EP2A70F1508I9N - 70K LE APEX II FPGA, 1.5V, 1508-FBGA | Altera
부품 번호: EP2A70F1508I9N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $260 | $2,600.00 |
| 100 | $232 | $23,200.00 |
| 500 | $205 | $102,500.00 |
| 1,000 | $185 | $185,000.00 |
EP2A70F1508I9N 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be electrically reconfigured by the end user to implement arbitrary digital logic. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy: an ASIC delivers the highest performance and lowest unit cost but cannot be changed after tape-out, a processor offers maximum flexibility at the cost of deterministic real-time behaviour, while an FPGA gives the designer hardware-level parallelism and re-programmability in a single device. The APEX II family is part of the broader programmable logic taxonomy: programmable logic -> CPLD/FPGA -> SRAM-based FPGA -> high-density FPGA.
Key features of the EP2A70F1508I9N include 198 MHz maximum internal operation, embedded system blocks (ESBs) for on-chip memory and FIFO functions, support for multiple I/O standards including LVTTL, LVCMOS, PCI, and LVDS, and a True-LVDS capable high-speed interface. The device also integrates Phase-Locked Loops (PLLs) for clock management, dedicated multiplier blocks, and an in-system programmability interface via the passive serial or JTAG configuration ports.
Technically, the APEX II architecture combines a fine-grained logic-element fabric with coarse-grained embedded system blocks, allowing efficient mapping of both datapath and control logic. The 0.15 µm process supports 1.5 V core operation, which reduces dynamic power compared to earlier 2.5 V families, while the high gate count and rich I/O capability enable system-on-chip integration in a single package.
Typical applications include high-speed telecommunications infrastructure, ASIC prototyping, DSP co-processing, and image-processing pipelines. The combination of high gate density and ample I/O bandwidth also makes the device suitable for test-and-measurement instrumentation and software-defined radio front-ends.
When designing with the EP2A70F1508I9N, pay close attention to the FC-FBGA ball-pitch and PCB stack-up: signal integrity depends on controlled-impedance routing and matched-length pairs. Power-rail decoupling and thermal management (the FC-FBGA package requires a thermal pad tied to a low-impedance ground) are equally critical to device reliability at 198 MHz.
This page synthesizes distributor pricing, APEX II family datasheets, and drop-in alternatives not found in the manufacturer datasheet - a practical engineering reference for new designs and legacy board support.
드롭인 대체품: EP2A70F1508I9N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2A70F1508I9N (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, System Gates, Operating Temperature, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2A70F1508I8
✅ 드롭인✓ 재고 있음
$188 / 개
데이터시트 보기 →EP2A70F1508I7
✅ 드롭인✓ 재고 있음
$92 / 개
데이터시트 보기 →EP2A70F1508C9N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A70F1508C9
✅ 드롭인✓ 재고 있음
$1310 / 개
데이터시트 보기 →EP2A70F1508C8N
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EP2A70F1508C7N
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2A70F1508I9N 최대 정격 & 전기적 특성
| Family | APEX II |
| Logic Elements | 67,200 |
| System Gates | 3,000,000 (3M) |
| Maximum Internal Frequency | 198 MHz |
| Process Technology | 0.15 µm CMOS |
| Core Voltage | 1.5 V |
| 패키지 | 1508-pin FC-FBGA |
| 실장 유형 | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Configuration Scheme | Passive Serial / JTAG |
| Embedded System Blocks | Yes (ESB for RAM/ROM/FIFO) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, LVDS |
| PLLs | Yes (clock management) |
| RoHS 상태 | Compliant (per Alibaba listing) |
| Device Series | EP2A70 |
EP2A70F1508I9N 1508-pin fc-fbga 핀 구성 가이드
EP2A70F1508I9N(1508-pin fc-fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2A70F1508I9N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2A70F1508I9N 적합 용도: 7 애플리케이션s: Telecommunications Infrastructure, ASIC Prototyping, DSP Co-Processing, Image and Video Processing, Software-Defined Radio Front-End, Test and Measurement Instrumentation, Industrial Automation Controllers.
Telecommunications Infrastructure
The EP2A70F1508I9N fits telecommunications infrastructure because its 3 million system gates and 67,200 logic elements can absorb multi-gigabit data-path logic, while the 198 MHz maximum internal frequency supports 155 Mbps and 622 Mbps SONET/SDH framer functions. The 1508-pin FC-FBGA exposes enough user I/O for parallel bus interfacing to network processors and SRAM banks. The embedded system blocks provide on-chip FIFO buffering between ingress and egress data streams, eliminating external FIFOs. Compared with an ASIC, the FPGA allows late-stage protocol changes and field upgrades - critical for telecom OEMs deploying new features across installed bases. Industrial temperature grade (-40C to +100C) supports outdoor and uncontrolled-environment deployments such as base-station racks.
추천
ASIC Prototyping
For ASIC prototyping, the EP2A70F1508I9N offers 3M system gates - large enough to map most sub-million-gate ASICs and many full-million-gate designs directly into a single device. The 0.15 µm APEX II fabric closely matches typical ASIC timing characteristics, so gate-level simulation results translate with reasonable accuracy. The JTAG and passive-serial configuration ports allow fast design-iteration cycles using Altera Quartus II. The FC-FBGA-1508 ball pitch, while dense, is supported by standard BGA layout services. Engineers mapping a target ASIC should budget at least 30% spare gates for routing overhead, and use the embedded system blocks for register-file and FIFO functions that would otherwise require multiple FPGAs.
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DSP Co-Processing
The EP2A70F1508I9N serves well as a DSP co-processor because the APEX II fabric includes dedicated multiplier blocks that deliver multi-MAC DSP throughput, and the 198 MHz Fmax sustains high sample rates for FIR filters, FFT engines, and digital down-converters. The 3M system gates can host dozens of parallel DSP lanes simultaneously. Embedded system blocks act as coefficient ROM and data buffer, offloading the host DSP's memory bus. The 1.5 V core reduces dynamic power versus older 2.5 V families, which matters in dense DSP farms. Industrial temperature grade is suitable for industrial vibration/acoustic monitoring and military signal-intelligence systems where off-the-shelf DSP processors cannot meet throughput targets.
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Image and Video Processing
Image and video processing pipelines benefit from the EP2A70F1508I9N's high logic density and generous I/O count: the 1508-pin FC-FBGA provides enough user pins to accept wide parallel video buses (24-bit, 30-bit, 36-bit) plus auxiliary control signals. The 198 MHz internal frequency supports 1080p60 real-time processing at 148.5 MHz pixel clock with margin. Embedded system blocks buffer line-store memory, eliminating external SRAM. The LVDS I/O standard is critical for interfacing with modern image sensors that use sub-LVDS or SLVS serialized outputs. Industrial temperature grade suits machine-vision systems in factory automation. Multiple parallel pipelines (Sobel, Canny, color conversion) can run concurrently in the same fabric.
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Software-Defined Radio Front-End
Software-defined radio (SDR) front-ends use the EP2A70F1508I9N for digital up/down-conversion, channelization, and modulation/demodulation because the 3M system gates can host wideband DDC chains at baseband, while the LVDS I/O supports high-speed ADC/DAC interfacing. The 198 MHz Fmax is enough for narrowband protocols and many wideband waveforms; wider bandwidths require multi-FPGA partitioning. Embedded system blocks act as data buffers between the ADC FIFO and the host processor. Industrial temperature grade supports outdoor SDR deployments. The 1.5 V core and PLLs for clock management simplify integration with low-voltage ADC/DAC analog front-ends. The device is on the APEX II End-of-Life list; new SDR designs should consider the Cyclone IV or Stratix families instead.
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Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, pattern generators, and protocol analyzers use the EP2A70F1508I9N because of its high logic density for parallel state-machine logic and 198 MHz Fmax for protocol timing accuracy. The 1508-pin FC-FBGA exposes enough channels for multi-lane protocol analysis (PCIe, SATA, USB 3.0, I2C, SPI) and offers LVDS for high-speed probing. Embedded system blocks implement deep capture buffers, eliminating external RAM in some configurations. The industrial temperature grade supports lab-to-floor transitions. PLLs allow precise trigger-timestamp generation, while the JTAG port supports in-system test. Engineers designing new instruments should consider migrating to Cyclone IV or Stratix families due to APEX II obsolescence.
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Industrial Automation Controllers
Industrial automation controllers use the EP2A70F1508I9N for high-speed motion control, vision-guided robotics, and real-time deterministic networking because the 3M system gates allow integration of the PLC, motion controller, and HMI logic into a single fabric. The 198 MHz Fmax delivers deterministic sub-microsecond cycle times required for synchronized servo control. Embedded system blocks implement deterministic FIFO queues for industrial Ethernet protocols (EtherCAT, PROFINET). The industrial temperature grade (-40C to +100C) is required for factory-floor operation, including outdoor cabinets. The 1.5 V core simplifies thermal design. Note that for new industrial designs, engineers should evaluate Cyclone IV or MAX 10 as modern, non-obsolete alternatives.
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추천 제품 요약
엔지니어링 참조 데이터: EP2A70F1508I9N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2A70F1508I8 | EP2A70F1508I7 | EP2A70F1508C9N | EP2A70F1508C9 | EP2A70F1508C8N | EP2A70F1508C7N |
|---|---|---|---|---|---|---|---|
| Package | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA | 1508-pin FC-FBGA |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Speed Grade | 9 (highest in EP2A70 family) | 8 | 7 | 9 | 9 | 8 | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Commercial |
| Logic Elements | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 | 67,200 |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS | 0.15 µm CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest speed grade in the EP2A70 family (vs EP2A70F1508I8)
- Industrial temperature grade extends operating range (vs EP2A70F1508C9N)
- Highest-density I/O package in the EP2A70 family (vs EP2A70B724I9N)
설계 노트
The 1508-pin FC-FBGA package of the EP2A70F1508I9N requires a thermal pad soldered to a low-impedance internal ground plane. Without this connection, junction temperature can exceed 125C under typical 198 MHz operation and reduce device lifetime. At 1.5 V core and 0.15 µm process, dynamic power scales linearly with toggle rate, so place decoupling capacitors directly under the BGA using a 4-layer PCB stack-up with dedicated power and ground planes. Add thermal vias in the BGA land pattern to conduct heat to inner copper layers.
FC-FBGA-1508 ball pitch is 1.0 mm with 0.6 mm solder balls - this requires microvia technology and sub-100 µm trace/space rules. Use a 4- or 6-layer PCB with impedance-controlled stack-up. Match LVDS pair lengths to within 150 mil for the 198 MHz internal frequency. Place configuration EEPROM and JTAG header within 2 inches of the FPGA. Use the Altera Quartus II pin planner to validate the ball assignments before PCB layout. Keep high-speed signals on inner signal layers sandwiched between continuous ground planes for return-path integrity.
The EP2A70F1508I9N is part of the APEX II family that reached End-of-Life several years ago. Do not design new production systems with this FPGA - instead, evaluate Altera/Intel Cyclone IV (EP4CE115) or Stratix (EP1S25) as modern replacements. The APEX II 0.15 µm process is also more sensitive to single-event upsets than newer 60 nm/40 nm Cyclone devices, so SEU mitigation (CRAM scrubbing) may be required for high-reliability applications. The 1.5 V core is incompatible with modern 1.0 V / 1.2 V supplies, so legacy designs need a separate 1.5 V regulator.
규정 준수 정보
RoHS3 compliance stated in the Alibaba listing (https://www.alibaba.com/product-detail/EP2A70F1508I9N-New-Original-One-Stop-Shopping_1601744237199.html). REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified data - left as 'unknown' rather than assumed.
