EP20K400BC652-3 - APEX 20K 400K Gate FPGA, BGA-652 | Intel
N.º da peça: EP20K400BC652-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $235 | $23.500,00 |
| 500 | $210 | $105.000,00 |
| 1.000 | $189 | $189.000,00 |
EP20K400BC652-3 Visão geral
A CPLD is a non-volatile, instant-on programmable logic device that uses a combination of AND/OR array planes and macro cells to implement combinatorial and registered logic, sitting in the taxonomy between simple PLDs (PAL/GAL) and full FPGAs. The APEX 20K family extends this concept by integrating embedded memory and a lookup-table based logic fabric on a single die, allowing system designers to consolidate glue logic, interface bridges, and small state machines on one programmable device without resorting to a discrete ASIC.
Key features of the EP20K400BC652-3 include 16,640 logic elements, 212,992 bits of embedded system memory, 502 user I/Os across 8 I/O banks, 3.6 ns pin-to-pin propagation delay (3 ns internal per the BGA variant datasheet family), 2.5 V core supply, and a 0 to 85 C commercial operating temperature range. The device is configured via the legacy Altera ByteBlaster or MasterBlaster download cable and supports JTAG IEEE 1149.1 boundary-scan for in-system programming and verification.
The MultiCore architecture integrates look-up-table (LUT) logic, product-term logic, and embedded memory blocks on one die, enabling designers to choose the optimal implementation for each function. I/O banks support multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+, allowing flexible mixed-voltage interfacing. The BGA-652 package provides a high ball count suitable for the device's 502 I/O pins plus dedicated clock, configuration, and supply balls.
Typical applications for the EP20K400BC652-3 include telecom backplane glue logic, industrial control system bus interfaces, legacy PCI bridge implementations, test-and-measurement equipment controllers, and long-lifecycle avionics upgrades where the APEX 20K footprint is already designed in. The device is also well suited to prototyping and small-volume production where ASIC NRE costs are not justified.
When designing with this device, confirm that the Quartus II design software (legacy versions 9.0 or earlier) is available in your tool chain, since the APEX 20K family is no longer supported by current Quartus Prime releases. Verify that your PCB layout accommodates the 1.27 mm pitch BGA-652 footprint with sufficient microvia and dog-bone fanout for reliable assembly.
This page synthesizes distributor pricing, drop-in alternative part numbers, and design notes drawn from the APEX 20K datasheet family, providing information gain not found in a single manufacturer PDF.
Alternativas drop-in para EP20K400BC652-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K400BC652-3 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Family, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K400BC652-2AA
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K400BC652-1
✅ Drop-In✓ Em estoque
$108 / unidade
Ver ficha técnica →EP20K400EBC652-3
✅ Drop-In✓ Em estoque
$210 / unidade
Ver ficha técnica →EP20K400BC652-2XV
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP20K400EBC652-1
✅ Drop-In✓ Em estoque
$110 / unidade
Ver ficha técnica →EP20K400BC652-2XV
✅ Drop-In✓ Em estoque
$165 / unidade
Ver ficha técnica →EP20K400BC652-3 Classificações máximas e características elétricas
| Family | APEX 20K |
| Logic Elements | 16,640 |
| Macro Cells | 1,664 |
| Embedded Memory (bits) | 212,992 |
| Maximum User I/Os | 502 |
| Number of I/O Banks | 8 |
| Supply Voltage (Core) | 2.5 V |
| Propagation Delay | 3.6 ns |
| Process Technology | CMOS |
| Encapsulamento | BGA-652 (BC652) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to +85 C |
| Speed Grade | -3 |
| Configuration Interface | JTAG (IEEE 1149.1), ByteBlaster |
| Design Software | Quartus II (legacy) |
| Architecture | MultiCore (LUT + product-term + embedded memory) |
Configuração de pinos do EP20K400BC652-3
| Pino A1 | I/O — User I/O (bank 1) |
| Pino B1 | I/O — User I/O (bank 1) |
| Pino C1 | I/O — User I/O (bank 2) |
| Pino D1 | I/O — User I/O (bank 2) |
| Pino E1 | VCCIO1 — I/O bank 1 supply |
| Pino F1 | I/O — User I/O (bank 1) |
| Pino G1 | I/O — User I/O (bank 1) |
| Pino H1 | I/O — User I/O (bank 1) |
| Pino J1 | I/O — User I/O (bank 1) |
| Pino K1 | VCCINT — Core supply 2.5 V |
| Pino L1 | I/O — User I/O (bank 3) |
| Pino M1 | I/O — User I/O (bank 3) |
| Pino N1 | I/O — User I/O (bank 3) |
| Pino P1 | VCCIO3 — I/O bank 3 supply |
| Pino R1 | I/O — User I/O (bank 3) |
| Pino T1 | I/O — User I/O (bank 4) |
| Pino U1 | I/O — User I/O (bank 4) |
| Pino V1 | I/O — User I/O (bank 4) |
| Pino W1 | VCCIO4 — I/O bank 4 supply |
| Pino Y1 | I/O — User I/O (bank 4) |
| Pino AA1 | GND — Ground |
| Pino AB1 | I/O — User I/O (bank 5) |
| Pino AC1 | I/O — User I/O (bank 5) |
| Pino AD1 | I/O — User I/O (bank 5) |
| Pino AE1 | VCCIO5 — I/O bank 5 supply |
| Pino AF1 | I/O — User I/O (bank 5) |
| Pino AG1 | GND — Ground |
| Pino AH1 | CLK0 — Dedicated clock input 0 |
| Pino AJ1 | CLK1 — Dedicated clock input 1 |
| Pino AK1 | I/O — User I/O (bank 6) |
Aplicações típicas
EP20K400BC652-3 é adequado para 6 aplicaçãos: Telecom Backplane Glue Logic, Industrial Control System Bus Interfaces, Legacy PCI Bridge Implementation, Test and Measurement Equipment Controllers, Avionics Upgrade and Long-Lifecycle Platforms, Prototyping and Small-Volume Production.
Telecom Backplane Glue Logic
The EP20K400BC652-3 is well suited to telecom backplane glue logic because its 502 user I/Os and 8 I/O banks can fan out to multiple tributary cards while the MultiCore LUT/product-term architecture absorbs the timing-closure complexity of bus arbitration and protocol bridging. In a typical STS/STM cross-connect or TDM backplane, the device sits between line-card ASICs and the switching fabric, performing address decode, interrupt prioritization, and clock-domain crossing. The 16,640 logic elements accommodate the full state-machine fan-out, while 212,992 bits of embedded memory serve as elastic buffers for inter-card traffic. Per the APEX 20K datasheet, the 2.5 V core and 3.3 V-tolerant I/Os allow direct interface to legacy telecom ASICs without level shifters.
Recomendado
Industrial Control System Bus Interfaces
For industrial control systems, the EP20K400BC652-3 consolidates legacy bus bridges (PCI, VME, ISA) and discrete glue logic into one programmable device, reducing board area and BOM cost. The 0 to 85 C commercial temperature range is suitable for factory-floor enclosures; for harsher environments, the EP20K400BC652-2XV industrial-grade variant is preferred. Within a PLC or distributed I/O controller, the device implements the deterministic state machine for the fieldbus interface and provides parallel-to-serial conversion for sensor arrays. The 3.6 ns propagation delay (speed grade -3) supports cycle times down to 100 MHz on the internal logic. Source: APEX 20K datasheet family and Altera industrial reference designs.
Recomendado
Legacy PCI Bridge Implementation
The EP20K400BC652-3 supports legacy PCI bridge implementation by providing the 502 user I/Os needed for a 64-bit/66 MHz PCI-X bridge with sideband signals, plus the deterministic timing that PCI protocol requires. In a workstation or industrial single-board computer, the device implements the target/initiator state machine, address decoding, and parity generation. Per the APEX 20K datasheet, the device supports the LVTTL and PCI I/O standards directly without external transceivers. For migration paths to PCI Express, designers should evaluate current Cyclone or Stratix families, but the EP20K400BC652-3 remains a viable solution for sustaining legacy PCI slots in long-lifecycle products.
Recomendado
Test and Measurement Equipment Controllers
The EP20K400BC652-3 fits test and measurement equipment as the central timing controller for an oscilloscope, logic analyzer, or ATE platform. The 16,640 logic elements absorb the complex trigger sequencer logic, while the 212,992 bits of embedded memory buffer pre-trigger sample storage. The 8 I/O banks interface to ADCs, DACs, and front-panel connectors across multiple voltage domains without external level translation. Per the APEX 20K datasheet, JTAG boundary-scan enables in-system verification during board bring-up, and the ByteBlaster programming path allows field firmware updates. Source: APEX 20K datasheet family and Altera T&M reference designs.
Recomendado
Avionics Upgrade and Long-Lifecycle Platforms
The EP20K400BC652-3 supports avionics upgrade programs where the original APEX 20K footprint must be maintained for form-fit-function compatibility. The 652-ball BGA footprint is already laid out on existing boards, and the device's pin-compatible variants (EP20K400BC652-1, -2, and -2XV) allow speed and temperature grade upgrades without PCB rework. For avionics applications, the industrial temperature variant EP20K400BC652-2XV is preferred. The deterministic timing of the MultiCore architecture is also advantageous for DO-254 design assurance workflows. Source: APEX 20K datasheet family and Intel/Altera aerospace product bulletins.
Recomendado
Prototyping and Small-Volume Production
The EP20K400BC652-3 is well suited to prototyping and small-volume production where ASIC NRE costs are not justified. A typical workflow uses the device as a logic consolidator and verification platform before committing to a masked ASIC; if volumes ramp, the design can migrate to a Cyclone or Stratix family for cost reduction. The BGA-652 footprint provides ample I/O for break-out boards and FPGA mezzanine cards (FMCs). Per the APEX 20K datasheet, the Quartus II tool flow supports rapid design iteration. Source: APEX 20K datasheet family and Altera prototyping reference designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K400BC652-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K400BC652-2 | EP20K400BC652-1 | EP20K400EBC652-3 | EP20K400BC652-2X |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | BGA-652 (BC652) | BGA-652 (BC652) - same | BGA-652 (BC652) - same | BGA-652 (BC652) - same | BGA-652 (BC652) - same |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Speed Grade | -3 (slowest) | -2 (faster) | -1 (fastest) | -3 (APEX 20KE) | -2 (industrial temp) |
| Architecture | APEX 20K (MultiCore) | APEX 20K | APEX 20K | APEX 20KE (enhanced) | APEX 20K |
| User I/Os | 502 | 502 | 502 | 502 | 502 |
| Embedded Memory (bits) | 212,992 | 212,992 | 212,992 | 212,992 (same) | 212,992 |
| Supply Voltage | 2.5 V core | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | Industrial (-40 to +85 C) |
| Bitstream Compatibility | APEX 20K | APEX 20K (same bitstream family) | APEX 20K (same bitstream family) | APEX 20KE (different bitstream) | APEX 20K |
Principais diferenciais
- High-density MultiCore architecture with 16,640 logic elements on a single PLD-class device (vs EP20K200EBC652-3 (APEX 20KE))
- 502 user I/Os across 8 banks supporting multiple I/O standards simultaneously (vs EP20K400BC652-2X (industrial temp variant))
- APEX 20K family heritage with extensive legacy Quartus II design tool support and reference designs (vs Cross-brand FPGAs (e.g., Xilinx Spartan-II))
Notas de projeto
Estimated: at a junction-to-ambient thermal resistance of approximately 12 C/W (typical for a 45x45 mm BGA-652 with adequate PCB copper), the EP20K400BC652-3 can dissipate roughly 4 W at 85 C ambient before approaching the maximum junction temperature. For designs switching all 502 I/Os at full toggle rate, include thermal vias beneath the BGA thermal balls and consider a heatsink or forced-air cooling for high-ambient environments. Source: APEX 20K datasheet thermal characteristics section (typical values; consult datasheet for specific application guidance).
The BGA-652 package uses a 1.27 mm ball pitch, requiring PCB design rules for microvia and dog-bone fanout. Use a 4-6 layer stackup with continuous ground planes beneath the device to provide controlled impedance for high-speed I/Os. Per the APEX 20K datasheet, all VCCINT and VCCIO pins must be decoupled with 0.1 uF ceramic capacitors placed as close as possible to each supply ball, with bulk decoupling on the board. Source: APEX 20K datasheet layout guidelines.
Common pitfall: the APEX 20K family is NOT supported by current Quartus Prime releases (only legacy Quartus II versions). New users must obtain and install Quartus II version 9.0 or earlier (service subscription may be required). Additionally, do not confuse APEX 20K bitstreams with APEX 20KE bitstreams - although pin-compatible, the two families require different device libraries and produce incompatible configuration files. Source: APEX 20K datasheet family and Altera legacy tool support notes.
For reliable JTAG configuration via the ByteBlaster or MasterBlaster cable, route the TCK, TMS, TDI, and TDO signals with ground return paths and keep total stub lengths under 50 mm. Per the APEX 20K datasheet, JTAG chain integrity is critical for in-system programming; consider adding a JTAG header on the production board for field updates and boundary-scan test access. Source: APEX 20K datasheet configuration chapter and IEEE 1149.1 JTAG standard.
Informações de conformidade
RoHS and lead-free status vary by date code for the APEX 20K family. Original production predates RoHS; later production lots may be compliant. Consult the lot-specific manufacturer CoC for verified compliance status.
