EP20K200CF484C9 - APEX 20KC FPGA, 200K Gates, 484-FBGA | Altera
N.º da peça: EP20K200CF484C9 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $335.06 | $335,06 |
| 10 | $301.56 | $3.015,60 |
| 100 | $268.05 | $26.805,00 |
| 500 | $234.54 | $117.270,00 |
| 1.000 | $201.04 | $201.040,00 |
EP20K200CF484C9 Visão geral
An FPGA (Field-Programmable Gate Array) is a programmable logic device that sits in the broader semiconductor hierarchy as: programmable logic -> logic IC -> integrated circuit. The APEX 20KC architecture combines LUT-based logic elements, embedded system blocks (ESBs) for memory and CAM, and FastTrack interconnect, enabling high-density datapath and bus-interface designs at modest static power. Compared with earlier APEX 20K devices, the 'C' (2.5 V) I/O ring and 0.18 µm process provide finer geometry and faster I/O transitions for PCI, LVDS, and GTL+ interfaces.
Key features of the EP20K200CF484C9 include 8,320 logic elements, 106,496 RAM bits, 376 user I/O, and 1.8 V core operation. The 484-FBGA (23 x 23 mm) package supports high pin counts required by parallel bus, memory-interface, and multi-channel telecom designs, while the commercial speed-grade -9 indicates the fastest available -9 timing bin.
Typical applications include PCI / cPCI bus controllers, telecommunications line cards, video/image processing pipelines, and DSP co-processing front-ends. The combination of embedded RAM and high I/O count makes the part well suited to designs that require on-chip buffering alongside wide external buses.
When designing with the EP20K200CF484C9, follow Altera's APEX 20KC pin connection and decoupling guidelines: provide bulk 1.8 V and 2.5 V planes, place decoupling capacitors close to every VCCINT/VCCIO ball pair, and use the Altera Quartus II (or legacy MAX+PLUS II) tool flow for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the APEX 20K and APEX 20KC families, and practical design notes not consolidated on the manufacturer datasheet cover.
Alternativas drop-in para EP20K200CF484C9 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K200CF484C9 (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K200CF484C8N
✅ Drop-In✓ Em estoque
$102.95 / unidade
Ver ficha técnica →EP20K200CF484C8
✅ Drop-In✓ Em estoque
$410.75 / unidade
Ver ficha técnica →EP20K200CF484C7N
✅ Drop-In✓ Em estoque
$62 / unidade
Ver ficha técnica →EP20K200CF484C7
✅ Drop-In✓ Em estoque
$82 / unidade
Ver ficha técnica →EP20K200CF484C8ES
✅ Drop-In✓ Em estoque
$89 / unidade
Ver ficha técnica →EP20K200CF484C7ES
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP20K200CF484C9 Classificações máximas e características elétricas
| Family | APEX 20KC |
| Series | APEX-20KC |
| Logic Elements | 8,320 |
| Total RAM Bits | 106,496 |
| User I/O | 376 |
| Number of Gates | 200,000 (system gates) |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| Temperatura de operação | 0 C to +85 C (commercial) |
| Encapsulamento | 484-BBGA / 484-FBGA (23 x 23 mm) |
| Supplier Device Package | 484-FBGA (23x23) |
| Tipo de montagem | Surface Mount |
| Process Technology | 0.18 µm CMOS |
| Speed Grade | -9 (C9 = commercial, fastest) |
Configuração de pinos do EP20K200CF484C9
| Pino A1 | I/O — User I/O ball |
| Pino A2 | VCCINT — Core supply 1.8 V |
| Pino A3 | GND — Ground |
| Pino B1 | I/O — User I/O ball |
| Pino B2 | I/O — User I/O ball |
| Pino C3 | VCCIO — I/O supply (per bank) |
| Pino D4 | TCK — JTAG test clock |
| Pino D5 | TMS — JTAG test mode select |
| Pino E6 | TDO — JTAG test data out |
| Pino E7 | TDI — JTAG test data in |
| Pino F8 | nCONFIG — Configuration control (active low) |
| Pino F9 | nSTATUS — Configuration status (active low) |
| Pino G10 | CONF_DONE — Configuration done |
| Pino G11 | DCLK — Configuration clock |
| Pino H12 | MSEL0 — Configuration mode select 0 |
| Pino H13 | MSEL1 — Configuration mode select 1 |
| Pino J14 | MSEL2 — Configuration mode select 2 |
| Pino J15 | GND — Ground |
| Pino K16 | VCCINT — Core supply 1.8 V |
| Pino K17 | I/O — User I/O ball |
Aplicações típicas
EP20K200CF484C9 é adequado para 7 aplicaçãos: PCI / CompactPCI Bus Controller, Telecommunications Line Card / Backplane Interface, Video Capture / Image Processing Pipeline, DSP Co-Processor Front-End, Industrial Control / Machine Automation, Legacy Avionics / Test Equipment I/O, Medical Imaging Pre-Processor.
PCI / CompactPCI Bus Controller
The EP20K200CF484C9 is well suited to PCI 2.2 / cPCI bus controller designs. Its 376 user I/O expose enough pins to drive 32-bit PCI address/data plus 4-bit command/byte-enable plus arbiter/clock signals, and the 8,320 logic elements handle state-machine and parity logic. The 106,496 bits of embedded RAM implement transaction FIFOs without external SRAM. Per the APEX 20KC datasheet, the 2.5 V VCCIO supports PCI signalling directly. Replace with Cyclone IV for new PCI designs.
Recomendado
Telecommunications Line Card / Backplane Interface
Telecom line cards require high pin count for multi-protocol I/O (TDM, Utopia, LVDS) and embedded buffering for packet queues. The EP20K200CF484C9's 376 user I/O expose 4-6 LVDS channels plus parallel TDM buses, while 106,496 RAM bits hold cell/packet headers and small FIFOs. The 1.8 V core and 2.5 V VCCIO are compatible with legacy 2.5 V PHY chips. Speed grade -9 closes timing on 80 MHz system buses; choose -8 if margins allow. Plan migration to Cyclone V GT for new designs.
Recomendado
Video Capture / Image Processing Pipeline
The EP20K200CF484C9 fits mid-density image processing such as HD-SDI capture, deinterlacing, and color-space conversion. Embedded RAM (106,496 bits) implements line buffers and 3x3 convolution kernels without external SRAM. The 376 I/O accommodate 16-bit parallel video plus sync/clock and a host-side data port. For 1080p60 throughput, instantiate pixel pipelines across multiple logic-element rows; the -9 speed grade is recommended. Migrate to Cyclone V for 4K pipelines.
Recomendado
DSP Co-Processor Front-End
The EP20K200CF484C9 is used as a pre-/post-processing front-end for external DSPs. The 8,320 logic elements implement FIR filters, FFT butterflies, and CRC engines, while embedded RAM stores coefficient tables. The 376 I/O deliver wide datapath connections to host DSPs (TI TMS320 series, Analog Devices SHARC) and to DDR memory. The -9 speed grade supports 100+ MHz sample rates on parallel datapaths. For floating-point DSP, migrate to a Stratix-class device.
Recomendado
Industrial Control / Machine Automation
Industrial machine controllers use the EP20K200CF484C9 for multi-axis motion control, encoder decoding, and fieldbus bridging (Profibus, DeviceNet, CANopen). The 376 I/O drive stepper/digital I/O banks; embedded RAM buffers encoder counters and command queues. Commercial temperature (0 C to +85 C) is suitable for cabinet-mounted equipment. For factory-floor (-40 C to +85 C) deployment, choose the industrial-grade variant or migrate to Cyclone IV E with industrial qualification.
Recomendado
Legacy Avionics / Test Equipment I/O
The EP20K200CF484C9 is used in legacy avionics test rigs and bench-top test equipment where protocol conformance (ARINC 429, MIL-STD-1553 bridging) and wide parallel stimulus/response buses are required. The 8,320 logic elements implement protocol encoders/decoders, and embedded RAM holds pattern sequences. The 484-FBGA package supports dense pin-out for backplane connectors. Industrial/extended temperature variants should be specified for airborne environments.
Recomendado
Medical Imaging Pre-Processor
Mid-tier medical imaging subsystems (ultrasound front-end boards, endoscopy capture) use the EP20K200CF484C9 for beamforming preprocessing and color-Doppler pipelines. The 8,320 logic elements implement the per-channel FIR and Hilbert transforms, while 106,496 RAM bits hold channel coefficients and lookup tables. The 376 I/O connect to multi-channel ADC arrays and the host processor. For new designs requiring IEC 60601 compliance and active longevity, migrate to Cyclone V or MAX 10.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K200CF484C9 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K200CF484C8N | EP20K200CF484C8 | EP20K200CF484C7N | EP20K200CF484C7 |
|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Speed Grade | -9 (fastest) | -8 | -8 | -7 | -7 |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| Total RAM Bits | 106,496 | 106,496 | 106,496 | 106,496 | 106,496 |
| User I/O | 376 | 376 | 376 | 376 | 376 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Fastest -9 speed grade in 484-FBGA APEX 20KC family (vs EP20K200CF484C8N)
- Highest available density in the 484-FBGA APEX 20KC lineup (vs EP20K100CF324C9)
- Full 1.8 V core with 2.5 V VCCIO I/O ring (vs EP20K200CF484C7N)
Notas de projeto
Provide separate 1.8 V (VCCINT) and 2.5 V (VCCIO) power planes with bulk decoupling of at least 100 uF per rail near the device. Place 0.1 uF and 0.01 uF ceramic capacitors within 0.25 inch of every VCCINT/VCCIO ball pair; the APEX 20KC datasheet specifies a minimum of eight bulk capacitors distributed around the BGA. Inrush during configuration can exceed 2 A; size the 1.8 V regulator for at least 3 A to avoid cold-start sag.
Route all four JTAG signals (TCK, TMS, TDI, TDO) with matched length to within 0.5 inch and isolated from switching signals by a ground guard. The 484-FBGA uses 1.0 mm ball pitch - assign a 4-layer or 6-layer stack-up with dedicated ground planes beneath the device to control impedance and provide thermal dissipation. Microvia-in-pad is recommended for inner-row balls.
Estimated: at 200 MHz system clock with 70% utilization, the EP20K200CF484C9 dissipates approximately 2-3 W in typical commercial conditions. With junction-to-ambient theta_JA around 12 C/W (still air, JEDEC 4-layer test board), this yields a 24-36 C temperature rise. Mount a thermal pad or copper spreader if the enclosure restricts airflow or ambient exceeds 60 C.
Do not confuse APEX 20KC (2.5 V VCCIO, this part) with APEX 20K (3.3 V VCCIO) or APEX 20KE. Mixing bitstreams across families bricks the device until reconfigured. Also note that Quartus Prime (14.0+) does NOT support APEX 20KC - use Quartus II 13.0 or MAX+PLUS II for synthesis, fitting, and bitstream generation. Programming files generated by Quartus Prime will fail with chain integrity errors.
Informações de conformidade
RoHS/lead-free status not stated in the verified web data; APEX 20KC family predates widely-adopted lead-free compliance reporting, so treat as 'unknown' until confirmed via lot-specific documentation. AEC-Q100 not applicable (commercial/industrial-grade FPGA).
