EP3SL70F484C4 - Stratix III L FPGA 67500 LE | Intel
部品番号: EP3SL70F484C4 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $869.92 | $869.92 |
| 10 | $850 | $8,500.00 |
| 100 | $820 | $82,000.00 |
| 500 | $800 | $400,000.00 |
| 1,000 | $780 | $780,000.00 |
EP3SL70F484C4 概要
An FPGA is an integrated circuit whose logic fabric can be configured after manufacturing, allowing engineers to implement custom digital logic without committing to an ASIC. FPGAs sit within the programmable logic device hierarchy below ASICs but above simple CPLDs. The EP3SL70F484C4 forms part of the Stratix III L family and is optimized for general-purpose logic from wireline access equipment to broadcast video processing.
Key features of the EP3SL70F484C4 include 67,500 logic elements for mid-density systems, 2,699,264 RAM bits for buffering and data storage, and 296 user I/O pins that can interface to multiple single-ended and differential signaling standards. The 484-ball FC-FBGA package provides a compact footprint while still exposing enough I/O for wide parallel buses, DDR memories, and external commodity interfaces. Distributor listings report this device as lead-free, and FPGAkey records a 1.1 V core supply voltage on a 65 nm process.
Although this part has no embedded high-speed serializer/deserializer transceivers in the logic-only L configuration, its logic density, embedded memory, and I/O count make it effective for controller, bridging, preprocessing, and protocol handling tasks. The C4 ordering bin in the Altera/Intel nomenclature denotes a commercial-temperature, speed-grade-sorted variant used for lower-cost applications where the higher speed grade is not required.
Typical applications include indoor telecom/network line cards, broadcast video processing chains, industrial automation controllers, medical imaging preprocessing, test and measurement instruments, and FPGA prototyping platforms. The 0°C to 85°C commercial temperature range is suitable for indoor, climate-controlled equipment but not for unheated automotive or extended-ambient deployments.
When using EP3SL70F484C4, designers must remember that an FPGA is volatile: configuration must be loaded from an external EPCS/SPI flash or through JTAG on every power-up. Power supply decoupling on the 1.1 V core rail and per-bank I/O supplies is essential for stable timing closure and reliable programming.
This page synthesizes distributor pricing, stock data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet. It is intended for engineers comparing EP3SL70F484C4 with other 484-ball Stratix III L derivatives before PCB layout and procurement.
ドロップイン代替品: EP3SL70F484C4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EP3SL70F484C4 （同一形状・フットプリント） — 相違点: Speed Grade, Operating Temperature, Package, Family, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
EP3SL70F484C4N
✅ ドロップイン✓ 在庫あり
$580 / 個
データシートを見る →EP3SL70F484C3G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$985 / 個
データシートを見る →EP3SL70F484C3
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$810 / 個
データシートを見る →EP3SL70F484C2N
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$149.5 / 個
データシートを見る →EP3SL70F484C2G
✅ ドロップイン ⚠️ 仕様未検証✓ 在庫あり
$240 / 個
データシートを見る →EP3SL70F484C2
✅ ドロップイン✓ 在庫あり
$980 / 個
データシートを見る →EP3SL70F484C4 最大定格＆電気的特性
| Manufacturer | Intel (Altera) |
| Series | Stratix III L |
| Device Type | FPGA |
| Number of Logic Elements/Cells | 67500 |
| Total RAM Bits | 2699264 |
| Number of User I/O | 296 |
| Number of Terminations | 484 |
| パッケージ / ケース | 484-BBGA, FCBGA |
| Package Shape | Square |
| Terminal Form | BALL |
| Core Supply Voltage | 1.1 V |
| Technology Node | 65 nm |
| Internal Frequency (marketplace listing) | 800 MHz |
| 動作温度範囲 | 0°C to 85°C |
| Packaging | Tray |
| 湿気感度レベル（MSL） | 3 (168 Hours) |
| Lead-Free Status | Lead Free |
EP3SL70F484C4 square ピン配置ガイド
EP3SL70F484C4 (square パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EP3SL70F484C4.
詳細は データシート をご参照ください。
主な用途
EP3SL70F484C4 の用途: 6 件s: Telecom Line Card and Access Equipment, Broadcast Video Processing, Industrial Automation Controllers, Medical Imaging Preprocessing, Test and Measurement Instrumentation, FPGA Prototyping and Lab Platform.
Telecom Line Card and Access Equipment
The EP3SL70F484C4 is well suited to indoor telecom line cards where 67,500 logic elements, 296 user I/O, and 2,699,264 RAM bits provide enough fabric for packet framing, FIFO buffering, and parallel bus conversion. Its 484-ball FC-FBGA package supports compact boards in central-office and enterprise equipment. The commercial 0°C to 85°C range fits controlled indoor environments. Typical use places the FPGA between a network processor, backplane parallel bus, and commodity memory devices. The Stratix III L architecture performs medium-complexity state machines and buffering without needing embedded transceivers. Configuration should be held in an external EPCS/SPI flash so the logic is loaded automatically after power-up. With 296 I/O, engineers can allocate banks for LVCMOS, LVTTL, or differential standards, while the 1.1 V core supply simplifies power-tree budgeting compared with older 1.5 V FPGAs.
おすすめ
Broadcast Video Processing
Broadcast video pipelines require parallel pixel processing, line buffers, and custom timing logic. The EP3SL70F484C4 provides 67,500 logic elements and 2,699,264 bits of RAM, which are practical for SDI ancillary data insertion, frame synchronization, and multi-format video conversion before dedicated ASICs or encoder devices. The 296 user I/O can connect to external FIFOs, DDR SDRAM controllers, and video serializer devices using bank-specific reference voltages. Because the FPGA is commercial-grade, it is ideal on studio cards with active cooling. The C4 speed bin is often sufficient for standard-definition and high-definition video rates, especially when the data path is parallel and pipelined. Designers placing the FC-FBGA device on a video processing board should use careful BGA fanout and keep the 1.1 V core plane clean to ensure reliable configuration and timing convergence.
おすすめ
Industrial Automation Controllers
Industrial controllers often need deterministic logic, flexible I/O expansion, and custom fieldbus bridging. The EP3SL70F484C4 supports this with 67,500 logic elements for PID loops, motion profiles, and protocol state machines. Its 296 I/O pins can interface to industrial transceivers for PROFIBUS, Ethernet, and parallel sensor arrays. The commercial grade is suitable only for climate-controlled cabinets; for outdoor or -40°C environments the industrial I variant would be preferred. A major advantage of this Intel/Altera device is the reuse of the same F484 layout across multiple speed-grade parts, which allows a controller manufacturer to qualify one PCB and later tune cost or performance by selecting C4, C3G, or C2G variants. Power and thermal design should include a 1.1 V core rail with adequate decoupling and airflow, especially when the FPGA drives many high-speed output banks.
おすすめ
Medical Imaging Preprocessing
Medical ultrasound and diagnostic imaging systems benefit from the EP3SL70F484C4's ability to perform parallel processing on raw image data before the main DSP or CPU. Its 67,500 logic elements can implement front-end filtering, beamforming ancillary control, and digital gain corrections, while the 2,699,264 RAM bits supply line and frame buffers. The 296 user I/O allow connection to multichannel ADC arrays, external SDRAM, and imaging processors. Since the device is commercial temperature, it is appropriate for controlled clinic and laboratory equipment with fan cooling. Medical system designers should also account for FPGA configuration latency at power-on and use a configuration device capable of fast loading. The FC-FBGA package has a fine ball pitch, so high-density PCB routing with microvias may be needed to connect all 296 I/O to the imaging data converters.
おすすめ
Test and Measurement Instrumentation
Oscilloscopes, logic analyzers, and signal generators often use FPGAs for high-speed parallel data acquisition, trigger logic, and pattern generation. The EP3SL70F484C4 offers 67,500 logic elements and 296 user I/O pins, allowing direct connection to waveform ADCs, pattern memory, and display controllers. Its 2,699,264 RAM bits support acquisition buffers and sequencing tables. The C4 speed bin is adequate for many mid-range instruments, while a C2 variant remains a drop-in upgrade on the same PCB. Instrument designers should design a stable 1.1 V core power plane to minimize jitter on clock distribution and use enough bypass capacitance for peak current during simultaneous I/O switching. Because the FPGA is SRAM-based, every instrument boot must load its measurement personality from external configuration memory, which also enables field upgrades of the instrument logic.
おすすめ
FPGA Prototyping and Lab Platform
The EP3SL70F484C4 is a strong choice for FPGA prototyping boards because the 484-ball FC-FBGA package is easier to route than larger 1152-ball parts while still providing 296 I/O. With 67,500 logic elements and 2,699,264 RAM bits, a designer can prototype a custom ASIC data path, implement a soft-core system, or test a video processing algorithm. The availability of multiple drop-in speed-grade variants on the same footprint means a single prototype PCB can support C4, C3, and C2 versions. Lab platforms should expose the FPGA's JTAG pins for instant configuration and debugging. A common design guideline is to place test points on all power rails, especially the 1.1 V core supply, and to include a configuration device header so different bitstreams can be loaded from either JTAG or on-board flash during bring-up.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EP3SL70F484C4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EP3SL70F484C4N | EP3SL70F484C3G | EP3SL70F484C3 | EP3SL70F484C2N | EP3SL70F484C2G | EP3SL70F484C2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA | 484-BBGA, FCBGA |
| Logic Elements/Cells | 67500 | 67500 | 67500 | 67500 | 67500 | 67500 | 67500 |
| Total RAM Bits | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 | 2699264 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade Ordering | C4 | C4 | C3 | C3 | C2 | C2 | C2 |
| Operating Temperature Range | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
主な差別化要因
- One F484 package allows cost and performance tuning without PCB change （vs EP3SL70F484C2 / EP3SL70F484C2G)
- Verified marketplace inventory and price point （vs EP3SL70F484C2)
- Commercial Stratix III L density with 296 I/O
設計ノート
Estimated: The EP3SL70F484C4 core supply is listed as 1.1 V on a 65 nm process. Provide a clean low-impedance 1.1 V plane with multiple decoupling capacitors near the BGA ball field, and use separate linear regulators or DC-DC modules for each I/O bank supply. Exact current depends on logic utilization, clock frequency, and I/O loading; if using a switching regulator, keep ripple below the FPGA's recommended power supply limits specified in the Stratix III power management documentation.
Because Stratix III FPGAs are SRAM-based, they lose their configuration when power is removed. Always include an external EPCS/SPI configuration device or design a JTAG host to load the bitstream after every power-on reset. The EP3SL70F484C4 datasheet and configuration user guide describe the active serial and JTAG modes. Do not confuse the C4 commercial speed-bin variant with an industrial-temperature part if the end system must operate below 0°C.
The 484-ball FC-FBGA package must be routed with controlled-impedance traces for high-speed differential and single-ended interfaces. Use a four-layer or higher stackup with dedicated power/ground planes. Place the FPGA close to external memories to minimize trace delay and crosstalk. For high pin-count BGA routing, use dog-bone fanout vias with appropriate drill sizes and check the Intel/Altera pin connection guidelines before generating the final netlist.
Estimated: A 65 nm, 1.1 V core FPGA can dissipate several watts under high utilization, but exact power depends on LUT usage, toggling rates, and I/O standards. The FC-FBGA package requires airflow or a heatsink if junction temperature exceeds the manufacturer's recommended limit. Use an FPGA power estimator spreadsheet during design to determine the thermal solution. The commercial 0°C to 85°C specification applies to the device; board-level local heating above 85°C must be avoided.
コンプライアンス情報
Distributor snippets describe the part as LEAD FREE, FBGA-484. No explicit RoHS/REACH certificate was found in the verified web data. The Altera N and G suffix variants are commonly used for lead-free ordering, but target C4 lead-free status should be confirmed against the manufacturer datasheet/order code before compliance-critical use.