EP2AGX260EF29C6N - Arria II GX FPGA 244K LE 780-FCBGA | Intel
N.º da peça: EP2AGX260EF29C6N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1700 | $17.000,00 |
| 50 | $1580 | $79.000,00 |
| 100 | $1495 | $149.500,00 |
| 500 | $1395 | $697.500,00 |
EP2AGX260EF29C6N Visão geral
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated hardware resources (memory, DSP, transceivers) into a single silicon fabric. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism and sub-microsecond reconfiguration. Arria II GX belongs to Altera's mid-range transceiver-equipped FPGA family, optimized for cost-sensitive high-speed serial I/O designs, bridging between the lower-cost Cyclone families and the high-end Stratix families.
Key features of the EP2AGX260EF29C6N include hardened PCI Express Gen2 x1/x2/x4 endpoints, dedicated 6.375 Gbps transceivers with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks, up to 1,148 embedded 18x18 multipliers (variable by device variant), and 32-bit DDR3 SDRAM external memory interfaces with integrated PHY. The -C6N speed grade provides a balanced trade-off between Fmax and power consumption, while the industrial-grade 'I' option and 0.9 V core simplify PCB power distribution when paired with high-efficiency switching controllers. The 780-ball FCBGA package exposes 8 transceiver channels per side in dedicated GXB banks.
Architecturally, the EP2AGX260EF29C6N organizes logic into Adaptive Logic Modules (ALMs) of 8-input fracturable look-up tables with dedicated arithmetic and register resources, paired with high-speed routing lines between LABs and column/row interfaces. Transceiver channels integrate serializer/deserializer, PLL, and equalization, allowing direct connection to SFP+, SFP, and backplane SERDES without external PHY. The 40 nm process technology, combined with Altera's Quartus Prime toolchain, delivers timing closure on complex multi-channel serial designs.
Typical applications for the EP2AGX260EF29C6N include wireless baseband processing in LTE/WiMAX base stations, broadcast video routers with SMPTE 259M/292M/424M SDI, defense signal-intelligence front ends, medical imaging preprocessing pipelines (CT, MRI, ultrasound beamforming), industrial high-speed data acquisition, and ASIC prototyping for networking line cards. The high logic density and PCIe Gen2 hard IP make it ideal for system controller and co-processing daughter cards on ATCA/AMC platforms.
When designing with this device, plan the power-tree for the 0.9 V core with adequate decoupling (multiple 0.1 uF + 10 uF + bulk ceramic capacitors) and assign high-speed transceiver pins early in PCB layout to keep loss budget under control. Quartus Prime provides synthesis, place-and-route, and SignalTap logic analyzer integration, with optional Qsys platform designer for system-level IP assembly.
This page consolidates distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet, helping procurement and design engineers quickly assess this part.
Alternativas drop-in para EP2AGX260EF29C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX260EF29C6N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Process Technology, Embedded Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX260EF29C6G
✅ Drop-In✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP2AGX260EF29C5N
✅ Drop-In✓ Em estoque
$1565 / unidade
Ver ficha técnica →EP2AGX260EF29C5G
✅ Drop-In✓ Em estoque
$2515 / unidade
Ver ficha técnica →EP2AGX260EF29C4N
✅ Drop-In✓ Em estoque
$1295 / unidade
Ver ficha técnica →EP2AGX260EF29C4G
✅ Drop-In✓ Em estoque
$1955.55 / unidade
Ver ficha técnica →EP2AGX260EF29C5
✅ Drop-In✓ Em estoque
$1870 / unidade
Ver ficha técnica →EP2AGX260EF29C6N Classificações máximas e características elétricas
| Series | Arria II GX |
| Logic Elements | 244188 |
| Total Memory Bits | 12038144 |
| Number of LABs/CLBs | 10260 |
| Number of I/O | 372 |
| Voltage - Supply | 0.9 V core |
| Temperatura de operação | 0C to +85C (commercial, C6 speed grade) |
| Tipo de montagem | Surface Mount (BGA) |
| Encapsulamento / Caixa | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | Yes |
| Nível MSL | 3 |
| JEDEC Standard | MS-034 |
| Process Technology | 40 nm CMOS |
| Maximum Operating Frequency | 500 MHz |
| Transceivers | Up to 16 GXB channels at 6.375 Gbps |
| Tipo de memória | M9K + MLAB (mixed) |
| Hard IP | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | 780-FBGA (FC-FBGA) |
Guia de Configuração de Pinos do EP2AGX260EF29C6N 780-fbga (fc-fbga)
Configuração de pinos para EP2AGX260EF29C6N (pacote 780-fbga (fc-fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX260EF29C6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX260EF29C6N é adequado para 6 aplicaçãos: Wireless Base Station Baseband, Broadcast Video Routing / SDI Switching, Medical Imaging Pipeline (CT/MRI/Ultrasound), Defense Signal Intelligence Front End, Industrial High-Speed Data Acquisition, ASIC Prototyping for Networking Line Cards.
Wireless Base Station Baseband
The EP2AGX260EF29C6N's 244,188 logic elements, dedicated 6.375 Gbps CPRI/OBSAI transceivers, and PCIe Gen2 hard IP make it ideal for LTE/WiMAX baseband processing and backhaul links. Placed between the RF frontend and baseband DSP, it performs FFT/iFFT pre/post-processing, rate adaptation, and serial-link aggregation with sub-microsecond latency. The 16 transceivers enable up to 16 CPRI links at 3.072 Gbps, sufficient for multi-sector 4x4 MIMO macro base stations, while 12 Mbits of on-chip memory eliminates external SRAM for small RACH windows.
Recomendado
Broadcast Video Routing / SDI Switching
The EP2AGX260EF29C6N's high LE count and embedded memory suit SMPTE 259M/292M/424M serial digital interface routers where many parallel inputs need large crosspoint switch matrices. Using 6.375 Gbps transceivers, the device supports 3G-SDI (2.97 Gbps) with significant overhead for reclocking and embedded audio demux. Designers instantiate multi-port RX/TX SDI IP cores that leverage the integrated PCS blocks, eliminating external reclocker ASICs. The 372 user I/Os are sufficient to implement full-size 144 x 144 HD-SDI routers with 1-to-1 redundancy paths.
Recomendado
Medical Imaging Pipeline (CT/MRI/Ultrasound)
The EP2AGX260EF29C6N's high logic density, 12 Mbits of on-chip memory, and high-throughput PCIe Gen2 interface suit medical imaging preprocessing where raw data rates exceed several Gbps. Deployed between the front-end ADC bank and the host workstation, the device performs beamforming for ultrasound arrays or back-projection preprocessing for CT reconstructions, offloading the host CPU and reducing overall scan time. The DDR3 PHY interface allows direct connection to high-bandwidth external memory required for image buffer storage, while the low 0.9 V core reduces thermal output in compact cart-based systems.
Recomendado
Defense Signal Intelligence Front End
The EP2AGX260EF29C6N's 6.375 Gbps transceivers and 244K logic elements support digital RF memory (DRFM) and channelized EW receiver subsystems. Multi-gigabit analog-to-digital converter data is funneled through GXB transceivers into the FPGA fabric for digital down-conversion, channelization, and pulse parameter extraction. The C6N commercial grade is suitable for ground-mobile applications; air-cooled platforms with -40C to +100C requirements should select the EP2AGX260EF29I5N industrial grade.
Recomendado
Industrial High-Speed Data Acquisition
The EP2AGX260EF29C6N provides a flexible preprocessor platform for industrial data acquisition backplanes that aggregate multiple ADC/DAC channels at hundreds of MSPS. Its 16 transceivers support multiple Aurora or Serial RapidIO lanes to backhaul processed data to a host controller, while 12 Mbits of on-chip memory absorb burst traffic. Industrial environments can use the EP2AGX260EF29I5N industrial speed grade to operate from -40C to +100C, sharing the same 780-FCBGA layout for design reuse between factory-floor and outdoor deployments.
Recomendado
ASIC Prototyping for Networking Line Cards
The EP2AGX260EF29C6N functions as a high-density prototyping vehicle for networking ASIC designs that need PCIe Gen2, multiple SerDes channels, and large memory. Engineering teams validate RTL and gate-level netlists against realistic SerDes behavior before committing to ASIC mask costs, with the 6.375 Gbps GXB channels emulating final ASIC SERDES performance. The FC-FBGA footprint provides a familiar BGA escape for high-speed signal routing, and the Quartus Prime ASIC prototyping flow supports seamless migration from FPGA validation to ASIC tape-out.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX260EF29C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C5G | EP2AGX260EF29C4N | EP2AGX260EF29C4G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (FC-FBGA, 29x29 mm) | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Speed Grade | C6 (commercial, slowest) | C6 | C5 (faster) | C5 (faster) | C4 | C4 |
| Logic Elements | 244188 | 244188 | 244188 | 244188 | 244188 | 244188 |
| User I/O | 372 | 372 | 372 | 372 | 372 | 372 |
| Embedded Memory (bits) | 12038144 | 12038144 | 12038144 | 12038144 | 12038144 | 12038144 |
| Pb-free / RoHS | C6N (non-G suffix) | Yes (G suffix) | No (N suffix) | Yes (G suffix) | No (N suffix) | Yes (G suffix) |
| Transceiver Rate (max) | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
Principais diferenciais
- Hard PCIe Gen2 x1/x2/x4 endpoints (vs EP2AGX190EF29C6G (lower-density))
- Pin-compatible speed grade options across C4/C5/C6 (vs EP2AGX260EF29C5N (faster speed grade))
- Pb-free BGA finish variants for global compliance (vs EP2AGX260EF29C5N (N suffix, SnPb ball finish))
Notas de projeto
The EP2AGX260EF29C6N can dissipate 8-15 W typical under full transceiver utilization. Use the FC-FBGA thermal ball pattern to attach a heatsink via a thermal interface material, and provide at least 4 oz copper on the top-side thermal escape layer. Estimate (TJ = TA + PD * theta_JA): at 85C ambient and 10 W with theta_JA of 6 C/W (heatsink), TJ = 145C, within spec but demanding margin. Provide forced-air cooling when 75% of transceiver channels operate at full rate.
Maintain 100-ohm differential impedance on GXB transceiver channels with up to 4.5 inches of stripline routing and 0.5 inch via stub limit. Use AC-coupling capacitors (100 nF) at every transmitter pin pair with 0201 footprint; series caps are required between TX and RX of adjacent chips. Place 0.1 uF + 10 uF + 47 uF bulk capacitors within 100 mil of each power ball cluster; the 0.9 V VCC core is sensitive to impedance discontinuities.
Allocate PCIe Gen2 hard IP for x1/x2/x4 modes via Quartus Prime IP catalog to use the integrated PCS/PMA. Reference clock jitter must be under 100 fs RMS for 6 Gbps operation; use a dedicated LVDS crystal oscillator with series AC-coupling. For multi-link designs, keep reference clock traces length-matched and away from switching power supply inductors to avoid spur injection into the CDR.
Do not connect transceiver pins to LVTTL/LVCMOS - GXB channels must be AC-coupled to standard SERDES signals. Validate bank voltage compatibility (3.3 V LVCMOS vs 1.5 V LVDS); the Arria II GX user I/O banks do NOT support 2.5 V LVCMOS legacy levels without level shifters. JTAG chains must include TCK pull-down and TMS pull-up resistors per IEEE 1149.1 boundary scan specification.
Informações de conformidade
The 'N' suffix indicates SnPb ball finish and is NOT RoHS-compliant - select the 'G' suffix variant (e.g., EP2AGX260EF29C6G) for RoHS-compliant assemblies. AEC-Q100 is not applicable to FPGAs. Reach and halogen-free status should be confirmed against the latest Intel material declaration (MDDS).
