EP2S60F1020C4N - 60K LE Stratix II FPGA, 1020-BGA | Intel | Altera
部品番号: EP2S60F1020C4N ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $87.5 | $875.00 |
| 100 | $80 | $8,000.00 |
| 500 | $73.5 | $36,750.00 |
| 1,000 | $67 | $67,000.00 |
EP2S60F1020C4N 概要
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that the user can configure after manufacture via a hardware description language (HDL) and toolchain. In the taxonomy, an FPGA sits under programmable logic -> logic ICs -> integrated circuits. Stratix II placed particular emphasis on high-speed DSP blocks, TriMatrix embedded memory, and high-speed differential I/O for communications and signal-processing workloads.
Key features include up to 24 DSP blocks delivering 192 18-bit x 18-bit multipliers, support for external DDR/DDR2/QDRII SRAM memories via dedicated interfaces, high-speed LVDS and clock-management circuitry (PLLs), and up to 12 global clock networks. The device is offered in a commercial temperature grade and supports configuration via passive serial, fast passive parallel, or JTAG modes using the Quartus II development environment.
Architecturally, the Stratix II family introduced an adaptive logic module (ALM) of 8 inputs that delivers higher effective logic utilization than the 4-input LUT-based architectures used in earlier FPGAs. The 90 nm process node, combined with the ALM fabric, allowed Stratix II to outperform the original Stratix family in both density-per-area and DSP throughput-per-watt.
Typical applications include high-performance digital signal processing (baseband, video codecs, radar), communications infrastructure (protocol bridging, packet processing), ASIC prototyping, and test-and-measurement instrumentation. The 1020-BGA package and 718 user I/Os make it well-suited for board-level designs that must route many differential pairs or parallel memory buses.
When designing with this device, plan for the 1.2 V core rail decoupling strategy (typically multiple 100 uF and 0.1 uF capacitors distributed around the BGA), and verify that the Quartus II toolchain version supports this device (Stratix II support is now legacy). For new designs, evaluate Stratix IV/V or Cyclone IV/V as successors.
ドロップイン代替品: EP2S60F1020C4N — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP2S60F1020C4N （同一形状・フットプリント） — 相違点: Speed Grade, Package, Operating Temperature, RoHS Status, Logic Elements.
クイック比較ツール — 並列比較する代替部品を選択:
EP2S60F1020C3N
✅ ドロップイン✓ 在庫あり
$1095 / 個
データシートを見る →EP2S60F1020C4
✅ ドロップイン✓ 在庫あり
$1240 / 個
データシートを見る →EP2S60F1020
✅ ドロップイン✓ 在庫あり
$1495 / 個
データシートを見る →EP2S130F1020C4N
✅ ドロップイン✓ 在庫あり
$2850 / 個
データシートを見る →EP2S130F1020C4
✅ ドロップイン✓ 在庫あり
$2800 / 個
データシートを見る →EP2S60F1020C4N 最大定格＆電気的特性
| Series | Stratix II |
| Family | Stratix II (EP2S60) |
| Logic Elements | 60,440 |
| Adaptive Logic Modules (ALMs) | 30,220 (approx.) |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory (bits) | 2,544,192 |
| Embedded Memory Blocks | M512/M4K/M-RAM TriMatrix memory |
| DSP Blocks (18-bit x 18-bit) | Up to 48 (24 per DSP block column pair typical) |
| User I/Os | 718 |
| Maximum Core Frequency | 711.24 MHz (per Arrow listing) |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| パッケージ | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) |
| 実装タイプ | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (C4 suffix indicates commercial, speed grade 4) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| PLLs / Clock Networks | Yes - on-chip PLLs and global clock networks |
| RoHS ステータス | EU RoHS compliant with exemption (per Arrow listing) |
EP2S60F1020C4N 1020-ball fc-fbga (fine-pitch chip-scale bga) ピン配置ガイド
EP2S60F1020C4N (1020-ball fc-fbga (fine-pitch chip-scale bga) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP2S60F1020C4N.
詳細は データシート をご参照ください。
主な用途
EP2S60F1020C4N の用途: 6 件s: High-Performance Digital Signal Processing, Communications Infrastructure - Protocol Bridging, ASIC Prototyping and Emulation, Test and Measurement Instrumentation, Video and Image Processing, Military/Aerospace Signal Processing (Legacy Programs).
High-Performance Digital Signal Processing
The EP2S60F1020C4N's 60,440 logic elements and integrated 18-bit x 18-bit DSP blocks (up to 192 multipliers) make it well suited for high-throughput DSP workloads such as FFT-based spectral analysis, multi-channel baseband processing, and video codec acceleration. The 2.5 Mbit TriMatrix embedded memory provides the on-chip storage required for FIR filter delay lines and FFT working buffers, eliminating many external memory accesses. Designers can sustain 200-400 MHz operation in DSP pipelines by leveraging the dedicated multiplier blocks and the Stratix II ALM fabric. Compared with a Cyclone-series FPGA, the Stratix II delivers roughly 2-3x the DSP throughput-per-watt for the same workload.
おすすめ
Communications Infrastructure - Protocol Bridging
The EP2S60F1020C4N's 718 user I/Os and high-speed LVDS support make it an excellent protocol bridge between legacy parallel buses and modern serial interfaces. The 1020-ball FC-FBGA package allows board designers to route many differential pairs simultaneously, supporting multi-gigabit LVDS lanes or external SFP+/SerDes interfaces. On-chip PLLs generate the multiple clock domains required for asynchronous rate matching. In telecom infrastructure designs, the device commonly bridges TDM/E1 streams to Ethernet or implements custom packet-processing engines, leveraging 1.2 V core operation to keep power budgets manageable at high I/O counts.
おすすめ
ASIC Prototyping and Emulation
With 60,440 logic elements, 2.5 Mbit embedded memory, and 718 user I/Os, the EP2S60F1020C4N can host medium-complexity ASIC prototypes before tapeout. Multi-FPGA partitioning is straightforward because the Quartus II toolchain provides well-documented timing closure on the Stratix II family. The 1020-ball FC-FBGA package exposes enough user I/Os to model chip-to-chip interfaces at full speed. Engineers typically build 4-8 FPGA prototyping boards of this density to validate SoC designs in the 5-10 Mgate range. The 1.2 V core supply simplifies power tree design compared to lower-density FPGAs that need multiple rails.
おすすめ
Test and Measurement Instrumentation
The EP2S60F1020C4N is widely deployed in logic analyzers, protocol testers, and arbitrary waveform generators where its 718 user I/Os enable parallel acquisition of many channels simultaneously. The 711.24 MHz core frequency supports real-time pattern generation and capture at hundreds of megahertz, while the embedded DSP blocks accelerate on-the-fly waveform math such as FFTs and digital filtering. The 1020-ball FC-FBGA package allows dense PCB layouts that place the FPGA close to high-speed ADCs and DACs, minimizing analog trace lengths. Designers value the Stratix II family's deterministic clocking for low-jitter trigger generation in measurement equipment.
おすすめ
Video and Image Processing
The EP2S60F1020C4N's combination of DSP throughput, embedded memory bandwidth, and 718 user I/Os makes it suitable for real-time video processing pipelines at resolutions up to 1080p60. Dedicated multipliers implement FIR filters for deinterlacing and noise reduction, while the TriMatrix memory holds multiple frame buffers for motion compensation. The 1020-ball FC-FBGA package supports 16-32-bit parallel video buses to external DDR2 capture memory, sustaining gigabytes-per-second throughput. Broadcast equipment manufacturers historically selected Stratix II for its deterministic latency in studio-grade video switchers and scalers.
おすすめ
Military/Aerospace Signal Processing (Legacy Programs)
Long-lifecycle defense and aerospace programs continue to use the EP2S60F1020C4N because the Stratix II family is fully documented and the 1020-ball FC-FBGA package is compatible with established board layouts. The 1.2 V core and 718 user I/Os support sensor-fusion and radar preprocessing pipelines in unmanned systems. The commercial temperature grade (C4 suffix) is acceptable for many ground-based and naval applications, while industrial-grade variants extend deployment options. Obsolescence is mitigated through franchised-distributor and aftermarket inventory channels that hold multi-year stocks for defense sustainment programs.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP2S60F1020C4N — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP2S60F1020C3N | EP2S60F1020C4 | EP2S60F1020 | EP2S130F1020C4N | EP2S130F1020C4 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 130,440 | 130,440 |
| Speed Grade | C4 (commercial, speed grade 4) | C3 (faster) | C4 (same) | varies per lot | C4 (same) | C4 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Memory (bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 6,747,840 (approx.) | 6,747,840 (approx.) |
| User I/Os | 718 | 718 | 718 | 718 | 742 (approx.) | 742 (approx.) |
| Process / Family | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II | 90 nm / Stratix II |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatible | Yes (this device) | Yes (same die) | Yes (same die) | Yes (same die) | No - larger device, recompile required | No - larger device, recompile required |
主な差別化要因
- Higher DSP and memory density than Cyclone-series FPGAs （vs EP2C70F896I8N (Cyclone II))
- Pin-compatible upgrade path to EP2S130 for higher density （vs EP2S130F1020C4N)
- Speed grade 3 option offers higher Fmax （vs EP2S60F1020C3N)
設計ノート
The 1020-ball FC-FBGA package requires a multilayer PCB with microvia technology (typically laser-drilled 0.1 mm vias) to break out the 1.0 mm pitch ball grid. Use at least 6 PCB layers for signal integrity, with dedicated ground and power planes immediately beneath the device. Route differential pairs (LVDS/clock) with 100 ohm differential impedance and matched length within 150 mil tolerance. Place 0.1 uF and 100 uF decoupling capacitors as close as possible to the VCCINT, VCCIO, and VCCP power balls to meet Stratix II power-integrity guidelines.
Estimated: with all 60,440 LEs switching at 25% toggle rate and 200 MHz core clock, total power can exceed 8-12 W. Mount the BGA on a thermal-pad stack-up with multiple thermal vias in the center ball grid to conduct heat to an internal copper plane. For designs operating in industrial temperature ranges, ensure junction-to-ambient thermal resistance stays below 15 C/W by adding a heatsink or forced-air cooling. Refer to the Stratix II PowerPlay Early Power Estimator for design-specific power budgeting.
Because EP2S60F1020C4N is obsolete and served by aftermarket distributors, be careful with counterfeit risk. Always request factory-traceable components with Certificate of Compliance, X-ray or decapsulation verification for high-reliability applications. Verify that the Quartus II toolchain version supports the specific speed grade and the 1020-ball FC-FBGA package symbol - Quartus Prime 14.0+ has dropped Stratix II support. Pin the Quartus II version to 13.1 or earlier for active development.
Reserve dedicated layers for DDR/DDR2/QDRII memory interfaces - the DQS signals must be routed with strict length matching (typically within 50 mil tolerance across the byte group) to maintain timing margin at 200-400 MHz data rates. Use the Stratix II PHYLite/PHY IP wizard in Quartus II to generate the pin assignments and PCB length-tuning requirements. Keep the PLL analog supply pins filtered with a ferrite bead and decoupling network to minimize jitter.
コンプライアンス情報
RoHS compliance per Arrow product listing ('EU RoHS Compliant with Exemption'). AEC-Q100 not applicable for FPGAs (different reliability qualification framework). Halogen-free status not confirmed in verified web data.
