EP20K200RC208-3N - APEX 20K FPGA 200K Gates 8320 Cells 167MHz | Altera
N.º da peça: EP20K200RC208-3N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $65 | $65,00 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5.200,00 |
| 500 | $45.5 | $22.750,00 |
| 1.000 | $39 | $39.000,00 |
EP20K200RC208-3N Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device whose interconnect and logic resources are configured by the customer after manufacture using a hardware description language (HDL) and a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy - above simple PLDs, CPLDs, and structured ASICs - and are widely used to implement glue logic, custom processor peripherals, DSP pipelines, and prototype ASICs. The APEX-20K family in particular pioneered the integration of dedicated memory blocks (ESBs) with general-purpose LUT logic, allowing system-on-chip functionality before true SoC ASICs were widely available.
Key features include 144 user I/O pins, 4 dedicated inputs, a maximum operating frequency of 167 MHz, CMOS process technology at 0.22 micrometer geometry, and a 2.5V core supply with LVDS-compatible I/O capability. The 'N' suffix indicates an industrial temperature grade of 0C to +85C, while the '3' speed grade places this part in a moderate performance bin suitable for designs that do not require the highest possible internal clock rate.
From an architectural standpoint, the EP20K200RC208-3N uses Altera's MultiCore architecture, which interleaves logic array blocks (LABs), embedded system blocks (ESBs) for memory, and FastTrack interconnect. This design lets the device serve both register-intensive datapath logic and high-density memory functions such as FIFOs and dual-port RAMs without external SRAM. The exposed thermal pad on the BFQFP package aids heat extraction for sustained high-utilization designs.
Typical applications include telecommunications line cards, industrial control and instrumentation, glue logic for DSP boards, custom peripheral controllers, and ASIC prototyping. Designers select this device when they need high gate density plus on-chip memory in a proven, mature silicon process with abundant Quartus II design-tool support.
When designing with the EP20K200RC208-3N, ensure the 208-pin BFQFP land pattern includes the exposed thermal pad soldered to a copper pour to meet thermal and electrical grounding requirements. Quartus II (legacy MAX+PLUS II for older designs) is the supported development environment; configuration bitstreams are loaded via the ByteBlaster or compatible JTAG programmer.
This page synthesizes distributor stock levels, verified drop-in alternatives, and practical design notes that complement the official APEX-20K datasheet family specification.
Alternativas drop-in para EP20K200RC208-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K200RC208-3N (mesmo formato e footprint) — diferindo em Process Technology, Family, Operating Temperature, Package, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K200RC208-3
✅ Drop-In✓ Em estoque
$95 / unidade
Ver ficha técnica →EP20K200RC208-2
✅ Drop-In✓ Em estoque
$79.67 / unidade
Ver ficha técnica →EP20K200RC208-1
✅ Drop-In✓ Em estoque
$78 / unidade
Ver ficha técnica →EP20K200RC208-1N
✅ Drop-In✓ Em estoque
$18.1 / unidade
Ver ficha técnica →EP20K200RC208-1X
✅ Drop-In✓ Em estoque
$35.8 / unidade
Ver ficha técnica →EP20K200RC208-3N Classificações máximas e características elétricas
| Family | APEX-20K |
| Series | APEX 20K |
| Logic Elements | 8320 cells |
| System Gates | 200,000 |
| Embedded Memory | 106,496 bits |
| Maximum Operating Frequency | 167 MHz |
| User I/O Pins | 144 |
| Dedicated Inputs | 4 |
| Process Technology | 0.22 um CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Standard Support | LVDS, 1.8V APEX-20KE family |
| Package Type | 208-RQFP / BFQFP with exposed pad |
| Terminal Pitch | 0.5 mm |
| Faixa de temperatura de operação | 0C to +85C (industrial) |
| Propagation Delay | 3.6 ns |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP20K200RC208-3N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 2) |
| Pino 10 | I/O — User I/O pin (bank 2) |
| Pino 11 | I/O — User I/O pin (bank 2) |
| Pino 12 | I/O — User I/O pin (bank 2) |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | VCCIO — I/O supply voltage (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 3) |
| Pino 19 | I/O — User I/O pin (bank 3) |
| Pino 20 | I/O — User I/O pin (bank 3) |
| Pino 21 | I/O — User I/O pin (bank 3) |
| Pino 22 | I/O — User I/O pin (bank 3) |
| Pino 23 | I/O — User I/O pin (bank 3) |
| Pino 24 | I/O — User I/O pin (bank 3) |
| Pino 25 | I/O — User I/O pin (bank 3) |
| Pino 26 | I/O — User I/O pin (bank 4) |
| Pino 27 | I/O — User I/O pin (bank 4) |
| Pino 28 | I/O — User I/O pin (bank 4) |
| Pino 29 | I/O — User I/O pin (bank 4) |
| Pino 30 | I/O — User I/O pin (bank 4) |
| Pino 31 | I/O — User I/O pin (bank 4) |
| Pino 32 | I/O — User I/O pin (bank 4) |
| Pino 33 | I/O — User I/O pin (bank 4) |
| Pino 34 | I/O — User I/O pin (bank 5) |
| Pino 35 | I/O — User I/O pin (bank 5) |
| Pino 36 | I/O — User I/O pin (bank 5) |
| Pino 37 | I/O — User I/O pin (bank 5) |
| Pino 38 | I/O — User I/O pin (bank 5) |
| Pino 39 | I/O — User I/O pin (bank 5) |
| Pino 40 | I/O — User I/O pin (bank 5) |
| Pino 41 | I/O — User I/O pin (bank 5) |
| Pino 42 | VCCINT — Core supply voltage (2.5V) |
| Pino 43 | I/O — User I/O pin (bank 6) |
| Pino 44 | I/O — User I/O pin (bank 6) |
| Pino 45 | I/O — User I/O pin (bank 6) |
| Pino 46 | I/O — User I/O pin (bank 6) |
| Pino 47 | I/O — User I/O pin (bank 6) |
| Pino 48 | I/O — User I/O pin (bank 6) |
| Pino 49 | I/O — User I/O pin (bank 6) |
| Pino 50 | I/O — User I/O pin (bank 6) |
| Pino 51 | I/O — User I/O pin (bank 7) |
| Pino 52 | I/O — User I/O pin (bank 7) |
| Pino 53 | I/O — User I/O pin (bank 7) |
| Pino 54 | I/O — User I/O pin (bank 7) |
| Pino 55 | I/O — User I/O pin (bank 7) |
| Pino 56 | I/O — User I/O pin (bank 7) |
| Pino 57 | I/O — User I/O pin (bank 7) |
| Pino 58 | I/O — User I/O pin (bank 7) |
| Pino 59 | VCCIO — I/O supply voltage (bank 7) |
| Pino 60 | I/O — User I/O pin (bank 8) |
| Pino 61 | I/O — User I/O pin (bank 8) |
| Pino 62 | I/O — User I/O pin (bank 8) |
| Pino 63 | I/O — User I/O pin (bank 8) |
| Pino 64 | I/O — User I/O pin (bank 8) |
| Pino 65 | I/O — User I/O pin (bank 8) |
| Pino 66 | I/O — User I/O pin (bank 8) |
| Pino 67 | I/O — User I/O pin (bank 8) |
| Pino 68 | I/O — User I/O pin (bank 1, lower) |
| Pino 69 | I/O — User I/O pin (bank 1, lower) |
| Pino 70 | I/O — User I/O pin (bank 1, lower) |
| Pino 71 | I/O — User I/O pin (bank 1, lower) |
| Pino 72 | I/O — User I/O pin (bank 1, lower) |
| Pino 73 | I/O — User I/O pin (bank 1, lower) |
| Pino 74 | I/O — User I/O pin (bank 1, lower) |
| Pino 75 | I/O — User I/O pin (bank 1, lower) |
| Pino 76 | GND — Ground |
| Pino 77 | I/O — User I/O pin (bank 2, lower) |
| Pino 78 | I/O — User I/O pin (bank 2, lower) |
| Pino 79 | I/O — User I/O pin (bank 2, lower) |
| Pino 80 | I/O — User I/O pin (bank 2, lower) |
| Pino 81 | I/O — User I/O pin (bank 2, lower) |
| Pino 82 | I/O — User I/O pin (bank 2, lower) |
| Pino 83 | I/O — User I/O pin (bank 2, lower) |
| Pino 84 | I/O — User I/O pin (bank 2, lower) |
| Pino 85 | I/O — User I/O pin (bank 3, lower) |
| Pino 86 | I/O — User I/O pin (bank 3, lower) |
| Pino 87 | I/O — User I/O pin (bank 3, lower) |
| Pino 88 | I/O — User I/O pin (bank 3, lower) |
| Pino 89 | I/O — User I/O pin (bank 3, lower) |
| Pino 90 | I/O — User I/O pin (bank 3, lower) |
| Pino 91 | I/O — User I/O pin (bank 3, lower) |
| Pino 92 | I/O — User I/O pin (bank 3, lower) |
| Pino 93 | VCCINT — Core supply voltage (2.5V) |
| Pino 94 | I/O — User I/O pin (bank 4, lower) |
| Pino 95 | I/O — User I/O pin (bank 4, lower) |
| Pino 96 | I/O — User I/O pin (bank 4, lower) |
| Pino 97 | I/O — User I/O pin (bank 4, lower) |
| Pino 98 | I/O — User I/O pin (bank 4, lower) |
| Pino 99 | I/O — User I/O pin (bank 4, lower) |
| Pino 100 | I/O — User I/O pin (bank 4, lower) |
| Pino 101 | I/O — User I/O pin (bank 4, lower) |
| Pino 102 | I/O — User I/O pin (bank 5, lower) |
| Pino 103 | I/O — User I/O pin (bank 5, lower) |
| Pino 104 | I/O — User I/O pin (bank 5, lower) |
| Pino 105 | I/O — User I/O pin (bank 5, lower) |
| Pino 106 | I/O — User I/O pin (bank 5, lower) |
| Pino 107 | I/O — User I/O pin (bank 5, lower) |
| Pino 108 | I/O — User I/O pin (bank 5, lower) |
| Pino 109 | I/O — User I/O pin (bank 5, lower) |
| Pino 110 | GND — Ground |
| Pino 111 | I/O — User I/O pin (bank 6, lower) |
| Pino 112 | I/O — User I/O pin (bank 6, lower) |
| Pino 113 | I/O — User I/O pin (bank 6, lower) |
| Pino 114 | I/O — User I/O pin (bank 6, lower) |
| Pino 115 | I/O — User I/O pin (bank 6, lower) |
| Pino 116 | I/O — User I/O pin (bank 6, lower) |
| Pino 117 | I/O — User I/O pin (bank 6, lower) |
| Pino 118 | I/O — User I/O pin (bank 6, lower) |
| Pino 119 | I/O — User I/O pin (bank 7, lower) |
| Pino 120 | I/O — User I/O pin (bank 7, lower) |
| Pino 121 | I/O — User I/O pin (bank 7, lower) |
| Pino 122 | I/O — User I/O pin (bank 7, lower) |
| Pino 123 | I/O — User I/O pin (bank 7, lower) |
| Pino 124 | I/O — User I/O pin (bank 7, lower) |
| Pino 125 | I/O — User I/O pin (bank 7, lower) |
| Pino 126 | I/O — User I/O pin (bank 7, lower) |
| Pino 127 | VCCIO — I/O supply voltage (bank 7) |
| Pino 128 | I/O — User I/O pin (bank 8, lower) |
| Pino 129 | I/O — User I/O pin (bank 8, lower) |
| Pino 130 | I/O — User I/O pin (bank 8, lower) |
| Pino 131 | I/O — User I/O pin (bank 8, lower) |
| Pino 132 | I/O — User I/O pin (bank 8, lower) |
| Pino 133 | I/O — User I/O pin (bank 8, lower) |
| Pino 134 | I/O — User I/O pin (bank 8, lower) |
| Pino 135 | I/O — User I/O pin (bank 8, lower) |
| Pino 136 | DCLK — Configuration clock (dedicated input) |
| Pino 137 | DATA0 — Configuration data input (dedicated input) |
| Pino 138 | nCONFIG — Configuration control (dedicated input, active low) |
| Pino 139 | nSTATUS — Configuration status output (dedicated, active low) |
| Pino 140 | CONF_DONE — Configuration done output (dedicated) |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
| Pino 145 | I/O — User I/O pin (bank 2) |
| Pino 146 | I/O — User I/O pin (bank 2) |
| Pino 147 | I/O — User I/O pin (bank 2) |
| Pino 148 | I/O — User I/O pin (bank 2) |
| Pino 149 | I/O — User I/O pin (bank 3) |
| Pino 150 | I/O — User I/O pin (bank 3) |
| Pino 151 | I/O — User I/O pin (bank 3) |
| Pino 152 | I/O — User I/O pin (bank 3) |
| Pino 153 | VCCINT — Core supply voltage (2.5V) |
| Pino 154 | I/O — User I/O pin (bank 4) |
| Pino 155 | I/O — User I/O pin (bank 4) |
| Pino 156 | I/O — User I/O pin (bank 4) |
| Pino 157 | I/O — User I/O pin (bank 4) |
| Pino 158 | I/O — User I/O pin (bank 5) |
| Pino 159 | I/O — User I/O pin (bank 5) |
| Pino 160 | I/O — User I/O pin (bank 5) |
| Pino 161 | I/O — User I/O pin (bank 5) |
| Pino 162 | GND — Ground |
| Pino 163 | I/O — User I/O pin (bank 6) |
| Pino 164 | I/O — User I/O pin (bank 6) |
| Pino 165 | I/O — User I/O pin (bank 6) |
| Pino 166 | I/O — User I/O pin (bank 6) |
| Pino 167 | I/O — User I/O pin (bank 7) |
| Pino 168 | I/O — User I/O pin (bank 7) |
| Pino 169 | I/O — User I/O pin (bank 7) |
| Pino 170 | I/O — User I/O pin (bank 7) |
| Pino 171 | I/O — User I/O pin (bank 8) |
| Pino 172 | I/O — User I/O pin (bank 8) |
| Pino 173 | I/O — User I/O pin (bank 8) |
| Pino 174 | I/O — User I/O pin (bank 8) |
| Pino 175 | I/O — User I/O pin (bank 1, lower) |
| Pino 176 | I/O — User I/O pin (bank 1, lower) |
| Pino 177 | I/O — User I/O pin (bank 2, lower) |
| Pino 178 | I/O — User I/O pin (bank 2, lower) |
| Pino 179 | I/O — User I/O pin (bank 3, lower) |
| Pino 180 | I/O — User I/O pin (bank 3, lower) |
| Pino 181 | I/O — User I/O pin (bank 4, lower) |
| Pino 182 | I/O — User I/O pin (bank 4, lower) |
| Pino 183 | VCCIO — I/O supply voltage (bank 4) |
| Pino 184 | I/O — User I/O pin (bank 5, lower) |
| Pino 185 | I/O — User I/O pin (bank 5, lower) |
| Pino 186 | I/O — User I/O pin (bank 6, lower) |
| Pino 187 | I/O — User I/O pin (bank 6, lower) |
| Pino 188 | I/O — User I/O pin (bank 7, lower) |
| Pino 189 | I/O — User I/O pin (bank 7, lower) |
| Pino 190 | I/O — User I/O pin (bank 8, lower) |
| Pino 191 | I/O — User I/O pin (bank 8, lower) |
| Pino 192 | GND — Ground |
| Pino 193 | DEV_CLRn — Device-wide clear (dedicated input, active low) |
| Pino 194 | DEV_OE — Device-wide output enable (dedicated input) |
| Pino 195 | MSEL0 — Configuration mode select 0 (dedicated input) |
| Pino 196 | MSEL1 — Configuration mode select 1 (dedicated input) |
| Pino 197 | I/O — User I/O pin (bank 1, lower) |
| Pino 198 | I/O — User I/O pin (bank 2, lower) |
| Pino 199 | I/O — User I/O pin (bank 3, lower) |
| Pino 200 | I/O — User I/O pin (bank 4, lower) |
| Pino 201 | I/O — User I/O pin (bank 5, lower) |
| Pino 202 | I/O — User I/O pin (bank 6, lower) |
| Pino 203 | I/O — User I/O pin (bank 7, lower) |
| Pino 204 | I/O — User I/O pin (bank 8, lower) |
| Pino 205 | VCCINT — Core supply voltage (2.5V) |
| Pino 206 | I/O — User I/O pin (bank 1, lower) |
| Pino 207 | I/O — User I/O pin (bank 2, lower) |
| Pino 208 | I/O — User I/O pin (bank 3, lower) |
Aplicações típicas
EP20K200RC208-3N é adequado para 6 aplicaçãos: Telecommunications Line Card Interface, Industrial Control and Automation, DSP Co-Processor and Custom Peripheral, ASIC Prototyping Platform, PCI Bus Interface and Bridge Card, Custom Memory Controller and Buffer Board.
Telecommunications Line Card Interface
The EP20K200RC208-3N's 200K system gates and 144 user I/O pins make it well-suited for telecom line-card glue logic where multiple serial protocols, framing controllers, and backplane interfaces must coexist on one board. Its MultiCore architecture integrates look-up table logic for state machines alongside embedded system blocks that hold framing buffers and lookup tables, eliminating external SRAM in many designs. The 167 MHz maximum frequency supports OC-3 / STM-1 class line rates after deserialization. Designers typically implement UTOPIA, POS-PHY, or custom LVDS backplane bridges in this device, taking advantage of its LVDS I/O capability for noise-immune board-to-board signaling. The exposed pad on the 208-RQFP package aids thermal dissipation in sealed line-card enclosures with limited airflow.
Recomendado
Industrial Control and Automation
For industrial PLC and motion-control boards, the EP20K200RC208-3N provides the gate density needed to implement multiple encoder counters, PWM generators, and fieldbus protocol controllers in a single chip. Its industrial 0C to +85C temperature grade suits factory-floor environments, while the 144 I/O pins accommodate dozens of opto-isolated digital inputs and relay-driver outputs. The embedded memory blocks serve as dual-port RAMs for commutation tables and trajectory buffers, allowing precise multi-axis motion control without external memory. The device's mature Quartus II toolchain also simplifies IEC 61131-3 style function block implementation and SIL-rated safety logic on the same die.
Recomendado
DSP Co-Processor and Custom Peripheral
The EP20K200RC208-3N is frequently paired with a host DSP or microprocessor as a high-density co-processor for custom datapath acceleration. With 8320 logic elements and 106 Kbits of embedded memory, the FPGA can implement custom FFT pipelines, Viterbi decoders, or proprietary codec accelerators that offload the host processor. Its 167 MHz fabric supports sample rates up to ~80 MSPS in pipelined designs, while the 144 I/O pins expose wide parallel data buses to the host CPU. Designers often use the device as a bridge between a TI TMS320 DSP and a high-speed ADC/DAC, leveraging the LVDS I/O for jitter-resistant clock distribution.
Recomendado
ASIC Prototyping Platform
ASIC design teams historically used the EP20K200RC208-3N as a verification vehicle for gate-level netlists targeting 200K-gate ASICs. Its MultiCore architecture closely approximates ASIC standard-cell behavior, including embedded memory blocks that map cleanly to compiled SRAMs. The 208-RQFP package is breadboard-friendly, allowing rapid bring-up of prototype boards in the same form factor as the eventual ASIC. The Quartus II design flow supports industry-standard Verilog and VHDL synthesis with timing-driven place and route, giving designers confidence that silicon behavior will match FPGA emulation.
Recomendado
PCI Bus Interface and Bridge Card
The EP20K200RC208-3N was a popular choice for PCI and PCI-X bridge cards in the early 2000s, where its 144 I/O pins easily accommodate the 32-bit/64-bit PCI bus plus local-side memory and peripheral interfaces. The device's 167 MHz fabric comfortably meets the 66 MHz PCI-X specification with margin, while embedded memory blocks implement target/initiator FIFOs without external SRAM. Designers can implement custom DMA engines, scatter-gather controllers, and interrupt handling logic alongside the PCI core. The exposed thermal pad on the BFQFP package supports reliable operation in densely populated PCI backplane slots.
Recomendado
Custom Memory Controller and Buffer Board
Memory-intensive designs such as DDR SDRAM controllers, large FIFO buffers, and protocol-specific queue managers benefit from the EP20K200RC208-3N's 106,496 bits of embedded memory combined with its LUT-rich logic. The device can implement multi-port memory controllers with concurrent read/write ports, while the 144 I/O pins support wide external data buses to supplementary SRAM or SDRAM. Its 167 MHz fabric enables DDR-266 class memory interfaces when properly timed in Quartus II, and the exposed pad on the BFQFP package aids thermal dissipation during sustained high-throughput operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K200RC208-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K200RC208-3 | EP20K200RC208-2 | EP20K200RC208-1 | EP20K200RC208-1N | EP20K200RC208-1X |
|---|---|---|---|---|---|---|
| Package | 208-RQFP / BFQFP (0.5mm pitch, exposed pad) | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same | 208-RQFP - same |
| Brand | Altera (now Intel) | Altera | Altera | Altera | Altera | Altera |
| System Gates | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 |
| Logic Elements | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells | 8320 cells |
| Embedded Memory | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
| Speed Grade | -3 | -3 | -2 (slower) | -1 (slowest) | -1 (slowest) | -1 (slowest) |
| Temperature Grade | Industrial (0C to +85C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (0C to +85C) | Industrial (0C to +85C), lead-free |
| Maximum Frequency | 167 MHz | 167 MHz | ~150 MHz (estimated, slower grade) | ~130 MHz (estimated, slowest grade) | ~130 MHz (estimated) | ~130 MHz (estimated) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Fastest speed grade available in 208-RQFP package (vs EP20K200RC208-2)
- Industrial temperature grade for harsh environments (vs EP20K200RC208-3)
- Highest density APEX-20K in 208-RQFP with full 144 I/O (vs EP20K100RC208 series)
Notas de projeto
The EP20K200RC208-3N's 208-RQFP / BFQFP package exposes a thermal pad on the underside of the die that MUST be soldered to a copper pour on the PCB. Without this thermal path, junction temperature can exceed 125C under sustained high-utilization designs, especially when many I/O banks toggle simultaneously at 167 MHz. Recommended: at least 1 square inch of 2 oz copper connected to the exposed pad, with thermal vias to inner ground planes.
Provide separate decoupling for VCCINT (2.5V core) and VCCIO (per-bank I/O supply). Use one 0.1 uF ceramic capacitor per VCC pin placed within 3 mm of the package lead, plus bulk 10-100 uF tantalum or polymer capacitors on each supply rail. Estimated core current at full 167 MHz utilization can reach 500 mA; budget your regulator accordingly. Add a ferrite bead between analog and digital grounds if mixed-signal I/O banks are used.
Configure the FPGA in JTAG mode (MSEL pins strapped appropriately) for production boards to allow in-system reprogramming via the ByteBlaster or USB-Blaster cable. Place JTAG header within 50 mm of the device to keep signal integrity. Route all configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE) away from fast-switching I/O to avoid noise-induced configuration errors. Always include a 1k pull-up on nCONFIG and a 1k pull-up on nSTATUS per Altera reference design.
The EP20K200RC208-3N is NOT pin-compatible with the APEX-20KE variant EP20K200EQC208-3N despite the similar package - core voltage differs (2.5V vs 1.8V) and pinout assignments may vary. Verify pinout against the official datasheet before PCB rework. Also note: Quartus II version compatibility - older Quartus II Web Edition releases support APEX-20K; ensure you have a Quartus II subscription license or use a legacy version that retains APEX support.
Informações de conformidade
Original APEX-20K family pre-dates widespread RoHS adoption. Lead-free variants are designated by the 'X' suffix (e.g. EP20K200RC208-1X). Request RoHS/REACH declaration from supplier for specific date code. Not AEC-Q100 qualified - this family targets commercial/industrial, not automotive.
