EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
N.º da peça: EP3SE260H780I4L ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1725 | $17.250,00 |
| 100 | $1595 | $159.500,00 |
| 250 | $1490 | $372.500,00 |
| 500 | $1395 | $697.500,00 |
EP3SE260H780I4L Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose logic function is defined after manufacturing by loading a user-supplied configuration bitstream into on-chip SRAM. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), above simple CPLDs in density, and below ASICs in per-unit cost but above them in design flexibility. FPGAs typically integrate programmable logic blocks, embedded multipliers, BRAM, clock networks, high-speed transceivers, and hard IP cores (memory controllers, PCIe, SERDES), making them suitable for high-throughput compute, signal processing, and prototyping tasks.
Key features of the EP3SE260H780I4L include 488 user I/Os, 1,536 18x18-bit multipliers (per Stratix III E family maximum), 19.4 Mbits of total BRAM per device-level maximum, and support for soft-core processors such as Nios II. The FC-HFBGA package provides a fine-pitch BGA with flip-chip attach and a high pin-count for high-bandwidth signal routing. Industrial temperature grade and JTAG IEEE 1149.1 boundary-scan support enable in-system programming and test.
Typical applications for the EP3SE260H780I4L include high-performance DSP and baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen1/Gen2, SRIO, XAUI), test and measurement instrumentation front-ends, military and aerospace signal processing, and high-port-count line-card controllers. The 780-pin FC-HFBGA package and industrial-grade qualification make it well-suited to demanding environments that require large logic capacity with deterministic timing closure.
When designing with the EP3SE260H780I4L, pay close attention to multi-rail power sequencing (0.9 V core, 1.1 V/1.2 V/1.5 V/2.5 V/3.3 V I/O and auxiliary supplies), thermal management on the FC-HFBGA substrate, and PCB stack-up to control impedance on the high-speed transceiver channels. Configuration can be loaded via JTAG, passive serial, or via a quad flash EPCQ device for fast multi-MB bitstreams.
Alternativas drop-in para EP3SE260H780I4L — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SE260H780I4L (mesmo formato e footprint) — diferindo em Package, Speed Grade, Family, Mounting Type, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SE260H780I4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1390 / unidade
Ver ficha técnica →EP3SE260H780I3N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3295 / unidade
Ver ficha técnica →EP3SE260H780I3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1410 / unidade
Ver ficha técnica →EP3SE260H780C4L
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1190 / unidade
Ver ficha técnica →EP3SE260H780C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP3SE260H780C4LN
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$11950 / unidade
Ver ficha técnica →EP3SE260H780I4L Classificações máximas e características elétricas
| Family | Stratix III E (Enhanced) |
| Logic Elements | 255,000 |
| Total Memory Bits | 16,672,640 |
| User I/O Count | 488 |
| Core Voltage | 0.9 V |
| Process Technology | 65 nm |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) |
| Tipo de montagem | Surface Mount (flip-chip) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) |
| Temperatura de operação | Industrial, -40C to +85C |
| Status RoHS | Compliant (lead-free) |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) |
Guia de Configuração de Pinos do EP3SE260H780I4L 780-bbga, fcbga (flip-chip)
Configuração de pinos para EP3SE260H780I4L (pacote 780-bbga, fcbga (flip-chip)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SE260H780I4L.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SE260H780I4L é adequado para 6 aplicaçãos: High-Performance DSP & Baseband Processing, ASIC Prototyping & Emulation, High-Speed Serial Protocol Bridging, Test & Measurement Instrumentation, Military & Aerospace Signal Processing, High-Port-Count Line-Card Controllers.
High-Performance DSP & Baseband Processing
The EP3SE260H780I4L fits high-performance DSP and baseband processing applications because of its 255,000 logic elements, dedicated 18x18 multipliers, and 16,672,640 bits of on-chip BRAM that enable parallel FIR, FFT, and channelization blocks. The 780-pin FC-HFBGA package provides enough user I/O to route multiple ADC/DAC data buses plus high-speed serial transceivers up to 6.375 Gbps for antenna aggregation. Designers typically instantiate the device with the Altera DSP Builder and IP cores for FFT, while the industrial temperature grade supports outdoor base-station deployments.
Recomendado
ASIC Prototyping & Emulation
Engineers use the EP3SE260H780I4L for ASIC prototyping and emulation because its 255K logic-element capacity can map complex SoC designs spanning multiple clock domains and IP blocks. The Stratix III E architecture supports partial reconfiguration and signal-tap logic-analyzer integration through JTAG, which shortens debug cycles. The 780-pin FC-HFBGA package allows large I/O counts for FPGA-asic-proto boards with DDR3 and PCIe edge fingers. Industrial temperature screening is helpful for early field-trial deployment.
Recomendado
High-Speed Serial Protocol Bridging
The EP3SE260H780I4L is well suited to high-speed serial protocol bridging, such as PCIe Gen1/2, Serial RapidIO (SRIO), and XAUI, because the Stratix III E device integrates hard SERDES blocks reaching up to 6.375 Gbps with low jitter. The 780-pin FC-HFBGA package provides controlled-impedance escape for the high-speed transceiver channels. Designers implement protocol bridges with Altera's IP library and validate link training via the Quartus Transceiver Toolkit. The 488 user I/Os handle side-band signals and management interfaces.
Recomendado
Test & Measurement Instrumentation
Test and measurement instruments such as oscilloscopes, logic analyzers, and protocol testers often use the EP3SE260H780I4L for its high logic density, abundant DSP blocks, and fast transceiver channels. The 0.9 V core supply and 65 nm process deliver performance per watt suitable for portable and bench-top instruments. The 780-pin FC-HFBGA package enables high-bandwidth ADC/DAC interfacing. Industrial temperature screening is essential for field-deployment instrumentation. Quartus SignalTap II logic analyzer integration accelerates bring-up and verification.
Recomendado
Military & Aerospace Signal Processing
The EP3SE260H780I4L targets military and aerospace signal-processing applications such as radar front-ends, electronic-warfare subsystems, and avionics databuses due to its industrial temperature grade, large logic capacity, and DSP-rich architecture. The 780-pin FC-HFBGA package provides rugged surface-mount attach suitable for high-shock/vibration environments when paired with under-fill and PCB stiffeners. Altera/Intel provides long-term support programs that often cover Stratix III E family members in defense programs.
Recomendado
High-Port-Count Line-Card Controllers
Telecom line cards with multi-port Ethernet, OTN, or SONET aggregation leverage the EP3SE260H780I4L for its high logic density, multiple transceiver channels, and integrated memory controllers. The 780-pin FC-HFBGA package offers enough I/O to manage 4-8 SFP+ cages plus a network processor interface. Industrial temperature screening supports central-office and outdoor-cabinet deployment. The Stratix III E family supports soft-core Nios II processors for management-plane tasks, reducing bill of materials.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SE260H780I4L — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SE260H780I4 | EP3SE260H780I3N | EP3SE260H780I3 | EP3SE260H780C4L | EP3SE260H780C4N |
|---|---|---|---|---|---|---|
| Package | 780-pin FC-HFBGA | 780-pin FC-HFBGA - same | 780-pin FC-HFBGA - same | 780-pin FC-HFBGA - same | 780-pin FC-HFBGA - same | 780-pin FC-HFBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 | 255,000 |
| Speed Grade | I4 (fastest, industrial) | I4 (industrial) | I3 (industrial) | I3 (industrial) | C4 (commercial) | C4 (commercial) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Total Memory Bits | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 | 16,672,640 |
Principais diferenciais
- Highest commercial logic density in Stratix III E family (vs EP3SE110F780I4L)
- Fastest speed grade (I4) versus I3 alternatives (vs EP3SE260H780I3)
- Industrial temperature grade versus C4 commercial (vs EP3SE260H780C4L)
Notas de projeto
Estimated: at 100 percent toggle rate on 255K logic elements, the EP3SE260H780I4L core draws approximately 2-3 W on the 0.9 V rail; total device power with transceivers active reaches 8-12 W. Multi-rail sequencing (0.9 V core must precede 1.1 V/2.5 V/3.3 V aux rails) is mandatory per Stratix III Handbook to avoid permanent damage. Use Altera's PowerPlay early-power estimator tool before PCB layout to size regulators.
The 780-pin FC-HFBGA package requires a high-density PCB stack-up with micro-via-in-pad and laser-drilled vias. Use a 4-6 mil pad pitch design rule with 0.5 oz copper on outer layers. Matched 100 ohm differential impedance on transceiver channels and 50 ohm single-ended on user I/O. Place 100 nF decoupling caps within 100 mil of every power pin, plus bulk caps every 2-3 mm of power rail.
Estimated: at 10 W total power dissipation on a 780-pin FC-HFBGA substrate, thermal resistance theta-JA is roughly 12-15 C/W with a properly designed 4-layer PCB and thermal via array under the die. Without thermal vias, junction temperature can exceed 125 C and trigger thermal shutdown. Recommend 100+ thermal vias under the BGA footprint connected to a copper pour on the bottom layer.
Informações de conformidade
RoHS compliant per Intel/Altera product environmental compliance documentation. 'L' suffix in part number indicates lead-free finish. AEC-Q100 not applicable (FPGA, not automotive-grade qualified). Industrial temperature screening per Stratix III E family datasheet.
