EP2C50U484C6 - Cyclone II FPGA, 50K LE, 484-FBGA | Intel
N.º da peça: EP2C50U484C6 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $154.44 | $154,44 |
| 10 | $138.5 | $1.385,00 |
| 100 | $125.2 | $12.520,00 |
| 250 | $118.4 | $29.600,00 |
| 500 | $115.42 | $57.710,00 |
EP2C50U484C6 Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined after manufacturing by a user-supplied bitstream stored in SRAM configuration cells. The Cyclone II family sits in the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Compared with CPLDs, FPGAs offer far higher logic density and embedded memory; compared with ASICs, they offer no NRE cost and instant design iteration. The EP2C50 specifically targets the mid-density Cyclone II tier, between EP2C35 (33K LE) and EP2C70 (70K LE), making it suitable for designers who outgrow the EP2C35 but do not need the full EP2C70 fabric.
Key features include 50,528 logic elements, 250 M4K embedded memory blocks (each 4 Kbit + parity, total 594 Kbit), up to 86 embedded 18x18 multipliers for DSP, 4 phase-locked loops, and 8 clock networks per quadrant. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, with 294 general-purpose I/O pins exposed through 8 I/O banks for flexible mixed-voltage interfacing. The U484 package offers 484 balls on a 1.0 mm pitch.
The 90 nm process and 1.2 V core supply yield typical quiescent power below 1 W in moderate-utilization designs, while the SRAM-based configuration allows unlimited re-programmability via JTAG or Active Serial. Bitstream security is supported through configuration decryption using a 128-bit AES block (in the -C8 speed grade -C6 variant requires external configuration encryption, see datasheet). All Cyclone II devices share the Quartus II design flow, simplifying migration across the family.
Typical applications include industrial motor control, video surveillance encoders, low-cost software-defined radio front-ends, and PCI-based data-acquisition cards. The 50K logic-element capacity and 86 hardware multipliers are well matched to mid-tier DSP pipelines and multi-channel baseband processing. Designers also use the EP2C50U484C6 for bridging legacy parallel buses to modern serial protocols in factory automation.
A practical design note: the U484 FineLine BGA requires 1.0 mm ball pitch, which is at the limit of cost-effective 4-layer PCB fabrication using laser-drilled microvias. Plan for a 6-layer stack-up with 0.2 mm laser vias or a 4-layer ENIG board with via-in-pad if the design team is unfamiliar with BGA fan-out. Configuration mode selection (AS, PS, JTAG) is set by MSEL pins at power-up and cannot be changed without re-boarding.
This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical BGA-layout design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing, second-sourcing, and board-level implementation decisions.
Alternativas drop-in para EP2C50U484C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C50U484C6 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C50F484C6
✅ Drop-In✓ Em estoque
$110 / unidade
Ver ficha técnica →EP2C50U484C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$175 / unidade
Ver ficha técnica →EP2C50U484C8
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$72.89 / unidade
Ver ficha técnica →EP2C35U484C6
✅ Drop-In✓ Em estoque
$106.22 / unidade
Ver ficha técnica →EP2C50F672C6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$55.95 / unidade
Ver ficha técnica →EP2C70F484C6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2C50U484C6 Classificações máximas e características elétricas
| Family | Cyclone II |
| Logic Elements | 50,528 |
| Embedded Memory (bits) | 594,432 |
| M4K RAM Blocks | 250 |
| Embedded 18x18 Multipliers | 86 |
| Maximum User I/O | 294 |
| PLLs | 4 |
| Process Technology | 90 nm CMOS SRAM |
| Core Supply Voltage | 1.2 V |
| Encapsulamento | 484-ball FineLine BGA (U484), 19x19 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial, -6) |
| Temperatura de operação | 0C to +85C (commercial) |
| Configuration Method | AS, PS, JTAG |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP2C50U484C6 484-ball fineline bga (u484), 19x19 mm, 1.0 mm pitch
Configuração de pinos para EP2C50U484C6 (pacote 484-ball fineline bga (u484), 19x19 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2C50U484C6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2C50U484C6 é adequado para 6 aplicaçãos: Industrial Motor Control, Video Surveillance Encoder, PCI Data Acquisition Card, Software-Defined Radio Baseband, Legacy Bus Bridge (ISA/PCI to Serial), Multi-Channel Industrial I/O Concentrator.
Industrial Motor Control
The EP2C50U484C6 fits industrial motor-control applications with its 86 embedded 18x18 multipliers, 4 PLLs for precise PWM generation, and 294 user I/O pins for parallel encoder and resolver feedback interfaces. The 50,528 logic elements support field-oriented control (FOC) state machines, space-vector PWM modulators, and closed-loop current/voltage regulators in a single device. The 90 nm process and 1.2 V core keep power dissipation under 1 W typical, important for sealed IP65 enclosures without active cooling. Source: Intel Cyclone II application notes on motor control.
Recomendado
Video Surveillance Encoder
Mid-range video encoders for H.264 / MJPEG streaming benefit from the EP2C50U484C6's 50,528 logic elements and 594 Kbit of embedded RAM, sufficient for one D1-resolution encode channel plus on-chip line buffering. The 294 user I/O pins interface directly to BT.656 / parallel sensor inputs, DDR2 SDRAM for frame storage, and an Ethernet MAC such as the Intel (formerly Lantiq) PEF2466. The 1.0 mm pitch U484 BGA allows 4-layer PCB fan-out with microvia stacks, keeping BOM cost low for high-volume security products. Source: Cyclone II video reference designs.
Recomendado
PCI Data Acquisition Card
The EP2C50U484C6's 294 I/O pins are well matched to 32-bit, 33 MHz PCI bus implementations with substantial headroom for analog-front-end glue logic, FIFOs, and DMA controllers. The 250 M4K memory blocks (4 Kbit each) provide 1 Mbit of on-chip buffering for high-speed ADC sample streams without external SRAM. The -C6 speed grade is the slowest Cyclone II grade, but it offers the best timing closure margin, important for 33 MHz PCI compliance. Source: Altera PCI reference design AN-342.
Recomendado
Software-Defined Radio Baseband
Low-cost software-defined radio receivers use the EP2C50U484C6 for IF/baseband processing, taking advantage of the 86 embedded 18x18 multipliers for digital down-conversion, channelization, and demodulation. The 4 PLLs generate the multiple synchronized clock domains required by ADC interfaces, DSP pipelines, and external memory controllers. With 50,528 logic elements the device handles narrow-band (200 kHz) digital-channelizer implementations of WCDMA or LTE in a single Cyclone II. Source: Altera SDR reference designs.
Recomendado
Legacy Bus Bridge (ISA/PCI to Serial)
The EP2C50U484C6 is widely deployed as a bridge between legacy parallel buses (ISA, VME, PCI) and modern serial interfaces (USB 2.0, Ethernet, SPI). The 294 I/O pins accommodate the wide parallel bus plus several serial controllers simultaneously, and 50,528 logic elements implement custom protocol state machines in a single chip. Industrial PC and test-equipment manufacturers continue to use the EP2C50 because of its long-term firmware stability and documented Quartus II design flow. Source: Altera bridge reference designs.
Recomendado
Multi-Channel Industrial I/O Concentrator
Industrial distributed I/O systems concentrate 32-128 channels of digital input, digital output, and analog measurement onto a single EP2C50U484C6 running an EtherCAT or Profinet slave stack. The 50,528 logic elements fit the protocol stack, mailbox handler, and diagnostic logic, while 294 I/O pins connect to multiple serial or parallel I/O expanders. The 1.2 V core and 90 nm process keep the device cool enough for DIN-rail-mounted sealed modules. Source: Intel Industrial Ethernet reference designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C50U484C6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C50F484C6 | EP2C50U484C7 | EP2C50U484C8 | EP2C35U484C6 | EP2C50F672C6 | EP2C70F484C6 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball UFBGA (U484), 19x19 mm, 1.0 mm pitch | 484-ball FBGA (F484) - same ball count | 484-ball UFBGA (U484) - same | 484-ball UFBGA (U484) - same | 484-ball UFBGA (U484) - same | 672-ball FBGA (F672) - different footprint | 484-ball FBGA (F484) - same ball count |
| Logic Elements | 50,528 | 50,528 | 50,528 | 50,528 | 33,216 | 50,528 | 68,416 |
| Embedded RAM (bits) | 594,432 | 594,432 | 594,432 | 594,432 | 483,840 | 594,432 | 1,152,000 |
| Embedded 18x18 Multipliers | 86 | 86 | 86 | 86 | 35 | 86 | 150 |
| Maximum User I/O | 294 | 294 | 294 | 294 | 322 | 450 | 294 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Speed Grade | C6 | C6 | C7 | C8 | C6 | C6 | C6 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Principais diferenciais
- Highest logic density in Cyclone II 484-ball BGA family (vs EP2C35U484C6)
- U484 Ultra FineLine BGA substrate (vs EP2C50F484C6)
- Best timing-closure margin in Cyclone II family (vs EP2C50U484C8)
Notas de projeto
The U484 FineLine BGA uses 1.0 mm ball pitch on a 19x19 mm body. This is at the practical limit of cost-effective 4-layer PCB fabrication. Use a 6-layer stack-up with 0.2-0.25 mm laser-drilled microvias for escape routing, or a 4-layer ENIG board with via-in-pad plating for sub-1.0 mm pitch fan-out. Route signals on the top layer only directly under the BGA; keep power/ground on inner layers with adequate via arrays for thermal dissipation. Source: Altera BGA layout guidelines.
Estimated: typical Cyclone II EP2C50 designs with 60% logic utilization and 100 MHz operation consume approximately 0.8-1.2 W from the 1.2 V VCCINT rail, with additional 0.3-0.5 W from VCCIO banks depending on switching frequency. Decouple each VCCINT/VCCIO pin pair with a 0.1 uF X7R ceramic plus a 10 uF bulk capacitor within 5 mm of the BGA. VCCA pins require a clean 2.5 V analog supply filtered through a ferrite bead for PLL stability. Source: Cyclone II hardware design guide.
Configuration mode (AS, PS, or JTAG) is set by MSEL pin strapping at power-up and cannot be changed in software. Select the wrong mode and the device will not configure. For AS (Active Serial) mode using an EPCS configuration device, ensure the AS data input is pulled up during power ramp to prevent spurious configuration. Source: Cyclone II configuration handbook.
Estimated: at full 100% logic utilization and 250 MHz toggle rate, EP2C50 junction temperature can exceed 100C with insufficient PCB copper. A minimum 4-layer PCB with a continuous ground plane beneath the BGA and at least 1 oz copper on outer layers is recommended for commercial-temperature (0C to +85C) operation. Derate to 70% utilization for industrial deployments without airflow. Source: Cyclone II thermal management AN-358.
Informações de conformidade
RoHS and lead-free per Intel/Altera product declaration. Not AEC-Q100 qualified (commercial temperature grade only). Conflict-mineral compliance per Intel supplier responsibility program.
