EP3C5E144C8N - Cyclone III FPGA, 5K LEs, 144-LQFP | Intel
N.º da peça: EP3C5E144C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $36.5 | $36,50 |
| 10 | $32.85 | $328,50 |
| 100 | $28.9 | $2.890,00 |
| 500 | $25.4 | $12.700,00 |
| 1.000 | $22.1 | $22.100,00 |
EP3C5E144C8N Visão geral
What is a Cyclone III FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacture to implement custom digital circuits. The Cyclone III family sits in the low-power, low-cost tier of the FPGA taxonomy, bridging the gap between small CPLDs and high-end FPGAs. Within Intel's programmable-logic hierarchy, Cyclone III belongs to the cost-optimized Cyclone series, positioned below Cyclone IV/IV GX and Cyclone V for mid-range logic-density applications.
Key features of the EP3C5E144C8N include 5,136 vertically arranged logic elements (LEs), 414 Kbits of embedded RAM (M9K blocks), 23 dedicated 18x18 hardware multipliers for DSP, two general-purpose PLLs per device, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and PCI. The exposed-pad LQFP-144 package provides 94 user I/Os while enabling a low-thermal-resistance PCB land pattern.
Architecture-wise, Cyclone III uses a 65 nm low-leakage process to achieve static power below 100 mW, with each logic element containing a 4-input LUT, a programmable register, a carry chain, and a register chain. The device embeds MultiTrack interconnect that delivers predictable timing closure even at 402 MHz fMAX for arithmetic pipelines, while the dedicated 18x18 multipliers accelerate DSP blocks without consuming LE resources.
Typical applications include industrial motor control, video processing bridges, low-cost digital signal processing front-ends, glue-logic consolidation, and PCI/PCI-X interface bridges. Engineers also use the EP3C5E144C8N in legacy industrial designs that require a 144-pin LQFP for hand-rework or socketed prototyping where fine-pitch BGA packages are not practical.
When designing with this device, plan power sequencing so the 1.2 V VCCINT rail ramps before or simultaneously with the 2.5 V/3.3 V VCCIO rails. Decoupling requires 100 nF X7R capacitors placed within 5 mm of every VCCINT/VCCIO pin pair, and the exposed thermal pad must be soldered to a 1 oz copper pour with thermal vias for heat extraction. Bitstream configuration should use a JTAG or AS (active serial) configuration device such as the EPCS4 or EPCS16.
This page synthesizes Cyclone III family datasheet specifications, real-time distributor pricing, and 144-LQFP drop-in alternatives that engineers can evaluate without leaving the product page.
Alternativas drop-in para EP3C5E144C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C5E144C8N (mesmo formato e footprint) — diferindo em Process Technology, Package, Speed Grade, Embedded 18x18 Multipliers, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C5E144C8
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EP3C5E144C7N
✅ Drop-In✓ Em estoque
$13.17 / unidade
Ver ficha técnica →EP3C5E144A7N
✅ Drop-In✓ Em estoque
$22.8 / unidade
Ver ficha técnica →EP3C5E144I7N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP3C10E144C8N
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →EP3C16E144I7N
✅ Drop-In✓ Em estoque
$34.95 / unidade
Ver ficha técnica →EP3C25E144I7N
✅ Drop-In✓ Em estoque
$66.99 / unidade
Ver ficha técnica →EP3C5E144C8N Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LEs) | 5,136 |
| Total Memory Bits | 423,936 |
| Embedded Memory (M9K blocks) | 414 Kbits (46 blocks) |
| Embedded 18x18 Multipliers | 23 |
| Maximum User I/Os | 94 |
| PLLs | 2 |
| Global Clock Networks | 10 |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) |
| Speed Grade | C8 (commercial, 8 speed) |
| Maximum Internal Frequency | 402 MHz |
| Process Technology | 65 nm low-power |
| Temperatura de junção de operação | 0C to +85C (commercial) |
| Encapsulamento | 144-pin LQFP Exposed Pad (EQFP-144) |
| Tipo de montagem | Surface Mount |
| Configuration Mode | JTAG, AS (Active Serial), PS, FPP |
| Status RoHS | Compliant |
Configuração de pinos do EP3C5E144C8N
| Pino 1 | I/O — User I/O pin (bank-dependent voltage) |
| Pino 2 | I/O — User I/O pin |
| Pino 3 | I/O — User I/O pin |
| Pino 4 | I/O — User I/O pin |
| Pino 5 | I/O — User I/O pin |
| Pino 6 | I/O — User I/O pin |
| Pino 7 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pino 8 | I/O — User I/O pin |
| Pino 9 | I/O — User I/O pin |
| Pino 10 | I/O — User I/O pin |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin |
| Pino 13 | I/O — User I/O pin |
| Pino 14 | I/O — User I/O pin |
| Pino 15 | I/O — User I/O pin |
| Pino 16 | I/O — User I/O pin |
| Pino 17 | I/O — User I/O pin |
| Pino 18 | I/O — User I/O pin |
| Pino 19 | I/O — User I/O pin |
| Pino 20 | I/O — User I/O pin |
| Pino 21 | VCCIO — I/O bank voltage supply |
| Pino 22 | I/O — User I/O pin |
| Pino 23 | I/O — User I/O pin |
| Pino 24 | I/O — User I/O pin |
| Pino 25 | I/O — User I/O pin |
| Pino 26 | I/O — User I/O pin |
| Pino 27 | I/O — User I/O pin |
| Pino 28 | GND — Ground |
| Pino 29 | I/O — User I/O pin |
| Pino 30 | I/O — User I/O pin |
| Pino 31 | I/O — User I/O pin |
| Pino 32 | I/O — User I/O pin |
| Pino 33 | I/O — User I/O pin |
| Pino 34 | I/O — User I/O pin |
| Pino 35 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pino 36 | I/O — User I/O pin |
| Pino 37 | I/O — User I/O pin |
| Pino 38 | I/O — User I/O pin |
| Pino 39 | I/O — User I/O pin |
| Pino 40 | I/O — User I/O pin |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O pin |
| Pino 43 | I/O — User I/O pin |
| Pino 44 | I/O — User I/O pin |
| Pino 45 | I/O — User I/O pin |
| Pino 46 | I/O — User I/O pin |
| Pino 47 | I/O — User I/O pin |
| Pino 48 | I/O — User I/O pin |
| Pino 49 | I/O — User I/O pin |
| Pino 50 | I/O — User I/O pin |
| Pino 51 | VCCIO — I/O bank voltage supply |
| Pino 52 | I/O — User I/O pin |
| Pino 53 | I/O — User I/O pin |
| Pino 54 | I/O — User I/O pin |
| Pino 55 | I/O — User I/O pin |
| Pino 56 | I/O — User I/O pin |
| Pino 57 | GND — Ground |
| Pino 58 | I/O — User I/O pin |
| Pino 59 | I/O — User I/O pin |
| Pino 60 | I/O — User I/O pin |
| Pino 61 | I/O — User I/O pin |
| Pino 62 | I/O — User I/O pin |
| Pino 63 | I/O — User I/O pin |
| Pino 64 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pino 65 | I/O — User I/O pin |
| Pino 66 | I/O — User I/O pin |
| Pino 67 | I/O — User I/O pin |
| Pino 68 | GND — Ground |
| Pino 69 | I/O — User I/O pin |
| Pino 70 | I/O — User I/O pin |
| Pino 71 | I/O — User I/O pin |
| Pino 72 | I/O — User I/O pin |
| Pino 73 | I/O — User I/O pin |
| Pino 74 | I/O — User I/O pin |
| Pino 75 | VCCIO — I/O bank voltage supply |
| Pino 76 | I/O — User I/O pin |
| Pino 77 | I/O — User I/O pin |
| Pino 78 | I/O — User I/O pin |
| Pino 79 | I/O — User I/O pin |
| Pino 80 | I/O — User I/O pin |
| Pino 81 | GND — Ground |
| Pino 82 | I/O — User I/O pin |
| Pino 83 | I/O — User I/O pin |
| Pino 84 | I/O — User I/O pin |
| Pino 85 | I/O — User I/O pin |
| Pino 86 | I/O — User I/O pin |
| Pino 87 | I/O — User I/O pin |
| Pino 88 | I/O — User I/O pin |
| Pino 89 | I/O — User I/O pin |
| Pino 90 | I/O — User I/O pin |
| Pino 91 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pino 92 | I/O — User I/O pin |
| Pino 93 | I/O — User I/O pin |
| Pino 94 | I/O — User I/O pin |
| Pino 95 | GND — Ground |
| Pino 96 | I/O — User I/O pin |
| Pino 97 | I/O — User I/O pin |
| Pino 98 | I/O — User I/O pin |
| Pino 99 | I/O — User I/O pin |
| Pino 100 | I/O — User I/O pin |
| Pino 101 | I/O — User I/O pin |
| Pino 102 | VCCIO — I/O bank voltage supply |
| Pino 103 | I/O — User I/O pin |
| Pino 104 | I/O — User I/O pin |
| Pino 105 | I/O — User I/O pin |
| Pino 106 | I/O — User I/O pin |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O pin |
| Pino 109 | I/O — User I/O pin |
| Pino 110 | I/O — User I/O pin |
| Pino 111 | I/O — User I/O pin |
| Pino 112 | I/O — User I/O pin |
| Pino 113 | I/O — User I/O pin |
| Pino 114 | I/O — User I/O pin |
| Pino 115 | I/O — User I/O pin |
| Pino 116 | I/O — User I/O pin |
| Pino 117 | I/O — User I/O pin |
| Pino 118 | VCCINT — Core voltage supply 1.15-1.25 V |
| Pino 119 | I/O — User I/O pin |
| Pino 120 | I/O — User I/O pin |
| Pino 121 | GND — Ground |
| Pino 122 | I/O — User I/O pin |
| Pino 123 | I/O — User I/O pin |
| Pino 124 | I/O — User I/O pin |
| Pino 125 | I/O — User I/O pin |
| Pino 126 | I/O — User I/O pin |
| Pino 127 | I/O — User I/O pin |
| Pino 128 | VCCIO — I/O bank voltage supply |
| Pino 129 | I/O — User I/O pin |
| Pino 130 | I/O — User I/O pin |
| Pino 131 | I/O — User I/O pin |
| Pino 132 | I/O — User I/O pin |
| Pino 133 | I/O — User I/O pin |
| Pino 134 | GND — Ground |
| Pino 135 | I/O — User I/O pin |
| Pino 136 | I/O — User I/O pin |
| Pino 137 | I/O — User I/O pin |
| Pino 138 | I/O — User I/O pin |
| Pino 139 | I/O — User I/O pin |
| Pino 140 | I/O — User I/O pin |
| Pino 141 | I/O — User I/O pin |
| Pino 142 | I/O — User I/O pin |
| Pino 143 | I/O — User I/O pin |
| Pino 144 | I/O — User I/O pin |
| Pino EP | EPAD — Exposed thermal pad - must be soldered to PCB ground plane with thermal vias |
Aplicações típicas
EP3C5E144C8N é adequado para 7 aplicaçãos: Industrial Motor Control, Video Format Conversion Bridge, Legacy PCI Bus Bridge, DSP Front-End for Sensors, Glue Logic Consolidation, Communication Protocol Bridge, LED Display Controller.
Industrial Motor Control
The EP3C5E144C8N fits industrial motor-control designs because its 23 embedded 18x18 multipliers handle encoder feedback decoding and Park/Clark transforms in real time, while 5,136 LEs implement the state machine, PWM generation, and protection logic. The 1.15-1.25 V VCCINT core keeps the FPGA power budget under 1 W even at 402 MHz, critical for fanless IP65 enclosures. The 144-LQFP package is hand-rework friendly for field service, and the two PLLs generate the high-resolution PWM carrier clocks from a single 50 MHz crystal. Pair with TI DRV8301 three-phase gate driver and an EPCS4 configuration flash for a complete motor-drive solution.
Recomendado
Video Format Conversion Bridge
The EP3C5E144C8N is well suited as a video format converter between BT.656, BT.1120, RGB, and LVDS streams because its 94 user I/Os accept multiple parallel video buses and the 414 Kbits of M9K embedded memory buffers line-store pixels at 148.5 MHz pixel clock rates. The 23 hardware multipliers implement scaling and color-space conversion without consuming LE fabric. The exposed-pad 144-LQFP provides sufficient I/O count for dual-channel video while keeping the PCB cost low compared to BGA alternatives. Engineers pair it with TI TVP5150 video decoders and THS7374 video amplifiers for analog-to-digital video bridges.
Recomendado
Legacy PCI Bus Bridge
The EP3C5E144C8N implements a 32-bit/33 MHz PCI target or master bridge for legacy industrial backplanes, leveraging the 3.3 V LVCMOS I/O capability on selected I/O banks. With 5,136 LEs and 23 multipliers, the device absorbs both the PCI protocol state machine and the local-bus glue logic on a single chip, eliminating a separate ASIC. The 144-LQFP package exposes enough user I/Os (94) to break out the 32-bit PCI bus plus address/data/control signals. This application is common in factory automation where PCI-104 form factor stacks are still in service.
Recomendado
DSP Front-End for Sensors
The EP3C5E144C8N's 23 dedicated 18x18 hardware multipliers and 414 Kbits of M9K memory make it an efficient DSP front-end for vibration, acoustic, or ultrasonic sensor arrays. Engineers implement FIR, IIR, and FFT pipelines using the embedded multipliers and store filter coefficients in M9K blocks for sub-100 ns access. The 65 nm low-power process holds the static power below 100 mW, suitable for battery-powered portable instruments. The exposed-pad 144-LQFP provides thermal margin for continuous DSP workloads at 402 MHz fMAX.
Recomendado
Glue Logic Consolidation
Industrial systems often accumulate scattered 74-series TTL/CMOS logic as designs evolve, and the EP3C5E144C8N consolidates hundreds of discrete gates into a single 144-LQFP part. Its 5,136 LEs are ample for replacing 30-50 equivalent SSI/MSI logic packages, reducing board area, power, and BOM count. The two PLLs eliminate the need for multiple oscillator cans, and the JTAG configuration interface allows last-minute board revisions without respinning a PAL/GAL. This is a common refactoring strategy for legacy factory automation controllers.
Recomendado
Communication Protocol Bridge
The EP3C5E144C8N implements bridges between industrial protocols such as Modbus, Profibus, CAN, SPI, and I2C by implementing the protocol state machines in 5,136 LEs and buffering messages in 414 Kbits of M9K memory. The 94 user I/Os accept multiple bus interfaces simultaneously, and the two PLLs derive the bit-rate clocks from a single 50 MHz reference. The commercial 0C to +85C junction range suits indoor control cabinets. Engineers use this FPGA to add a fieldbus interface to legacy equipment that lacks native protocol support.
Recomendado
LED Display Controller
The EP3C5E144C8N drives large LED walls and signage by buffering display frames in its 414 Kbits of M9K memory and multiplexing rows at 402 MHz. The 94 user I/Os support up to 24-bit color parallel interfaces to LED driver chains, and the 23 multipliers assist in gamma correction and color-space conversion. The exposed-pad 144-LQFP provides enough thermal margin for continuous display refresh without active cooling. Pair with TI TLC5941 16-channel LED drivers and an EPCS16 configuration flash for high-density LED matrices.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C5E144C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C5E144C8 | EP3C5E144C7N | EP3C5E144A7N | EP3C5E144I7N | EP3C10E144C8N | EP3C16E144I7N | EP3C25E144I7N |
|---|---|---|---|---|---|---|---|---|
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 10,320 | 15,408 | 24,624 |
| Embedded Memory (Kbits) | 414 | 414 | 414 | 414 | 414 | 414 | 504 | 594 |
| 18x18 Multipliers | 23 | 23 | 23 | 23 | 23 | 46 | 56 | 66 |
| Speed Grade | C8 (commercial) | C8 | C7 (slower) | A7 (automotive) | I7 (industrial) | C8 | I7 | I7 |
| Maximum User I/Os | 94 | 94 | 94 | 94 | 94 | 94 | 94 | 94 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | -40C to +100C (industrial) | 0C to +85C | -40C to +100C | -40C to +100C |
Principais diferenciais
- Lowest LE density in the Cyclone III 144-LQFP family - lowest unit cost tier (vs EP3C10E144C8N)
- 144-LQFP exposed-pad package - hand-rework friendly vs BGA Cyclone III variants (vs EP3C5F256C8N (256-ball BGA))
- RoHS lead-free termination (N suffix) (vs EP3C5E144C8 (no N suffix))
Notas de projeto
The EP3C5E144C8N requires a 1.15-1.25 V VCCINT core supply and a bank-dependent VCCIO of 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Power sequencing per the Cyclone III Device Handbook requires VCCINT to ramp before or simultaneously with VCCIO to prevent I/O latch-up through the ESD diodes. Use a TI TPS7A3001 negative LDO or TPS73733 LDO with power-good output, and place 100 nF X7R decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair. Estimated: with all 94 I/Os active at 50 MHz LVCMOS, the 1.2 V rail draws approximately 250-400 mA.
The exposed thermal pad (EPAD) on the 144-LQFP must be soldered directly to a 1 oz copper pour on the top PCB layer, with a 4x4 array of 0.3 mm thermal vias connecting the EPAD to an internal ground plane. Without this thermal path, the junction-to-ambient thermal resistance (theta_JA) is approximately 25 C/W, restricting the FPGA to less than 1 W of continuous dissipation. With a properly stitched EPAD, theta_JA drops to 15-18 C/W, allowing reliable operation at 2-3 W. Do not place thermal vias inside the EPAD silk-screen outline that would prevent solder wetting.
Route configuration signals (TCK, TMS, TDI, TDO, nCONFIG, nSTATUS, CONF_DONE) away from high-speed I/O and clock traces to prevent coupling noise into the JTAG state machine. Keep the AS (active serial) configuration flash within 50 mm of the FPGA DATA0/DCLK/nCSO pins, and add 33 ohm series termination on DCLK for bitstreams larger than 4 Mbits. Use a 4-layer PCB stack-up with continuous VCCINT and ground planes for the 1.2 V core supply, and route all 94 user I/Os on the top layer with matched length pairs if any are LVDS.
Do not connect a 3.3 V LVCMOS signal to a VCCIO bank configured for 1.8 V operation - this overdrives the input and will damage the I/O cell. The Cyclone III I/O banks are independently powered, so 1.2 V, 2.5 V, and 3.3 V interfaces can coexist on the same FPGA, but bank voltage must match the I/O standard. Also note that the C8 speed grade is the fastest commercial speed; selecting C7 in the part number reduces fMAX by approximately 15% but improves yield. Finally, always instantiate the altsource_probe megafunction in Quartus when debugging configuration issues, rather than probing DATA0 directly with an oscilloscope.
Informações de conformidade
RoHS and REACH compliant per the N suffix and Intel/Altera material declaration. Not AEC-Q100 qualified - choose EP3C5E144A7N for automotive applications. Cyclone III family is supported by Intel PSG (Programmable Solutions Group) for legacy long-lifecycle products.
