EP2C70F896C6 - 68K LE Cyclone II FPGA, 896-FBGA | Intel
MPN: EP2C70F896C6 ⚠ Son Satın AlmaEP2C70F896C6 Genel Bakış
An FPGA (Field-Programmable Gate Array) is a programmable logic device whose logic fabric, interconnect, and I/O behavior are defined by a user-loaded configuration bitstream. In the system hierarchy, FPGAs sit between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with design-time flexibility. The Cyclone II family specifically targets the low-power, high-volume cost band between CPLDs and high-end FPGAs, originally introduced in 2004 as Altera's response to Xilinx Spartan-3.
Key features include up to 500 MHz internal operation, dedicated hardware multipliers for DSP pipelines, support for external memory interfaces including DDR/DDR2/QDRII SDRAM, and a 4-wire serial configuration interface (AS, PS, or JTAG modes). The 896-FBGA package provides high I/O density for parallel bus implementations and high-speed external memory connections.
Typical applications include digital signal processing front-ends, video processing pipelines, industrial machine vision, motor control, soft-core processor implementations (NIOS II), and communications protocol bridging. Designers appreciate the strong balance between logic density and unit cost that this part historically delivered.
When designing with this device, ensure the FPGA configuration scheme (active serial versus JTAG) is selected up-front, and verify that the board layout supports the 896-ball FBGA ball pitch with adequate breakout routing. This page synthesizes distributor pricing, drop-in Cyclone II alternatives, and practical design notes not typically found in the manufacturer datasheet alone.
Drop-in alternatifler için EP2C70F896C6 — aynı paket, pin-başına uyumlu. PCB yeniden montajı gerektiren farklı paket bileşenleri dışlanmıştır.
Bu Serideki Variantlar
Yedek parça uyumlu olan aynı serideki modeller EP2C70F896C6 (aynı form faktörü ve ayağa oturma) — farklı olan Package, Speed Grade, Process Technology, Configuration Modes, RoHS Status.
EP2C70F672C6
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2C70F896I8N
✅ YerleştirmeFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2C70F672I8N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2C70F672C8N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2C70F672C7N
✅ Yerleştirme ⚠️ Onaylanmamış ÖzelliklerFiyat için iletişime geçin
Veri Şablonunu Görüntüle →EP2C70F896C6 Maksimum Değerlendirmeler & Elektriksel Özellikler
| Family | Cyclone II |
| Logic Elements | 68,416 |
| Total Memory Bits | 1,152,000 |
| M9K Memory Blocks | 622 |
| Embedded 18x18 Multipliers | 150 |
| PLLs | 4 |
| Maximum User I/O | 622 (per DigiKey listing) |
| Maximum Operating Frequency | 500 MHz |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Paket | 896-ball FBGA (FineLine BGA) |
| Montaj Türü | Surface Mount |
| Configuration Modes | Active Serial, Passive Serial, JTAG |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix |
| Speed Grade | 6 |
EP2C70F896C6 896-ball fbga (fineline bga) Pin Yapısı Kılavuzu
EP2C70F896C6 (896-ball fbga (fineline bga) paket) için pin yapısı. Bu dijital IC, GPIO, iletişim arayüzleri (UART, SPI, I2C) ve güç pinleri içerir. Alternatif pin işlevleri ve yapılandırma seçenekleri için üretici veri kitapçığını referans alın. Tünel sistem tasarımı ve PCB yerleşimi için temel bir bileşendir.
Ayrıntılı pin çıkış verisi mevcut değil: EP2C70F896C6.
Aşağıdaki veri sayfası tam pin konfigürasyonu için.
Tipik Uygulamalar
EP2C70F896C6 için uygundur 7 uygulamas: Digital Signal Processing (DSP) Front-End, Industrial Video Processing, Motor Control and Industrial Automation, Soft-Core Processor Implementation (NIOS II), Communications Protocol Bridging, Test and Measurement Instrumentation, Legacy Design Production Continuity.
Digital Signal Processing (DSP) Front-End
The EP2C70F896C6 hosts real-time DSP front-ends where the 150 embedded 18x18 hardware multipliers deliver dedicated MAC throughput for FIR filters, FFT engines, and digital down-converters. Operating at up to 500 MHz internal clock with 4 PLLs, the device generates the multiple derived clocks needed by parallel DSP lanes. The 1,152,000 embedded RAM bits plus external DDR/DDR2 controller support sustain high data-rate sample buffers. Unlike microcontrollers, the FPGA fabric executes parallel operations in hardware, dramatically increasing throughput per watt for signal-chain workloads.
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Industrial Video Processing
In machine vision and surveillance imaging, the EP2C70F896C6 provides the logic capacity to implement real-time image processing pipelines at D1 to 720p resolutions. The 622 maximum user I/Os capture parallel video busses (RGB, ITU-R BT.656, or Camera Link) and drive HDMI/DVI outputs, while the 150 multipliers accelerate 2D convolution and edge-detection kernels. The 4 PLLs synthesize pixel clocks and memory controller phases. Industrial grade variants (EP2C70F896I8N) extend operation to -40C to +100C, suitable for factory floor deployment.
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Motor Control and Industrial Automation
The EP2C70F896C6 executes field-oriented control (FOC) algorithms for multi-axis motor drives, benefiting from parallel PWM generation and hardware current-loop sampling. The 622 user I/Os interface with multiple encoder inputs (QEP, SSI, BISS), resolver-to-digital converters, and gate-driver enable signals, while the 4 PLLs lock to precise switching frequencies (typically 8-32 kHz) and ADC sample clocks. Compared with a microcontroller, the FPGA eliminates interrupt-jitter in the current loop and enables deterministic sub-microsecond loop times for high-speed spindle or servo control.
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Soft-Core Processor Implementation (NIOS II)
The EP2C70F896C6 fabric is large enough to host a NIOS II/f soft-core processor running up to 200 DMIPS alongside substantial user logic, making it ideal for custom embedded controllers with bespoke peripherals. The 1,152,000 embedded RAM bits serve as tightly-coupled on-chip memory for code and data, reducing external memory pressure. 622 I/Os connect to any combination of UARTs, SPIs, I2Cs, Ethernet MACs, or custom register interfaces. This capability enables single-chip SoC integration at unit-cost economics impossible with hard-core MCU parts.
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Communications Protocol Bridging
The EP2C70F896C6 implements custom protocol converters between industrial and telecom interfaces (E1/T1, CAN, RS-485, Ethernet, PCIe endpoint, UART). The 622 I/Os handle multiple simultaneous physical-layer ports, while the FPGA fabric implements stateful protocol engines in hardware with no software latency. Hardware multipliers accelerate CRC, encryption, and forward-error-correction blocks. Compared to a discrete ASSP bridge IC, the FPGA accommodates late-stage protocol additions and customer-specific framing without respinning the PCB.
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Test and Measurement Instrumentation
The EP2C70F896C6 underpins custom logic-analyzers, pattern-generators, and protocol-analyzers where deterministic timing and deep parallel capture are essential. The 622 I/Os enable wide-channel test heads (32+ channels per bank) and the embedded M9K RAM blocks serve as capture FIFIs before DMA transfer. The 150 multipliers accelerate on-the-fly signal-statistics computations, while 4 PLLs synthesize multi-rate sampling clocks. Compared with a general-purpose oscilloscope ASIC, the FPGA offers full reconfigurability for emerging serial standards.
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Legacy Design Production Continuity
Many long-lifecycle industrial, aerospace, and defense programs continue to use the EP2C70F896C6 because re-validation of FPGA-bitstreams is expensive and risky. Intel's Product Discontinuance Program makes this part available for last-time-buy orders through franchised distributors, supporting production runs for the next several years. Engineers should perform a one-time lifetime-buy calculation based on field-deployed unit counts and projected end-of-production dates, then store parts in moisture-sealed ESD bags with controlled humidity.
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Önerilen Ürünler Özeti
Mühendislik referans verileri: EP2C70F896C6 — karşılaştırma, tasarım rehberi ve uyumluluk bilgileri.
Seçim Kılavuzu
Alternatiflerle Karşılaştırma
| Parametre | Bu Ürün | EP2C70F672C6 | EP2C70F896I8N | EP2C70F672I8N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 896-ball FBGA | 672-pin FBGA | 896-ball FBGA - same | 672-pin FBGA |
| Logic Elements | 68,416 | 68,416 | 68,416 | 68,416 |
| Maximum User I/O | 622 | 422 (smaller package) | 622 (same) | 422 |
| Embedded Multipliers (18x18) | 150 | 150 | 150 | 150 |
| Total Memory Bits | 1,152,000 | 1,152,000 | 1,152,000 | 1,152,000 |
| PLLs | 4 | 4 | 4 | 4 |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Ana Farklılayıcılar
- Maximum logic density in the Cyclone II family (karşılaştırma:EP2C50F484C6)
- Maximum I/O count in the 896-ball FBGA footprint (karşılaştırma:EP2C70F672C6)
- Commercial speed grade 6 is the fastest in the family (karşılaştırma:EP2C70F896I8N (industrial speed grade 8))
Tasarım Notları
The 896-ball FBGA with 1.0 mm pitch requires a multilayer PCB (8+ layers recommended) with microvia or via-in-pad technology for breakout. Use a 4-layer stack-up only if signal count is modest. Reference Intel's Cyclone II Hardware Design Guidelines for matched-impedance layout rules for DDR2/QDRII memory interfaces; maintain differential pair length matching within 150 mils to avoid setup/hold violations at 200 MHz.
Estimated: Cyclone II core current at 68,416 LEs with 50% toggle rate and 150 multipliers active is approximately 1.2 A at 1.2 V (estimated based on typical Cyclone II datasheet curves). With 4 PLL analog supplies plus I/O bank supplies (each bank may require 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V), budget at least 6 distinct supply rails with proper decoupling (0.1 uF + 10 uF per pin-pair). Decoupling is critical to avoid PLL jitter degradation.
Do not confuse MSL (Moisture Sensitivity Level) and bake requirements: 896-ball FBGA Cyclone II parts are MSL3 typically and require sealed dry-pack storage before reflow. Many counterfeit units enter the supply chain via improper rework of MSL-packaged devices. Always source from franchised distributors for last-time-buy parts and request the manufacturer date-code and lot trace to verify authenticity.
Place the EPCS configuration memory within 3 inches of the FPGA data lines to minimize signal integrity issues during AS configuration. Add 4.7 kohm pull-up resistors on nCONFIG, nSTATUS, and CONF_DONE to ensure clean boot. Reserve the JTAG TCK/TMS/TDI/TDO chain header on the PCB even if your design uses AS mode in production - JTAG is essential for development debug and board-level boundary-scan verification.
Uyumluluk Bilgisi
RoHS and REACH compliance status to be confirmed from manufacturer product page. Cyclone II devices are designed for industrial/commercial (not automotive AEC-Q100) applications. Lead-free reflow per JEDEC J-STD-020.
