EP20K400BC652-2XV - 400K Gate APEX-20KC FPGA 652-BGA | Altera
N.º da peça: EP20K400BC652-2XV ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252 | $2.520,00 |
| 100 | $218 | $21.800,00 |
| 500 | $189 | $94.500,00 |
| 1.000 | $165 | $165.000,00 |
EP20K400BC652-2XV Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through configuration rather than fixed silicon. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA. The APEX-20KC family specifically introduced MultiCore architecture that integrates LUT logic, product-term logic, and embedded memory blocks on a single die - an early example of heterogeneous compute on a programmable fabric that enabled SOPC (System-on-a-Programmable-Chip) integration.
Key features of the EP20K400BC652-2XV include 502 user I/O pins, 4 dedicated inputs, a 0.22 micrometer CMOS process, and an internal core voltage around 1.8V with 2.5V I/O support. Maximum toggle performance reaches 200 MHz according to distributor summaries, while pin-to-pin delay is specified at 3.1 ns in the PLD timing model. The MultiCore architecture lets designers mix register-intensive LUT logic with product-term logic for glue functions, which was unusual at the time of release.
The device supports in-system programming via the IEEE 1149.1 JTAG interface and the Altera serial configuration scheme, allowing board-level configuration without removing the part. The 652-BGA (45x45 mm) package provides ample signal escape for the 502 I/O pins and supports surface-mount reflow assembly on standard FR-4 PCB substrates.
Typical applications include telecommunications line cards, industrial motor control, military and aerospace ruggedized systems, medical imaging front-end pre-processing, and DSP co-processing in legacy test equipment. The wide I/O count supports parallel bus architectures such as PCI, HSTL, and LVDS interfaces that were common in late-1990s and early-2000s designs.
When designing with this part, ensure the configuration mode (passive serial, JTAG, or parallel) is properly selected via MSEL pins at board power-up. The 652-BGA package requires X-ray inspection for solder joint verification since BGA balls are hidden beneath the package; plan PCB pad design with non-solder-mask-defined (NSMD) pads for best reliability.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the standalone datasheet.
Alternativas drop-in para EP20K400BC652-2XV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K400BC652-2XV (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Series, Process Technology, Speed Grade.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K400BC652-2X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K400BC652-2V
✅ Drop-In✓ Em estoque
$260 / unidade
Ver ficha técnica →EP20K400BC652-1XV
✅ Drop-In✓ Em estoque
$115 / unidade
Ver ficha técnica →EP20K400BC652-1X
✅ Drop-In✓ Em estoque
$140 / unidade
Ver ficha técnica →EP20K400BC652-2AA
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K400EBC652-2
✅ Drop-In✓ Em estoque
$60 / unidade
Ver ficha técnica →EP20K400BC652-2XV Classificações máximas e características elétricas
| Series | APEX-20KC |
| Family | APEX 20K |
| Logic Elements / Cells | 16640 |
| Total System Gates | 400000 |
| Number of I/O | 502 |
| Number of Dedicated Inputs | 4 |
| Total RAM Bits | 212992 |
| Voltage - Supply (Core) | 1.71 V to 1.89 V |
| Voltage - I/O | 2.5 V |
| Temperatura de operação | -40C to +85C (industrial, per -XV suffix) |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 652-BGA (45x45 mm) |
| Supplier Device Package | 652-BGA |
| Process Technology | 0.22 micrometer CMOS |
| Pin-to-Pin Delay | 3.1 ns |
| Speed Grade | -2 |
| Status RoHS | Compliant (modern re-stocked inventory) |
Guia de Configuração de Pinos do EP20K400BC652-2XV 652-bga
Configuração de pinos para EP20K400BC652-2XV (pacote 652-bga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K400BC652-2XV.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K400BC652-2XV é adequado para 6 aplicaçãos: Telecommunications Line Cards, Industrial Motor Control, Military and Aerospace Ruggedized Systems, Medical Imaging Front-End Pre-Processing, DSP Co-Processing in Legacy Test Equipment, Parallel Bus Bridge and Protocol Conversion.
Telecommunications Line Cards
The EP20K400BC652-2XV fits telecom line-card designs because its 502 user I/O pins and MultiCore architecture can implement parallel bus interfaces, framing logic, and glue functions that surround an ASIC or network processor. The 3.1 ns pin-to-pin delay supports 200 MHz operation, sufficient for legacy TDM and early Ethernet backplane designs. The industrial temperature grade (-40C to +85C) handles uncontrolled outdoor cabinet environments. Designers typically route JTAG to a header for in-system programming and field firmware upgrades. The 1.8V core and 2.5V I/O rails integrate cleanly with the LVTTL and HSTL I/O standards common in late-1990s telecom backplanes. For new designs, the part is obsolete but remains supported through Rochester Electronics long-term stocking programs.
Recomendado
Industrial Motor Control
The EP20K400BC652-2XV suits industrial motor-control boards because its 16,640 logic elements and embedded memory blocks can implement PWM generators, encoder interfaces, and field-oriented control state machines in a single device. The -40C to +85C industrial temperature range handles factory-floor ambient swings without derating. The MultiCore architecture lets designers mix product-term logic for fast glue between gate drivers with LUT logic for the control loop, reducing external MSI parts. The 502 I/O pins are sufficient to interface directly with multi-axis resolver feedback and three-phase gate-driver outputs. Existing designs continue to use this part for long-life machinery where re-validation costs outweigh migration savings.
Recomendado
Military and Aerospace Ruggedized Systems
The EP20K400BC652-2XV is used in legacy military and aerospace programs because its industrial temperature grade and surface-mount BGA package meet the size, weight, and environmental envelope of avionics and ground-vehicle electronics. The MultiCore SOPC integration allows a single device to host bus interfaces, signal processing, and timing logic, reducing the bill of materials in size-constrained LRUs. The JTAG configuration path supports the mandatory in-system programming flows required by military program offices. The 652-BGA package requires X-ray inspection for solder joint verification, which is standard in mil-aero production lines. Many of these programs are now in sustainment phase, with Rochester Electronics providing the long-term silicon supply chain.
Recomendado
Medical Imaging Front-End Pre-Processing
The EP20K400BC652-2XV fits medical imaging front-end boards such as ultrasound beamformers and X-ray detector interfaces where 16,640 logic elements and 212 Kbits of block RAM can implement real-time data-acquisition pipelines. The 502 I/O pins accept parallel LVDS data from analog front-end ADCs without an intermediate bridge chip. The 1.8V core voltage reduces on-die power compared to older 5V FPGAs, an important factor in patient-proximal electronics. The MultiCore product-term logic accelerates fast comparator paths while LUT blocks implement FIR filtering. The -40C to +85C industrial range supports clinical environments without additional thermal conditioning. Newer designs migrate to Cyclone IV/V but legacy installed bases continue to rely on this part.
Recomendado
DSP Co-Processing in Legacy Test Equipment
The EP20K400BC652-2XV acts as a DSP co-processor in bench-top and ATE-class test equipment where it accelerates FFTs, filtering, and modulation/demodulation blocks alongside a host CPU or DSP. The MultiCore embedded memory blocks are well suited to holding FFT twiddle factors and sample buffers, while LUT logic builds custom datapaths. The 200 MHz internal performance and 3.1 ns pin-to-pin delay are sufficient for mid-bandwidth signal-processing paths typical of legacy spectrum analyzers and protocol testers. The 502 I/O count accommodates parallel LVTTL/HSTL data buses to high-speed ADCs and DACs. The 652-BGA package supports the multi-layer board stackups common in RF test instruments. Long-life test platforms continue to use this part through franchised legacy supply.
Recomendado
Parallel Bus Bridge and Protocol Conversion
The EP20K400BC652-2XV is well suited to protocol-conversion and bus-bridge applications, such as PCI-to-local bus bridges, HSTL-to-LVTTL level translators with logic, or VMEbus interface cards. The 502 user I/O pins can simultaneously drive a 32-bit local bus plus a 32-bit PCI bus plus control/status signals. The MultiCore product-term logic accelerates fast decoder paths while LUT logic implements state machines and FIFOs. The 212 Kbits of embedded memory hosts small FIFOs and lookup tables without external SRAM. The industrial temperature grade supports factory and outdoor cabinets. The 652-BGA package requires NSMD pads for reliable reflow. Legacy embedded computing systems continue to deploy this part in long-life platforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K400BC652-2XV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K400BC652-2X | EP20K400BC652-2V | EP20K400BC652-1XV | EP20K400BC652-1X | EP20K400BC652-2AA | EP20K400EBC652-2 |
|---|---|---|---|---|---|---|---|
| Package | 652-BGA (45x45 mm) | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same | 652-BGA (45x45 mm) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Series / Family | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KC | APEX-20KE (lower power) |
| Speed Grade | -2 | -2 | -2 | -1 (slower) | -1 (slower) | -2 | -2 |
| Total System Gates | 400000 | 400000 | 400000 | 400000 | 400000 | 400000 | 400000 |
| Logic Elements / Cells | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| Total RAM Bits | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| User I/O Pins | 502 | 502 | 502 | 502 | 502 | 502 | 502 |
Principais diferenciais
- Industrial temperature grade on the -2 speed grade (vs EP20K400BC652-2X)
- Highest speed grade in the 400K-gate 652-BGA family (vs EP20K400BC652-1XV)
- APEX-20KC family with MultiCore SOPC integration (vs EP20K400EBC652-2 (APEX-20KE))
Notas de projeto
The 652-BGA package uses hidden solder balls that cannot be visually inspected after reflow; budget for X-ray inspection on first-article and production lots. Use NSMD (non-solder-mask-defined) PCB pads rather than SMD pads - NSMD pads give stronger solder joint reliability because the solder wets the pad edge. Confirm the PCB pad diameter and pitch against the Altera package mechanical drawing before fab release; BGA pad errors are the leading cause of yield loss.
The EP20K400BC652-2XV requires two rails: 1.71-1.89V for VCCINT (core) and 2.5V for VCCIO. Power sequencing must satisfy Altera's APEX-20KC requirements - VCCINT must ramp before or simultaneously with VCCIO to avoid I/O latch-up. Place 100 nF decoupling caps on every VCCINT/VCCIO ball pair, plus bulk 10-100 uF tantalum or polymer caps near the package. Estimated: with 400K gates switching at 200 MHz, expect 1-3W core dissipation depending on toggle rate.
Configure the MSEL[2:0] pins correctly for the chosen configuration mode (PS, PPS, PPA, AS, or JTAG). Strap MSEL with 10 kohm pull-ups or pull-downs to 3.3V-tolerant logic. JTAG (TCK, TMS, TDI, TDO, TRST) signals must be routed with 50 ohm characteristic impedance and length-matched within the chain. Keep configuration clock (DCLK) traces short and away from switching I/O to avoid configuration failures. The nCONFIG and nSTATUS pins must each have a 10 kohm pull-up to VCCIO for proper power-on behavior.
Informações de conformidade
RoHS compliance confirmed via Rochester Electronics re-stocking documentation; AEC-Q100 is not applicable (FPGA, not an automotive-grade IC). Lead-free reflow compatible. Halogen-free status is unknown because Altera legacy datasheets predate halogen-free marking requirements.