EP2A70F1508I9N - 70K LE APEX II FPGA, 1.5V, 1508-FBGA | Altera
N.º da peça: EP2A70F1508I9N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $260 | $2.600,00 |
| 100 | $232 | $23.200,00 |
| 500 | $205 | $102.500,00 |
| 1.000 | $185 | $185.000,00 |
EP2A70F1508I9N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: an ASIC delivers the highest performance and lowest unit cost but cannot be changed after tape-out, a processor offers maximum flexibility at the cost of deterministic real-time behaviour, while an FPGA gives the designer hardware-level parallelism and re-programmability in a single device. The APEX II family is part of the broader programmable logic taxonomy: programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA.
Key features of the EP2A70F1508I9N include 198 MHz maximum internal operation, embedded system blocks (ESBs) for on-chip memory and FIFO functions, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, and a True-LVDS capable high-speed interface. The device also integrates Phase-Locked Loops (PLLs) for clock management, dedicated multiplier blocks, and an in-system programmability interface via the passive serial or JTAG configuration ports.
Technically, the APEX II architecture combines a fine-grained logic-element fabric with coarse-grained embedded system blocks, allowing efficient mapping of both datapath and control logic. The 0.15 µm process supports 1.5 V core operation, which reduces dynamic power compared to earlier 2.5 V families, while the high gate count and rich I/O capability enable system-on-chip integration in a single package.
Typical applications include high-speed telecommunications infrastructure, ASIC prototyping, DSP co-processing, and image-processing pipelines. The combination of high gate density and ample I/O bandwidth also makes the device suitable for test-and-measurement instrumentation and software-defined radio front-ends.
When designing with the EP2A70F1508I9N, pay close attention to the FC-FBGA ball-pitch and PCB stack-up: signal integrity depends on controlled-impedance routing and matched-length pairs. Power-rail decoupling and thermal management (the FC-FBGA package requires a thermal pad tied to a low-impedance ground) are equally critical to device reliability at 198 MHz.
This page synthesizes distributor pricing, APEX II family datasheets, and drop-in alternatives not found in the manufacturer datasheet - a practical engineering reference for new designs and legacy board support.
Alternativas drop-in para EP2A70F1508I9N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2A70F1508I9N (mesmo formato e footprint) — diferindo em Process Technology, Package, System Gates, Operating Temperature, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2A70F1508I8
✅ Drop-In✓ Em estoque
$188 / unidade
Ver ficha técnica →EP2A70F1508I7
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP2A70F1508C9N
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP2A70F1508C9
✅ Drop-In✓ Em estoque
$1310 / unidade
Ver ficha técnica →EP2A70F1508C8N
✅ Drop-In✓ Em estoque
$175 / unidade
Ver ficha técnica →EP2A70F1508C7N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP2A70F1508I9N Classificações máximas e características elétricas
| Family | APEX II |
| Logic Elements | 67,200 |
| System Gates | 3,000,000 (3M) |
| Maximum Internal Frequency | 198 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| Encapsulamento | 1508-pin FC-FBGA |
| Tipo de montagem | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration Scheme | Passive Serial / JTAG |
| Embedded System Blocks | Yes (ESB for RAM/ROM/FIFO) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, LVDS |
| PLLs | Yes (clock management) |
| Status RoHS | Compliant (per Alibaba listing) |
| Device Series | EP2A70 |
Guia de Configuração de Pinos do EP2A70F1508I9N 1508-pin fc-fbga
Configuração de pinos para EP2A70F1508I9N (pacote 1508-pin fc-fbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2A70F1508I9N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2A70F1508I9N é adequado para 7 aplicaçãos: Telecommunications Infrastructure, ASIC Prototyping, DSP Co-Processing, Image and Video Processing, Software-Defined Radio Front-End, Test and Measurement Instrumentation, Industrial Automation Controllers.
Telecommunications Infrastructure
The EP2A70F1508I9N fits telecommunications infrastructure because its 3 million system gates and 67,200 logic elements can absorb multi-gigabit data-path logic, while the 198 MHz maximum internal frequency supports 155 Mbps and 622 Mbps SONET/SDH framer functions. The 1508-pin FC-FBGA exposes enough user I/O for parallel bus interfacing to network processors and SRAM banks. The embedded system blocks provide on-chip FIFO buffering between ingress and egress data streams, eliminating external FIFOs. Compared with an ASIC, the FPGA allows late-stage protocol changes and field upgrades - critical for telecom OEMs deploying new features across installed bases. Industrial temperature grade (-40C to +100C) supports outdoor and uncontrolled-environment deployments such as base-station racks.
Recomendado
ASIC Prototyping
For ASIC prototyping, the EP2A70F1508I9N offers 3M system gates - large enough to map most sub-million-gate ASICs and many full-million-gate designs directly into a single device. The 0.15 µm APEX II fabric closely matches typical ASIC timing characteristics, so gate-level simulation results translate with reasonable accuracy. The JTAG and passive-serial configuration ports allow fast design-iteration cycles using Altera Quartus II. The FC-FBGA-1508 ball pitch, while dense, is supported by standard BGA layout services. Engineers mapping a target ASIC should budget at least 30% spare gates for routing overhead, and use the embedded system blocks for register-file and FIFO functions that would otherwise require multiple FPGAs.
Recomendado
DSP Co-Processing
The EP2A70F1508I9N serves well as a DSP co-processor because the APEX II fabric includes dedicated multiplier blocks that deliver multi-MAC DSP throughput, and the 198 MHz Fmax sustains high sample rates for FIR filters, FFT engines, and digital down-converters. The 3M system gates can host dozens of parallel DSP lanes simultaneously. Embedded system blocks act as coefficient ROM and data buffer, offloading the host DSP's memory bus. The 1.5 V core reduces dynamic power versus older 2.5 V families, which matters in dense DSP farms. Industrial temperature grade is suitable for industrial vibration/acoustic monitoring and military signal-intelligence systems where off-the-shelf DSP processors cannot meet throughput targets.
Recomendado
Image and Video Processing
Image and video processing pipelines benefit from the EP2A70F1508I9N's high logic density and generous I/O count: the 1508-pin FC-FBGA provides enough user pins to accept wide parallel video buses (24-bit, 30-bit, 36-bit) plus auxiliary control signals. The 198 MHz internal frequency supports 1080p60 real-time processing at 148.5 MHz pixel clock with margin. Embedded system blocks buffer line-store memory, eliminating external SRAM. The LVDS I/O standard is critical for interfacing with modern image sensors that use sub-LVDS or SLVS serialized outputs. Industrial temperature grade suits machine-vision systems in factory automation. Multiple parallel pipelines (Sobel, Canny, color conversion) can run concurrently in the same fabric.
Recomendado
Software-Defined Radio Front-End
Software-defined radio (SDR) front-ends use the EP2A70F1508I9N for digital up/down-conversion, channelization, and modulation/demodulation because the 3M system gates can host wideband DDC chains at baseband, while the LVDS I/O supports high-speed ADC/DAC interfacing. The 198 MHz Fmax is enough for narrowband protocols and many wideband waveforms; wider bandwidths require multi-FPGA partitioning. Embedded system blocks act as data buffers between the ADC FIFO and the host processor. Industrial temperature grade supports outdoor SDR deployments. The 1.5 V core and PLLs for clock management simplify integration with low-voltage ADC/DAC analog front-ends. The device is on the APEX II End-of-Life list; new SDR designs should consider the Cyclone IV or Stratix families instead.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, pattern generators, and protocol analyzers use the EP2A70F1508I9N because of its high logic density for parallel state-machine logic and 198 MHz Fmax for protocol timing accuracy. The 1508-pin FC-FBGA exposes enough channels for multi-lane protocol analysis (PCIe, SATA, USB 3.0, I2C, SPI) and offers LVDS for high-speed probing. Embedded system blocks implement deep capture buffers, eliminating external RAM in some configurations. The industrial temperature grade supports lab-to-floor transitions. PLLs allow precise trigger-timestamp generation, while the JTAG port supports in-system test. Engineers designing new instruments should consider migrating to Cyclone IV or Stratix families due to APEX II obsolescence.
Recomendado
Industrial Automation Controllers
Industrial automation controllers use the EP2A70F1508I9N for high-speed motion control, vision-guided robotics, and real-time deterministic networking because the 3M system gates allow integration of the PLC, motion controller, and HMI logic into a single fabric. The 198 MHz Fmax delivers deterministic sub-microsecond cycle times required for synchronized servo control. Embedded system blocks implement deterministic FIFO queues for industrial Ethernet protocols (EtherCAT, PROFINET). The industrial temperature grade (-40C to +100C) is required for factory-floor operation, including outdoor cabinets. The 1.5 V core simplifies thermal design. Note that for new industrial designs, engineers should evaluate Cyclone IV or MAX 10 as modern, non-obsolete alternatives.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2A70F1508I9N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2A70F1508I8 | EP2A70F1508I7 | EP2A70F1508C9N | EP2A70F1508C9 | EP2A70F1508C8N | EP2A70F1508C7N |
|---|---|---|---|---|---|---|---|
| Package | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | 9 (highest in EP2A70 family) | 8 | 7 | 9 | 9 | 8 | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest speed grade in the EP2A70 family (vs EP2A70F1508I8)
- Industrial temperature grade extends operating range (vs EP2A70F1508C9N)
- Highest-density I/O package in the EP2A70 family (vs EP2A70B724I9N)
Notas de projeto
The 1508-pin FC-FBGA package of the EP2A70F1508I9N requires a thermal pad soldered to a low-impedance internal ground plane. Without this connection, junction temperature can exceed 125C under typical 198 MHz operation and reduce device lifetime. At 1.5 V core and 0.15 µm process, dynamic power scales linearly with toggle rate, so place decoupling capacitors directly under the BGA using a 4-layer PCB stack-up with dedicated power and ground planes. Add thermal vias in the BGA land pattern to conduct heat to inner copper layers.
FC-FBGA-1508 ball pitch is 1.0 mm with 0.6 mm solder balls - this requires microvia technology and sub-100 µm trace/space rules. Use a 4- or 6-layer PCB with impedance-controlled stack-up. Match LVDS pair lengths to within 150 mil for the 198 MHz internal frequency. Place configuration EEPROM and JTAG header within 2 inches of the FPGA. Use the Altera Quartus II pin planner to validate the ball assignments before PCB layout. Keep high-speed signals on inner signal layers sandwiched between continuous ground planes for return-path integrity.
The EP2A70F1508I9N is part of the APEX II family that reached End-of-Life several years ago. Do not design new production systems with this FPGA - instead, evaluate Altera/Intel Cyclone IV (EP4CE115) or Stratix (EP1S25) as modern replacements. The APEX II 0.15 µm process is also more sensitive to single-event upsets than newer 60 nm/40 nm Cyclone devices, so SEU mitigation (CRAM scrubbing) may be required for high-reliability applications. The 1.5 V core is incompatible with modern 1.0 V / 1.2 V supplies, so legacy designs need a separate 1.5 V regulator.
Informações de conformidade
RoHS3 compliance stated in the Alibaba listing (https://www.alibaba.com/product-detail/EP2A70F1508I9N-New-Original-One-Stop-Shopping_1601744237199.html). REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified data - left as 'unknown' rather than assumed.
