EP2C70F896C6 - 68K LE Cyclone II FPGA, 896-FBGA | Intel
N.º da peça: EP2C70F896C6 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $936.74 | $936,74 |
| 10 | $880 | $8.800,00 |
| 100 | $805 | $80.500,00 |
| 500 | $720 | $360.000,00 |
| 1.000 | $650 | $650.000,00 |
EP2C70F896C6 Visão geral
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream. In the system hierarchy, FPGAs sit between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with design-time flexibility. The Cyclone II family specifically targets the low-power, high-volume cost band between CPLDs and high-end FPGAs, originally introduced in 2004 as Altera's response to Xilinx Spartan-3.
Key features include up to 500 MHz internal operation, dedicated hardware multipliers for DSP pipelines, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and a 4-wire serial configuration interface (AS, PS, or JTAG modes). The 896-FBGA package provides high I/O density for parallel bus implementations and high-speed external memory connections.
Typical applications include digital signal processing front-ends, video processing pipelines, industrial machine vision, motor control, soft-core processor implementations (NIOS II), and communications protocol bridging. Designers appreciate the strong balance between logic density and unit cost that this part historically delivered.
When designing with this device, ensure the FPGA configuration scheme (active serial versus JTAG) is selected up-front, and verify that the board layout supports the 896-ball FBGA ball pitch with adequate breakout routing. This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical design notes not typically found in the manufacturer datasheet alone.
Alternativas drop-in para EP2C70F896C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C70F896C6 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Configuration Modes, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C70F672C6
✅ Drop-In✓ Em estoque
$338.91 / unidade
Ver ficha técnica →EP2C70F896I8N
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP2C70F672I8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →EP2C70F672C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$239.75 / unidade
Ver ficha técnica →EP2C70F672C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →EP2C70F896C6 Classificações máximas e características elétricas
| Family | Cyclone II |
| Logic Elements | 68,416 |
| Total Memory Bits | 1,152,000 |
| M9K Memory Blocks | 622 |
| Embedded 18x18 Multipliers | 150 |
| PLLs | 4 |
| Maximum User I/O | 622 (per DigiKey listing) |
| Maximum Operating Frequency | 500 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Encapsulamento | 896-ball FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount |
| Configuration Modes | Active Serial, Passive Serial, JTAG |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix |
| Speed Grade | 6 |
Guia de Configuração de Pinos do EP2C70F896C6 896-ball fbga (fineline bga)
Configuração de pinos para EP2C70F896C6 (pacote 896-ball fbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2C70F896C6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2C70F896C6 é adequado para 7 aplicaçãos: Digital Signal Processing (DSP) Front-End, Industrial Video Processing, Motor Control and Industrial Automation, Soft-Core Processor Implementation (NIOS II), Communications Protocol Bridging, Test and Measurement Instrumentation, Legacy Design Production Continuity.
Digital Signal Processing (DSP) Front-End
The EP2C70F896C6 hosts real-time DSP front-ends where the 150 embedded 18x18 hardware multipliers deliver dedicated MAC throughput for FIR filters, FFT engines, and digital down-converters. Operating at up to 500 MHz internal clock with 4 PLLs, the device generates the multiple derived clocks needed by parallel DSP lanes. The 1,152,000 embedded RAM bits plus external DDR/DDR2 controller support sustain high data-rate sample buffers. Unlike microcontrollers, the FPGA fabric executes parallel operations in hardware, dramatically increasing throughput per watt for signal-chain workloads.
Recomendado
Industrial Video Processing
In machine vision and surveillance imaging, the EP2C70F896C6 provides the logic capacity to implement real-time image processing pipelines at D1 to 720p resolutions. The 622 maximum user I/Os capture parallel video busses (RGB, ITU-R BT.656, or Camera Link) and drive HDMI/DVI outputs, while the 150 multipliers accelerate 2D convolution and edge-detection kernels. The 4 PLLs synthesize pixel clocks and memory controller phases. Industrial grade variants (EP2C70F896I8N) extend operation to -40C to +100C, suitable for factory floor deployment.
Recomendado
Motor Control and Industrial Automation
The EP2C70F896C6 executes field-oriented control (FOC) algorithms for multi-axis motor drives, benefiting from parallel PWM generation and hardware current-loop sampling. The 622 user I/Os interface with multiple encoder inputs (QEP, SSI, BISS), resolver-to-digital converters, and gate-driver enable signals, while the 4 PLLs lock to precise switching frequencies (typically 8-32 kHz) and ADC sample clocks. Compared with a microcontroller, the FPGA eliminates interrupt-jitter in the current loop and enables deterministic sub-microsecond loop times for high-speed spindle or servo control.
Recomendado
Soft-Core Processor Implementation (NIOS II)
The EP2C70F896C6 fabric is large enough to host a NIOS II/f soft-core processor running up to 200 DMIPS alongside substantial user logic, making it ideal for custom embedded controllers with bespoke peripherals. The 1,152,000 embedded RAM bits serve as tightly-coupled on-chip memory for code and data, reducing external memory pressure. 622 I/Os connect to any combination of UARTs, SPIs, I2Cs, Ethernet MACs, or custom register interfaces. This capability enables single-chip SoC integration at unit-cost economics impossible with hard-core MCU parts.
Recomendado
Communications Protocol Bridging
The EP2C70F896C6 implements custom protocol converters between industrial and telecom interfaces (E1/T1, CAN, RS-485, Ethernet, PCIe endpoint, UART). The 622 I/Os handle multiple simultaneous physical-layer ports, while the FPGA fabric implements stateful protocol engines in hardware with no software latency. Hardware multipliers accelerate CRC, encryption, and forward-error-correction blocks. Compared to a discrete ASSP bridge IC, the FPGA accommodates late-stage protocol additions and customer-specific framing without respinning the PCB.
Recomendado
Test and Measurement Instrumentation
The EP2C70F896C6 underpins custom logic-analyzers, pattern-generators, and protocol-analyzers where deterministic timing and deep parallel capture are essential. The 622 I/Os enable wide-channel test heads (32+ channels per bank) and the embedded M9K RAM blocks serve as capture FIFIs before DMA transfer. The 150 multipliers accelerate on-the-fly signal-statistics computations, while 4 PLLs synthesize multi-rate sampling clocks. Compared with a general-purpose oscilloscope ASIC, the FPGA offers full reconfigurability for emerging serial standards.
Recomendado
Legacy Design Production Continuity
Many long-lifecycle industrial, aerospace, and defense programs continue to use the EP2C70F896C6 because re-validation of FPGA-bitstreams is expensive and risky. Intel's Product Discontinuance Program makes this part available for last-time-buy orders through franchised distributors, supporting production runs for the next several years. Engineers should perform a one-time lifetime-buy calculation based on field-deployed unit counts and projected end-of-production dates, then store parts in moisture-sealed ESD bags with controlled humidity.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C70F896C6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C70F672C6 | EP2C70F896I8N | EP2C70F672I8N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 896-ball FBGA | 672-pin FBGA | 896-ball FBGA - same | 672-pin FBGA |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 |
| Maximum User I/O | 622 | 422 (smaller package) | 622 (same) | 422 |
| Embedded Multipliers (18x18) | 150 | 150 | 150 | 150 |
| Total Memory Bits | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| PLLs | 4 | 4 | 4 | 4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Maximum logic density in the Cyclone II family (vs EP2C50F484C6)
- Maximum I/O count in the 896-ball FBGA footprint (vs EP2C70F672C6)
- Commercial speed grade 6 is the fastest in the family (vs EP2C70F896I8N (industrial speed grade 8))
Notas de projeto
The 896-ball FBGA with 1.0 mm pitch requires a multilayer PCB (8+ layers recommended) with microvia or via-in-pad technology for breakout. Use a 4-layer stack-up only if signal count is modest. Reference Intel's Cyclone II Hardware Design Guidelines for matched-impedance layout rules for DDR2/QDRII memory interfaces; maintain differential pair length matching within 150 mils to avoid setup/hold violations at 200 MHz.
Estimated: Cyclone II core current at 68,416 LEs with 50% toggle rate and 150 multipliers active is approximately 1.2 A at 1.2 V (estimated based on typical Cyclone II datasheet curves). With 4 PLL analog supplies plus I/O bank supplies (each bank may require 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V), budget at least 6 distinct supply rails with proper decoupling (0.1 uF + 10 uF per pin-pair). Decoupling is critical to avoid PLL jitter degradation.
Do not confuse MSL (Moisture Sensitivity Level) and bake requirements: 896-ball FBGA Cyclone II parts are MSL3 typically and require sealed dry-pack storage before reflow. Many counterfeit units enter the supply chain via improper rework of MSL-packaged devices. Always source from franchised distributors for last-time-buy parts and request the manufacturer date-code and lot trace to verify authenticity.
Place the EPCS configuration memory within 3 inches of the FPGA data lines to minimize signal integrity issues during AS configuration. Add 4.7 kohm pull-up resistors on nCONFIG, nSTATUS, and CONF_DONE to ensure clean boot. Reserve the JTAG TCK/TMS/TDI/TDO chain header on the PCB even if your design uses AS mode in production - JTAG is essential for development debug and board-level boundary-scan verification.
Informações de conformidade
RoHS and REACH compliance status to be confirmed from manufacturer product page. Cyclone II devices are designed for industrial/commercial (not automotive AEC-Q100) applications. Lead-free reflow per JEDEC J-STD-020.
