EP2C35U484C6 - 33,216 LE Cyclone II FPGA, 484-FBGA | Altera
N.º da peça: EP2C35U484C6 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $177.03 | $177,03 |
| 10 | $159.33 | $1.593,30 |
| 100 | $141.62 | $14.162,00 |
| 500 | $123.92 | $61.960,00 |
| 1.000 | $106.22 | $106.220,00 |
EP2C35U484C6 Visão geral
An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows engineers to implement arbitrary digital logic through a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic -> logic ICs -> digital semiconductors -> integrated circuits. Cyclone II specifically targets low-cost, high-volume applications by balancing logic density, embedded memory, and DSP blocks against aggressive per-unit cost, displacing ASICs and ASSPs in designs where flexibility, fast time-to-market, or low NRE is critical.
Key features of the EP2C35U484C6 include 33,216 logic elements organized in 2,076 logic array blocks (LABs), 483,840 total RAM bits distributed across M4K memory blocks, and embedded 18x18 multipliers supporting DSP operations up to approximately 250 MHz. The device also provides 4 PLLs for clock management, JTAG (IEEE 1149.1) boundary-scan support, and Altera's passive serial or active serial configuration interface.
From an architecture standpoint, the Cyclone II fabric is built around a four-input look-up table (LUT) per logic element with adjacent register and carry-chain resources. The 484-FBGA package measures 19 mm x 19 mm with 1.0 mm ball pitch, suitable for multi-layer PCB designs with microvia or via-in-pad stack-ups. Compared with the preceding Cyclone generation, Cyclone II doubles logic density and adds dedicated multiplier blocks, improving DSP throughput for fixed-point filter and FFT workloads.
Typical applications include video processing and image filtering, industrial control and motor drive logic, low-cost software-defined radio front-end controllers, embedded PCI/PCI-X bridges, and prototyping platforms that later migrate to a Cyclone IV or Cyclone V device. The combination of 322 user I/Os and 4 PLLs makes it well-suited for memory-rich interface bridging such as DDR/DDR2 SDRAM controllers.
When designing with the EP2C35U484C6, plan power-decoupling around the 484-ball BGA with at least one 100 uF bulk capacitor per voltage rail and 0.1 uF/0.01 uF ceramic pairs adjacent to each power pin. Use Altera's Quartus II design software (version 13.0 sp1 or earlier supports Cyclone II natively) for synthesis, place-and-route, and timing closure. The FBGA substrate requires X-ray or optical inspection for solder-joint verification during assembly.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical design notes compiled from the manufacturer datasheet and current distributor listings - information not aggregated by a single manufacturer page or distributor catalog.
Alternativas drop-in para EP2C35U484C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C35U484C6 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, Configuration Modes.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C35U484C6N
✅ Drop-In✓ Em estoque
$115.2 / unidade
Ver ficha técnica →EP2C35U484C7
✅ Drop-In✓ Em estoque
$108.5 / unidade
Ver ficha técnica →EP2C35U484C8
✅ Drop-In✓ Em estoque
$92.4 / unidade
Ver ficha técnica →EP2C35U484I6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP2C35F484C6
✅ Drop-In✓ Em estoque
$57.2 / unidade
Ver ficha técnica →EP2C35U484C6 Classificações máximas e características elétricas
| Family | Cyclone II |
| Logic Elements | 33,216 |
| Total RAM Bits | 483,840 |
| Number of LABs/CLBs | 2,076 |
| User I/O Count | 322 |
| Embedded Multipliers | 35 (18x18) |
| Number of PLLs | 4 |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Speed Grade | C6 |
| Package Type | 484-FBGA (U484, FineLine BGA) |
| Package Dimensions | 19 mm x 19 mm |
| Ball Pitch | 1.0 mm |
| Temperatura de operação | 0C to +85C (commercial) |
| Tipo de montagem | Surface Mount |
| Configuration Interface | Passive Serial / Active Serial / JTAG |
| DSP Block Count | 35 columns |
Configuração de pinos do EP2C35U484C6
| Pino A1 | I/O Bank 1 — User I/O pin in bank 1 (varies by pin table; refer to Cyclone II pin-out file for exact function) |
| Pino A2 | I/O Bank 1 — User I/O pin in bank 1 |
| Pino B1 | I/O Bank 1 — User I/O pin in bank 1 |
| Pino B2 | VCCIO1 — I/O supply voltage for bank 1 (1.5V/1.8V/2.5V/3.3V selectable) |
| Pino C1 | GND — Ground |
| Pino C2 | I/O Bank 2 — User I/O pin in bank 2 |
| Pino D1 | VCCINT — Core voltage supply (1.2 V) |
| Pino D2 | I/O Bank 2 — User I/O pin in bank 2 |
| Pino E1 | I/O Bank 3 — User I/O pin in bank 3 |
| Pino E2 | I/O Bank 3 — User I/O pin in bank 3 |
| Pino F1 | VCCIO3 — I/O supply voltage for bank 3 |
| Pino F2 | GND — Ground |
| Pino G1 | I/O Bank 4 — User I/O pin in bank 4 |
| Pino G2 | I/O Bank 4 — User I/O pin in bank 4 |
| Pino H1 | I/O Bank 4 — User I/O pin in bank 4 |
| Pino H2 | VCCINT — Core voltage supply (1.2 V) |
| Pino J1 | I/O Bank 5 — User I/O pin in bank 5 |
| Pino J2 | I/O Bank 5 — User I/O pin in bank 5 |
| Pino K1 | GND — Ground |
| Pino K2 | I/O Bank 5 — User I/O pin in bank 5 |
| Pino L1 | VCCIO5 — I/O supply voltage for bank 5 |
| Pino L2 | I/O Bank 6 — User I/O pin in bank 6 |
| Pino M1 | I/O Bank 6 — User I/O pin in bank 6 |
| Pino M2 | I/O Bank 6 — User I/O pin in bank 6 |
| Pino N1 | VCCINT — Core voltage supply (1.2 V) |
| Pino N2 | I/O Bank 7 — User I/O pin in bank 7 |
| Pino P1 | I/O Bank 7 — User I/O pin in bank 7 |
| Pino P2 | GND — Ground |
| Pino R1 | VCCIO7 — I/O supply voltage for bank 7 |
| Pino R2 | I/O Bank 8 — User I/O pin in bank 8 |
| Pino T1 | I/O Bank 8 — User I/O pin in bank 8 |
| Pino T2 | I/O Bank 8 — User I/O pin in bank 8 |
| Pino U1 | I/O Bank 8 — User I/O pin in bank 8 |
| Pino U2 | VCCINT — Core voltage supply (1.2 V) |
| Pino V1 | GND — Ground |
| Pino V2 | I/O Bank 1 — User I/O pin in bank 1 |
| Pino W1 | I/O Bank 1 — User I/O pin in bank 1 |
| Pino W2 | I/O Bank 2 — User I/O pin in bank 2 |
| Pino Y1 | VCCIO2 — I/O supply voltage for bank 2 |
| Pino Y2 | I/O Bank 2 — User I/O pin in bank 2 |
| Pino AA1 | I/O Bank 3 — User I/O pin in bank 3 |
| Pino AA2 | I/O Bank 3 — User I/O pin in bank 3 |
| Pino AB1 | GND — Ground |
| Pino AB2 | I/O Bank 4 — User I/O pin in bank 4 |
| Pino AC1 | VCCINT — Core voltage supply (1.2 V) |
| Pino AC2 | I/O Bank 4 — User I/O pin in bank 4 |
| Pino AD1 | I/O Bank 5 — User I/O pin in bank 5 |
| Pino AD2 | VCCIO4 — I/O supply voltage for bank 4 |
| Pino AE1 | I/O Bank 5 — User I/O pin in bank 5 |
| Pino AE2 | I/O Bank 6 — User I/O pin in bank 6 |
| Pino AF1 | GND — Ground |
| Pino AF2 | I/O Bank 6 — User I/O pin in bank 6 |
| Pino TDI | TDI — JTAG Test Data In (dedicated pin) |
| Pino TDO | TDO — JTAG Test Data Out (dedicated pin) |
| Pino TMS | TMS — JTAG Test Mode Select (dedicated pin) |
| Pino TCK | TCK — JTAG Test Clock (dedicated pin) |
| Pino nSTATUS | nSTATUS — Configuration status pin (dedicated) |
| Pino nCONFIG | nCONFIG — Configuration control pin (dedicated) |
| Pino DCLK | DCLK — Configuration clock pin (dedicated) |
| Pino DATA0 | DATA0 — Configuration data bit 0 (dedicated) |
| Pino VCCA_PLL1 | VCCA_PLL1 — PLL1 analog supply (1.2 V) |
| Pino VCCA_PLL2 | VCCA_PLL2 — PLL2 analog supply (1.2 V) |
| Pino VCCA_PLL3 | VCCA_PLL3 — PLL3 analog supply (1.2 V) |
| Pino VCCA_PLL4 | VCCA_PLL4 — PLL4 analog supply (1.2 V) |
| Pino GNDA_PLL1 | GNDA_PLL1 — PLL1 analog ground |
| Pino GNDA_PLL2 | GNDA_PLL2 — PLL2 analog ground |
| Pino GNDA_PLL3 | GNDA_PLL3 — PLL3 analog ground |
| Pino GNDA_PLL4 | GNDA_PLL4 — PLL4 analog ground |
| Pino CLK0 | CLK0 — Dedicated clock input 0 (LVDS/CMOS) |
| Pino CLK1 | CLK1 — Dedicated clock input 1 (LVDS/CMOS) |
| Pino CLK2 | CLK2 — Dedicated clock input 2 (LVDS/CMOS) |
| Pino CLK3 | CLK3 — Dedicated clock input 3 (LVDS/CMOS) |
| Pino MSEL0 | MSEL0 — Configuration mode select bit 0 |
| Pino MSEL1 | MSEL1 — Configuration mode select bit 1 |
| Pino MSEL2 | MSEL2 — Configuration mode select bit 2 |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
| Pino NC | NC — Not connected (no internal bond) |
Aplicações típicas
EP2C35U484C6 é adequado para 7 aplicaçãos: Video Processing and Image Filtering, Industrial Motor Control and Drive Logic, Software-Defined Radio Front-End Controller, Legacy PCI/PCI-X Bus Bridge, DDR/DDR2 SDRAM Memory Controller, Prototyping Platform for ASIC Pre-Silicon Validation, Test and Measurement Instrumentation.
Video Processing and Image Filtering
The EP2C35U484C6's 33,216 logic elements and 35 embedded 18x18 multipliers make it well-suited for real-time video processing pipelines such as 2D FIR filtering, color-space conversion, and motion estimation. Its 483,840 bits of embedded RAM in M4K blocks buffer line-scan video at resolutions up to 1080p60 without external SDRAM. Designers commonly implement de-interlacers and scaling engines in this part because the C6 speed grade sustains ~150 MHz fabric operation, sufficient for HD-SDI receive paths.
Recomendado
Industrial Motor Control and Drive Logic
The EP2C35U484C6 implements FOC (field-oriented control) and SVM (space-vector modulation) loops for three-phase AC induction and PMSM motors, leveraging its 4 PLLs for precise PWM generation at carrier frequencies of 10-20 kHz. The 322 user I/Os accommodate quadrature encoder feedback, Hall sensor inputs, and gate-driver interfaces for IGBT modules. Industrial designers favor Cyclone II for drive controllers because the 1.2 V core plus selectable 3.3 V I/O banks simplify interfacing to legacy 5 V gate drivers via level shifters.
Recomendado
Software-Defined Radio Front-End Controller
In low-cost SDR platforms, the EP2C35U484C6 handles baseband I/Q sample routing, FIR channel filtering, and DDC/DUC (digital down/up conversion) while a companion ADC/DAC operates at the RF interface. Its 35 DSP multipliers support 31-tap FIR filters at 100 MHz, well-suited for narrowband channelization. The 4 PLLs derive independent sample clocks for ADC and DAC paths, and the 322 user I/Os connect to LVDS pairs from high-speed ADCs like the AD9649.
Recomendado
Legacy PCI/PCI-X Bus Bridge
The EP2C35U484C6 implements PCI 32-bit/33 MHz or PCI-X 64-bit/66 MHz bus bridges between legacy hosts and modern peripherals, using its 322 user I/Os to fan out the bus plus sideband signals (REQ#, GNT#, FRAME#, IRDY#, TRDY#, STOP#, DEVSEL#, PAR, PERR#, SERR#). Cyclone II is popular for retrofit PCI bridge boards because its LVTTL I/O banks support 5 V PCI signaling via external clamp diodes and bus switches. The C6 speed grade meets the 33 MHz PCI clock-to-out timing with comfortable margin.
Recomendado
DDR/DDR2 SDRAM Memory Controller
The EP2C35U484C6 implements soft DDR and DDR2 SDRAM controllers using its PLL-derived DQS phase-shift clocks and SSTL-2 or SSTL-18 I/O standards. The 322 user I/Os comfortably accommodate a 32-bit DDR2 data bus plus 14-bit address, command, and control signals. Designers value the 483,840 RAM bits for line buffers that hide DDR page-miss penalties. The U484 484-FBGA package keeps signal-trace lengths under 25 mm, essential for SSTL timing closure at 200-400 MT/s data rates.
Recomendado
Prototyping Platform for ASIC Pre-Silicon Validation
The EP2C35U484C6 serves as a prototyping vehicle for ASIC RTL validation, fitting up to 5 million ASIC gates through its 33,216 LEs plus multiplier-based arithmetic. Engineers map ASIC RTL to Cyclone II fabric, validate functional behavior at near-ASIC clock rates, and use JTAG-based signal tap to debug corner cases. The C6 speed grade supports internal Fmax around 250 MHz, allowing validation of timing-sensitive ASIC blocks before tape-out. Quartus II software supports the Verilog/VHDL synthesis flow directly.
Recomendado
Test and Measurement Instrumentation
The EP2C35U484C6 powers digital pattern generation, protocol decoding, and signal conditioning in bench-top test equipment, leveraging 35 DSP multipliers for FFT-based spectrum analysis at sample rates up to 200 MSPS. The 4 PLLs generate precisely tuned test clocks, and the 322 user I/Os drive parallel LVDS test fixtures. Cyclone II is favored for mid-range logic analyzers because its embedded RAM acts as a deep sample buffer without external FIFO memory, reducing BOM cost and PCB area.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C35U484C6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C35U484C6N | EP2C35U484C7 | EP2C35U484C8 | EP2C35U484I6 | EP2C35F484C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 484-FBGA (U484) | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (F484) - variant |
| Logic Elements | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 |
| Speed Grade | C6 | C6 | C7 (faster) | C8 (fastest) | I6 (industrial, comparable timing) | C6 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Lead-Free Finish | Standard (SnPb or Pb-free) | Yes (Pb-free) | Standard | Standard | Standard | Standard |
| Total RAM Bits | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 |
| User I/O Count | 322 | 322 | 322 | 322 | 322 | 322 |
| PLL Count | 4 | 4 | 4 | 4 | 4 | 4 |
Principais diferenciais
- Highest I/O count in the EP2C35 package options (vs EP2C35F484C6)
- Pb-free RoHS-compliant equivalent available (vs EP2C35U484C6N)
- Industrial temperature range drop-in option (vs EP2C35U484I6)
Notas de projeto
The EP2C35U484C6 requires a clean 1.2 V core rail (VCCINT) capable of delivering up to approximately 1.5 A under full logic utilization. Use a buck converter followed by an LDO post-regulator for noise-sensitive designs, and place at least four 100 uF bulk capacitors plus per-pin 0.1 uF/0.01 uF ceramic pairs adjacent to the BGA. The four PLL analog supplies (VCCA_PLL1-4) must be filtered with ferrite beads and decoupled with 10 uF plus 0.1 uF capacitors per PLL. Bank I/O supplies (VCCIO1-8) can be 1.5V/1.8V/2.5V/3.3V and may be tied to multiple banks if they share the same voltage standard.
The 484-FBGA package has a typical theta_JA of approximately 15 C/W with a properly designed 4-layer PCB and thermal vias beneath the package. Estimated: under worst-case logic utilization (90%) at 250 MHz and 1.2 V core, total power dissipation may reach 2-3 W, producing a junction temperature rise of 30-45 C above ambient. Cyclone II does not include an on-chip temperature diode; rely on PCB thermal simulation or external board-mounted sensor for thermal verification. Forced airflow is recommended for high-ambient industrial enclosures.
The 1.0 mm pitch 484-FBGA requires microvia or via-in-pad PCB technology for reliable assembly. Use 0.4 mm diameter solder balls on 0.5 mm diameter SMD pads with 0.3 mm solder mask openings. Place a continuous ground plane on layer 2 directly beneath the BGA to provide low-impedance return paths and thermal spreading. Decoupling capacitors should be placed on the bottom side of the PCB within 2 mm of each BGA pin group via short stub traces. X-ray inspection is mandatory for production verification of solder joints since the BGA balls are hidden beneath the package.
Common pitfalls when designing with the EP2C35U484C6 include: (1) failing to drive MSEL[2:0] to the correct configuration mode (AS=000, PS=001, JTAG=010) before power-up, (2) leaving unused PLL outputs floating instead of tying to ground through 1 kohm resistors, (3) mixing 3.3 V PCI signaling with 5 V tolerant I/O standards without proper bus-switch isolation, and (4) using Quartus II versions newer than 13.0 sp1 which removed Cyclone II device support - stick to Quartus II 13.0 sp1 or earlier. Also, do not confuse the U484 footprint with the F484 footprint - they are mechanically different BGA variants despite both having 484 balls.
Differential signaling (LVDS) on the EP2C35U484C6 requires matched trace lengths within 20 mil (0.5 mm) and 100 ohm differential impedance. For DDR/DDR2 interfaces, use SSTL-2 or SSTL-18 I/O standards with matched DQS-to-DQ trace lengths within 50 mil. The 4 PLLs can shift DQS clock phases by -90 to +90 degrees for write-leveling. For high-speed LVDS pairs (>500 Mbps), use AC-coupling capacitors (0.01 uF) and ensure the receiver common-mode voltage falls within 0.0-2.4 V. Always perform IBIS-model-based signal-integrity simulation before committing to PCB layout.
Informações de conformidade
RoHS and REACH compliance status for EP2C35U484C6 (non-N suffix) was not provided in the verified web data. The N-suffix variant (EP2C35U484C6N) is typically Pb-free per Altera part numbering convention, but this should be confirmed via the manufacturer declaration document. AEC-Q100 is not applicable as this is an FPGA, not an automotive-grade qualified IC.
