EP2S60F1020C4N - 60K LE Stratix II FPGA, 1020-BGA | Intel | Altera
N.º da peça: EP2S60F1020C4N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $80 | $8.000,00 |
| 500 | $73.5 | $36.750,00 |
| 1.000 | $67 | $67.000,00 |
EP2S60F1020C4N Visão geral
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the user can configure after manufacture via a hardware description language (HDL) and toolchain. In the taxonomy, an FPGA sits under programmable logic -> logic ICs -> integrated circuits. Stratix II placed particular emphasis on high-speed DSP blocks, TriMatrix embedded memory, and high-speed differential I/O for communications and signal-processing workloads.
Key features include up to 24 DSP blocks delivering 192 18-bit x 18-bit multipliers, support for external DDR/DDR2/QDRII SRAM memories via dedicated interfaces, high-speed LVDS and clock-management circuitry (PLLs), and up to 12 global clock networks. The device is offered in a commercial temperature grade and supports configuration via passive serial, fast passive parallel, or JTAG modes using the Quartus II development environment.
Architecturally, the Stratix II family introduced an adaptive logic module (ALM) of 8 inputs that delivers higher effective logic utilization than the 4-input LUT-based architectures used in earlier FPGAs. The 90 nm process node, combined with the ALM fabric, allowed Stratix II to outperform the original Stratix family in both density-per-area and DSP throughput-per-watt.
Typical applications include high-performance digital signal processing (baseband, video codecs, radar), communications infrastructure (protocol bridging, packet processing), ASIC prototyping, and test-and-measurement instrumentation. The 1020-BGA package and 718 user I/Os make it well-suited for board-level designs that must route many differential pairs or parallel memory buses.
When designing with this device, plan for the 1.2 V core rail decoupling strategy (typically multiple 100 uF and 0.1 uF capacitors distributed around the BGA), and verify that the Quartus II toolchain version supports this device (Stratix II support is now legacy). For new designs, evaluate Stratix IV/V or Cyclone IV/V as successors.
Alternativas drop-in para EP2S60F1020C4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S60F1020C4N (mesmo formato e footprint) — diferindo em Speed Grade, Package, Operating Temperature, RoHS Status, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S60F1020C3N
✅ Drop-In✓ Em estoque
$1095 / unidade
Ver ficha técnica →EP2S60F1020C4
✅ Drop-In✓ Em estoque
$1240 / unidade
Ver ficha técnica →EP2S60F1020
✅ Drop-In✓ Em estoque
$1495 / unidade
Ver ficha técnica →EP2S130F1020C4N
✅ Drop-In✓ Em estoque
$2850 / unidade
Ver ficha técnica →EP2S130F1020C4
✅ Drop-In✓ Em estoque
$2800 / unidade
Ver ficha técnica →EP2S60F1020C4N Classificações máximas e características elétricas
| Series | Stratix II |
| Family | Stratix II (EP2S60) |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 (approx.) |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory (bits) | 2,544,192 |
| Embedded Memory Blocks | M512/M4K/M-RAM TriMatrix memory |
| DSP Blocks (18-bit x 18-bit) | Up to 48 (24 per DSP block column pair typical) |
| User I/Os | 718 |
| Maximum Core Frequency | 711.24 MHz (per Arrow listing) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Encapsulamento | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| Tipo de montagem | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (C4 suffix indicates commercial, speed grade 4) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| PLLs / Clock Networks | Yes - on-chip PLLs and global clock networks |
| Status RoHS | EU RoHS compliant with exemption (per Arrow listing) |
Guia de Configuração de Pinos do EP2S60F1020C4N 1020-ball fc-fbga (fine-pitch chip-scale bga)
Configuração de pinos para EP2S60F1020C4N (pacote 1020-ball fc-fbga (fine-pitch chip-scale bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2S60F1020C4N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2S60F1020C4N é adequado para 6 aplicaçãos: High-Performance Digital Signal Processing, Communications Infrastructure - Protocol Bridging, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Video and Image Processing, Military/Aerospace Signal Processing (Legacy Programs).
High-Performance Digital Signal Processing
The EP2S60F1020C4N's 60,440 logic elements and integrated 18-bit x 18-bit DSP blocks (up to 192 multipliers) make it well suited for high-throughput DSP workloads such as FFT-based spectral analysis, multi-channel baseband processing, and video codec acceleration. The 2.5 Mbit TriMatrix embedded memory provides the on-chip storage required for FIR filter delay lines and FFT working buffers, eliminating many external memory accesses. Designers can sustain 200-400 MHz operation in DSP pipelines by leveraging the dedicated multiplier blocks and the Stratix II ALM fabric. Compared with a Cyclone-series FPGA, the Stratix II delivers roughly 2-3x the DSP throughput-per-watt for the same workload.
Recomendado
Communications Infrastructure - Protocol Bridging
The EP2S60F1020C4N's 718 user I/Os and high-speed LVDS support make it an excellent protocol bridge between legacy parallel buses and modern serial interfaces. The 1020-ball FC-FBGA package allows board designers to route many differential pairs simultaneously, supporting multi-gigabit LVDS lanes or external SFP+/SerDes interfaces. On-chip PLLs generate the multiple clock domains required for asynchronous rate matching. In telecom infrastructure designs, the device commonly bridges TDM/E1 streams to Ethernet or implements custom packet-processing engines, leveraging 1.2 V core operation to keep power budgets manageable at high I/O counts.
Recomendado
ASIC Prototyping and Emulation
With 60,440 logic elements, 2.5 Mbit embedded memory, and 718 user I/Os, the EP2S60F1020C4N can host medium-complexity ASIC prototypes before tapeout. Multi-FPGA partitioning is straightforward because the Quartus II toolchain provides well-documented timing closure on the Stratix II family. The 1020-ball FC-FBGA package exposes enough user I/Os to model chip-to-chip interfaces at full speed. Engineers typically build 4-8 FPGA prototyping boards of this density to validate SoC designs in the 5-10 Mgate range. The 1.2 V core supply simplifies power tree design compared to lower-density FPGAs that need multiple rails.
Recomendado
Test and Measurement Instrumentation
The EP2S60F1020C4N is widely deployed in logic analyzers, protocol testers, and arbitrary waveform generators where its 718 user I/Os enable parallel acquisition of many channels simultaneously. The 711.24 MHz core frequency supports real-time pattern generation and capture at hundreds of megahertz, while the embedded DSP blocks accelerate on-the-fly waveform math such as FFTs and digital filtering. The 1020-ball FC-FBGA package allows dense PCB layouts that place the FPGA close to high-speed ADCs and DACs, minimizing analog trace lengths. Designers value the Stratix II family's deterministic clocking for low-jitter trigger generation in measurement equipment.
Recomendado
Video and Image Processing
The EP2S60F1020C4N's combination of DSP throughput, embedded memory bandwidth, and 718 user I/Os makes it suitable for real-time video processing pipelines at resolutions up to 1080p60. Dedicated multipliers implement FIR filters for deinterlacing and noise reduction, while the TriMatrix memory holds multiple frame buffers for motion compensation. The 1020-ball FC-FBGA package supports 16-32-bit parallel video buses to external DDR2 capture memory, sustaining gigabytes-per-second throughput. Broadcast equipment manufacturers historically selected Stratix II for its deterministic latency in studio-grade video switchers and scalers.
Recomendado
Military/Aerospace Signal Processing (Legacy Programs)
Long-lifecycle defense and aerospace programs continue to use the EP2S60F1020C4N because the Stratix II family is fully documented and the 1020-ball FC-FBGA package is compatible with established board layouts. The 1.2 V core and 718 user I/Os support sensor-fusion and radar preprocessing pipelines in unmanned systems. The commercial temperature grade (C4 suffix) is acceptable for many ground-based and naval applications, while industrial-grade variants extend deployment options. Obsolescence is mitigated through franchised-distributor and aftermarket inventory channels that hold multi-year stocks for defense sustainment programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S60F1020C4N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S60F1020C3N | EP2S60F1020C4 | EP2S60F1020 | EP2S130F1020C4N | EP2S130F1020C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 130,440 | 130,440 |
| Speed Grade | C4 (commercial, speed grade 4) | C3 (faster) | C4 (same) | varies per lot | C4 (same) | C4 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 6,747,840 (approx.) | 6,747,840 (approx.) |
| User I/Os | 718 | 718 | 718 | 718 | 742 (approx.) | 742 (approx.) |
| Process / Family | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatible | Yes (this device) | Yes (same die) | Yes (same die) | Yes (same die) | No - larger device, recompile required | No - larger device, recompile required |
Principais diferenciais
- Higher DSP and memory density than Cyclone-series FPGAs (vs EP2C70F896I8N (Cyclone II))
- Pin-compatible upgrade path to EP2S130 for higher density (vs EP2S130F1020C4N)
- Speed grade 3 option offers higher Fmax (vs EP2S60F1020C3N)
Notas de projeto
The 1020-ball FC-FBGA package requires a multilayer PCB with microvia technology (typically laser-drilled 0.1 mm vias) to break out the 1.0 mm pitch ball grid. Use at least 6 PCB layers for signal integrity, with dedicated ground and power planes immediately beneath the device. Route differential pairs (LVDS/clock) with 100 ohm differential impedance and matched length within 150 mil tolerance. Place 0.1 uF and 100 uF decoupling capacitors as close as possible to the VCCINT, VCCIO, and VCCP power balls to meet Stratix II power-integrity guidelines.
Estimated: with all 60,440 LEs switching at 25% toggle rate and 200 MHz core clock, total power can exceed 8-12 W. Mount the BGA on a thermal-pad stack-up with multiple thermal vias in the center ball grid to conduct heat to an internal copper plane. For designs operating in industrial temperature ranges, ensure junction-to-ambient thermal resistance stays below 15 C/W by adding a heatsink or forced-air cooling. Refer to the Stratix II PowerPlay Early Power Estimator for design-specific power budgeting.
Because EP2S60F1020C4N is obsolete and served by aftermarket distributors, be careful with counterfeit risk. Always request factory-traceable components with Certificate of Compliance, X-ray or decapsulation verification for high-reliability applications. Verify that the Quartus II toolchain version supports the specific speed grade and the 1020-ball FC-FBGA package symbol - Quartus Prime 14.0+ has dropped Stratix II support. Pin the Quartus II version to 13.1 or earlier for active development.
Reserve dedicated layers for DDR/DDR2/QDRII memory interfaces - the DQS signals must be routed with strict length matching (typically within 50 mil tolerance across the byte group) to maintain timing margin at 200-400 MHz data rates. Use the Stratix II PHYLite/PHY IP wizard in Quartus II to generate the pin assignments and PCB length-tuning requirements. Keep the PLL analog supply pins filtered with a ferrite bead and decoupling network to minimize jitter.
Informações de conformidade
RoHS compliance per Arrow product listing ('EU RoHS Compliant with Exemption'). AEC-Q100 not applicable for FPGAs (different reliability qualification framework). Halogen-free status not confirmed in verified web data.
