EP3C80F484C7 - 295 I/O Cyclone III FPGA | Altera
N.º da peça: EP3C80F484C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $351.8368 | $351,84 |
| 10 | $315 | $3.150,00 |
| 100 | $280 | $28.000,00 |
| 500 | $245 | $122.500,00 |
| 1.000 | $215 | $215.000,00 |
EP3C80F484C7 Visão geral
An FPGA is a semiconductor integrated circuit containing configurable logic blocks, programmable interconnects, input/output resources, and memory elements. Unlike an application-specific integrated circuit, an FPGA can be electrically configured after PCB assembly. This makes it useful when a design requires rapid iteration, multiple interface protocols, parallel datapaths, or hardware functions that are not efficiently served by a fixed-function processor or controller. Cyclone III devices are part of the Altera programmable-logic family and are intended for cost-sensitive digital systems.
The headline resource figures are 81,264 logic cells, 2,810,880 memory bits, 295 I/O, and 437.5 MHz stated frequency. These values indicate a device suitable for moderately complex control logic, communications interfaces, image or data preprocessing, and test equipment. The 484-ball FBGA package supports the high I/O count while using a surface-mount ball-grid-array format. The package designation must be checked against the PCB footprint and ball map before substitution because ball numbering and package orientation are critical.
The supplied data identifies the device as a 65 nm FPGA operating at 1.2 V. It also identifies 5,079 LABs in one distributor result. The architecture is not described in the verified snippets, so detailed values for logic elements, embedded multipliers, phase-locked loops, transceiver count, operating temperature, speed grade, and thermal resistance are not asserted here. Those parameters should be confirmed from the manufacturer documentation or a current authorized source before design release.
Typical applications include industrial control and automation, communications-interface aggregation, video or imaging preprocessing, test and measurement, and embedded digital signal processing. The 295 I/O resources can support multiple parallel interfaces, while the stated 437.5 MHz value provides a useful design target for timing analysis. Because programmable devices can be constrained by routing, I/O standards, memory bandwidth, power integrity, and tool configuration, system-level validation remains necessary.
For design-in, verify the exact 484-ball FBGA footprint, power rails, configuration interface, supported I/O standards, bank restrictions, clocking resources, and recommended decoupling network from the manufacturer documentation. Treat the listed 1.2 V and 437.5 MHz values as verified device facts, but do not assume timing closure at that frequency in every design. The final design should include timing analysis, signal-integrity review, thermal analysis, and configuration-file validation.
This product data combines verified distributor specifications, package and resource information, sourcing observations, and explicit uncertainty markers. It is intended to help engineers distinguish confirmed facts from parameters that require manufacturer-document verification, reducing the risk of assuming unsupported electrical or pin-level details.
Alternativas drop-in para EP3C80F484C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C80F484C7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, Total Memory Bits, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C80F484C6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$102.5 / unidade
Ver ficha técnica →EP3C80F484C6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$369.38 / unidade
Ver ficha técnica →EP3C120F484C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$185 / unidade
Ver ficha técnica →EP3C55F484C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.75 / unidade
Ver ficha técnica →EP3C40F484C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$264 / unidade
Ver ficha técnica →EP3C80F484C7 Classificações máximas e características elétricas
| Device Type | Field Programmable Gate Array (FPGA) |
| Family | Cyclone III |
| Logic Cells | 81264 cells |
| Memory | 2810880 bit |
| User I/O | 295 I/O |
| Logic Array Blocks | 5079 LABs |
| Technology | 65 nm |
| Stated Frequency | 437.5 MHz |
| Tensão de alimentação | 1.2 V |
| Encapsulamento | 484-BGA |
| Contagem de pinos | 484 pins |
| Tipo de montagem | Surface Mount |
| Configuration | FPGA programmable after assembly |
Guia de Configuração de Pinos do EP3C80F484C7 484-bga
Configuração de pinos para EP3C80F484C7 (pacote 484-bga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C80F484C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C80F484C7 é adequado para 6 aplicaçãos: Industrial Control and Automation, Communications Interface Aggregation, Video and Imaging Preprocessing, Test and Measurement Equipment, Embedded Digital Signal Processing, Legacy Embedded System Modernization.
Industrial Control and Automation
EP3C80F484C7 can serve as a configurable control and interface device in industrial automation equipment. Its verified 81,264 logic cells, 5,079 LABs, and 295 I/O provide substantial resources for combining sensor acquisition, actuator sequencing, state machines, protocol handling, and timing functions on one programmable platform. The 484-BGA package supports a high number of I/O connections, but industrial equipment still requires careful bank planning and signal-integrity review. The device is not asserted as an industrial-temperature or EMC-qualified component because those values are not in the supplied data. Design validation should include the exact I/O standards, 1.2 V power implementation, clocking limits, configuration process, thermal performance, and environmental compliance. A Cyclone III FPGA can be especially useful when control logic must evolve without a new PCB, provided the firmware, timing constraints, and safety requirements are managed together.
Recomendado
Communications Interface Aggregation
EP3C80F484C7 is a plausible device for systems that aggregate or translate several communications interfaces. The verified 295 I/O count can support parallel data paths, while 81,264 logic cells and 5,079 LABs provide room for protocol state machines, data formatting, clock-domain handling, and supervisory logic. The stated 437.5 MHz value is useful for preliminary timing discussions, but it is not a guarantee that every interface will operate at that rate. Confirm supported I/O standards, input thresholds, output drive settings, bank voltages, and any restrictions from the manufacturer documentation. The 484-BGA footprint also makes PCB escape routing and power delivery important. Use controlled-impedance routing where required, preserve return paths, and validate configuration and reset behavior. Because the supplied data does not identify transceiver count or specific protocol support, the FPGA should be selected for interface functions only after those details are confirmed.
Recomendado
Video and Imaging Preprocessing
EP3C80F484C7 can be evaluated for image preprocessing, frame formatting, pixel processing, and timing-control functions. Its 81,264 logic cells, 2,810,880 memory bits, and 295 I/O provide useful resources for buffering, filtering, cropping, synchronization, and sensor-to-system data conditioning. The supplied data gives a stated 437.5 MHz frequency, which can support preliminary architecture work but does not establish achievable pixel throughput for a specific image format or clock domain. Check the actual memory architecture, clocking resources, I/O performance, and power constraints in the manufacturer documentation. The 484-BGA package can accommodate many I/O signals, but high-speed image interfaces demand short routes, continuous reference planes, impedance control, and careful placement of decoupling components. FPGA configuration data, timing constraints, and pin assignments should be reviewed in the design tool before fabrication.
Recomendado
Test and Measurement Equipment
EP3C80F484C7 may fit test and measurement equipment that needs flexible acquisition, sequencing, trigger, and data-formatting logic. The verified 295 I/O count, 81,264 logic cells, 5,079 LABs, and 2,810,880 memory bits can support parallel instrument control, measurement scheduling, waveform qualification, and communications with a host processor. The stated 437.5 MHz frequency provides a starting point for timing analysis, but actual performance depends on the implemented logic, I/O standards, routing, and measurement accuracy requirements. The device should not be treated as a precision analog component; sensitive measurements still require appropriate analog front-end design, grounding, shielding, and calibration. Confirm configuration reliability, thermal behavior, power integrity, and the exact package footprint before layout. For instruments requiring deterministic operation, apply rigorous timing constraints and verify the generated configuration against the production design.
Recomendado
Embedded Digital Signal Processing
EP3C80F484C7 can be considered for embedded digital signal processing that benefits from parallel hardware implementation. The verified 81,264 logic cells and 5,079 LABs can host filtering, transforms, modulation, detection, or control algorithms, while the 2,810,880-bit memory figure supports buffering and intermediate data storage. The stated 437.5 MHz value can be used for early performance planning, but the supplied data does not confirm multiplier count, DSP block architecture, memory bandwidth, or achievable signal-processing throughput. These values are [DATA_NEEDED: DSP and memory architecture] and must be checked before committing the FPGA to an algorithm. Power integrity, clock distribution, I/O timing, and thermal analysis are also important in a dense 484-BGA implementation. Use fixed-point or other verified arithmetic resources according to the manufacturer documentation, and validate the design with real stimulus rather than relying on nominal family-level specifications.
Recomendado
Legacy Embedded System Modernization
EP3C80F484C7 is potentially useful for maintaining or modernizing embedded systems built around the Cyclone III family. Its verified 295 I/O, 81,264 logic cells, 2,810,880 memory bits, 1.2 V supply, and 484-BGA package provide a documented starting point for evaluating firmware migration, interface replacement, or logic consolidation. However, lifecycle status is unknown in the supplied data, so a new production program should not assume long-term availability. Review the manufacturer’s current product-status and ordering information, toolchain support, configuration security, and authorized supply options before design approval. Related Cyclone III MPNs may be candidates for capacity or package matching, but they are not automatically drop-in replacements. A modernization project should preserve the original board’s timing, pinout, power sequencing, clocking, and configuration requirements, or perform a controlled redesign when any of those assumptions change.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C80F484C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C80F484C6 | EP3C80F484C6N | EP3C120F484C7N | EP3C55F484C7N | EP3C40F484C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA | 484-BGA | 484-BGA | 484-BGA | 484-BGA | 484-BGA |
| Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
Principais diferenciais
- High verified I/O resource count (vs EP3C55F484C7N)
- Substantial logic capacity (vs EP3C40F484C7N)
- Higher capacity option within related device family (vs EP3C120F484C7N)
- Same-family package context (vs EP3C80F484C6)
Notas de projeto
Design the power-distribution network around the verified 1.2 V supply and the 65 nm Cyclone III architecture, while treating all rail tolerances and current requirements as [DATA_NEEDED: current consumption and power sequencing] until confirmed in the manufacturer documentation. Use local decoupling at the package, separate noisy outputs from sensitive references, and verify the 484-BGA power-pin map. Estimate total current from the final I/O utilization and clocking plan, then check regulator capacity, transient response, thermal rise, and startup sequencing against the actual design.
The 484-ball FBGA package requires verified land-pattern, ball-map, and escape-routing information before layout release. The supplied data confirms 484-BGA but does not provide pin names or ball assignments, so [DATA_NEEDED: complete 484-ball pinout] must be resolved. Use the official package drawing to establish orientation, via-in-pad or dog-bone strategy, plane continuity, and manufacturing allowances. Keep high-speed routes short, maintain uninterrupted reference planes, and avoid crossing plane splits unless the design rules explicitly permit it.
The verified data does not provide junction temperature, package thermal resistance, or power dissipation, so thermal analysis cannot be completed from the supplied facts. Estimate the FPGA power from the final resource utilization, clock frequencies, toggling rates, I/O loading, and configuration contents, then compare the result with the manufacturer’s thermal limits and package guidelines. Provide adequate copper spreading, thermal vias where allowed, airflow as required, and temperature monitoring for production equipment. Do not present an estimated junction temperature as a datasheet specification.
The stated 437.5 MHz frequency is not a substitute for timing closure or interface validation. Define clock domains, input and output timing constraints, I/O standards, slew rates, drive strengths, and termination requirements in the FPGA design tool. For high-speed parallel or serialized links, control impedance, minimize stubs, maintain a continuous return path, and analyze crosstalk and power bounce on the assembled PCB. Confirm the exact I/O-bank and clock-resource restrictions from the manufacturer documentation because the verified snippets do not identify those constraints.
Do not assume that a related Cyclone III MPN is a drop-in replacement merely because it uses a 484-BGA designation. Package text alone does not prove ball-to-ball compatibility, power compatibility, timing, temperature grade, or configuration behavior. Likewise, do not infer a complete pinout from a generic symbol. Validate the manufacturer’s package drawing, ordering information, device status, configuration interface, supported I/O standards, and design-tool support. For legacy FPGA procurement, record the exact ordering code, package marking, date code, and supplier traceability in the BOM and incoming-inspection process.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations were not provided in the verified data. AEC-Q100 is not_applicable because the supplied data does not identify automotive qualification.