EP2A40F724 - APEX II FPGA 1.5M Gates 655360 Cells | Altera
N.º da peça: EP2A40F724 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $255 | $2.550,00 |
| 100 | $225 | $22.500,00 |
| 500 | $195 | $97.500,00 |
| 1.000 | $168 | $168.000,00 |
EP2A40F724 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement virtually any digital logic function. FPGAs sit within the programmable logic hierarchy alongside CPLDs, occupying a higher-density tier that allows them to integrate entire subsystems - processors, memory controllers, and high-speed serial interfaces - onto a single device. The APEX II family specifically targets high-performance applications requiring large logic capacity and embedded memory.
Key features of the EP2A40F724 include built-in support for LVDS data rates up to 840 Mbps, embedded CAM (Content-Addressable Memory) blocks for networking lookup tables, four PLL clock managers with up to eight clock outputs per device, and 12 dedicated clock pins. The device provides up to 498 user I/O pins via the 724-ball FineLine BGA package, supporting hot-socketing and IEEE 1149.1 JTAG boundary-scan testing for board-level diagnostics.
The APEX II architecture combines a MultiCore architecture with LUT-based logic elements, allowing designers to allocate resources between combinational logic, dual-port RAM, CAM, and arithmetic functions within a single device. The 0.15 µm CMOS process technology balances high performance with low static power dissipation, while the dedicated memory and CAM blocks eliminate the need for external lookup memory in routing and classification applications.
Typical applications for the EP2A40F724 include telecommunications switching equipment, network routers and switches, high-speed serial protocol bridges, digital signal processing front-ends, and ASIC prototyping platforms. The combination of high gate count, embedded CAM, and LVDS support makes it well-suited for packet classification, bus interfaces, and glue-logic consolidation.
When designing with this FPGA, ensure robust 1.5 V core decoupling with low-ESR ceramic capacitors placed close to each power pin. Signal integrity for LVDS lanes requires matched-length routing and 100 ohm differential termination. Programming is performed via JTAG or the Altera ByteBlaster/USB-Blaster download cable, and configuration memory can be loaded from a serial PROM such as the EPC16 or EPC64.
This page synthesizes verified distributor stock data, drop-in alternatives from the same APEX II family, and practical design notes not aggregated in the manufacturer datasheet, supporting both procurement decisions and board-level implementation.
Alternativas drop-in para EP2A40F724 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2A40F724 (mesmo formato e footprint) — diferindo em Operating Temperature, Process Technology, Series, Package, Package / Case.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2A40B724I8
✅ Drop-In✓ Em estoque
$611 / unidade
Ver ficha técnica →EP2A40B724I9
✅ Drop-In✓ Em estoque
$150 / unidade
Ver ficha técnica →EP2A40B724C9
✅ Drop-In✓ Em estoque
$395.38 / unidade
Ver ficha técnica →EP2A40B724C8
✅ Drop-In✓ Em estoque
$615 / unidade
Ver ficha técnica →EP2A40B724I7
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →EP2A40F724 Classificações máximas e características elétricas
| Family | APEX II |
| Series | EP2A |
| Logic Elements | 38400 |
| System Gates | 1,500,000 (typical) |
| Maximum User I/O | 498 |
| Embedded RAM Bits | 655360 |
| CAM Blocks | Yes |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Encapsulamento | 724-ball FineLine BGA (F724) |
| Temperatura de operação | 0C to +85C (commercial) |
| Process Technology | 0.15 µm CMOS |
| Programming Interface | JTAG (IEEE 1149.1) / Altera ByteBlaster |
Guia de Configuração de Pinos do EP2A40F724 724-ball fineline bga (f724)
Configuração de pinos para EP2A40F724 (pacote 724-ball fineline bga (f724)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2A40F724.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2A40F724 é adequado para 6 aplicaçãos: Telecommunications Switching Equipment, Network Routers and Switches, ASIC Prototyping Platforms, High-Speed Serial Protocol Bridges, Digital Signal Processing Front-Ends, Industrial Control and Glue Logic Consolidation.
Telecommunications Switching Equipment
The EP2A40F724 fits telecommunications switching equipment because its 1.5 million system gates and embedded CAM blocks provide the logic capacity needed for packet classification and forwarding tables at line-card rates. The four on-chip PLLs with up to eight clock outputs each support multiple clock domains for backplane SERDES, fabric interfaces, and management processors. LVDS support up to 840 Mbps accommodates high-speed parallel connections between line cards and switch fabrics without external transceivers.
Recomendado
Network Routers and Switches
Network routers and switches benefit from the EP2A40F724's 498 user I/O pins and embedded CAM blocks, which implement IPv4 and IPv6 longest-prefix-match lookup tables directly on-chip. The 655,360 bits of embedded dual-port RAM provide packet buffers and queue descriptors without requiring external memory for many architectures. Multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) interfaces directly to ASICs, network processors, and PHY devices across multiple voltage rails.
Recomendado
ASIC Prototyping Platforms
ASIC prototyping platforms use the EP2A40F724's 38,400 logic elements and high gate count to validate million-gate ASIC designs before tape-out. The device's MultiCore architecture supports mixed-width data paths and arithmetic functions that map directly from RTL synthesis, simplifying partition-to-prototype workflows. LVDS I/O up to 840 Mbps enables high-speed chip-to-chip bridging on prototyping boards, while JTAG-based configuration speeds iterative design debug.
Recomendado
High-Speed Serial Protocol Bridges
The EP2A40F724 implements high-speed serial protocol bridges by combining its LVDS support at 840 Mbps with on-chip PLLs and 38,400 logic elements for protocol state machines, CRC engines, and 8b/10b encoding. The 724-ball FineLine BGA package provides controlled-impedance routing for multi-lane LVDS channels with matched-length constraints. Designers can implement RapidIO, SPI-4.2, and proprietary backplane protocols without external PHY devices in low-port-count bridges.
Recomendado
Digital Signal Processing Front-Ends
Digital signal processing front-ends leverage the EP2A40F724's embedded dual-port RAM and 38,400 logic elements to implement FIR filters, FFT engines, and digital down-converters with deterministic latency. The four PLLs generate the multiple clock domains required for ADC sample rates, decimation filters, and downstream DSP processors. 498 user I/O pins interface directly to high-resolution ADCs and DACs operating at multi-hundred-MHz sample rates, with LVDS reducing board complexity.
Recomendado
Industrial Control and Glue Logic Consolidation
Industrial control systems use the EP2A40F724 to consolidate multiple discrete logic devices, bus bridges, and custom state machines onto a single programmable device. The MultiCore architecture supports wide data-path arithmetic for motor control loop calculations, while JTAG-based in-system programming simplifies firmware updates in deployed equipment. Hot-socketing support allows field replacement without powering down the host system, a critical feature for 24/7 industrial automation installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2A40F724 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2A40B724I8 | EP2A40B724I9 | EP2A40B724C9 | EP2A40B724C8 | EP2A40B724I7 |
|---|---|---|---|---|---|---|
| Package | 724-ball FineLine BGA (F724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM Bits | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 |
| Maximum User I/O | 498 | 498 | 498 | 498 | 498 | 498 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
Principais diferenciais
- Same APEX II die in industrial temperature grade (vs EP2A40B724I8)
- Higher speed grade available for performance-critical designs (vs EP2A40B724C9)
- Larger logic capacity than smaller APEX II variants (vs EP2A25F724)
Notas de projeto
The EP2A40F724 requires a clean 1.5 V core supply with bulk decoupling of 100 uF tantalum or polymer plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCC pin group. Auxiliary voltage rails for VCCIO (1.5/1.8/2.5/3.3 V) and VCCPD (1.5 V pre-driver) must be sequenced after core power to avoid latch-up. Estimated: core current at 1.5 million gate utilization is approximately 0.5-1.5 A depending on clock rate and toggle activity, requiring a regulator rated for at least 3 A peak with proper thermal management.
The 724-ball FineLine BGA requires a multilayer PCB with at least 6 layers for controlled-impedance routing and power/ground plane integrity. Microvia or stacked-via technology is recommended for fan-out under the BGA pads. Signal traces should maintain 50 ohm single-ended and 100 ohm differential impedance, with matched length (within 150 mils) for LVDS pairs to preserve 840 Mbps timing margins.
Estimated: at full logic utilization with 80 percent toggle activity, the EP2A40F724 dissipates approximately 3-5 W of power depending on clock frequency and I/O switching rate. The 724-ball FineLine BGA package has a theta_JA of approximately 12-15 C/W with proper board cooling, requiring thermal vias under the package and adequate airflow for reliable operation in industrial environments. Without active cooling, derate clock frequency or reduce utilization to maintain junction temperature below 100C.
Do not confuse F724 (FineLine BGA, smaller pitch) with B724 (standard BGA, larger pitch) packages - they are NOT footprint compatible and require different PCB land patterns. Configuration mode pins MSEL[2:0] must be tied to the correct levels for the desired configuration scheme (AS, PS, JTAG) before power-up. Hot-socketing support requires the I/O pins to be tri-stated during power sequencing, which depends on the proper ramp rate of VCCIO supplies.
Informações de conformidade
Part is obsolete; detailed compliance status was not available in the verified web data. RoHS, REACH, lead-free, and halogen-free status require direct manufacturer or franchised distributor verification for production qualification.
