EP2AGX260EF29I3G - 244K LE Arria II GX FPGA, 780-FCBGA | Intel
N.º da peça: EP2AGX260EF29I3G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1720 | $17.200,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1540 | $770.000,00 |
| 1.000 | $1480 | $1.480.000,00 |
EP2AGX260EF29I3G Visão geral
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed transceivers, all interconnected by a programmable routing fabric. FPGAs sit within the broader category of programmable logic devices (PLDs) > digital integrated circuits > semiconductors. The Arria II GX family specifically targets mid-range applications requiring a balance of logic density, transceiver bandwidth, and power efficiency, placing it between Cyclone (low-cost) and Stratix (high-performance) families within Intel's (formerly Altera's) FPGA portfolio.
Key features of the EP2AGX260EF29I3G include 244,188 logic elements, 12 Mbits of embedded memory, integrated transceivers supporting multi-gigabit serial interfaces, on-chip multipliers for DSP operations, and a 0.9 V core supply. The 40 nm process technology provides an optimal balance between static and dynamic power consumption, which is critical for thermally constrained embedded systems.
The architecture combines a lookup-table-based logic fabric with hard DSP blocks, block RAM (M9K/M144K), and high-speed serial transceivers. This heterogeneous structure enables designers to implement complex signal processing pipelines, packet processing engines, and high-speed interface bridging without sacrificing logic utilization.
Typical applications include wireless baseband processing, high-definition video broadcast equipment, military secure communications, industrial machine vision, and high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet). The industrial temperature grade (-40C to +100C) makes it appropriate for harsh-environment deployments.
When designing with this device, ensure proper power decoupling and thermal management. The 780-ball FCBGA package requires controlled-impedance PCB stackup and high-quality BGA assembly processes. Designers should reference the manufacturer datasheet for transceiver channel placement, PLL configuration, and I/O standard support.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EP2AGX260EF29I3G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX260EF29I3G (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Process Technology, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX260EF29C6N
✅ Drop-In✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP2AGX260EF29C6G
✅ Drop-In✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP2AGX260EF29C5N
✅ Drop-In✓ Em estoque
$1565 / unidade
Ver ficha técnica →EP2AGX260EF29C4N
✅ Drop-In✓ Em estoque
$1295 / unidade
Ver ficha técnica →EP2AGX260EF29C5G
✅ Drop-In✓ Em estoque
$2515 / unidade
Ver ficha técnica →EP2AGX260EF29C4G
✅ Drop-In✓ Em estoque
$1955.55 / unidade
Ver ficha técnica →EP2AGX260EF29I3G Classificações máximas e características elétricas
| Series | Arria II GX |
| Family | Arria II GX |
| Logic Elements / Cells | 244,188 |
| Total RAM Bits | 12,038,144 |
| Number of I/O | 372 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Operating Frequency (max) | 500 MHz |
| Temperatura de operação | -40C to +100C (Industrial) |
| Encapsulamento / Caixa | 780-BBGA, FCBGA |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP2AGX260EF29I3G 780-bbga, fcbga
Configuração de pinos para EP2AGX260EF29I3G (pacote 780-bbga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX260EF29I3G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX260EF29I3G é adequado para 6 aplicaçãos: Wireless Baseband Processing, High-Definition Video Broadcast Equipment, Military Secure Communications, Industrial Machine Vision, High-Speed Serial Protocol Bridging, Test and Measurement Instrumentation.
Wireless Baseband Processing
The EP2AGX260EF29I3G is well suited for wireless baseband signal processing chains. Its 244,188 logic elements and high-speed DSP blocks enable implementation of multi-carrier FFT/iFFT pipelines, channel estimation, and MIMO processing. The integrated multi-gigabit transceivers move digitized RF data between the FPGA and ADC/DAC chips at rates typical of LTE and 5G NR fronthaul. The 500 MHz fabric performance provides timing headroom for complex baseband algorithms. Industrial temperature grade supports outdoor base-station deployments.
Recomendado
High-Definition Video Broadcast Equipment
Broadcast video routers, multi-format converters, and contribution encoders benefit from the EP2AGX260EF29I3G's combination of 372 user I/O pins and 12 Mbits of embedded memory. The FPGA can interface with SDI, HDMI, DisplayPort, and SMPTE 2022 IP simultaneously. Its block RAM supports line buffers and frame stores needed for up/down/cross-conversion at 3G-SDI and 4K UHD resolutions. High-density logic fabric handles multi-stream transcoding without external companion chips.
Recomendado
Military Secure Communications
The industrial temperature rating (-40C to +100C) and 40 nm process make the EP2AGX260EF29I3G attractive for tactical radios, software-defined radio platforms, and encrypted datalink modems. Its high-speed transceivers support encrypted waveform generation at multi-gigabit rates, while the abundant logic fabric accommodates complex cryptographic pipelines. Designers can implement bulk encryption (AES-256, ChaCha20) alongside modem DSP without external co-processors.
Recomendado
Industrial Machine Vision
Machine vision systems requiring CoaXPress, Camera Link, or GigE Vision interfaces leverage the EP2AGX260EF29I3G's transceiver channels and abundant logic. Frame buffers stored in 12 Mbits of embedded block RAM allow real-time image pre-processing, edge detection, and ROI extraction. The 372 user I/O pins connect multiple camera streams, lighting controllers, and gigabit Ethernet uplinks simultaneously. Industrial temperature grade fits factory-floor deployments.
Recomendado
High-Speed Serial Protocol Bridging
PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO bridges, and 10 Gigabit Ethernet MACs all map efficiently to the EP2AGX260EF29I3G's transceiver and logic resources. Hard IP cores for these protocols (licensed separately in Quartus II) consume minimal fabric, leaving abundant headroom for application logic. The 500 MHz core clock supports line-rate processing at full protocol throughput.
Recomendado
Test and Measurement Instrumentation
High-speed oscilloscopes, protocol analyzers, and arbitrary waveform generators use the EP2AGX260EF29I3G for real-time DSP, triggering, and display pipelines. The combination of multi-gigabit transceivers, dense logic, and abundant memory is ideal for 10+ GSPS real-time acquisition systems. Industrial temperature grade supports bench and portable instruments that must operate in labs without climate control.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX260EF29I3G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX260EF29C6N | EP2AGX260EF29C6G | EP2AGX260EF29C5N | EP2AGX260EF29C5G |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 244,188 | 244,188 (same) | 244,188 (same) | 244,188 (same) | 244,188 (same) |
| Total RAM Bits | 12,038,144 | 12,038,144 (same) | 12,038,144 (same) | 12,038,144 (same) | 12,038,144 (same) |
| Number of I/O | 372 | 372 (same) | 372 (same) | 372 (same) | 372 (same) |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | -3 | -6 (slower) | -6 (slower) | -5 (slower) | -5 (slower) |
| Process Technology | 40 nm | 40 nm (same) | 40 nm (same) | 40 nm (same) | 40 nm (same) |
| Core Voltage | 0.9 V | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) | 0.9 V (same) |
Principais diferenciais
- Industrial temperature grade (-40C to +100C) (vs EP2AGX260EF29C6N)
- Speed grade -3 (highest performance) (vs EP2AGX260EF29C5N)
- 244,188 logic elements (largest Arria II GX density) (vs EP2AGX190FF35I5N)
Notas de projeto
Estimated: at full fabric utilization (~80% LE, 70% RAM, 100% transceiver activity) the EP2AGX260EF29I3G can dissipate 8-12 W. The 780-FCBGA package has no exposed top-side heatsink; thermal management must use a heat spreader attached via thermal interface material (TIM) to the package lid, plus a heatsink or forced-air cooling. For sealed enclosures, derate to 6-8 W total or risk thermal runaway of the FPGA core.
The 780-ball FCBGA requires a controlled-impedance PCB stackup (typically 8-12 layers for high-speed transceiver channels). Use a 1.0 mm or 1.27 mm pitch BGA land pattern per JEDEC standards and follow Intel's recommended via-in-pad or microvia escape patterns. Power plane decoupling requires 0402/0201 capacitors within 100 mil of each power ball, plus bulk decoupling on each voltage rail.
Do not confuse speed grade designators: -3 (fastest, lowest temperature delay), -4, -5, -6 (slowest). Higher number = slower device. Also note that 'N' suffix indicates Pb-free/RoHS while absence of 'N' indicates SnPb ball finish. Industrial temperature parts (I) cannot be substituted into commercial-grade thermal environments without re-qualifying timing closure, though fabric and pinout are identical.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not returned in the verified distributor data. For EPC2AGX260EF29I3G without N suffix, ball finish may be SnPb; parts with N suffix (e.g. EP2AGX260EF29C6N) are typically Pb-free. Request the latest Intel material declaration certificate before shipping into regulated markets.