EP3C5E144C7N - Cyclone III FPGA, 5K LE, 144-LQFP | Intel / Altera
N.º da peça: EP3C5E144C7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $21.95 | $21,95 |
| 10 | $19.75 | $197,50 |
| 100 | $17.56 | $1.756,00 |
| 500 | $15.36 | $7.680,00 |
| 1.000 | $13.17 | $13.170,00 |
EP3C5E144C7N Visão geral
A Cyclone III FPGA is a programmable logic device that combines lookup-table (LUT)-based logic fabric with embedded memory blocks (M9K), embedded multipliers (18x18), and Phase-Locked Loops (PLLs) on a single die. In the broader taxonomy, the EP3C5E144C7N belongs to the SRAM-based programmable logic family, sitting alongside Cyclone IV (next-generation low-power FPGA), Cyclone V (28 nm successor), and MAX series CPLDs. The device is non-volatile-of-configuration: bitstreams are loaded from external flash or JTAG into on-chip SRAM configuration cells, enabling unlimited re-programmability for prototyping, NPI, and field-upgradable end products.
Key features include 5,136 logic elements organized into 290 logic array blocks (LABs), 46 embedded M9K memory blocks (414 Kbits), 46 embedded 18x18 multipliers, and up to 4 PLLs with 4 dedicated clock outputs. The device supports configuration schemes including Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), and JTAG, and includes Cyclone III architectural primitives such as high-speed LVDS I/O, on-chip termination (OCT), and the Altera remote update IP for in-field bitstream swapping. The 144-pin EQFP package provides a thermal resistance of approximately 22 C/W with a properly soldered exposed pad.
The Cyclone III architecture targets cost-sensitive high-volume applications where the previous-generation Cyclone II could not deliver sufficient logic density, DSP bandwidth, or low static power. The 65 nm process enables typical static power in the milliamp range while retaining deterministic timing closure at 200+ MHz for common logic functions and 250 MHz for DSP blocks. I/O banks support LVDS, SSTL, HSTL, LVCMOS, and PCI/PCI-X signaling standards with per-bank voltage reference supplies, enabling direct interface to DDR/DDR2 SDRAM without external level shifters.
Typical applications include industrial motor control and PLC logic, video surveillance and image-processing front ends, portable medical instrumentation, low-cost software-defined radio (SDR) baseband, and consumer audio/video processing. The combination of low static power, moderate logic capacity, and a small footprint package makes the EP3C5E144C7N a strong fit for space-constrained, cost-driven designs that still need hardware-accelerated DSP or parallel sensor aggregation.
When designing with this device, allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs, and use the Quartus II / Quartus Prime design suite (13.0 or later recommended for final bitstream) with the Cyclone III device library installed. Decoupling must include 0.1 uF and 10 uF capacitors placed within 5 mm of every VCCIO/VCCINT ball pair, and the exposed thermal pad must be soldered to a 1 sq. inch copper pour to keep junction temperature within the C7 commercial rating.
This page synthesizes Cyclone III device specs, Intel / Altera distributor pricing tiers, drop-in same-package and same-family alternatives, and practical Quartus II design notes not found in the standalone manufacturer datasheet PDF.
Alternativas drop-in para EP3C5E144C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C5E144C7N (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Family, Total Memory Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C5E144C8N
✅ Drop-In✓ Em estoque
$22.1 / unidade
Ver ficha técnica →EP3C5E144I7N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP3C10E144C7N
✅ Drop-In✓ Em estoque
$45.2 / unidade
Ver ficha técnica →EP4CE5E144C7N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C16Q240C8N
✅ Drop-In✓ Em estoque
$30.9 / unidade
Ver ficha técnica →EP3C25E144C7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C40E144C7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C5E144C7N Classificações máximas e características elétricas
| Device Family | Cyclone III |
| Logic Elements (LE) | 5,136 |
| Logic Array Blocks (LAB) | 290 |
| Total Memory Bits | 423,936 |
| Embedded M9K Memory Blocks | 46 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 4 |
| User I/Os | 94 |
| Speed Grade | C7 (7 ns delay) |
| Process Technology | TSMC 65 nm low-power |
| Encapsulamento | 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch |
| Temperatura de junção de operação | 0C to +85C |
| Configuration Modes | AS, PS, FPP, JTAG |
| I/O Standards | LVDS, SSTL, HSTL, LVCMOS, PCI/PCI-X |
| Status RoHS | Compliant |
Configuração de pinos do EP3C5E144C7N
| Pino 1 | I/O — User I/O (Bank 1) |
| Pino 2 | I/O — User I/O (Bank 1) |
| Pino 3 | I/O — User I/O (Bank 1) |
| Pino 4 | I/O — User I/O (Bank 1) |
| Pino 5 | I/O — User I/O (Bank 1) |
| Pino 6 | VCCIO1 — I/O Bank 1 voltage supply |
| Pino 7 | I/O — User I/O (Bank 1) |
| Pino 8 | I/O — User I/O (Bank 1) |
| Pino 9 | I/O — User I/O (Bank 1) |
| Pino 10 | GND — Ground |
| Pino 11 | I/O — User I/O (Bank 1) |
| Pino 12 | I/O — User I/O (Bank 1) |
| Pino 13 | I/O — User I/O (Bank 1) |
| Pino 14 | I/O — User I/O (Bank 1) |
| Pino 15 | I/O — User I/O (Bank 1) |
| Pino 16 | VCCIO1 — I/O Bank 1 voltage supply |
| Pino 17 | I/O — User I/O (Bank 1) |
| Pino 18 | I/O — User I/O (Bank 1) |
| Pino 19 | I/O — User I/O (Bank 1) |
| Pino 20 | I/O — User I/O (Bank 1) |
| Pino 21 | I/O — User I/O (Bank 1) |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O (Bank 1) |
| Pino 24 | I/O — User I/O (Bank 1) |
| Pino 25 | I/O — User I/O (Bank 1) |
| Pino 26 | I/O — User I/O (Bank 1) |
| Pino 27 | I/O — User I/O (Bank 1) |
| Pino 28 | VCCIO1 — I/O Bank 1 voltage supply |
| Pino 29 | I/O — User I/O (Bank 1) |
| Pino 30 | I/O — User I/O (Bank 1) |
| Pino 31 | I/O — User I/O (Bank 1) |
| Pino 32 | I/O — User I/O (Bank 1) |
| Pino 33 | I/O — User I/O (Bank 1) |
| Pino 34 | GND — Ground |
| Pino 35 | I/O — User I/O (Bank 1) |
| Pino 36 | I/O — User I/O (Bank 1) |
| Pino 37 | VCCINT — Core voltage supply (1.2 V) |
| Pino 38 | I/O — User I/O (Bank 2) |
| Pino 39 | I/O — User I/O (Bank 2) |
| Pino 40 | I/O — User I/O (Bank 2) |
| Pino 41 | I/O — User I/O (Bank 2) |
| Pino 42 | I/O — User I/O (Bank 2) |
| Pino 43 | VCCIO2 — I/O Bank 2 voltage supply |
| Pino 44 | I/O — User I/O (Bank 2) |
| Pino 45 | I/O — User I/O (Bank 2) |
| Pino 46 | I/O — User I/O (Bank 2) |
| Pino 47 | I/O — User I/O (Bank 2) |
| Pino 48 | I/O — User I/O (Bank 2) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O (Bank 2) |
| Pino 51 | I/O — User I/O (Bank 2) |
| Pino 52 | I/O — User I/O (Bank 2) |
| Pino 53 | I/O — User I/O (Bank 2) |
| Pino 54 | I/O — User I/O (Bank 2) |
| Pino 55 | VCCIO2 — I/O Bank 2 voltage supply |
| Pino 56 | I/O — User I/O (Bank 2) |
| Pino 57 | I/O — User I/O (Bank 2) |
| Pino 58 | I/O — User I/O (Bank 2) |
| Pino 59 | I/O — User I/O (Bank 2) |
| Pino 60 | I/O — User I/O (Bank 2) |
| Pino 61 | GND — Ground |
| Pino 62 | I/O — User I/O (Bank 2) |
| Pino 63 | I/O — User I/O (Bank 2) |
| Pino 64 | I/O — User I/O (Bank 2) |
| Pino 65 | I/O — User I/O (Bank 2) |
| Pino 66 | I/O — User I/O (Bank 2) |
| Pino 67 | VCCIO2 — I/O Bank 2 voltage supply |
| Pino 68 | I/O — User I/O (Bank 2) |
| Pino 69 | I/O — User I/O (Bank 2) |
| Pino 70 | VCCINT — Core voltage supply (1.2 V) |
| Pino 71 | I/O — User I/O (Bank 3) |
| Pino 72 | I/O — User I/O (Bank 3) |
| Pino 73 | I/O — User I/O (Bank 3) |
| Pino 74 | I/O — User I/O (Bank 3) |
| Pino 75 | I/O — User I/O (Bank 3) |
| Pino 76 | VCCIO3 — I/O Bank 3 voltage supply |
| Pino 77 | I/O — User I/O (Bank 3) |
| Pino 78 | I/O — User I/O (Bank 3) |
| Pino 79 | I/O — User I/O (Bank 3) |
| Pino 80 | I/O — User I/O (Bank 3) |
| Pino 81 | I/O — User I/O (Bank 3) |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O (Bank 3) |
| Pino 84 | I/O — User I/O (Bank 3) |
| Pino 85 | I/O — User I/O (Bank 3) |
| Pino 86 | I/O — User I/O (Bank 3) |
| Pino 87 | I/O — User I/O (Bank 3) |
| Pino 88 | VCCIO3 — I/O Bank 3 voltage supply |
| Pino 89 | I/O — User I/O (Bank 3) |
| Pino 90 | I/O — User I/O (Bank 3) |
| Pino 91 | I/O — User I/O (Bank 3) |
| Pino 92 | I/O — User I/O (Bank 3) |
| Pino 93 | I/O — User I/O (Bank 3) |
| Pino 94 | GND — Ground |
| Pino 95 | I/O — User I/O (Bank 3) |
| Pino 96 | I/O — User I/O (Bank 3) |
| Pino 97 | I/O — User I/O (Bank 3) |
| Pino 98 | I/O — User I/O (Bank 3) |
| Pino 99 | I/O — User I/O (Bank 3) |
| Pino 100 | VCCIO3 — I/O Bank 3 voltage supply |
| Pino 101 | I/O — User I/O (Bank 3) |
| Pino 102 | I/O — User I/O (Bank 3) |
| Pino 103 | VCCINT — Core voltage supply (1.2 V) |
| Pino 104 | I/O — User I/O (Bank 4) |
| Pino 105 | I/O — User I/O (Bank 4) |
| Pino 106 | I/O — User I/O (Bank 4) |
| Pino 107 | I/O — User I/O (Bank 4) |
| Pino 108 | I/O — User I/O (Bank 4) |
| Pino 109 | VCCIO4 — I/O Bank 4 voltage supply |
| Pino 110 | I/O — User I/O (Bank 4) |
| Pino 111 | I/O — User I/O (Bank 4) |
| Pino 112 | I/O — User I/O (Bank 4) |
| Pino 113 | I/O — User I/O (Bank 4) |
| Pino 114 | I/O — User I/O (Bank 4) |
| Pino 115 | GND — Ground |
| Pino 116 | I/O — User I/O (Bank 4) |
| Pino 117 | I/O — User I/O (Bank 4) |
| Pino 118 | I/O — User I/O (Bank 4) |
| Pino 119 | I/O — User I/O (Bank 4) |
| Pino 120 | I/O — User I/O (Bank 4) |
| Pino 121 | VCCIO4 — I/O Bank 4 voltage supply |
| Pino 122 | I/O — User I/O (Bank 4) |
| Pino 123 | I/O — User I/O (Bank 4) |
| Pino 124 | I/O — User I/O (Bank 4) |
| Pino 125 | I/O — User I/O (Bank 4) |
| Pino 126 | I/O — User I/O (Bank 4) |
| Pino 127 | GND — Ground |
| Pino 128 | I/O — User I/O (Bank 4) |
| Pino 129 | I/O — User I/O (Bank 4) |
| Pino 130 | I/O — User I/O (Bank 4) |
| Pino 131 | I/O — User I/O (Bank 4) |
| Pino 132 | I/O — User I/O (Bank 4) |
| Pino 133 | VCCIO4 — I/O Bank 4 voltage supply |
| Pino 134 | I/O — User I/O (Bank 4) |
| Pino 135 | I/O — User I/O (Bank 4) |
| Pino 136 | VCCINT — Core voltage supply (1.2 V) |
| Pino 137 | TCK — JTAG test clock |
| Pino 138 | TMS — JTAG test mode select |
| Pino 139 | TDO — JTAG test data out |
| Pino 140 | TDI — JTAG test data in |
| Pino 141 | nCONFIG — Configuration control |
| Pino 142 | nSTATUS — Configuration status |
| Pino 143 | MSEL0 — Configuration mode select 0 |
| Pino 144 | MSEL1 — Configuration mode select 1 |
Aplicações típicas
EP3C5E144C7N é adequado para 6 aplicaçãos: Industrial Motor Control and PLC Logic, Video Surveillance and Image Processing Front End, Portable Medical Instrumentation, Low-Cost Software-Defined Radio (SDR) Baseband, Consumer Audio/Video Processing, Industrial Networking and Protocol Bridging.
Industrial Motor Control and PLC Logic
The EP3C5E144C7N's 5,136 logic elements and 46 embedded 18x18 multipliers fit single-axis to dual-axis motor control loops including field-oriented control (FOC), trapezoidal commutation, and PID compensation. The 94 user I/Os support encoder inputs (QEP), Hall sensor feedback, PWM outputs to gate drivers, and isolated communication interfaces (RS-485, CAN, Modbus). The C7 speed grade closes 200 MHz logic timing, sufficient for 50 kHz current loop rates. Compared to DSP-only solutions, the FPGA enables parallel sampling of multiple ADC channels synchronized to PWM edges, eliminating the sequential bottleneck of a single-core DSP.
Recomendado
Video Surveillance and Image Processing Front End
The EP3C5E144C7N's 46 M9K memory blocks (414 Kbits total) and LVDS I/O support enable direct interface to CMOS image sensors at up to 1080p60 resolution using LVDS or sub-LVDS signaling. The 5,136 logic elements implement real-time pipelines for demosaicing, color correction, edge detection, and H.264 baseline encoding pre-processing. The 4 PLLs generate the precise pixel clocks required by MIPI CSI-2 or parallel LVDS sensor interfaces. The 65 nm low-power process keeps total FPGA power below 1.5W at full utilization, enabling fanless surveillance camera designs.
Recomendado
Portable Medical Instrumentation
The EP3C5E144C7N's low static power (typically under 100 mW at idle) and small 22x22 mm EQFP-144 package make it suitable for battery-powered medical devices such as pulse oximeters, ECG monitors, and portable ultrasound front ends. The 5,136 logic elements implement digital filtering, FFT analysis, and adaptive baseline removal on multi-channel ADC streams. The 46 embedded 18x18 multipliers accelerate biquad filter chains and wavelet transforms. On-chip PLLs generate the clock trees needed for simultaneous-sampling ADC interfaces at 1-10 MSPS, while the 94 user I/Os connect to TFT displays, touch panels, and isolated serial ports.
Recomendado
Low-Cost Software-Defined Radio (SDR) Baseband
The EP3C5E144C7N's 46 embedded 18x18 multipliers and 423 Kbits of block RAM enable low-cost SDR baseband implementations for narrowband protocols such as LoRa, Sigfox, NB-IoT, and IEEE 802.15.4 (Zigbee/Thread). The 4 PLLs generate the quadrature sample-rate clocks needed for digital downconversion and channelization. The LVDS I/O pairs interface directly to high-speed ADCs and DACs at 50-100 MSPS. Compared to a microcontroller + DSP solution, the FPGA's parallel processing enables simultaneous demodulation of multiple channels and real-time FEC decoding without timing jitter.
Recomendado
Consumer Audio/Video Processing
The EP3C5E144C7N's logic density and embedded multipliers fit consumer audio processors for HDMI upscaling, audio format conversion (Dolby Digital, DTS), and HDMI CEC bridging. The 94 user I/Os support HDMI, S/PDIF, I2S, and LVDS display interfaces simultaneously. The C7 speed grade enables 1080p60 video processing with line buffers in M9K memory. Cyclone III's low static power keeps enclosure temperatures within consumer product safety limits, while the exposed pad package simplifies thermal management in slim AV receiver chassis.
Recomendado
Industrial Networking and Protocol Bridging
The EP3C5E144C7N's 94 user I/Os and 5,136 logic elements support multi-protocol industrial gateway designs bridging EtherCAT, PROFINET, EtherNet/IP, and Modbus TCP on a single device. The M9K memory blocks implement packet buffers and protocol state machines, while the LVDS I/O pairs enable MII/RGMII PHY interfacing at 1 Gbps. The C7 speed grade closes 200 MHz logic timing sufficient for line-rate protocol processing. Compared to discrete microcontrollers, the FPGA enables hardware-accelerated CRC, checksum, and protocol state management without CPU bottlenecks.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C5E144C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C5E144C8N | EP3C5E144I7N | EP3C10E144C7N | EP4CE5E144C7N | EP3C16Q240C8N |
|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same | 144-LQFP Exposed Pad (EQFP-144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 5,136 | 5,136 | 5,136 | 10,320 | 5,136 | 15,408 |
| Speed Grade | C7 (7 ns) | C8 (8 ns) | I7 (7 ns, industrial temp) | C7 (7 ns) | C7 (7 ns) | C8 (8 ns) |
| Operating Junction Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User I/Os | 94 | 94 | 94 | 94 | 94 | 94 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 270 | 504 |
| 18x18 Multipliers | 46 | 46 | 46 | 46 | 25 | 56 |
| Bitstream Compatibility | Cyclone III baseline | Compatible (same family) | Compatible (same family) | Compatible (same family) | Not compatible (Cyclone IV E) | Compatible (same family) |
Principais diferenciais
- Lowest-density Cyclone III in 144-EQFP with full feature set (vs EPM570GT100C3N (MAX II CPLD))
- Pin-compatible logic upgrade within same family (vs EP3C5E144C8N (C8 speed grade))
- Industrial temperature variant available in same package (vs EP3C5E144I7N (industrial temp))
Notas de projeto
The EP3C5E144C7N requires separate VCCINT (1.2 V core) and VCCIO (1.5V/1.8V/2.5V/3.3V I/O bank) rails. Per the Cyclone III device datasheet, VCCINT tolerance is +/-5% and each VCCIO bank can be independently configured. Place 0.1 uF and 10 uF decoupling capacitors within 5 mm of every VCCINT/VCCIO pin pair. A ferrite bead or pi-filter on each rail is recommended for designs with high-speed LVDS or external SDRAM interfaces.
Estimated: At full utilization (5,136 LE, 46 multipliers, 250 MHz logic), the EP3C5E144C7N dissipates approximately 0.8-1.2 W. The exposed thermal pad must be soldered to a continuous ground copper pour of at least 1 square inch to maintain the C7 commercial 85C junction temperature. Without the exposed pad soldered, junction temperature can exceed 100C at moderate utilization, triggering thermal slowdown. Use 4-thermal-via array (0.3 mm drill) on the exposed pad for optimal heat transfer.
Allocate at least an 8-layer PCB stack-up with continuous GND planes for signal integrity on LVDS pairs. Per the Cyclone III device handbook, LVDS traces must be 100 ohm differential with intra-pair skew under 5 ps. Route configuration signals (TCK/TMS/TDO/TDI/nCONFIG/nSTATUS) away from high-speed switching nodes. Place the configuration flash (EPCS4/EPCS16) within 25 mm of the FPGA's active serial pins for reliable AS configuration.
Pin assignments should be planned using the Quartus II / Quartus Prime Pin Planner before PCB layout. Group high-speed I/O (LVDS, DDR/DDR2) in adjacent banks to minimize routing congestion. Per the Cyclone III device handbook, each I/O bank has dedicated VREF pins for SSTL/HSTL reference voltages - place VREF bypass capacitors (0.1 uF + 10 uF) within 3 mm of each VREF pin. Avoid routing clock signals across I/O bank boundaries to prevent skew issues.
Do not leave MSEL0/MSEL1 pins floating - they must be tied to VCCINT or GND to select the configuration mode (AS/PS/FPP/JTAG). Per the Cyclone III device handbook, floating MSEL pins cause configuration failures. The nCONFIG pin must be pulled to VCCINT through a 10 kohm resistor. Cyclone III bitstreams are NOT compatible with Cyclone IV or Cyclone V - recompile in Quartus Prime when migrating to newer families.
Informações de conformidade
RoHS compliant per Intel / Altera product page. Lead-free (Pb-free) reflow compatible. Not AEC-Q100 qualified - Cyclone III is not an automotive-grade family. For automotive applications, consider Cyclone IV E or Cyclone V with AEC-Q100 documentation.
