EP2A40F724 - APEX II FPGA 1.5M Gates 655360 Cells | Altera
부품 번호: EP2A40F724 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $255 | $2,550.00 |
| 100 | $225 | $22,500.00 |
| 500 | $195 | $97,500.00 |
| 1,000 | $168 | $168,000.00 |
EP2A40F724 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and dedicated I/O cells that can be re-programmed to implement virtually any digital logic function. FPGAs sit within the programmable logic hierarchy alongside CPLDs, occupying a higher-density tier that allows them to integrate entire subsystems - processors, memory controllers, and high-speed serial interfaces - onto a single device. The APEX II family specifically targets high-performance applications requiring large logic capacity and embedded memory.
Key features of the EP2A40F724 include built-in support for LVDS data rates up to 840 Mbps, embedded CAM (Content-Addressable Memory) blocks for networking lookup tables, four PLL clock managers with up to eight clock outputs per device, and 12 dedicated clock pins. The device provides up to 498 user I/O pins via the 724-ball FineLine BGA package, supporting hot-socketing and IEEE 1149.1 JTAG boundary-scan testing for board-level diagnostics.
The APEX II architecture combines a MultiCore architecture with LUT-based logic elements, allowing designers to allocate resources between combinational logic, dual-port RAM, CAM, and arithmetic functions within a single device. The 0.15 µm CMOS process technology balances high performance with low static power dissipation, while the dedicated memory and CAM blocks eliminate the need for external lookup memory in routing and classification applications.
Typical applications for the EP2A40F724 include telecommunications switching equipment, network routers and switches, high-speed serial protocol bridges, digital signal processing front-ends, and ASIC prototyping platforms. The combination of high gate count, embedded CAM, and LVDS support makes it well-suited for packet classification, bus interfaces, and glue-logic consolidation.
When designing with this FPGA, ensure robust 1.5 V core decoupling with low-ESR ceramic capacitors placed close to each power pin. Signal integrity for LVDS lanes requires matched-length routing and 100 ohm differential termination. Programming is performed via JTAG or the Altera ByteBlaster/USB-Blaster download cable, and configuration memory can be loaded from a serial PROM such as the EPC16 or EPC64.
This page synthesizes verified distributor stock data, drop-in alternatives from the same APEX II family, and practical design notes not aggregated in the manufacturer datasheet, supporting both procurement decisions and board-level implementation.
드롭인 대체품: EP2A40F724 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A40F724 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Process Technology, Series, Package, Package / Case.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A40B724I8
✅ 드롭인✓ 재고 있음
$611 / 개
데이터시트 보기 →EP2A40B724I9
✅ 드롭인✓ 재고 있음
$150 / 개
데이터시트 보기 →EP2A40B724C9
✅ 드롭인✓ 재고 있음
$395.38 / 개
데이터시트 보기 →EP2A40B724C8
✅ 드롭인✓ 재고 있음
$615 / 개
데이터시트 보기 →EP2A40B724I7
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →EP2A40F724 최대 정격 & 전기적 특성
| Family | APEX II |
| Series | EP2A |
| Logic Elements | 38400 |
| System Gates | 1,500,000 (typical) |
| Maximum User I/O | 498 |
| Embedded RAM Bits | 655360 |
| CAM Blocks | Yes |
| PLLs | 4 |
| Global Clock Networks | 16 |
| Core Voltage | 1.5 V |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| 패키지 | 724-ball FineLine BGA (F724) |
| 동작 온도 | 0C to +85C (commercial) |
| Process Technology | 0.15 µm CMOS |
| Programming Interface | JTAG (IEEE 1149.1) / Altera ByteBlaster |
EP2A40F724 724-ball fineline bga (f724) 핀 구성 가이드
EP2A40F724(724-ball fineline bga (f724) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A40F724.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A40F724 적합 용도: 6 애플리케이션s: Telecommunications Switching Equipment, Network Routers and Switches, ASIC Prototyping Platforms, High-Speed Serial Protocol Bridges, Digital Signal Processing Front-Ends, Industrial Control and Glue Logic Consolidation.
Telecommunications Switching Equipment
The EP2A40F724 fits telecommunications switching equipment because its 1.5 million system gates and embedded CAM blocks provide the logic capacity needed for packet classification and forwarding tables at line-card rates. The four on-chip PLLs with up to eight clock outputs each support multiple clock domains for backplane SERDES, fabric interfaces, and management processors. LVDS support up to 840 Mbps accommodates high-speed parallel connections between line cards and switch fabrics without external transceivers.
추천
Network Routers and Switches
Network routers and switches benefit from the EP2A40F724's 498 user I/O pins and embedded CAM blocks, which implement IPv4 and IPv6 longest-prefix-match lookup tables directly on-chip. The 655,360 bits of embedded dual-port RAM provide packet buffers and queue descriptors without requiring external memory for many architectures. Multi-voltage I/O support (1.5 V, 1.8 V, 2.5 V, 3.3 V) interfaces directly to ASICs, network processors, and PHY devices across multiple voltage rails.
추천
ASIC Prototyping Platforms
ASIC prototyping platforms use the EP2A40F724's 38,400 logic elements and high gate count to validate million-gate ASIC designs before tape-out. The device's MultiCore architecture supports mixed-width data paths and arithmetic functions that map directly from RTL synthesis, simplifying partition-to-prototype workflows. LVDS I/O up to 840 Mbps enables high-speed chip-to-chip bridging on prototyping boards, while JTAG-based configuration speeds iterative design debug.
추천
High-Speed Serial Protocol Bridges
The EP2A40F724 implements high-speed serial protocol bridges by combining its LVDS support at 840 Mbps with on-chip PLLs and 38,400 logic elements for protocol state machines, CRC engines, and 8b/10b encoding. The 724-ball FineLine BGA package provides controlled-impedance routing for multi-lane LVDS channels with matched-length constraints. Designers can implement RapidIO, SPI-4.2, and proprietary backplane protocols without external PHY devices in low-port-count bridges.
추천
Digital Signal Processing Front-Ends
Digital signal processing front-ends leverage the EP2A40F724's embedded dual-port RAM and 38,400 logic elements to implement FIR filters, FFT engines, and digital down-converters with deterministic latency. The four PLLs generate the multiple clock domains required for ADC sample rates, decimation filters, and downstream DSP processors. 498 user I/O pins interface directly to high-resolution ADCs and DACs operating at multi-hundred-MHz sample rates, with LVDS reducing board complexity.
추천
Industrial Control and Glue Logic Consolidation
Industrial control systems use the EP2A40F724 to consolidate multiple discrete logic devices, bus bridges, and custom state machines onto a single programmable device. The MultiCore architecture supports wide data-path arithmetic for motor control loop calculations, while JTAG-based in-system programming simplifies firmware updates in deployed equipment. Hot-socketing support allows field replacement without powering down the host system, a critical feature for 24/7 industrial automation installations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2A40F724 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A40B724I8 | EP2A40B724I9 | EP2A40B724C9 | EP2A40B724C8 | EP2A40B724I7 |
|---|---|---|---|---|---|---|
| Package | 724-ball FineLine BGA (F724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) | 724-ball BGA (B724) |
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Family | APEX II | APEX II | APEX II | APEX II | APEX II | APEX II |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Embedded RAM Bits | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 |
| Maximum User I/O | 498 | 498 | 498 | 498 | 498 | 498 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
주요 차별점
- Same APEX II die in industrial temperature grade (vs EP2A40B724I8)
- Higher speed grade available for performance-critical designs (vs EP2A40B724C9)
- Larger logic capacity than smaller APEX II variants (vs EP2A25F724)
설계 노트
The EP2A40F724 requires a clean 1.5 V core supply with bulk decoupling of 100 uF tantalum or polymer plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each VCC pin group. Auxiliary voltage rails for VCCIO (1.5/1.8/2.5/3.3 V) and VCCPD (1.5 V pre-driver) must be sequenced after core power to avoid latch-up. Estimated: core current at 1.5 million gate utilization is approximately 0.5-1.5 A depending on clock rate and toggle activity, requiring a regulator rated for at least 3 A peak with proper thermal management.
The 724-ball FineLine BGA requires a multilayer PCB with at least 6 layers for controlled-impedance routing and power/ground plane integrity. Microvia or stacked-via technology is recommended for fan-out under the BGA pads. Signal traces should maintain 50 ohm single-ended and 100 ohm differential impedance, with matched length (within 150 mils) for LVDS pairs to preserve 840 Mbps timing margins.
Estimated: at full logic utilization with 80 percent toggle activity, the EP2A40F724 dissipates approximately 3-5 W of power depending on clock frequency and I/O switching rate. The 724-ball FineLine BGA package has a theta_JA of approximately 12-15 C/W with proper board cooling, requiring thermal vias under the package and adequate airflow for reliable operation in industrial environments. Without active cooling, derate clock frequency or reduce utilization to maintain junction temperature below 100C.
Do not confuse F724 (FineLine BGA, smaller pitch) with B724 (standard BGA, larger pitch) packages - they are NOT footprint compatible and require different PCB land patterns. Configuration mode pins MSEL[2:0] must be tied to the correct levels for the desired configuration scheme (AS, PS, JTAG) before power-up. Hot-socketing support requires the I/O pins to be tri-stated during power sequencing, which depends on the proper ramp rate of VCCIO supplies.
규정 준수 정보
Part is obsolete; detailed compliance status was not available in the verified web data. RoHS, REACH, lead-free, and halogen-free status require direct manufacturer or franchised distributor verification for production qualification.
