BGA deliver enough high-speed differential channels to bridge neighbour FPGAs in a partitioned ASIC prototype at hundreds of MHz. Designers can partition an ASIC RTL design across multiple EP1S40F1508C6NGA devices and prototype at near-ASIC speeds using TDM-based pin multiplexing and time-stationary partitioning. The 12 embedded DSP blocks and 3.4 Mbit of block RAM together accommodate modest processor cores and on-chip trace buffers for hardware-assisted debug workflows before the ASIC tape-out.
Recommended
High-Speed Data Acquisition
The EP1S40F1508C6NGA suits high-speed data-acquisition back-ends because its 822 I/O include sufficient LVDS pairs to interface to 8- or 16-channel simultaneous-sampling ADC arrays at 200+ MSPS, while the 3.4 Mbit TriMatrix RAM provides per-channel sample buffering between the ADC data-stream and the PCIe/DDR transfer engine. Engineers implement FIR/CIC decimation filters in DSP blocks to reduce the data-rate before DMA transfer, and the Stratix PLL block generates the low-jitter ADC sampling clock from an onboard crystal. Typical end-equipment includes oscilloscope acquisition ASICs, medical imaging front-ends, and radar digitiser cards.
Recommended
Industrial Imaging and Video Processing
The EP1S40F1508C6NGA serves industrial imaging applications because its parallel LE fabric can process multiple Camera-Link or CoaXPress streams simultaneously, while 822 I/O and on-chip TriMatrix RAM deliver the buffering required for line-scan and area-scan machine-vision pipelines. The 12 DSP blocks accelerate 2D FIR filters, color-space conversion, and Bayer demosaicing, and the Stratix LVDS transceivers accept the high-speed serialiser-deserialiser outputs of modern CMOS image sensors at hundreds of MHz. Industrial cameras and inspection systems benefit from the deterministic-latency fabric compared with GPU approaches, particularly when integration with real-time PLC control is required.
Recommended
Aerospace and Defense Signal Processing
The EP1S40F1508C6NGA (C6 commercial speed grade) has historically been deployed in aerospace and defense signal-processing systems because of its high LE/DSP density and its lead-free 1508-BGA assembly suitable for avionics and ground-based radar applications. The 822 I/O drive multiple synchronous LVDS links to ADC/DAC sub-arrays, while the 12 DSP blocks implement pulse-compression, MTI filtering, and digital beam-forming kernels that dominate radar and electronic-warfare compute budgets. Although the C6 commercial temperature grade limits deployment to controlled environments, the same Stratix EP1S40 die is also offered in industrial speed grades for wider environmental envelopes.
Recommended
Recommended Products Summary
Engineering reference data for EP1S40F1508C6NGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S40F1020C6N | EP1S30F780C6N | EP1S25F1020C6N | EP1S25F780C6N | EP1S30F1020C6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA | 780-BGA, FCBGA | 1020-BGA, FCBGA |
| Logic Elements | 41,250 | 41,250 | 32,470 | 25,660 | 25,660 | 32,470 |
| Embedded RAM (bits) | 3,423,744 | 3,423,744 | 2,215,104 | 1,944,576 | 1,944,576 | 2,215,104 |
| User I/O | 822 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| DSP Blocks | 12 | 12 | 10 | 10 | 10 | 10 |
| Speed Grade | C6 (commercial) | C6 | C6 | C6 | C6 | C6 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. 1-piece Price (USD) | $285 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Highest logic density in the Stratix EP1S40 family tier (vs EP1S30F780C6N)
- Maximum TriMatrix RAM density in the EP1S40 line (vs EP1S25F1020C6N)
- Highest user I/O count in the EP1S40 family (vs EP1S40F1020C6N)
- 12 dedicated DSP blocks for high-MACPU throughput (vs EP1S25F780C6N)
Design Notes
The 1508-ball FCBGA package of the EP1S40F1508C6NGA mandates an HDI PCB stack-up with microvias (typically 0.1 mm laser-drilled) or via-in-pad construction; the 1.0 mm ball pitch cannot be reliably breakout-routed with conventional through-hole vias. Top-layer ground pour directly under the BGA keeps the return-path inductance below 100 pH, and 0.1 µF plus 0.01 µF X7R decoupling capacitors must be placed within 100 mils of every VCCIO/VCCINT ball per the Stratix Device Handbook. For LVDS pairs targeting >500 Mbps, use 100 Ω differential stripline geometry with length-matching within ±10 mil across bytes.
Estimated: at maximum LE utilization (~80%) with the C6 commercial speed grade and 1.5 V VCCINT, the EP1S40F1508C6NGA draws roughly 1.5–2.5 W of core power plus I/O power that scales with toggle rate. The 1508-BGA exposes a thermal pad through the inner-row balls, so a continuous top-layer ground pour plus 4–6 thermal vias directly under the die region is essential to keep junction temperature below 100 °C. Without adequate thermal relief, the commercial 0 °C–85 °C ambient specification can be violated inside a sealed enclosure, particularly in fanless industrial designs.
Configuration mode pins MSEL[2:0] must be tied to defined logic levels (never floating) per the configuration scheme; floating MSEL pins are a common boot-failure root cause on Stratix EP1S40 boards. JTAG pins TCK, TMS, TDI, and TRST must follow the IEEE 1149.1 recommended termination, and nCONFIG must be tied to VCCIO through a 4.7 kΩ pull-up if left unused. Do not leave configuration-data pins DCLK floating in passive-serial mode — they need to be pulled to known states via the EPCS/EPC device. Also note that the EP1S40 does not support 1.2 V VCCINT; using the wrong core voltage permanently damages the die.
Compliance Information
Lead-free ball finish confirmed by trailing 'N' suffix per Altera/Intel ordering code convention. Halogen-free status and conflict-minerals compliance not stated in provided data — set to 'unknown' per data authenticity rules.
