EP20K600EFC672-2X - APEX 20KE 600K Gates FPGA | Intel/Altera
N.º da peça: EP20K600EFC672-2X ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $145 | $14.500,00 |
| 500 | $128 | $64.000,00 |
| 1.000 | $115 | $115.000,00 |
EP20K600EFC672-2X Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnects, and dedicated memory blocks on a single silicon die. APEX 20KE sits in the mid-to-large-capacity tier of early-2000s programmable logic, providing MultiCore architecture that integrates look-up table logic with embedded memory. It is commonly used for high-density glue logic, custom datapath designs, and prototyping of ASIC-equivalent systems.
The device exposes 508 user I/O pins supporting a wide variety of I/O standards and includes 4 Phase-Locked Loops (PLLs) for clock synthesis and skew management. Embedded system blocks (ESBs) provide true dual-port RAM, FIFO, and content-addressable memory (CAM) functions. Hot-swap compatibility and I/O programmability allow direct interfacing with backplane buses and mixed-voltage systems without external glue.
Architecturally, APEX 20KE uses a four-level hierarchical interconnect network (MegaLAB, LAB, row, and column) and supports LVTTL, LVCMOS, SSTL, HSTL, GTL, and PECL I/O standards. The 1.48 ns propagation delay and 200 MHz internal performance place this part in the high-speed regime for its generation, suitable for telecom line cards, imaging pipelines, and industrial control logic.
Typical applications include telecommunications line-card interfaces, high-speed image and video processing, industrial automation controllers, ASIC prototyping platforms, and test-and-measurement instrumentation. The 672-pin FineLine BGA package provides high I/O density for backplane-driven designs. When integrating this part, allocate sufficient PCB area for the BGA fanout, follow the manufacturer's decoupling and power-plane recommendations, and use the Quartus design toolchain for configuration bitstream generation. This page synthesizes distributor availability, parametric drop-in alternatives, and design guidance not found on a single manufacturer page.
Alternativas drop-in para EP20K600EFC672-2X — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K600EFC672-2X (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K600EFC672-2N
✅ Drop-In✓ Em estoque
$158 / unidade
Ver ficha técnica →EP20K600EFC672-1XN
✅ Drop-In✓ Em estoque
$285 / unidade
Ver ficha técnica →EP20K600EFC672-1X
✅ Drop-In✓ Em estoque
$980 / unidade
Ver ficha técnica →EP20K600EFC672-3N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP20K600EBC652-2X
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$275 / unidade
Ver ficha técnica →EP20K600EFC672-2X Classificações máximas e características elétricas
| Family | APEX 20KE |
| Typical Gates | 600,000 |
| Logic Elements / Cells | 24,320 |
| Embedded Memory Bits | 311,296 |
| Maximum User I/O | 508 |
| Number of PLLs | 4 |
| Package Type | 672-pin FineLine BGA (FC-FBGA) |
| Package Size | 45 x 45 mm, 1.27 mm pitch |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 µm all-layer copper CMOS |
| Propagation Delay (typical) | 1.48 ns |
| Maximum Internal Frequency | 200 MHz |
| Temperatura de operação | 0 °C to +85 °C (commercial) |
| Lead-Free Variant | EP20K600EFC672-2N |
| Status RoHS | Not RoHS compliant (X suffix is SnPb); use -2N suffix for lead-free |
| Configuration Method | Serial / Parallel (Quartus-supported) |
Guia de Configuração de Pinos do EP20K600EFC672-2X 45 x 45 mm, 1.27 mm pitch
Configuração de pinos para EP20K600EFC672-2X (pacote 45 x 45 mm, 1.27 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K600EFC672-2X.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K600EFC672-2X é adequado para 6 aplicaçãos: Telecommunications Line-Card Interfaces, High-Speed Image and Video Processing Pipelines, ASIC Prototyping Platform, Industrial Automation Controllers, Test and Measurement Instrumentation, Military and Aerospace Avionics Datapaths.
Telecommunications Line-Card Interfaces
The EP20K600EFC672-2X delivers 600K gates and 508 user I/Os in a 672-FBGA package, making it a fit for telecom line cards that aggregate multiple framers, mappers, and MAC-layer functions. Its 4 on-chip PLLs synthesize the multiple reference clocks required for T1/E1, SONET, and Ethernet PHY interfaces. According to the APEX 20KE datasheet, the I/O banks support LVTTL, LVCMOS, SSTL, and HSTL standards, allowing direct interface to bus transceivers without external glue logic. The 311,296-bit embedded memory buffer small FIFO queues between PHY and MAC layers, eliminating external SRAM.
Recomendado
High-Speed Image and Video Processing Pipelines
The 24,320 logic elements and 311 Kbit embedded memory of the EP20K600EFC672-2X support real-time pixel pipelines for image preprocessing, color-space conversion, and edge detection. The 1.48 ns propagation delay and 200 MHz internal frequency allow line-rate processing at 720p/60 over wide parallel video buses. According to the APEX 20KE datasheet, the ESBs can be configured as dual-port RAM, enabling frame-buffer line storage without external memory. The 508 I/Os route wide data buses and sync signals across the device.
Recomendado
ASIC Prototyping Platform
Engineers commonly use the EP20K600EFC672-2X as an ASIC prototyping vehicle for designs targeting 0.5M-0.7M ASIC gates. The MultiCore architecture with embedded ESBs preserves the memory hierarchy of the target ASIC, simplifying RTL-to-FPGA mapping. According to the APEX 20KE datasheet, Quartus synthesis maps Altera IP and standard RTL to the device with timing-driven place-and-route. The 672-FBGA provides the I/O density needed to replicate complex ASIC pin-out for bring-up.
Recomendado
Industrial Automation Controllers
The EP20K600EFC672-2X serves as a state-machine and protocol-conversion engine in industrial PLCs, motor drives, and SCADA front-ends. The 4 PLLs derive multiple servo-loop sampling rates from a single reference clock, and the 508 I/Os interface to encoder counters, PWM generators, and isolated digital I/O. According to the APEX 20KE datasheet, the commercial temperature range of 0 °C to +85 °C covers most factory-floor environments. The embedded ESBs implement deterministic FIFO buffering between the field-bus and the control CPU.
Recomendado
Test and Measurement Instrumentation
Test-equipment designers leverage the EP20K600EFC672-2X for pattern generation, protocol-analyzer state machines, and high-speed data acquisition pre-processing. The 200 MHz internal performance drives real-time trigger logic, and the 508 I/Os sample wide parallel buses at full rate. According to the APEX 20KE datasheet, the ESBs in CAM mode enable hardware content-addressable search for protocol-analyzer pattern matching. The 1.8 V core plus 3.3 V tolerant I/O simplifies integration with mixed-voltage acquisition front-ends.
Recomendado
Military and Aerospace Avionics Datapaths
Although Intel marks the EP20K600EFC672-2X as commercial temperature, it remains a maintenance part for deployed military and aerospace systems where the original APEX 20KE was qualified to MIL-STD or DO-254 standards. The high logic density, deterministic PLLs, and 508 I/Os fit avionics bus interfaces (MIL-STD-1553, ARINC 429) and radar preprocessing. According to the APEX 20KE datasheet, the device is built on a 0.15 µm copper CMOS process with proven reliability in long-life programs. Maintenance-of-supply contracts typically guarantee continued availability of -2X variants for legacy avionics LRUs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K600EFC672-2X — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K600EFC672-2N | EP20K600EFC672-1XN | EP20K600EFC672-1X | EP20K600EFC672-3N | EP20K600EBC652-2X |
|---|---|---|---|---|---|---|
| Package | 672-pin FineLine BGA (FC-FBGA) | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 672-pin FineLine BGA - same | 652-pin BGA (different) |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (200 MHz internal) | -2 (200 MHz internal) | -1 (slower, ~150 MHz) | -1 (slower, ~150 MHz) | -3 (faster than -2) | -2 (200 MHz internal) |
| Lead-Free / RoHS | No (SnPb -2X suffix) | Yes (lead-free) | Yes (lead-free) | No (SnPb) | Yes (lead-free) | No (SnPb) |
| Logic Elements / Cells | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 | 24,320 |
| Embedded Memory (bits) | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 | 311,296 |
| Maximum User I/O | 508 | 508 | 508 | 508 | 508 | 488 (652-BGA package) |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
Principais diferenciais
- Drop-in lead-free alternative on same 672-FBGA footprint (vs EP20K600EFC672-2N)
- Higher speed grade option on same footprint (vs EP20K600EFC672-3N)
- Lower-cost speed-grade variant for cost-sensitive designs (vs EP20K600EFC672-1X)
Notas de projeto
The EP20K600EFC672-2X is a 672-ball FC-FBGA on 1.27 mm pitch, requiring a 4-6 layer PCB with microvia (or via-in-pad) fanout. Follow the Altera/Intel BGA PCB layout guidelines: use a continuous ground plane on layer 2, dedicated 1.8 V and 3.3 V power planes on layers 3-4, and matched-length differential pairs for high-speed I/O. Decouple every VCCINT pin with a 0.1 µF X7R ceramic plus a 10 µF tantalum bulk cap within 5 mm of the BGA. Without microvia technology, signal escape routing is impossible for this pin density.
The EP20K600EFC672-2X requires a 1.8 V core supply (VCCINT) plus one or more I/O bank voltages (VCCIO) configurable to 1.5 V, 1.8 V, 2.5 V, 3.3 V. Sequence the supplies per the APEX 20KE datasheet: VCCINT must rise first or simultaneously with VCCIO; failure to sequence may damage the device. Estimated: at 200 MHz toggle rate with 30% utilization the device draws ~1.0-1.4 A from VCCINT - design the regulator for 1.6 A minimum and use a 4-layer copper pour to spread heat. Add a soft-start ramp of at least 1 ms to limit inrush current.
Estimated: at ambient 70 °C, 200 MHz toggle rate, 30% utilization, VCCINT 1.8 V at ~1.4 A, the EP20K600EFC672-2X dissipates ~2.5 W. With FC-FBGA thermal resistance θJA around 15 °C/W on a JEDEC 4-layer test board, junction rises by ~38 °C, yielding Tj ~108 °C - well within the commercial 0-85 °C ambient spec but no margin. For forced-air cooling or extended temperature operation, derate utilization to 20% or upgrade to industrial-grade -2X parts. The 672-FBGA provides bottom-side thermal contact suitable for an exposed-pad thermal interface.
Common pitfalls when designing with the EP20K600EFC672-2X include (1) confusing the -2X speed grade with the -2N lead-free grade - they share speed but differ in finish; (2) routing 3.3 V signals into a 1.8 V VCCIO bank, damaging the I/O; (3) using a non-Quartus-supported configuration mode without verifying the datasheet; (4) assuming the APEX 20KE ESBs can substitute for true dual-clock FIFO logic without checking timing closure; (5) using generic JTAG programmers - configure with the Altera ByteBlasterMV or USB-Blaster. Per the Intel/Altera APEX 20KE datasheet, always validate timing with the Quartus TimeQuest analyzer after place-and-route.
Informações de conformidade
The -2X suffix denotes SnPb (lead-bearing) finish and is not RoHS compliant; use the -2N suffix for lead-free RoHS compliance. AEC-Q100 is not applicable - this is an FPGA, not an automotive IC. Other compliance fields not stated in the verified data.
