EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel
N.º da peça: EP3SL70F484C4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $869.92 | $869,92 |
| 10 | $850 | $8.500,00 |
| 100 | $820 | $82.000,00 |
| 500 | $800 | $400.000,00 |
| 1.000 | $780 | $780.000,00 |
EP3SL70F484C4 Visão geral
An FPGA is an integrated circuit whose logic fabric can be configured after manufacturing, allowing engineers to implement custom digital logic without committing to an ASIC. FPGAs sit within the programmable logic device hierarchy below ASICs but above simple CPLDs. The EP3SL70F484C4 forms part of the Stratix III L family and is optimized for general-purpose logic from wireline access equipment to broadcast video processing.
Key features of the EP3SL70F484C4 include 67,500 logic elements for mid-density systems, 2,699,264 RAM bits for buffering and data storage, and 296 user I/O pins that can interface to multiple single-ended and differential signaling standards. The 484-ball FC-FBGA package provides a compact footprint while still exposing enough I/O for wide parallel buses, DDR memories, and external commodity interfaces. Distributor listings report this device as lead-free, and FPGAkey records a 1.1 V core supply voltage on a 65 nm process.
Although this part has no embedded high-speed serializer/deserializer transceivers in the logic-only L configuration, its logic density, embedded memory, and I/O count make it effective for controller, bridging, preprocessing, and protocol handling tasks. The C4 ordering bin in the Altera/Intel nomenclature denotes a commercial-temperature, speed-grade-sorted variant used for lower-cost applications where the higher speed grade is not required.
Typical applications include indoor telecom/network line cards, broadcast video processing chains, industrial automation controllers, medical imaging preprocessing, test and measurement instruments, and FPGA prototyping platforms. The 0°C to 85°C commercial temperature range is suitable for indoor, climate-controlled equipment but not for unheated automotive or extended-ambient deployments.
When using EP3SL70F484C4, designers must remember that an FPGA is volatile: configuration must be loaded from an external EPCS/SPI flash or through JTAG on every power-up. Power supply decoupling on the 1.1 V core rail and per-bank I/O supplies is essential for stable timing closure and reliable programming.
This page synthesizes distributor pricing, stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. It is intended for engineers comparing EP3SL70F484C4 with other 484-ball Stratix III L derivatives before PCB layout and procurement.
Alternativas drop-in para EP3SL70F484C4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL70F484C4 (mesmo formato e footprint) — diferindo em Speed Grade, Operating Temperature, Package, Family, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SL70F484C4N
✅ Drop-In✓ Em estoque
$580 / unidade
Ver ficha técnica →EP3SL70F484C3G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$985 / unidade
Ver ficha técnica →EP3SL70F484C3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$810 / unidade
Ver ficha técnica →EP3SL70F484C2N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$149.5 / unidade
Ver ficha técnica →EP3SL70F484C2G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$240 / unidade
Ver ficha técnica →EP3SL70F484C2
✅ Drop-In✓ Em estoque
$980 / unidade
Ver ficha técnica →EP3SL70F484C4 Classificações máximas e características elétricas
| Manufacturer | Intel (Altera) |
| Series | Stratix III L |
| Device Type | FPGA |
| Number of Logic Elements/Cells | 67500 |
| Total RAM Bits | 2699264 |
| Number of User I/O | 296 |
| Number of Terminations | 484 |
| Encapsulamento / Caixa | 484-BBGA, FCBGA |
| Package Shape | Square |
| Terminal Form | BALL |
| Core Supply Voltage | 1.1 V |
| Technology Node | 65 nm |
| Internal Frequency (marketplace listing) | 800 MHz |
| Faixa de temperatura de operação | 0°C to 85°C |
| Packaging | Tray |
| Nível de sensibilidade à umidade (MSL) | 3 (168 Hours) |
| Lead-Free Status | Lead Free |
Guia de Configuração de Pinos do EP3SL70F484C4 square
Configuração de pinos para EP3SL70F484C4 (pacote square). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SL70F484C4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SL70F484C4 é adequado para 6 aplicaçãos: Telecom Line Card and Access Equipment, Broadcast Video Processing, Industrial Automation Controllers, Medical Imaging Preprocessing, Test and Measurement Instrumentation, FPGA Prototyping and Lab Platform.
Telecom Line Card and Access Equipment
The EP3SL70F484C4 is well suited to indoor telecom line cards where 67,500 logic elements, 296 user I/O, and 2,699,264 RAM bits provide enough fabric for packet framing, FIFO buffering, and parallel bus conversion. Its 484-ball FC-FBGA package supports compact boards in central-office and enterprise equipment. The commercial 0°C to 85°C range fits controlled indoor environments. Typical use places the FPGA between a network processor, backplane parallel bus, and commodity memory devices. The Stratix III L architecture performs medium-complexity state machines and buffering without needing embedded transceivers. Configuration should be held in an external EPCS/SPI flash so the logic is loaded automatically after power-up. With 296 I/O, engineers can allocate banks for LVCMOS, LVTTL, or differential standards, while the 1.1 V core supply simplifies power-tree budgeting compared with older 1.5 V FPGAs.
Recomendado
Broadcast Video Processing
Broadcast video pipelines require parallel pixel processing, line buffers, and custom timing logic. The EP3SL70F484C4 provides 67,500 logic elements and 2,699,264 bits of RAM, which are practical for SDI ancillary data insertion, frame synchronization, and multi-format video conversion before dedicated ASICs or encoder devices. The 296 user I/O can connect to external FIFOs, DDR SDRAM controllers, and video serializer devices using bank-specific reference voltages. Because the FPGA is commercial-grade, it is ideal on studio cards with active cooling. The C4 speed bin is often sufficient for standard-definition and high-definition video rates, especially when the data path is parallel and pipelined. Designers placing the FC-FBGA device on a video processing board should use careful BGA fanout and keep the 1.1 V core plane clean to ensure reliable configuration and timing convergence.
Recomendado
Industrial Automation Controllers
Industrial controllers often need deterministic logic, flexible I/O expansion, and custom fieldbus bridging. The EP3SL70F484C4 supports this with 67,500 logic elements for PID loops, motion profiles, and protocol state machines. Its 296 I/O pins can interface to industrial transceivers for PROFIBUS, Ethernet, and parallel sensor arrays. The commercial grade is suitable only for climate-controlled cabinets; for outdoor or -40°C environments the industrial I variant would be preferred. A major advantage of this Intel/Altera device is the reuse of the same F484 layout across multiple speed-grade parts, which allows a controller manufacturer to qualify one PCB and later tune cost or performance by selecting C4, C3G, or C2G variants. Power and thermal design should include a 1.1 V core rail with adequate decoupling and airflow, especially when the FPGA drives many high-speed output banks.
Recomendado
Medical Imaging Preprocessing
Medical ultrasound and diagnostic imaging systems benefit from the EP3SL70F484C4's ability to perform parallel processing on raw image data before the main DSP or CPU. Its 67,500 logic elements can implement front-end filtering, beamforming ancillary control, and digital gain corrections, while the 2,699,264 RAM bits supply line and frame buffers. The 296 user I/O allow connection to multichannel ADC arrays, external SDRAM, and imaging processors. Since the device is commercial temperature, it is appropriate for controlled clinic and laboratory equipment with fan cooling. Medical system designers should also account for FPGA configuration latency at power-on and use a configuration device capable of fast loading. The FC-FBGA package has a fine ball pitch, so high-density PCB routing with microvias may be needed to connect all 296 I/O to the imaging data converters.
Recomendado
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators often use FPGAs for high-speed parallel data acquisition, trigger logic, and pattern generation. The EP3SL70F484C4 offers 67,500 logic elements and 296 user I/O pins, allowing direct connection to waveform ADCs, pattern memory, and display controllers. Its 2,699,264 RAM bits support acquisition buffers and sequencing tables. The C4 speed bin is adequate for many mid-range instruments, while a C2 variant remains a drop-in upgrade on the same PCB. Instrument designers should design a stable 1.1 V core power plane to minimize jitter on clock distribution and use enough bypass capacitance for peak current during simultaneous I/O switching. Because the FPGA is SRAM-based, every instrument boot must load its measurement personality from external configuration memory, which also enables field upgrades of the instrument logic.
Recomendado
FPGA Prototyping and Lab Platform
The EP3SL70F484C4 is a strong choice for FPGA prototyping boards because the 484-ball FC-FBGA package is easier to route than larger 1152-ball parts while still providing 296 I/O. With 67,500 logic elements and 2,699,264 RAM bits, a designer can prototype a custom ASIC data path, implement a soft-core system, or test a video processing algorithm. The availability of multiple drop-in speed-grade variants on the same footprint means a single prototype PCB can support C4, C3, and C2 versions. Lab platforms should expose the FPGA's JTAG pins for instant configuration and debugging. A common design guideline is to place test points on all power rails, especially the 1.1 V core supply, and to include a configuration device header so different bitstreams can be loaded from either JTAG or on-board flash during bring-up.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL70F484C4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SL70F484C4N | EP3SL70F484C3G | EP3SL70F484C3 | EP3SL70F484C2N | EP3SL70F484C2G | EP3SL70F484C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA |
| Logic Elements/Cells | 67500 | 67500 | 67500 | 67500 | 67500 | 67500 | 67500 |
| Total RAM Bits | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade Ordering | C4 | C4 | C3 | C3 | C2 | C2 | C2 |
| Operating Temperature Range | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
Principais diferenciais
- One F484 package allows cost and performance tuning without PCB change (vs EP3SL70F484C2 / EP3SL70F484C2G)
- Verified marketplace inventory and price point (vs EP3SL70F484C2)
- Commercial Stratix III L density with 296 I/O
Notas de projeto
Estimated: The EP3SL70F484C4 core supply is listed as 1.1 V on a 65 nm process. Provide a clean low-impedance 1.1 V plane with multiple decoupling capacitors near the BGA ball field, and use separate linear regulators or DC-DC modules for each I/O bank supply. Exact current depends on logic utilization, clock frequency, and I/O loading; if using a switching regulator, keep ripple below the FPGA's recommended power supply limits specified in the Stratix III power management documentation.
Because Stratix III FPGAs are SRAM-based, they lose their configuration when power is removed. Always include an external EPCS/SPI configuration device or design a JTAG host to load the bitstream after every power-on reset. The EP3SL70F484C4 datasheet and configuration user guide describe the active serial and JTAG modes. Do not confuse the C4 commercial speed-bin variant with an industrial-temperature part if the end system must operate below 0°C.
The 484-ball FC-FBGA package must be routed with controlled-impedance traces for high-speed differential and single-ended interfaces. Use a four-layer or higher stackup with dedicated power/ground planes. Place the FPGA close to external memories to minimize trace delay and crosstalk. For high pin-count BGA routing, use dog-bone fanout vias with appropriate drill sizes and check the Intel/Altera pin connection guidelines before generating the final netlist.
Estimated: A 65 nm, 1.1 V core FPGA can dissipate several watts under high utilization, but exact power depends on LUT usage, toggling rates, and I/O standards. The FC-FBGA package requires airflow or a heatsink if junction temperature exceeds the manufacturer's recommended limit. Use an FPGA power estimator spreadsheet during design to determine the thermal solution. The commercial 0°C to 85°C specification applies to the device; board-level local heating above 85°C must be avoided.
Informações de conformidade
Distributor snippets describe the part as LEAD FREE, FBGA-484. No explicit RoHS/REACH certificate was found in the verified web data. The Altera N and G suffix variants are commonly used for lead-free ordering, but target C4 lead-free status should be confirmed against the manufacturer datasheet/order code before compliance-critical use.