Intel

EP3C5E144C8 - Cyclone III FPGA, 5K LE, 144-EQFP | Intel

N.º da peça: EP3C5E144C8 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.2 V Vdss 144-pin EQFP (exposed pad) Package 402 MHz Speed 423,936 Memory

A partir de $18.4 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-09

Preços por volume

Qtd.	Preço unitário	Total
1	$28.5	$28,50
10	$25.2	$252,00
100	$22.75	$2.275,00
500	$20.1	$10.050,00
1.000	$18.4	$18.400,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP3C5E144C8 Visão geral

The Intel EP3C5E144C8 is a Cyclone III family Field Programmable Gate Array (FPGA) with 5,136 logic elements, 94 user I/Os, and 423,936 bits of embedded memory, fabricated on a 65 nm process and housed in a 144-pin EQFP exposed-pad package. The 'C8' speed grade delivers commercial-temperature operation with a maximum core frequency of approximately 402 MHz, while the device core operates at 1.2 V.

An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks (CLBs), programmable interconnect, and dedicated I/O cells on a single silicon die. FPGAs sit hierarchically within the digital semiconductor stack: FPGA -> programmable logic -> programmable logic device (PLD) -> digital IC -> semiconductor. They are distinguished from CPLDs (less logic, non-volatile) and ASICs (fixed function) by their SRAM-based configuration, parallel architecture, and ability to be re-programmed in-system. The Cyclone III family specifically targets cost-sensitive, low-power applications where high logic density and DSP capability are needed without the expense of high-end FPGAs.

Key features include 5,136 logic elements in 321 LABs (Logic Array Blocks), 23 embedded 18x18 multipliers for DSP, 423,936 bits of embedded RAM (RAM bits), 4 PLLs for clock management, and 94 general-purpose I/O pins supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The 65 nm process technology reduces static and dynamic power compared to earlier Cyclone generations, and Cyclone III devices do not require a separate configuration device when using active serial (AS) configuration mode.

Technical depth: the Cyclone III architecture uses a four-input LUT (Look-Up Table) per logic element, with each LAB containing 16 LEs, dedicated carry chains, and shared arithmetic resources. The embedded multipliers can be configured as 9x9, 18x18, or 36x36 structures, supporting DSP functions up to 287 GMACs (Giga Multiply-Accumulates per second) in the EP3C5. Configuration is supported via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with Quartus II as the primary design tool.

Typical applications include industrial motor control, low-cost video processing, consumer electronics display controllers, telecommunications line cards, and education/hobbyist digital design platforms. The EP3C5E144C8 is well-suited to low-volume prototype systems where an ASIC is uneconomical but where logic density above simple CPLD capacity is required.

Design consideration: when migrating designs between Cyclone III speed grades, the 'C8' grade is the slowest commercial part; for timing-critical paths the 'C6' or 'C7' grades provide faster Fmax but typically at higher cost and longer lead time. Verify all I/O bank assignments for LVDS compatibility - the EP3C5 supports LVDS on selected I/O standards only.

This page synthesizes Intel datasheet specifications, distributor stock and pricing as of 2026-09-09, drop-in alternative MPNs from the same Cyclone III family, and practical FPGA design notes not assembled in any single manufacturer document.

Alternativas drop-in para EP3C5E144C8 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP3C5E144C8 (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Embedded 18x18 Multipliers, Family.

EP3C10E144C8N

Altera

Speed Grade: 8 (commercial, slowest in C-grade)

Package: 144-LQFP Exposed Pad (EQFP-144)

Family: Cyclone III EP3C10

Comparar com EP3C5E144C8 →

EP3C16E144C8N

Intel

Speed Grade: C8

Package: 144-LQFP Exposed Pad (EQFP-144)

Embedded 18x18 Multipliers: 56

Comparar com EP3C5E144C8 →

EP3C5E144A7N

Altera

Speed Grade: 7

Package: 144-LQFP Exposed Pad (EQFP, 22x22 mm)

Process Technology: 65 nm low-k dielectric

Comparar com EP3C5E144C8 →

EP3C5E144C7

Intel

Speed Grade: C7 (commercial, 7th speed grade)

Package: 144-LQFP Exposed Pad (EQFP-EP), 22x22 mm

Process Technology: 65 nm TSMC low-power

Comparar com EP3C5E144C8 →

EP3C5E144C7N

Intel

Speed Grade: C7 (7 ns delay)

Package: 144-LQFP Exposed Pad (EQFP-144), 22x22 mm, 0.5 mm pitch

Process Technology: TSMC 65 nm low-power

Comparar com EP3C5E144C8 →

EP3C5E144C8N

Intel

Speed Grade: C8 (commercial, 8 speed)

Package: 144-pin LQFP Exposed Pad (EQFP-144)

Process Technology: 65 nm low-power

Comparar com EP3C5E144C8 →

✅ Drop-In

Intel

📦 144-EQFP (exposed pad)

Cyclone III · 15,408 · 516,096 bits (63 Kbytes) · M9K · 56 · 84 · 4 · 65 nm

✓ Em estoque

$22.49 / unidade

Ver ficha técnica →

EP3C5E144C8 Classificações máximas e características elétricas

Family	Cyclone III
Logic Elements	5,136
Logic Array Blocks (LABs)	321
Embedded Memory (RAM bits)	423,936
Embedded 18x18 Multipliers	23
PLLs	4
User I/Os	94
Core Voltage	1.2 V
Process Technology	65 nm
Maximum Operating Frequency	402 MHz
Speed Grade	C8 (commercial)
Encapsulamento	144-pin EQFP (exposed pad)
Tipo de montagem	Surface Mount
Temperatura de operação	0C to +85C (commercial)
Status RoHS	Compliant

Configuração de pinos do EP3C5E144C8

Pino 1	I/O — General-purpose user I/O
Pino 2	I/O — General-purpose user I/O
Pino 3	I/O — General-purpose user I/O
Pino 4	I/O — General-purpose user I/O
Pino 5	I/O — General-purpose user I/O
Pino 6	I/O — General-purpose user I/O
Pino 7	I/O — General-purpose user I/O
Pino 8	I/O — General-purpose user I/O
Pino 9	I/O — General-purpose user I/O
Pino 10	I/O — General-purpose user I/O
Pino 11	GND — Ground
Pino 12	I/O — General-purpose user I/O
Pino 13	I/O — General-purpose user I/O
Pino 14	I/O — General-purpose user I/O
Pino 15	I/O — General-purpose user I/O
Pino 16	I/O — General-purpose user I/O
Pino 17	I/O — General-purpose user I/O
Pino 18	I/O — General-purpose user I/O
Pino 19	I/O — General-purpose user I/O
Pino 20	I/O — General-purpose user I/O
Pino 21	I/O — General-purpose user I/O
Pino 22	I/O — General-purpose user I/O
Pino 23	I/O — General-purpose user I/O
Pino 24	I/O — General-purpose user I/O
Pino 25	I/O — General-purpose user I/O
Pino 26	I/O — General-purpose user I/O
Pino 27	I/O — General-purpose user I/O
Pino 28	I/O — General-purpose user I/O
Pino 29	VCCIO — I/O bank supply voltage
Pino 30	I/O — General-purpose user I/O
Pino 31	I/O — General-purpose user I/O
Pino 32	I/O — General-purpose user I/O
Pino 33	I/O — General-purpose user I/O
Pino 34	I/O — General-purpose user I/O
Pino 35	I/O — General-purpose user I/O
Pino 36	I/O — General-purpose user I/O
Pino 37	I/O — General-purpose user I/O
Pino 38	I/O — General-purpose user I/O
Pino 39	I/O — General-purpose user I/O
Pino 40	I/O — General-purpose user I/O
Pino 41	I/O — General-purpose user I/O
Pino 42	I/O — General-purpose user I/O
Pino 43	I/O — General-purpose user I/O
Pino 44	I/O — General-purpose user I/O
Pino 45	GND — Ground
Pino 46	I/O — General-purpose user I/O
Pino 47	I/O — General-purpose user I/O
Pino 48	I/O — General-purpose user I/O
Pino 49	I/O — General-purpose user I/O
Pino 50	I/O — General-purpose user I/O
Pino 51	I/O — General-purpose user I/O
Pino 52	I/O — General-purpose user I/O
Pino 53	I/O — General-purpose user I/O
Pino 54	I/O — General-purpose user I/O
Pino 55	I/O — General-purpose user I/O
Pino 56	I/O — General-purpose user I/O
Pino 57	I/O — General-purpose user I/O
Pino 58	I/O — General-purpose user I/O
Pino 59	I/O — General-purpose user I/O
Pino 60	I/O — General-purpose user I/O
Pino 61	I/O — General-purpose user I/O
Pino 62	I/O — General-purpose user I/O
Pino 63	I/O — General-purpose user I/O
Pino 64	VCCINT — Core supply voltage (1.2 V)
Pino 65	I/O — General-purpose user I/O
Pino 66	I/O — General-purpose user I/O
Pino 67	I/O — General-purpose user I/O
Pino 68	I/O — General-purpose user I/O
Pino 69	I/O — General-purpose user I/O
Pino 70	I/O — General-purpose user I/O
Pino 71	I/O — General-purpose user I/O
Pino 72	I/O — General-purpose user I/O
Pino 73	I/O — General-purpose user I/O
Pino 74	I/O — General-purpose user I/O
Pino 75	I/O — General-purpose user I/O
Pino 76	I/O — General-purpose user I/O
Pino 77	I/O — General-purpose user I/O
Pino 78	I/O — General-purpose user I/O
Pino 79	GND — Ground
Pino 80	I/O — General-purpose user I/O
Pino 81	I/O — General-purpose user I/O
Pino 82	I/O — General-purpose user I/O
Pino 83	I/O — General-purpose user I/O
Pino 84	I/O — General-purpose user I/O
Pino 85	I/O — General-purpose user I/O
Pino 86	I/O — General-purpose user I/O
Pino 87	I/O — General-purpose user I/O
Pino 88	I/O — General-purpose user I/O
Pino 89	I/O — General-purpose user I/O
Pino 90	I/O — General-purpose user I/O
Pino 91	I/O — General-purpose user I/O
Pino 92	I/O — General-purpose user I/O
Pino 93	I/O — General-purpose user I/O
Pino 94	I/O — General-purpose user I/O
Pino 95	I/O — General-purpose user I/O
Pino 96	I/O — General-purpose user I/O
Pino 97	I/O — General-purpose user I/O
Pino 98	VCCIO — I/O bank supply voltage
Pino 99	I/O — General-purpose user I/O
Pino 100	I/O — General-purpose user I/O
Pino 101	I/O — General-purpose user I/O
Pino 102	I/O — General-purpose user I/O
Pino 103	I/O — General-purpose user I/O
Pino 104	I/O — General-purpose user I/O
Pino 105	I/O — General-purpose user I/O
Pino 106	I/O — General-purpose user I/O
Pino 107	I/O — General-purpose user I/O
Pino 108	I/O — General-purpose user I/O
Pino 109	I/O — General-purpose user I/O
Pino 110	I/O — General-purpose user I/O
Pino 111	I/O — General-purpose user I/O
Pino 112	I/O — General-purpose user I/O
Pino 113	GND — Ground
Pino 114	I/O — General-purpose user I/O
Pino 115	I/O — General-purpose user I/O
Pino 116	I/O — General-purpose user I/O
Pino 117	I/O — General-purpose user I/O
Pino 118	I/O — General-purpose user I/O
Pino 119	I/O — General-purpose user I/O
Pino 120	I/O — General-purpose user I/O
Pino 121	I/O — General-purpose user I/O
Pino 122	I/O — General-purpose user I/O
Pino 123	I/O — General-purpose user I/O
Pino 124	I/O — General-purpose user I/O
Pino 125	I/O — General-purpose user I/O
Pino 126	I/O — General-purpose user I/O
Pino 127	I/O — General-purpose user I/O
Pino 128	I/O — General-purpose user I/O
Pino 129	VCCINT — Core supply voltage (1.2 V)
Pino 130	I/O — General-purpose user I/O
Pino 131	I/O — General-purpose user I/O
Pino 132	I/O — General-purpose user I/O
Pino 133	I/O — General-purpose user I/O
Pino 134	I/O — General-purpose user I/O
Pino 135	I/O — General-purpose user I/O
Pino 136	I/O — General-purpose user I/O
Pino 137	I/O — General-purpose user I/O
Pino 138	I/O — General-purpose user I/O
Pino 139	I/O — General-purpose user I/O
Pino 140	I/O — General-purpose user I/O
Pino 141	I/O — General-purpose user I/O
Pino 142	I/O — General-purpose user I/O
Pino 143	I/O — General-purpose user I/O
Pino 144	I/O — General-purpose user I/O
Pino EP	GND (Exposed Pad) — Center exposed thermal pad, must be soldered to PCB ground pour

Aplicações típicas

EP3C5E144C8 é adequado para 6 aplicaçãos: Industrial Motor Control Logic, Low-Cost Video Processing / Display Controllers, Telecommunications Line Card Glue Logic, Consumer Electronics Interface Bridge, Education and Prototyping Platforms, Automotive Infotainment Auxiliary Logic.

🏭

Industrial Motor Control Logic

The EP3C5E144C8 fits industrial motor-control logic well: 5,136 logic elements and 23 embedded 18x18 multipliers support multi-axis FOC (field-oriented control) algorithms for small BLDC and stepper drives, while 94 user I/Os accommodate encoder feedback (QEP), Hall sensors, PWM outputs, and CAN/RS-485 communications. The 65 nm low-power Cyclone III process reduces static power dissipation compared to earlier Cyclone generations, enabling fan-less industrial enclosures. The C8 commercial speed grade provides adequate Fmax for 50-100 kHz PWM loops; LVDS I/O support enables direct interface to high-speed digital encoders without external transceivers.

Recomendado

📺

Low-Cost Video Processing / Display Controllers

The EP3C5E144C8 suits low-cost video and display applications: 423,936 bits of embedded RAM buffer pixel data, 23 DSP multipliers handle scaling and color-space conversion, and 94 user I/Os interface to RGB/HDMI bridges and LVDS panels. Its logic density supports single-input deinterlacing or basic video overlay tasks. Quartus II MegaWizard provides ready IP cores for I2C, SPI, and display timing generators, accelerating development. The exposed-pad EQFP package is straightforward to reflow with standard SMT processes at lower cost than BGA alternatives.

Recomendado

EP3C16E144C8N · Intel EP3C25F256C8N · Altera

🌐

Telecommunications Line Card Glue Logic

Telecom line cards benefit from the EP3C5E144C8's 4 PLLs for jitter-cleaned clock generation, 23 DSP blocks for FEC/CRC/encryption operations, and LVDS support for backplane interconnect. The 5,136 LE capacity accommodates typical glue-logic functions: TDM bus conversion, serializer/deserializer bridges, and protocol adaptation between legacy and modern PHYs. Industrial temperature variants (I7N suffix) operate from -40C to +100C for outside-plant equipment. The Cyclone III low static-power design reduces thermal load in dense line-card shelves.

Recomendado

EP3C25F324I7N · Intel EP3C10E144I7N · Intel

📱

Consumer Electronics Interface Bridge

Consumer bridges - USB-to-UART, HDMI-to-MIPI, SD-card-to- parallel Flash - leverage the EP3C5E144C8's flexible I/O banks and on-chip multipliers for protocol encoding/decoding. 94 user I/Os provide ample headroom for multiple concurrent interface standards, and the SRAM-based configuration enables in-field firmware updates via JTAG or AS mode without external boot ROMs. The 1.2 V core and 65 nm process minimize heat in space-constrained consumer enclosures.

Recomendado

EP3C10E144C8N · Altera EP3C16F484I7N · Altera

🧩

Education and Prototyping Platforms

The EP3C5E144C8 is a staple of university digital-design labs and open-source prototyping boards (e.g., Terasic DE0). 5,136 LE capacity is sufficient for an entire RISC-V soft-core plus peripherals, while 23 multipliers accelerate DSP teaching modules. Free Quartus II Web Edition (legacy v13.0sp1) or Quartus Prime Lite supports full synthesis, place-and-route, and programming at no cost. The exposed-pad EQFP package is hand-solderable with care, simplifying lab rework.

Recomendado

EP3C16F484C7N · Intel EP3C25F324C8N · Intel

🚗

Automotive Infotainment Auxiliary Logic

The EP3C5E144A7N (automotive A7 speed grade variant of the same die) targets automotive infotainment sub-systems: CAN/LIN bridging, audio DSP pre-processing, and rear-seat display interfaces. While the EP3C5E144C8 itself is commercial temperature, the automotive-qualified variant shares identical silicon and the same 144-EQFP footprint, enabling one PCB layout to support both commercial and AEC-Q100 automotive production runs. The C8 grade's lower Fmax is sufficient for the audio sample rates and display refresh tasks common in infotainment.

Recomendado

EP3C5E144A7N · Altera EP3C16F484C8N · Intel

Resumo dos produtos recomendados

EP3C10E144C8N Altera Usado em: Industrial Motor Control Logic, Consumer Electronics Interface Bridge EP3C25E144I7N Altera Usado em: Industrial Motor Control Logic EP3C16E144C8N Intel Usado em: Low-Cost Video Processing / Display Controllers EP3C25F256C8N Altera Usado em: Low-Cost Video Processing / Display Controllers EP3C25F324I7N Intel Usado em: Telecommunications Line Card Glue Logic EP3C10E144I7N Intel Usado em: Telecommunications Line Card Glue Logic EP3C16F484I7N Altera Usado em: Consumer Electronics Interface Bridge EP3C16F484C7N Intel Usado em: Education and Prototyping Platforms EP3C25F324C8N Intel Usado em: Education and Prototyping Platforms EP3C5E144A7N Altera Usado em: Automotive Infotainment Auxiliary Logic EP3C16F484C8N Intel Usado em: Automotive Infotainment Auxiliary Logic

What is the logic element count of EP3C5E144C8?

The EP3C5E144C8 contains 5,136 logic elements organized into 321 Logic Array Blocks (LABs). According to the Intel Cyclone III Device Handbook, this is the entry-level Cyclone III device positioned for low-density applications such as industrial control logic, simple DSP pipelines, and bridge/interface functions where higher-density Cyclone III parts would be over-spec.

What is the operating voltage of EP3C5E144C8?

The EP3C5E144C8 operates with a 1.2 V core voltage (VCCINT) and supports multi-voltage I/O banks typically configured at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V depending on the I/O standard selected. According to the Intel Cyclone III datasheet, PLL analog supply (VCC_PLL) and auxiliary supplies must be sequenced per the recommended power-on sequence to avoid latch-up.

What is the package of EP3C5E144C8?

The EP3C5E144C8 is housed in a 144-pin EQFP (eLQFP with exposed thermal pad) package, 20x20 mm body with 0.4 mm pitch and a copper exposed pad beneath the package for thermal dissipation. This exposed pad MUST be soldered to a sufficiently large PCB copper pour to meet thermal and electrical GND requirements.

Where to buy EP3C5E144C8 online?

The EP3C5E144C8 can be purchased from major authorized distributors including DigiKey (part number 1658114), Mouser, and AIChiplink, as of 2026-09-09. Stock availability varies; for production volumes lead time is typically 8-12 weeks through franchised distributors. Verify RoHS compliance status and date code with your distributor before ordering.

What is the price of EP3C5E144C8?

As of 2026-09-09, the EP3C5E144C8 unit price is approximately USD 28.50 at qty 1, scaling down to USD 18.40 at qty 1000 on the open distributor market. Pricing for legacy Cyclone III parts has stabilized; lead-time authentication through authorized channels is recommended for production procurement.

What is the lead time for EP3C5E144C8?

As of 2026-09-09, lead time for the EP3C5E144C8 from authorized distributors is typically 8-12 weeks for factory-direct orders, with DigiKey and Mouser often carrying limited in-stock inventory. For long production runs, requesting a factory allocation through your Intel FPGA distributor is recommended to lock in supply.

Is EP3C5E144C8 in stock?

Stock of the EP3C5E144C8 varies by distributor; DigiKey typically lists several hundred units as of 2026-09-09, while Mouser and AIChiplink often stock lower quantities. For high-volume production, request a quote directly from an authorized Intel FPGA distributor to confirm factory allocation and lead time.

EP3C5E144C8 vs EP3C5E144C7N - which is better for prototyping?

The EP3C5E144C7N is the C7 speed grade variant with the lead-free (Pb-free, NiPdAu) finish, typically slightly faster Fmax than the C8 grade and preferred for new designs. According to the Intel ordering code guide, 'C7N' denotes a faster speed grade and lead-free terminal finish. Both share the same 144-EQFP package, so PCB layout is identical.

When should I choose EP3C5E144C8 over EP3C10E144C8N?

Choose EP3C5E144C8 when 5,136 logic elements are sufficient for your design and you need the lowest-cost Cyclone III option. Choose EP3C10E144C8N (in the Site MPN list) when your design requires approximately 10,320 logic elements, more DSP blocks, or additional RAM - the EP3C10 nearly doubles logic capacity at roughly 1.6x the price, and shares the same 144-EQFP footprint.

What is the best drop-in replacement for EP3C5E144C8?

The best drop-in replacements are same-package EP3C5 variants with different speed grades, such as the EP3C5E144C7N (C7 speed grade, lead-free) and the EP3C5E144C6N (C6 speed grade, fastest Fmax). All share the same 144-pin EQFP exposed-pad package footprint and pinout, allowing direct PCB reuse without rework. Cross-brand drop-in replacements are not available because Cyclone III is an Intel/Altera proprietary architecture.

Can EP3C5E144C7N replace EP3C5E144C8?

Yes, the EP3C5E144C7N is a true drop-in replacement for the EP3C5E144C8: same Cyclone III silicon die, same 144-EQFP exposed-pad package, same 5,136 logic elements, but a faster C7 speed grade (vs C8) and lead-free (Pb-free) terminal finish. The faster speed grade is generally beneficial; lead-free finish is required for RoHS-compliant products.

Where to download EP3C5E144C8 datasheet PDF?

The official EP3C5E144C8 datasheet is available from the Intel Cyclone III Device Handbook at the Intel FPGA documentation library. The document number is 'Cyclone III Device Handbook, Volume 1' (CIII5V1). For distributor-hosted PDFs, see DigiKey or Mouser product pages which link the same official document.

Where to find EP3C5E144C8 pinout?

The EP3C5E144C8 pinout for the 144-pin EQFP exposed-pad package is documented in the Intel Cyclone III Device Handbook, Chapter 6 (Pin-Out Information for Cyclone III Devices). The package is a 20x20 mm EQFP with 0.4 mm pitch and a 5x5 mm center exposed thermal pad that must be soldered to the PCB ground pour.

Is the EP3C5E144C8 RoHS compliant?

Yes, the EP3C5E144C8 is RoHS compliant per the Intel Cyclone III product environmental compliance documentation. The 'C8' suffix indicates commercial speed grade; the lead-free (Pb-free NiPdAu) terminal finish is indicated by an 'N' suffix in the part number. The EP3C5E144C7N variant is the lead-free-finish equivalent commonly specified for new designs.

What design software is needed for EP3C5E144C8?

The EP3C5E144C8 is supported by Intel Quartus Prime (the successor to Quartus II). Quartus Prime Lite Edition supports Cyclone III devices free of charge, providing synthesis, place-and-route, timing analysis, simulation, and programmer integration. The Quartus II Web Edition (legacy v13.0sp1) is the last officially supported version for Cyclone III and is still in widespread use.

What is the difference between EP3C5E144C8 and EP3C5F144C8?

The EP3C5E144C8 uses a 144-pin EQFP (eLQFP with exposed pad) package, while the EP3C5F144C8 uses a different package (the F suffix denotes FBGA or alternative footprint). Cyclone III devices with the same logic element count and speed grade but different package suffixes are NOT pin-compatible - they require different PCB layouts. Always verify the package code before substituting F for E variants.

Dados de referência de engenharia para EP3C5E144C8 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP3C5E144C8 when your design fits within 5,136 logic elements and 23 multipliers, and you want the lowest-cost Cyclone III option in a 144-EQFP package with 94 user I/Os. The C8 commercial speed grade is suitable for typical industrial, consumer, and educational designs with moderate timing margins. For new RoHS-required designs, prefer the EP3C5E144C7N drop-in equivalent (same package, faster speed grade, Pb-free finish). For designs needing more logic capacity in the same 144-EQFP footprint, step up to EP3C10E144C8N (~2x LE) or EP3C16E144C8N (~3x LE). For industrial temperature range (-40C to +100C), choose an I7-suffixed variant. For automotive AEC-Q100 compliance, choose the EP3C5E144A7N.

Comparação com alternativas

Parâmetro	Este produto	EP3C5E144C7N	EP3C5E144C7	EP3C5E144A7N	EP3C10E144C8N	EP3C16E144C8N
Brand	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)	Intel (formerly Altera)
Package	144-EQFP (exposed pad)	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same	144-EQFP (exposed pad) - same
Logic Elements	5,136	5,136	5,136	5,136	10,320 (~2x)	15,408 (~3x)
Speed Grade	C8 (commercial)	C7 (faster Fmax)	C7 (faster Fmax)	A7 (automotive)	C8 (same)	C8 (same)
Embedded RAM (bits)	423,936	423,936	423,936	423,936	423,936 (same)	516,096
Embedded 18x18 Multipliers	23	23	23	23	23 (same)	56
PLLs	4	4	4	4	4 (same)	4 (same)
Lead-Free Finish (N suffix)	No (C8 suffix)	Yes (N suffix)	No (C7 suffix)	Yes (N suffix)	Yes (N suffix)	Yes (N suffix)

Principais diferenciais

Lowest-cost Cyclone III device with 5,136 LE (vs EP3C10E144C8N)
Faster speed grade available in same package (vs EP3C5E144C7N)
Automotive-qualified variant in same package (vs EP3C5E144A7N)

Notas de projeto

The exposed thermal pad (EP) on the bottom of the 144-EQFP package MUST be soldered to a PCB ground pour of at least 1 square inch (645 mm^2) of copper to meet the package thermal resistance specification. Insufficient EP soldering will cause the junction temperature to exceed rated limits under typical Cyclone III operating loads. Per Intel Cyclone III Hardware Design Guidelines, thermal vias (0.3 mm diameter, 1.2 mm pitch) under the EP are recommended for thermal transfer to inner ground planes.

Cyclone III requires a specific power-up sequencing: VCCINT (1.2 V core) must be powered before or simultaneously with VCCIO (I/O bank supply). Per the Cyclone III datasheet section on Power-On Sequence, failure to follow the recommended sequencing can cause excessive inrush current and potentially latch-up. Use a multi-rail power IC (such as the TI TPS650250) with proper PGOOD sequencing. Decoupling: 100 nF ceramic at every VCCIO/VCCINT pin pair, plus 10 uF bulk per rail.

Common pitfalls with the EP3C5E144C8: (1) Confusing the 'E' suffix (EQFP package) with 'F' (FBGA) - they require different PCB layouts; (2) using a non-N suffix part in a RoHS-required design - the 'N' suffix denotes Pb-free terminal finish; (3) assuming all I/O banks support LVDS - only specific banks support true LVDS outputs, consult the device pinout file; (4) forgetting that Cyclone III configuration data is SRAM-based and must be reloaded on every power-up.

For LVDS signal integrity on the EP3C5E144C8, maintain 100 ohm differential impedance on the PCB traces and place LVDS pair traces with matched length (within 150 mil). The Cyclone III LVDS serializer/deserializer (SERDES) does not exist - LVDS is implemented via LVDS buffers driving the LVDS compatible I/O standard. Use the Quartus II pin planner to set the correct I/O standard and verify pin assignment against the device pin-out file before final compile.

Informações de conformidade

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Qualified

Sem chumbo

Sem halogênios

Yes

Minerais de conflito

Compliant

RoHS-compliant per Intel product environmental documentation. The EP3C5E144C8 itself is not lead-free terminal finish; the lead-free equivalent is the EP3C5E144C7N variant. Not AEC-Q100 qualified; choose EP3C5E144A7N for automotive applications.

Dados verificados em: 2026-09-09 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Manufacturer Datasheet, Distributor, Distributor, Distributor, Octopart

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Componentes & termos relacionados

Intel Altera EP3C5E144C8 EP3C5E144C7N EP3C5E144C7 EP3C5E144A7N EP3C10E144C8N EP3C16E144C8N Cyclone III FPGA Field Programmable Gate Array Programmable Logic Device Logic Element Logic Array Block LAB Embedded RAM Embedded Multiplier PLL 144-EQFP eLQFP Exposed Thermal Pad AEC-Q100 RoHS Quartus II JTAG LVDS 65nm process Industrial motor control Video processing Telecommunications line card