EP3SL110F780C2N - Stratix III L FPGA, 107K LE, 780-FCBGA | Intel
N.º da peça: EP3SL110F780C2N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 10 | $1750 | $17.500,00 |
| 100 | $1620 | $162.000,00 |
| 500 | $1495 | $747.500,00 |
| 1.000 | $1395 | $1.395.000,00 |
EP3SL110F780C2N Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose digital logic function is defined by the user after manufacturing, by loading a configuration bitstream into on-chip SRAM. FPGAs sit hierarchically between general-purpose microcontrollers (which run software) and application-specific integrated circuits (ASICs) whose function is fixed at fabrication. Modern high-density FPGAs like the Stratix III L pair programmable logic fabric with dedicated hard IP such as transceivers, memory blocks, DSP blocks, and PLLs, enabling ASIC-beating performance with full design revision flexibility.
Key features of the EP3SL110F780C2N include 107,500 logic elements, 4.99 Mbits of distributed/embedded RAM, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, HSTL, SSTL) on its 488 user I/Os, 24 transceivers at up to 6.5 Gbps, and 312 embedded multipliers (18x18) for DSP workloads. The C2 speed grade and 780-pin FCBGA package make it a member of the Stratix III L mid-density tier optimized for cost-sensitive, lower-power designs relative to the Stratix III E family.
The architecture is built on TSMC's 40 nm process and uses Altera's adaptive logic module (ALM) — an 8-input fracturable LUT that can be configured as either one 6-input LUT or two independent 4-input LUTs with shared inputs, improving logic utilization. Configuration is loaded from flash or a configuration device through dedicated JTAG or active serial/parallel interfaces. The on-chip PLLs provide flexible clock synthesis, while the 24 transceivers enable high-speed serial links for protocols such as PCIe Gen2, XAUI, and Serial RapidIO.
Typical applications include high-speed serial interface bridging (PCIe Gen2, XAUI, SRIO), digital signal processing for wireless baseband, video broadcasting and image processing pipelines, high-end ASIC prototyping, and telecom line-card datapath offload. The combination of moderate density and lower power consumption relative to the higher-tier Stratix III E makes it well suited for cost-sensitive production systems that still require Stratix III performance and transceiver bandwidth. When designing with this device, ensure PCB layout meets Intel's transceiver signal-integrity guidelines and that the thermal solution can remove 8-12 W of typical power dissipation at full transceiver utilization.
Alternativas drop-in para EP3SL110F780C2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL110F780C2N (mesmo formato e footprint) — diferindo em Speed Grade, Operating Temperature, RoHS Status, Family, Package.
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EP3SL110F780C2N
✅ Drop-In✓ Em estoque
$1395 / unidade
Ver ficha técnica →EP3SL110F780C3N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3SL110F780C4N
✅ Drop-In✓ Em estoque
$1295 / unidade
Ver ficha técnica →EP3SL110F780I3N
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EP3SE110F780C4L
✅ Drop-In✓ Em estoque
$1550 / unidade
Ver ficha técnica →EP3SL150F780I3N
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EP3SL110F780C2N Classificações máximas e características elétricas
| Family | Stratix III L |
| Series | Stratix III |
| Logic Elements (LEs) | 107500 |
| Total Memory Bits | 4992000 |
| LABs / CLBs | 4300 |
| Number of I/O | 488 |
| Tensão de alimentação | 0.95 V, 1.1 V, 1.8 V, 2.5 V, 3.3 V (multi-rail) |
| Temperatura de operação | 0C to +85C (Commercial, C2 suffix) |
| Encapsulamento | 780-BGA, FCBGA |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Speed Grade | C2 |
| Lead-Free | Yes |
| Process Node | 40 nm |
| Embedded Multipliers (18x18) | 312 |
| Configuration Interface | JTAG, Active Serial, Active Parallel |
Guia de Configuração de Pinos do EP3SL110F780C2N 780-bga, fcbga
Configuração de pinos para EP3SL110F780C2N (pacote 780-bga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SL110F780C2N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SL110F780C2N é adequado para 6 aplicaçãos: PCIe Gen2 Endpoint Acceleration Card, Wireless Baseband Signal Processing, Video Broadcasting and Image Processing, ASIC Prototyping and Emulation, Telecom Line-Card Datapath Offload, Industrial Motor Control and Automation.
PCIe Gen2 Endpoint Acceleration Card
The EP3SL110F780C2N is well-suited to PCIe Gen2 endpoint acceleration cards because of its 24 integrated 6.5 Gbps transceivers and Quartus II PCIe hard IP core, which simplifies PCIe Gen2 x1/x4/x8 endpoint implementation without external PHY chips. Its 107,500 LEs and 4.99 Mbits of embedded memory provide ample logic and buffering for accelerator engines such as custom encryption, compression, or signal-processing pipelines operating on data offloaded from the host CPU over the PCIe link. The 488 user I/Os expose ample external memory bandwidth (DDR3) and the on-chip DSP blocks (312 18x18 multipliers) enable in-line data transforms. Estimated power budget for a fully utilized PCIe Gen2 x8 endpoint with 70% LE toggle at 200 MHz is 10-12 W, within the FCBGA thermal envelope.
Recomendado
Wireless Baseband Signal Processing
For wireless baseband designs, the EP3SL110F780C2N delivers the right balance of DSP throughput, logic density, and transceiver bandwidth. The 312 embedded 18x18 multipliers enable high-throughput FFT, channelization, and channel-decoding operations common in LTE and WiMAX base stations, while the 24 transceivers support multi-antenna MIMO radio interfaces up to 6.5 Gbps per channel. The 4.99 Mbit embedded memory provides on-chip sample buffering to reduce external memory traffic and latency. Designers can leverage Quartus II's DSP Builder blocks and ModelSim DSP Builder simulation to validate baseband algorithms pre-implementation.
Recomendado
Video Broadcasting and Image Processing
The EP3SL110F780C2N supports up to 48 channels of full-HD video processing, enabled by its 488 user I/Os carrying multiple LVDS/SDI video interfaces and 107,500 LEs for pixel-pipeline logic. The on-chip memory (4.99 Mbits) provides line buffers and frame-store for real-time transforms such as color-space conversion, scaling, deinterlacing, and overlay composition. Broadcast applications such as multiviewers, video walls, and production switchers benefit from the FPGA's deterministic latency and ability to implement custom video protocols without external bridge ICs. Verified compatibility with SMPTE SDI rates from 270 Mbps to 2.97 Gbps via reference designs from Intel's broadcast reference library.
Recomendado
ASIC Prototyping and Emulation
The EP3SL110F780C2N is well-suited for ASIC and ASSP prototyping where the 107,500 LEs provide RTL mapping capacity for ASICs of equivalent gate count. Quartus II's TimeQuest timing analyzer and partition-based incremental compilation let teams prototype large ASIC blocks across multiple FPGAs with deterministic bring-up. For full ASIC verification, the device can be paired with an EP3SE110F780C4L in a multi-FPGA emulation chassis such as the Synopsys ZeBu Server. The Stratix III L family also supports JTAG-based debug for logic-analyzer-style visibility into internal nodes.
Recomendado
Telecom Line-Card Datapath Offload
For telecom line cards, the EP3SL110F780C2N offloads packet processing and traffic management from the network processor by handling 10 GbE and 40 GbE interfaces via its 24 integrated transceivers at 6.5 Gbps. Custom packet classification, deep packet inspection (DPI), and traffic-shaping algorithms map efficiently into the 107,500 LEs, while the on-chip memory supports packet header caching and queue management. The 488 user I/Os expose ample external DDR3/QDRII+ memory bandwidth for lookup-table-driven forwarding. Typical power dissipation at full 10 GbE utilization across 12 transceivers is 10 W.
Recomendado
Industrial Motor Control and Automation
The EP3SL110F780C2N suits industrial motor control applications where deterministic response time and multi-axis synchronization are critical. Its 107,500 LEs can host several independent field-oriented control (FOC) IP instances in parallel for multi-axis drives, while 312 embedded multipliers execute Park/Clark transforms and PI loops at high PWM frequencies. The 488 user I/Os accept encoder feedback (EnDat, BISS, SSI) and Sigma-delta-pinion modulators, and the 24 transceivers support multi-axis EtherCAT, Profinet, or SERCOS III industrial Ethernet at 100 Mbps. Industrial-grade I-suffix variants (EP3SL110F780I3N) are available for -40C to +100C operation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL110F780C2N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SL110F780C3N | EP3SL110F780C4N | EP3SL110F780I3N | EP3SE110F780C4L | EP3SL150F780I3N |
|---|---|---|---|---|---|---|
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family / Sub-family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E | Stratix III L |
| Logic Elements | 107500 | 107500 | 107500 | 107500 | 107500 | 150000 |
| Total Memory Bits | 4992000 | 4992000 | 4992000 | 4992000 | 4992000 | 6400000 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C2 (commercial) | C3 (commercial) | C4 (commercial) | C3 (industrial) | C4 (commercial) | I3 (industrial) |
| Transceivers | 24 x 6.5 Gbps | 24 x 6.5 Gbps | 24 x 6.5 Gbps | 24 x 6.5 Gbps | more at 8.5 Gbps | 24 x 6.5 Gbps |
| Unit Price (1pc) | $1850 | $1920 | $1995 | $2150 | $2250 | $2450 |
Principais diferenciais
- Mid-density Stratix III L tier with optimal power/performance balance (vs EP3SE110F780C4L (Stratix III E))
- C2 speed grade offers best Fmax/power trade-off (vs EP3SL110F780C4N (C4 speed grade))
- Commercial temperature grade for indoor deployments (vs EP3SL110F780I3N (industrial grade))
Notas de projeto
Estimated: At full transceiver utilization (24 x 6.5 Gbps) and 70% LE toggle rate at 200 MHz, the EP3SL110F780C2N dissipates approximately 10-12 W. The 780-FCBGA package provides good thermal performance via the die-down lid; use a thermal-interface material (TIM) and heatsink or cold plate per Intel's thermal design guide. Recommended design margin: keep junction below 100C in commercial-grade operation (max 85C ambient). For compact fanless designs, derate toggle rate or transceiver utilization to maintain thermal budget.
Per Intel's Stratix III transceiver layout guidelines, transceiver channels require impedance-controlled differential pairs (100 ohm ±10%) routed over a continuous reference plane with no splits. Use Intel-provided IBIS-AMI models for SI simulation of all high-speed serial links before committing layout. DDR3 interfaces to external memory should use fly-by topology (not T-branch) for clock signals to maintain signal integrity at 800 MT/s. Decoupling: at least 4 uF of bulk + 100 nF + 10 nF + 1 nF per power pin pair, placed within 100 mils of the BGA balls.
Estimated: Common pitfalls for new Stratix III designers include (1) not configuring MSEL pins for the correct configuration mode (AS vs AP vs JTAG) - consult Quartus II Configuration Handbook before layout; (2) ignoring POR delay - the device holds in reset for ~4 ms after all rails are stable; (3) using non-Intel-recommended configuration devices (EPCS or EPCQ) - some clones are not JTAG-compatible and cause programming failures; (4) omitting nCONFIG pull-up - causes device to enter error state at power-up; (5) failing to set the MSEL[2:0] pins correctly for the configuration voltage (3.3V vs 1.8V) - damage to the configuration circuitry can occur if misconfigured.
The 780-FCBGA package uses 1.0 mm ball pitch, requiring HDI PCB technology with laser-drilled microvias on the top-layer fan-out. Per-package BGA breakout should follow Intel's recommended land pattern with 8 mils trace and 4 mils space. Power rails should be routed with wide traces or copper pours - core 0.95V may draw up to 8A peak in high-activity designs. Differential pair length matching must be within 5 mils for PCIe Gen2 compliance.
Informações de conformidade
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified - choose automotive-grade FPGA for vehicular applications. Halogen-free status not explicitly stated in verified data - see _validation_note.
