EP3C10E144C7 - 10K LLE Cyclone III FPGA | Altera Corporation
N.º da peça: EP3C10E144C7 ✓ AtivoEP3C10E144C7 Visão geral
A field-programmable gate array, or FPGA, is a programmable semiconductor whose digital logic and interconnect resources can be configured after manufacture. An FPGA belongs to the broader logic-device hierarchy and can function as a configurable parallel processor, interface controller, data acquisition engine, or embedded signal-processing system. Unlike a fixed-function application-specific integrated circuit, an FPGA allows logic, memory interfaces, and peripheral behavior to be updated by loading a configuration bitstream.
The supplied manufacturer and distributor records identify 10,320 logic elements, 94 I/O, 423,936 embedded-memory bits, and the 144-LQFP exposed-pad package as the principal device characteristics. The exposed pad provides a direct thermal path from the FPGA to the PCB copper when the package is properly assembled. Its 94 I/O support connections to external memory, sensors, communications transceivers, converters, and control peripherals, while the embedded multipliers accelerate suitable DSP operations.
Cyclone III devices combine configurable logic with on-chip memory resources and dedicated clock-management functions. PLL specifications are described in the Cyclone III device documentation, while the embedded multipliers support DSP applications. Programmable logic allows engineers to implement parallel data acquisition, protocol conversion, state machines, filtering, and control functions in one device instead of combining several fixed-function components.
Typical uses include industrial automation, communications infrastructure, embedded instrumentation, video and image processing, digital signal processing, and control systems. The same EP3C10E144C7 can serve as a controller beside external DDR memory, as an interface between sensors and a host processor, or as a dedicated DSP accelerator. Quartus II and DSP Builder provide the design, compilation, and simulation workflow for these systems.
A critical implementation consideration is exposed-pad soldering and thermal design. The pad should be connected to a grounded copper area using the manufacturer-recommended land pattern and assembly process. Signal integrity also depends on controlled-impedance routing for external memories and high-speed interfaces, with input/output placement and clock planning performed in the FPGA design tools.
This page combines the verified distributor specification, the manufacturer datasheet link, sourcing information, drop-in family comparisons, and practical FPGA implementation guidance. It distinguishes confirmed EP3C10E144C7 data from parameters that require confirmation in the manufacturer device documentation before schematic release or production procurement.
Alternativas drop-in para EP3C10E144C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C10E144C7 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Series, Total Memory Bits, Family.
EP3C10E144C8N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10E144C8N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10E144I7
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10E144I7N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10E144C7 Classificações máximas e características elétricas
| Device Type | Cyclone III field-programmable gate array (FPGA) |
| Logic Elements | 10,320 logic elements |
| User I/O | 94 I/O |
| Embedded Memory | 423,936 bits |
| Encapsulamento | 144-LQFP exposed pad |
| Terminal Count | 144 terminals |
| Tipo de montagem | Surface mount |
| Programmable Logic | Cyclone III FPGA architecture |
Guia de Configuração de Pinos do EP3C10E144C7 144-lqfp exposed pad
Configuração de pinos para EP3C10E144C7 (pacote 144-lqfp exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C10E144C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C10E144C7 é adequado para 6 aplicaçãos: Industrial Automation and Embedded Control, Communications Interface and Protocol Conversion, Data Acquisition and Signal Conditioning, Digital Signal Processing Accelerator, Video and Image Processing, Programmable Test and Measurement.
Industrial Automation and Embedded Control
The EP3C10E144C7 fits compact industrial controllers because it provides 10,320 logic elements, 94 user I/O, and 423,936 embedded-memory bits for sequencing, interlocks, and state-machine logic. Its programmable architecture lets one device coordinate sensors, actuators, counters, and communication interfaces without relying on a large collection of fixed-function logic. The 144-LQFP exposed pad also provides a direct thermal path when the FPGA drives I/O continuously. Before schematic release, verify industrial temperature-grade requirements, I/O voltage limits, and exposed-pad land geometry against the manufacturer documentation.
Recomendado
Communications Interface and Protocol Conversion
The EP3C10E144C7 is appropriate for communications adapters where parallel programmable logic must bridge or translate data streams. Its 10,320 logic elements can support framing, buffering, state management, and interface conversion, while 94 I/O provide connections to transceivers and external memories. The Cyclone III family also includes PLL resources for clock generation and embedded multipliers for suitable data-processing operations. Exact communication standards, supported I/O standards, and timing limits remain product-specific, so the design should be checked against the relevant Cyclone III device chapter before schematic release.
Recomendado
Data Acquisition and Signal Conditioning
The EP3C10E144C7 supports parallel data-acquisition systems that sample, filter, timestamp, or route multiple digital channels. With 94 user I/O, it can interface to external ADCs, sensors, memory, and host interfaces, while 10,320 logic elements provide parallel datapath and control logic. Its 423,936 embedded-memory bits offer local storage for buffers and working data. Designers should verify acquisition-clock rates, input thresholds, output timing, and supported memory interfaces in the manufacturer datasheet, since those values were not present in the supplied verified snippets.
Recomendado
Digital Signal Processing Accelerator
The EP3C10E144C7 can implement DSP functions using parallel Cyclone III logic, embedded multipliers, and PLLs. The manufacturer documentation explicitly identifies embedded multipliers and DSP Builder integration, making the device relevant to filtering, waveform generation, correlation, and fixed-point arithmetic. The 10,320 logic elements and 423,936 embedded-memory bits provide the resource base for moderate-throughput parallel pipelines. Actual throughput depends on the selected arithmetic implementation, clock target, memory configuration, and Quartus II timing closure, which must be confirmed during compilation.
Recomendado
Video and Image Processing
The EP3C10E144C7 is suitable for embedded video or image-processing tasks that benefit from parallel logic, such as pixel routing, thresholding, line buffering, and format conversion. Its 10,320 logic elements can implement several parallel processing stages, and 94 I/O can connect external image sensors, memory, and displays. Cyclone III embedded multipliers and PLL resources can assist suitable arithmetic and clocking operations. Designers should verify the required video timing, memory-interface topology, I/O standard, and achievable pixel-clock rate in the Cyclone III device documentation.
Recomendado
Programmable Test and Measurement
The EP3C10E144C7 can serve as a programmable controller in test and measurement equipment, where sequencing, pattern generation, timing control, and result capture benefit from adaptable logic. Its 94 I/O provide broad connection flexibility, and the 10,320 logic elements support parallel stimulus generation and analysis functions. Embedded memory can retain local vectors or captured results, while PLL resources assist clock generation. The engineer must confirm differential I/O support, input-voltage tolerances, timing margins, and exposed-pad layout for the selected instrumentation architecture.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C10E144C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C10E144C8 | EP3C10E144C8N | EP3C10E144I7 | EP3C10E144I7N |
|---|---|---|---|---|---|
| Brand | Altera Corporation | Altera Corporation | Altera Corporation | Altera Corporation | Altera Corporation |
| Package | 144-LQFP exposed pad | 144-LQFP exposed pad | 144-LQFP exposed pad | 144-LQFP exposed pad | 144-LQFP exposed pad |
| Device Family | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| User I/O | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits |
| Terminal Count | 144 | 144 | 144 | 144 | 144 |
| Programming Support | Quartus II and DSP Builder | Quartus II and DSP Builder | Quartus II and DSP Builder | Quartus II and DSP Builder | Quartus II and DSP Builder |
Principais diferenciais
- Matches the identified 10K Cyclone III resource profile (vs EP3C10E144C8)
- Provides 94 user I/O for external peripheral connectivity (vs EP3C10E144C8N)
- Combines programmable logic with embedded DSP resources (vs EP3C10E144I7)
Notas de projeto
Treat the exposed pad as the FPGA's primary thermal path. Follow the manufacturer's land-pattern and solder-process requirements, provide a continuous ground-connected copper pad where permitted, and use through-vias to distribute heat into inner and bottom copper layers. Validate the final assembly with the actual PCB stack-up and enclosure. The supplied data does not provide thermal resistance or maximum junction temperature, so these values must be obtained from the manufacturer documentation rather than estimated from package size alone.
Place configuration, clock, and high-fanout interface routing away from sensitive inputs, and assign package pins in Quartus II before fixing the schematic-to-PCB mapping. Preserve the exposed-pad keepout and solder mask requirements from the recommended package drawing. Because the verified source snippets do not contain the complete 144-terminal pinout, engineers must cross-check every power, ground, configuration, clock, and user I/O assignment against the manufacturer pin table rather than reconstructing it from a family diagram.
Use the Cyclone III device documentation to select I/O standards, drive strength, slew rate, and termination settings for external memory or high-speed interfaces. Route clocks on controlled-impedance layers, keep return paths continuous, and observe device-specific input and output timing constraints. The EP3C10E144C7's 94 I/O provide substantial connectivity, but pin multiplexing and timing constraints can reduce usable external interfaces; confirm the final assignment and timing closure in the Quartus II fit report.
Do not assume that the similarly named EP3C10E144C8, C8N, I7, or I7N orderable devices are unconditional substitutes. Although the verified sources place them in the same 144-pin family with 10,320 logic elements and 94 I/O, suffix-specific temperature, speed-grade, qualification, and lifecycle conditions may differ. Review the current manufacturer ordering guide and confirm every electrical and environmental requirement before changing the BOM.
Informações de conformidade
The supplied verified snippets identify the device family and package but do not provide definitive RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Compliance must be confirmed from the current manufacturer product documentation or a distributor declaration.