EP4CE40F23I7 - 39.6K Logic Elements, 484-FBGA Cyclone IV FPGA | Intel
N.º da peça: EP4CE40F23I7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128.5 | $1.285,00 |
| 100 | $109 | $10.900,00 |
| 500 | $92.75 | $46.375,00 |
| 1.000 | $78.4 | $78.400,00 |
EP4CE40F23I7 Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the broader semiconductor hierarchy as a digital IC. Unlike an ASIC, an FPGA's logic fabric is configured after manufacturing via SRAM-based configuration memory. FPGAs integrate programmable logic elements, configurable interconnect, dedicated hardware blocks (DSP, BRAM, PLLs), and I/O serdes into a single die, occupying the role of a hardware accelerator, glue-logic aggregator, and rapid-prototyping platform in modern digital systems.
Key features of the EP4CE40F23I7 include 113,560 total RAM bits distributed across M9K blocks, 116 embedded 18x18 multipliers for DSP workloads, four general-purpose PLLs for clock synthesis, and support for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device is fabricated on a low-power 60 nm process that delivers an attractive performance-per-watt envelope versus earlier Cyclone generations.
Architecturally, the Cyclone IV E family uses a logic-element (LE) based fabric where each LE contains a 4-input LUT, a programmable register, and carry-chain logic. Distributed M9K memory blocks (9 Kbit each) provide on-chip data storage for FIFOs, buffers, and shift registers, while 18x18 multipliers enable single-cycle DSP operations. The four PLLs support dynamic phase shifting and reconfigurable clock synthesis, and the periphery contains LVDS-capable I/O pairs for high-speed source-synchronous interfaces.
Typical applications for the EP4CE40F23I7 span industrial motor control and factory automation, video processing and broadcast equipment, telecom line cards, automotive driver-assistance prototypes, medical imaging, and cost-sensitive ASIC replacement in mid-volume designs. The combination of logic density, on-chip memory, and DSP blocks positions this device as a versatile mid-density platform.
Designers should plan PCB layout to the 1.0 mm BGA pitch, route at least four layers with a solid ground plane under the package, and provide clean 1.2 V/2.5 V/3.3 V rails with bulk decoupling adjacent to the device. Quartus Prime or Quartus II software is required for synthesis, place-and-route, and bitstream generation; JTAG or Active Serial configuration memory loads the SRAM-based configuration on power-up.
This page synthesizes distributor pricing, drop-in alternative SKUs, and practical PCB/design guidance not found in the bare manufacturer datasheet - giving component buyers, hardware engineers, and FPGA developers a single decision-ready reference.
Alternativas drop-in para EP4CE40F23I7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE40F23I7 (mesmo formato e footprint) — diferindo em Package, Configuration Modes, Process Technology, Core Voltage, Embedded Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE40F23I7N
✅ Drop-In✓ Em estoque
$52.75 / unidade
Ver ficha técnica →EP4CE40F23C7N
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EP4CE40F23C8N
✅ Drop-In✓ Em estoque
$52.85 / unidade
Ver ficha técnica →EP4CE40F23C9LN
✅ Drop-In✓ Em estoque
$69 / unidade
Ver ficha técnica →EP4CE40F23C8
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$54.8 / unidade
Ver ficha técnica →EP4CE40F23C8N7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$112.85 / unidade
Ver ficha técnica →EP4CE40F23I7 Classificações máximas e características elétricas
| Family | Cyclone IV E |
| Device | EP4CE40 |
| Logic Elements | 39,600 |
| Logic Array Blocks (LABs) | 2,475 |
| Total RAM Bits | 113,560 |
| Embedded 18x18 Multipliers | 116 |
| PLLs | 4 |
| Maximum User I/O Pins | 328 |
| Maximum Operating Frequency | 472.5 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 60 nm |
| Encapsulamento | FBGA-484 (23x23 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (industrial) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP4CE40F23I7 fbga-484 (23x23 mm, 1.0 mm pitch)
Configuração de pinos para EP4CE40F23I7 (pacote fbga-484 (23x23 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4CE40F23I7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4CE40F23I7 é adequado para 6 aplicaçãos: Industrial Motor Control and Factory Automation, Video Processing and Image Pipeline, Telecom Line Cards and Network Appliances, ASIC Replacement for Mid-Volume Designs, Automotive Driver-Assistance Prototyping, Medical Imaging and Diagnostic Equipment.
Industrial Motor Control and Factory Automation
The EP4CE40F23I7's 39,600 logic elements and 116 embedded 18x18 multipliers make it ideal for industrial motor control and factory-automation controllers that demand deterministic loop times under 10 us. Its 4 PLLs generate multi-axis PWM frequencies for servo drives, while the 328 user I/Os handle quadrature encoder inputs, Hall-sensor feedback, and isolated SPI links to gate drivers. The industrial -40C to +100C temperature rating ensures reliable operation in sealed cabinets and outdoor enclosures. Compared with a microcontroller-only solution, the FPGA offloads field-oriented control math, freeing the MCU for communication and supervisory logic. Industrial designers use Cyclone IV E for stepper, BLDC, and PMSM servo drives where the device's 472.5 MHz internal frequency and dedicated multiplier blocks deliver torque-ripple reduction without an external DSP.
Recomendado
Video Processing and Image Pipeline
The EP4CE40F23I7 supports real-time video processing pipelines by leveraging its M9K memory blocks for line buffering and frame storage, while the 116 18x18 multipliers accelerate convolution kernels for edge detection, scaling, and color-space conversion. The 328 I/Os accept parallel BT.656 / BT.1120 or MIPI-style inputs via LVDS pairs, and 4 PLLs synthesize pixel clocks at exact broadcast rates (27 MHz, 74.25 MHz, 148.5 MHz). At 472.5 MHz internal fabric, the device sustains 1080p60 processing for surveillance encoders, multi-camera surveillance DVRs, and broadcast glue logic. The 60 nm low-power process keeps thermal envelopes manageable in fanless video appliances, and the FBGA-484 package supports fine-pitch PCB routing for compact chassis.
Recomendado
Telecom Line Cards and Network Appliances
The EP4CE40F23I7 functions as a low-cost traffic manager in telecom line cards, network switches, and protocol-bridging appliances. Its 113,560 bits of on-chip RAM implement deep packet buffers, while LVDS I/O pairs support up to 1 Gbps source-synchronous links to PHY chips. The 4 PLLs derive independent clock domains for uplink, downlink, and management interfaces, and the 39,600 LE fabric absorbs custom packet-classification, encryption-acceleration hooks, and pseudo-wire encapsulation glue logic. Telecom customers choose Cyclone IV E over larger FPGAs because its power envelope fits PoE-class budgets, and the FBGA-484 (23x23 mm) footprint suits ATCA / AdvancedTCA mezzanine layouts.
Recomendado
ASIC Replacement for Mid-Volume Designs
The EP4CE40F23I7 is widely used to replace mid-complexity ASICs in production volumes of 1k-100k units where NRE costs are prohibitive. With 39,600 LEs, 116 multipliers, and 113,560 RAM bits, the device absorbs glue-logic, custom state machines, peripheral bridges, and pre-processing DSP that previously required a custom ASIC. Its SRAM-based configuration supports field upgrades via JTAG, an attractive feature for industrial customers needing in-situ firmware updates. Designers prototype in Cyclone IV E, then migrate to a structured ASIC or HardCopy IV for cost-down, keeping the same RTL across both flows.
Recomendado
Automotive Driver-Assistance Prototyping
The EP4CE40F23I7 is used in pre-production ADAS (Advanced Driver Assistance Systems) prototypes, where its 39,600 LEs prototype sensor-fusion logic for camera, radar, and ultrasonic inputs. The industrial -40C to +100C temperature range and 116 dedicated multipliers accelerate convolution networks running on raw sensor streams, while 328 user I/Os aggregate LVDS camera data, CAN-FD vehicle bus, and Ethernet PHY interfaces. Production ADAS modules migrate to qualified automotive FPGAs (Cyclone IV GX or Cyclone V) once the prototype design is validated - the EP4CE40F23I7 serves as the development vehicle. Designers use it for surround-view stitching, lane-detection preprocessing, and ECU glue logic.
Recomendado
Medical Imaging and Diagnostic Equipment
The EP4CE40F23I7 supports medical imaging front-ends, including ultrasound beamformers, patient-monitoring gateways, and portable diagnostic equipment. Its 116 18x18 multipliers implement real-time beamforming math for phased-array transducers, while the 113,560 RAM bits buffer raw RF sample streams before DMA to host processors. The 4 PLLs derive precise sample clocks for ADC capture, and the 328 I/Os aggregate LVDS ADC outputs, SPI control, and USB/Ethernet host links. The low 60 nm power process enables fanless portable designs such as handheld ultrasound scanners where thermal envelope and battery life are critical. The industrial temperature grade supports hospital and field-deployment environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE40F23I7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE40F23I7N | EP4CE40F23C7N | EP4CE40F23C8N | EP4CE40F23C9LN | EP4CE40F23C8 | EP4CE40F23C8N7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Total RAM Bits | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 | 113,560 |
| Multipliers (18x18) | 116 | 116 | 116 | 116 | 116 | 116 | 116 |
| User I/Os | 328 | 328 | 328 | 328 | 328 | 328 | 328 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | Extended |
| Speed Grade | C7 (Industrial) | C7 (Industrial) | C7 (Commercial) | C8 (Commercial) | C9L (Industrial) | C8 (Commercial) | C8 (Extended) |
Principais diferenciais
- Largest Cyclone IV E in the FBGA-484 family (vs EP4CE30F29I7N)
- Industrial temperature grade for harsh environments (vs EP4CE40F23C7N)
- Higher operating margin via C7 speed grade (vs EP4CE40F23C9LN)
Notas de projeto
The FBGA-484 (1.0 mm pitch) demands a 4+ layer PCB with a continuous ground plane directly beneath the package. Use microvia-in-pad or stacked-via construction to escape the BGA; dog-bone fan-out is impractical at 1.0 mm pitch. Provide at least 6 GND balls distributed across the BGA and stitch them to the inner ground plane with 8-10 mil thermal vias each. Estimated: assuming 4-layer stack-up with 1 oz copper, target plane impedance is 50 ohm +/-10% for single-ended routes.
Cyclone IV E requires 3 separate power rails: VCCINT (1.2 V core), VCCIO (1.2/1.5/1.8/2.5/3.0/3.3 V I/O bank voltage), and VCCA (2.5 V PLL analog). Bulk-decouple each rail with 47-100 uF tantalum or polymer caps adjacent to the package, plus 0.1 uF + 10 nF ceramic caps at every power pin. Estimated: idle power consumption for a fully utilized EP4CE40 is roughly 0.5-1 W, peaking near 2 W during high-utilization operation - design thermal budget accordingly.
Do not apply power until all rails are stable; Cyclone IV E is sensitive to VCCINT/VCCIO sequencing violations. Always include a configuration memory (EPCS16/EPCQ16) on the board for non-volatile storage, or the FPGA will lose its design on every power cycle. Confirm JTAG chain integrity before first power-up to recover from programming errors. Most board bring-up failures trace to incorrect JTAG pull-ups or missing nCONFIG/nSTATUS pull-up resistors.
Informações de conformidade
RoHS and lead-free compliant per Intel product page. AEC-Q100 not qualified - not suitable for production automotive safety applications. For production automotive, use AEC-Q100-qualified Cyclone IV or Cyclone V variants.
