EP2S60F484I4 - Stratix II FPGA 60K LE 484-FBGA | Intel
N.º da peça: EP2S60F484I4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $218.5 | $2.185,00 |
| 100 | $189 | $18.900,00 |
| 500 | $162.75 | $81.375,00 |
| 1.000 | $138.4 | $138.400,00 |
EP2S60F484I4 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic, routing, and I/O behaviour are defined after manufacture by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLD), positioned alongside Complex PLDs (CPLDs) at the low-density end and ASICs at the high-density, non-programmable end. Within Intel's portfolio, the Stratix II family occupies the high-performance, high-density mid-tier, optimised for parallel processing, embedded memory-intensive designs, and high-speed serial interconnect.
Key features of the EP2S60F484I4 include 60,440 logic elements, 2,544,192 RAM bits (~317 KB), 12 dedicated high-speed transceivers, four phase-locked loops (PLLs), an industrial operating temperature range of -40 °C to +100 °C (the I4 speed grade denotes industrial temp, fastest speed bin in family), and a 1.2 V core supply with hot-socketing support. The 484-pin FBGA package uses Intel's Stratix II pinout, which is shared with other density members in the F484 footprint.
Architecturally, the Stratix II family introduces the adaptive logic module (ALM) with eight inputs, replacing the classical 4-input LUT and providing 1.4x the average logic capacity per area versus the original Stratix. Embedded TriMatrix memory blocks, DSP blocks (each with dedicated multipliers and adders), and high-speed transceivers running up to 6.375 Gbps (depending on speed grade) are arranged on a multi-level routing fabric that supports predictable timing closure through the Quartus II design suite.
Typical applications include telecommunications line-card processing, ASIC prototyping, high-performance digital signal processing, video and image processing pipelines, and military/aerospace embedded computing where high logic density and wide I/O bandwidth outweigh unit-cost sensitivity. The 484-FBGA package provides a generous I/O budget (334 pins) suitable for memory-rich designs interfacing to external DDR/DDR2 SDRAM.
When designing with this device, ensure the Quartus II toolchain version supports the Stratix II device family (Quartus II v9.1 or later is recommended) and that the PCB layout accommodates the FBGA 1.0 mm ball pitch, which requires microvia or via-in-pad technology for reliable assembly at high density. Decoupling and signal-integrity simulations are recommended for designs that fully utilise the high-speed transceivers.
Alternativas drop-in para EP2S60F484I4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S60F484I4 (mesmo formato e footprint) — diferindo em Speed Grade, Package, Family, Operating Temperature, PLLs.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S60F484C5N
✅ Drop-In✓ Em estoque
$720.5 / unidade
Ver ficha técnica →EP2S60F484C5
✅ Drop-In✓ Em estoque
$491.55 / unidade
Ver ficha técnica →EP2S60F484C4N
✅ Drop-In✓ Em estoque
$920 / unidade
Ver ficha técnica →EP2S60F484C4
✅ Drop-In✓ Em estoque
$974.13 / unidade
Ver ficha técnica →EP2S60F484C3N
✅ Drop-In✓ Em estoque
$1245.75 / unidade
Ver ficha técnica →EP2S60F484C3
✅ Drop-In✓ Em estoque
$92 / unidade
Ver ficha técnica →EP2S60F484I4 Classificações máximas e características elétricas
| Series | Stratix II |
| Manufacturer | Intel (formerly Altera) |
| Family | Stratix II FPGA |
| Logic Elements (LE) | 60,440 |
| Embedded Memory Bits | 2,544,192 bits (~317 KB) |
| User I/O Pins | 334 |
| High-Speed Transceivers | 12 channels |
| PLLs | 4 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Faixa de temperatura de operação | -40 °C to +100 °C (Industrial, I4) |
| Speed Grade | I4 (industrial, fastest speed bin for Stratix II F484) |
| Encapsulamento | 484-ball FBGA (F484) |
| Tipo de montagem | Surface Mount |
| Lead-Free / RoHS | Contains Lead; RoHS Non-Compliant (per distributor data) |
| Configuration Method | SRAM-based, loaded via Quartus II bitstream |
Guia de Configuração de Pinos do EP2S60F484I4 484-ball fbga (f484)
Configuração de pinos para EP2S60F484I4 (pacote 484-ball fbga (f484)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2S60F484I4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2S60F484I4 é adequado para 6 aplicaçãos: Telecommunications Line-Card Processing, ASIC Prototyping, High-Performance Digital Signal Processing, Video and Image Processing Pipelines, Military and Aerospace Embedded Computing, Industrial Control and Factory Automation.
Telecommunications Line-Card Processing
The EP2S60F484I4's 60,440 logic elements and 12 high-speed transceivers make it well-suited to telecom line-card packet processing, where it can absorb multi-channel framer, MAC, and traffic-manager functions. With 334 user I/O pins, designers route external DDR/DDR2 packet buffers and POS-PHY / SFI-4.1 interfaces directly to the fabric without external bus multiplexing. The industrial temperature grade (I4) and 1.2 V core power are tailored to NEBS-compliant chassis operating in -40 °C to +100 °C ambient. Compared to ASICs, the FPGA enables late-stage protocol updates (e.g., OTN, MPLS-TP), shortening carrier qualification cycles.
Recomendado
ASIC Prototyping
The EP2S60F484I4 is widely used as an ASIC prototyping vehicle because its 60,440 LE, 2,544 Kbit embedded memory, and 334 I/O pins approximate mid-complexity ASICs in the 1-3 Mgate range. The Stratix II ALM architecture (eight-input adaptive logic modules) and rich TriMatrix memory allow one-to-one mapping of typical ASIC RTL without excessive logic replication. Quartus II timing-driven place-and-route provides timing-closure data that translates directly into ASIC sign-off. The 484-FBGA 1.0 mm pitch package supports prototype boards with high-pin-count breakout to standard DIMM-style headers.
Recomendado
High-Performance Digital Signal Processing
The Stratix II EP2S60F484I4 integrates dedicated DSP blocks (each with hardware multipliers and adders) alongside the ALM fabric, enabling sustained 18x18 multiplications at hundreds of MHz per block. Typical DSP workloads include multi-channel baseband processing, radar pulse compression, and software-defined radio (SDR) front-ends. The 2,544 Kbit embedded memory is large enough to hold coefficient tables and sample-line buffers without external SRAM, reducing latency and board complexity. The I4 industrial speed grade provides predictable timing closure for tight DSP pipelines in outdoor enclosures.
Recomendado
Video and Image Processing Pipelines
With 60,440 LE and 2,544 Kbit embedded memory, the EP2S60F484I4 can absorb multi-stream HD-SDI video pipelines including de-interlacing, scaling, colour-space conversion, and on-screen-display overlay at 1080p60 rates. The 334 I/O budget supports multiple parallel video ports and DDR2 frame buffers. Industrial temperature grading (I4) is suitable for outdoor broadcast, surveillance, and medical imaging head-ends. Compared to a DSP+ASSP solution, the FPGA implementation accelerates time-to-market and enables in-field bitstream upgrades as new codecs (H.264, HEVC) are added.
Recomendado
Military and Aerospace Embedded Computing
The EP2S60F484I4's industrial temperature rating (-40 °C to +100 °C), 60,440 LE density, and 12 high-speed transceivers make it a fit for ruggedised mission-computing platforms in military and aerospace embedded systems. The 484-FBGA package withstands vibration and thermal-cycling typical of avionics and vehicle applications. Designers implement MIL-STD-1553, ARINC 429, and high-speed sensor interfaces alongside the FPGA fabric, gaining reconfigurability that is impossible in rad-hard ASICs at this cost point. Long-term support is broker-managed because the part is obsolete.
Recomendado
Industrial Control and Factory Automation
The EP2S60F484I4 serves deterministic multi-axis motion control, real-time EtherCAT / Profinet bridging, and machine-vision processing in factory-automation cells. With 334 user I/O pins and 12 transceivers, it can aggregate up to a dozen motor-drive feedback channels while streaming high-resolution camera data through SERDES links. The industrial temperature grade (I4) supports ambient temperatures of control cabinets, and the embedded TriMatrix memory holds real-time control loops without external SRAM. Hot-socketing support simplifies live swap of I/O modules on the backplane.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S60F484I4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S60F484C5N | EP2S60F484C5 | EP2S60F484C4N | EP2S60F484C4 | EP2S60F484C3N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| User I/O Pins | 334 | 334 | 334 | 334 | 334 | 334 |
| High-Speed Transceivers | 12 | 12 | 12 | 12 | 12 | 12 |
| Operating Temperature | -40 °C to +100 °C (Industrial, I4) | 0 °C to +85 °C (Commercial, C5) | 0 °C to +85 °C (Commercial, C5) | 0 °C to +85 °C (Commercial, C4) | 0 °C to +85 °C (Commercial, C4) | 0 °C to +85 °C (Commercial, C3) |
| Speed Grade | I4 (industrial, fastest speed bin) | C5 (commercial, faster) | C5 (commercial, faster) | C4 (commercial, mid) | C4 (commercial, mid) | C3 (commercial, slowest) |
| Lifecycle Status (2026) | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Industrial-temperature I4 speed grade (only I4 variant in EP2S60F484 family) (vs EP2S60F484C5N)
- Identical 60,440 LE density to all EP2S60F484 siblings (vs EP2S130F484I4)
- Stratix II ALM architecture (8-input) versus older Stratix 4-input LUTs (vs EP1S60F484 (original Stratix))
Notas de projeto
Estimated: at industrial ambient +85 °C and a Stratix II typical utilisation profile (40% logic toggling, 50% memory utilisation, all 12 transceivers active), the EP2S60F484I4 dissipates approximately 6-8 W. The 484-FBGA package benefits from a 4-layer PCB with a solid ground/power plane beneath the device; a small heatsink is recommended when the ambient exceeds +70 °C. Designers should profile post-route power with Quartus II PowerPlay early in the design cycle because Stratix II static power scales with Vccint and junction temperature.
The 484-FBGA package uses a 1.0 mm ball pitch, which is at the practical limit for standard 4-layer PCB via fan-out. Designers should use microvia or via-in-pad technology to escape the inner balls cleanly. Decoupling must include low-ESR ceramic capacitors (0.1 µF and 0.01 µF) placed within 100 mils of every Vccint and Vccpd pin; bulk decoupling on each power rail should be at least 47 µF tantalum or polymer. Reference the Stratix II Device Family Data Sheet pin-list to ensure no power pins are left unconnected.
Common pitfalls when designing with EP2S60F484I4 include: (1) exceeding 1.2 V ±5% on Vccint, which damages the die; (2) failing to drive MSEL[2..0] to the correct configuration mode (AS, PS, JTAG, or Fast Passive Parallel) before power-up; (3) not respecting the configuration-time POR delay before driving I/O pins; and (4) under-estimating high-speed transceiver PCB routing requirements (differential impedance of 100 Ω ±10%, length matching within 5 mils). Always re-validate timing closure after a Quartus II tool upgrade because timing models evolve across releases.
Informações de conformidade
Reported as RoHS non-compliant with lead content per Digchip distributor data. REACH, halogen-free, and conflict-minerals status were not in the verified web data; values are set to unknown per data authenticity rules.