EP3C10F256C7 - 10,320-L Logic Element Cyclone III FPGA | Altera
N.º da peça: EP3C10F256C7 ✗ Fim de vidaEP3C10F256C7 Visão geral
An FPGA is a programmable digital integrated circuit containing configurable logic, memory, and I/O blocks. Unlike a fixed-function application-specific integrated circuit, a Cyclone III FPGA allows designers to implement parallel processing, interface bridging, protocol handling, and custom control logic in one device. The EP3C10F256C7 belongs to the Cyclone III product family, positioned between small CPLDs and larger FPGAs.
Principal device attributes include 10,320 logic elements, a listed 402 MHz switching-rate figure, 182 I/O, embedded PLL capability, and 423,936 memory bits. Its 256-LBGA package provides a dense surface-mount footprint for multilayer printed circuit boards. The listed operating-temperature range of -40 C to +125 C supports temperature-tolerant industrial deployments when the complete board, power system, and external components are also qualified.
Programming and configuration determine the logic implemented in the FPGA's programmable fabric. Designers should verify power sequencing, configuration interface timing, bank-supply requirements, clocking, and I/O standards against the complete Cyclone III device documentation for the selected density, speed grade, and package. Because a BGA package does not expose a conventional lead-by-lead schematic symbol, board layout, via-in-pad requirements, solder-mask design, and assembly profiles should be validated against the official package data.
Typical uses include industrial control and data acquisition, communications line cards, parallel sensor aggregation, embedded video or image processing, protocol bridges, and programmable logic for test equipment. The 182 available I/O permit simultaneous connections to external converters, memories, transceivers, and microcontrollers, while the internal logic and memory blocks support parallel pipelines and state-machine-intensive designs.
A critical design consideration is that logic, memory, PLL, and I/O resources must be verified against the target clock rate before schematic capture. Engineers should also confirm configuration flash or cable compatibility, provide decoupling close to each supply ball, and plan thermal and via routing for the 256-ball footprint.
This product page consolidates verified distributor specifications, source-linked pricing, same-package replacement candidates, and practical FPGA integration considerations that are not presented together in a single manufacturer datasheet.
Alternativas drop-in para EP3C10F256C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C10F256C7 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Embedded 18x18 Multipliers, PLLs, RoHS Status.
EP3C10F256C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C10F256I7N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10F256C8N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10F256C8N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C10F256C6N
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →EP3C10F256I8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C10F256C7 Classificações máximas e características elétricas
| Device Type | FPGA |
| FPGA Family | Cyclone III |
| Logic Elements | 10,320 logic elements |
| Embedded Memory | 423,936 bits |
| User I/O | 182 I/O |
| Maximum Switching Frequency | 402 MHz |
| Tensão de alimentação | 1.15 V to 1.25 V |
| Temperatura de operação | -40 C to +125 C |
| Package Type | 256-LBGA |
| Package Standard | MS-034 |
| Package Pin Count | 256 pins |
| Package Shape | Square |
| Terminal Form | Ball |
| Tipo de montagem | Surface mount |
| Lead-Free Status | Lead free |
| PLL | Yes |
| Logic Blocks | 10,320 |
Guia de Configuração de Pinos do EP3C10F256C7 square
Configuração de pinos para EP3C10F256C7 (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C10F256C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C10F256C7 é adequado para 6 aplicaçãos: Industrial Control and Automation, Communications Line Card and Protocol Bridge, Parallel Sensor Aggregation, Programmable Test and Measurement, Embedded Image Preprocessing, Configuration and Secure Control Platform.
Industrial Control and Automation
The EP3C10F256C7 fits industrial control systems that require parallel logic execution, numerous external connections, and operation across a wide temperature range. Its 10,320 logic elements and 182 I/O can support machine sequencing, interlock logic, counter and timer functions, and communication protocol handling without relying on a separate high-pin-count microcontroller. The 256-LBGA package also supports compact control boards, while the verified -40 C to +125 C range supports temperature-tolerant deployments. Before release, designers must verify the exact required clock rate against the 402 MHz listed device figure, confirm power-sequencing requirements for the 1.15 V to 1.25 V supply, and validate the complete board against the manufacturing and reliability needs of the target industrial system.
Recomendado
Communications Line Card and Protocol Bridge
The EP3C10F256C7 is suitable for communications line-card and protocol-bridge designs that need multiple parallel data paths and flexible interface assignment. Its 182 I/O can accommodate control signals, status indicators, and multiple low-speed interfaces, while the internal programmable logic can implement framing, buffering, and state-machine functions. The embedded PLL capability supports clock generation where required, although each PLL and clock-domain configuration must be checked against the complete Cyclone III documentation. Designers should preserve timing margin for protocol conversion, keep the 256-BGA escape and power distribution under control, and confirm that configuration flash or a configuration controller fits the board without violating the 1.15 V to 1.25 V supply constraints.
Recomendado
Parallel Sensor Aggregation
The EP3C10F256C7 offers a practical implementation path for aggregating outputs from multiple sensors when deterministic parallel sampling is required. The 10,320 logic elements can host counters, threshold comparators, filters, and data-formatting pipelines, while 423,936 memory bits provide on-chip buffering for concurrent acquisition channels. Its 182 I/O permit direct connection to converters, sensors, and capture circuitry without excessive multiplexing. Because the verified data does not state the number of memory blocks or supported I/O standards, engineers should confirm those resources against the design budget before assigning pins. A suitable board should use short, controlled routing for acquisition signals, local decoupling on the supply balls, and a clocking scheme that keeps sampling paths aligned and repeatable.
Recomendado
Programmable Test and Measurement
The EP3C10F256C7 can implement programmable test logic where product behavior depends on timing sequences, pattern generation, and multiple instrument interactions. Its programmable fabric allows logic blocks to be combined into counters, pattern generators, capture comparators, and sequencing engines, while 182 I/O provide connections to the device under test and control peripherals. The listed 402 MHz device figure supports designs that require substantial parallel processing, but it should not be treated as a guaranteed system-clock rate without timing-closure analysis. Laboratory-card designs should also account for input loading, output drive standards, grounding, and impedance control. Configuration storage, trigger distribution, and instrument-specific interface logic should be validated together before committing the 256-LBGA layout to fabrication.
Recomendado
Embedded Image Preprocessing
The EP3C10F256C7 is appropriate for embedded image-preprocessing stages that require deterministic pixel operations, line and frame buffers, and flexible sensor-interface logic. Its 423,936 memory bits can support buffering within a constrained pipeline, while 10,320 logic elements can implement thresholding, color correction, filtering, and format conversion. The 182 I/O provide capacity for parallel pixel capture, synchronization, and configuration signals. Engineers must budget actual memory blocks and routing against the target frame size because the verified data does not enumerate those resources. Clock-domain crossings, video timing, and output interface standards should be resolved in the Quartus design, while PCB placement should keep the FPGA, external memory, and power circuitry arranged for predictable timing and manageable BGA routing.
Recomendado
Configuration and Secure Control Platform
The EP3C10F256C7 can act as the central programmable controller in a board where configuration, health monitoring, and peripheral arbitration must be adapted to the deployed hardware. Its programmable logic can implement configuration sequencing, register maps, watchdog behavior, and status collection, while 182 I/O support links to flash, supervisory controllers, and external peripherals. This makes it useful for industrial gateways or configurable test platforms that need a stable hardware function with field-updatable logic. The design must observe the 1.15 V to 1.25 V supply requirement and provide a secure, repeatable configuration path with verified startup behavior. Engineers should also review bitstream compatibility, memory initialization, and recovery procedures before using the FPGA for safety-adjacent control functions.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C10F256C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C10F256C7N | EP3C10F256I7N | EP3C10F256C8N | EP3C10F256C8 |
|---|---|---|---|---|---|
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| Brand | Altera | Altera | Altera | Altera | Altera |
| Device Type | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 10,320 |
| User I/O | 182 I/O | 182 I/O | 182 I/O | 182 I/O | 182 I/O |
Principais diferenciais
- Closest verified same-package ordering variant (vs EP3C10F256C7N)
- Higher speed-grade alternative with the same resource density (vs EP3C10F256C8N)
- Industrial-grade alternative matching the principal resource counts (vs EP3C10F256I7N)
- Wide verified operating-temperature range (vs EP3C10F256C7)
Notas de projeto
The verified EP3C10F256C7 supply range is 1.15 V to 1.25 V, but core current, I/O current, and bank voltages were not provided. Do not size the power tree from the family name alone. Obtain the complete electrical-characteristics table for the exact speed grade and temperature grade, determine worst-case static and dynamic current across operating modes, and include startup, configuration-transient, and tolerance margin. Place bulk and high-frequency decoupling directly against the appropriate 256-LBGA power and ground balls, and validate power sequencing before schematic release.
Treat the 256-LBGA footprint as a layout-constrained design rather than a conventional fine-pitch two-sided assembly. Escape power, ground, configuration, clocks, and user I/O using the manufacturer's ball map and the PCB capability of the fabricator. Avoid routing sensitive clocks through dense logic regions, keep decoupling connections short with minimal inductance, and confirm whether the assembly process supports via-in-pad or requires filled thermal-via arrays. Because the verified data confirms the package but not the complete ball assignment, do not construct the footprint from an unverified third-party drawing.
A matching family name and package do not by themselves guarantee a drop-in qualification. Before substituting EP3C10F256C7N, EP3C10F256I7N, or a C8-series device, verify the exact ball map, voltage, temperature class, speed grade, configuration interface, supported I/O standards, and bitstream compatibility. Check whether the replacement's ordering suffix denotes a commercial, industrial, lead-free, or speed-grade variation. Also confirm configuration retention behavior and obtain original-manufacturer traceability because mature FPGA inventory may include mixed date codes and nonauthorized channels.
Define clock and high-speed interface requirements before assigning FPGA pins. The listed 402 MHz device switching figure is a device-family figure and is not automatically the maximum user clock available after routing and timing closure. Use the complete timing reports, constrain all input and output delays, and reserve margins for board skew, jitter, and process variation. If the design uses PLL-generated clocks, verify their permitted operating range and insertion requirements from the complete device documentation before freezing the pinout.
Informações de conformidade
The verified chipdig listing identifies the EP3C10F256C7 package as lead-free. RoHS, REACH, halogen-free, and conflict-minerals status were not explicitly stated in the supplied data and are therefore recorded as unknown. AEC-Q100 is not applicable because the verified sources do not identify this device as an automotive-qualified part.
