EP4CE40F23C8N - Cyclone IV E FPGA, 39.6K LE, 484-FBGA | Intel
N.º da peça: EP4CE40F23C8N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $73.2 | $732,00 |
| 100 | $65.4 | $6.540,00 |
| 500 | $58.1 | $29.050,00 |
| 1.000 | $52.85 | $52.850,00 |
EP4CE40F23C8N Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device whose interconnect and function blocks can be configured after manufacture by loading a bitstream into SRAM-based configuration memory. Within the broader semiconductor taxonomy, FPGAs sit above CPLDs (Complex Programmable Logic Devices) in logic capacity and below ASICs in per-unit cost. The Cyclone IV E sub-family belongs to the low-cost, non-transceiver branch of the Cyclone IV family, sharing the same Quartus Prime design environment as Cyclone IV GX parts.
Key features include 4 PLLs for clock synthesis, 66 embedded 18x18 multipliers supporting DSP operations, 1,161 Kbit of M9K block RAM, and support for external memory interfaces such as DDR, DDR2, and QDR II SRAM. User I/O voltages are programmable to 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, and LVDS, with 8 I/O banks for flexible mixed-voltage interfacing.
The 484-ball FBGA package provides a 1.0 mm ball pitch suitable for multilayer PCB fabrication with standard reflow profiles. Configuration options include JTAG, Active Serial (AS), and Passive Serial (PS) modes using a serial configuration flash or download cable.
Typical applications include industrial motor control, video processing bridges, LED display controllers, and protocol bridging between legacy and modern interfaces. The part is also well-suited for prototyping ASIC functionality, machine vision preprocessing, and embedded soft-processor cores such as Nios II.
When designing with this part, ensure the PCB supports the 1.0 mm BGA pitch with microvia or via-in-pad fabrication, and provision decoupling close to each bank supply. Configuration mode selection at MSEL pins must match the selected boot source, otherwise the device will fail to configure.
This page synthesizes Cyclone IV E specifications, drop-in alternatives with the same FBGA-484 footprint, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para EP4CE40F23C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE40F23C8N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Configuration Modes, Embedded Memory, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE40F23C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EP4CE40F23C6N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$76.8 / unidade
Ver ficha técnica →EP4CE40F23A7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$118.4 / unidade
Ver ficha técnica →EP4CE55F23C8N
✅ Drop-In✓ Em estoque
$74 / unidade
Ver ficha técnica →EP4CE30F23C8N
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →EP4CE40F23I7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.75 / unidade
Ver ficha técnica →EP4CE40F23C8N Classificações máximas e características elétricas
| Family | Cyclone IV E |
| Logic Elements | 39,600 |
| Logic Array Blocks (LABs) | 2,475 |
| Embedded Memory | 1,134 Kbit (M9K blocks) |
| Embedded 18x18 Multipliers | 66 |
| PLLs | 4 |
| Maximum User I/O | 328 |
| User I/O Banks | 8 |
| Core Voltage | 1.2 V |
| Maximum Operating Frequency | 200 MHz |
| Process Technology | 60 nm low-power |
| Encapsulamento | 484-ball FBGA (FineLine BGA), 1.0 mm pitch |
| Tipo de montagem | Surface Mount (BGA) |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Temperatura de operação | 0C to +85C (commercial) |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Guia de Configuração de Pinos do EP4CE40F23C8N 484-ball fbga (fineline bga), 1.0 mm pitch
Configuração de pinos para EP4CE40F23C8N (pacote 484-ball fbga (fineline bga), 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4CE40F23C8N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4CE40F23C8N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Processing Bridge, LED Display Controller, Protocol Bridging (Legacy/Modern Interfaces), ASIC Prototyping, Embedded Soft-Processor (Nios II) Systems.
Industrial Motor Control
The EP4CE40F23C8N is well-suited for industrial motor control designs combining PWM generation, encoder feedback decoding, and current sensing in a single FPGA. Its 39,600 logic elements provide capacity for 3-phase space-vector PWM, FOC algorithms, and dual-axis position loops. The 66 embedded 18x18 multipliers handle Park/Clarke transforms and PI controllers at typical 10-20 kHz control loop rates. The 4 PLLs generate precise switching frequencies from a single crystal, while the 8 I/O banks interface to 3.3 V logic, 5 V signals through level shifters, and differential encoder inputs.
Recomendado
Video Processing Bridge
The EP4CE40F23C8N's 1,134 Kbit embedded M9K memory and 328 user I/Os make it suitable for video format conversion between parallel RGB, LVDS, and CSI-2 interfaces. The M9K blocks serve as line buffers for scaling and deinterlacing at 720p/1080p resolutions, while the LVDS-capable I/O banks accept high-speed serializer/deserializer inputs. Quartus Prime's VIP (Video and Image Processing) suite supports common operations including color space conversion and frame rate conversion. The 484-FBGA package provides sufficient I/O for dual-input, dual-output video router designs.
Recomendado
LED Display Controller
The EP4CE40F23C8N drives large LED video walls by combining high I/O count with deep memory buffers. Each LED driver channel can be mapped to a dedicated pin in the 328 user I/O, and the M9K memory blocks hold scan-line data for refresh. The 66 DSP multipliers handle gamma correction and color-space conversion per pixel, while the 4 PLLs drive multiple scan-rate clocks from a common reference. The Cyclone IV E fabric runs at 200 MHz, sufficient for 16-bit color at 60 Hz refresh across 64 million pixels.
Recomendado
Protocol Bridging (Legacy/Modern Interfaces)
The EP4CE40F23C8N bridges legacy industrial protocols (RS-485, CAN, SPI, I2C, UART) to modern interfaces (Ethernet, USB, PCIe soft IP) through Quartus Prime reference designs. Its 39,600 LEs handle multiple protocol stacks concurrently, and the 1,134 Kbit embedded memory buffers protocol frames during forwarding. The 8 I/O banks support multiple voltage domains (1.2 V to 3.3 V) for connecting legacy 5 V interfaces via simple resistor dividers. Industrial temperature variants (EP4CE-A7N suffix) operate from -40C to +125C for factory-floor deployment.
Recomendado
ASIC Prototyping
The EP4CE40F23C8N serves as a low-cost ASIC prototype platform before committing to mask sets, allowing RTL development and verification in real hardware. Its 39,600 LEs map directly to ASIC gates at typical 4:1 to 6:1 ratio, while the 484-FBGA package exposes all signals for logic analyzer probing. The 1,134 Kbit M9K memory emulates SRAM blocks, and the 66 multipliers verify DSP blocks. Quartus Prime supports incremental compilation, enabling partial bitstream updates during prototype iteration without full re-compilation cycles.
Recomendado
Embedded Soft-Processor (Nios II) Systems
The EP4CE40F23C8N hosts Altera's Nios II soft-core processor for embedded control applications requiring custom peripherals. A Nios II/f core consumes approximately 1,800 LEs, leaving ample capacity for custom peripherals and accelerators in the remaining 37,800 LEs. The 4 PLLs generate processor and peripheral clocks from a common reference, while the 328 user I/Os connect to external memories, sensors, and actuators. The 1,134 Kbit M9K memory holds RTOS data structures and DMA buffers, with external SDRAM supported through the dedicated memory interfaces.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE40F23C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE40F23C7N | EP4CE40F23C6N | EP4CE40F23A7N | EP4CE55F23C8N | EP4CE30F23C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (1.0 mm pitch) | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same | 484-FBGA (1.0 mm pitch) - same |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 55,560 | 28,848 |
| Embedded Memory (Kbit) | 1,134 | 1,134 | 1,134 | 1,134 | 2,340 | 594 |
| Multipliers (18x18) | 66 | 66 | 66 | 66 | 156 | 66 |
| Maximum User I/O | 328 | 328 | 328 | 328 | 328 | 328 |
| Speed Grade | 8 (commercial) | 7 (faster) | 6 (fastest) | 7 (automotive) | 8 | 8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +125C (automotive) | 0C to +85C | 0C to +85C |
Principais diferenciais
- Higher logic capacity at same 484-FBGA footprint (vs EP4CE30F23C8N)
- Commercial temperature grade for cost-sensitive applications (vs EP4CE40F23A7N)
- Speed grade 8 cost optimization (vs EP4CE40F23C6N)
Notas de projeto
The 484-FBGA package uses a 1.0 mm ball pitch and requires multilayer PCB fabrication with microvia or via-in-pad technology. Standard 4-layer FR4 with 1 oz copper is acceptable for most applications, but designs with high-speed LVDS signaling benefit from 6 or 8 layers with dedicated ground planes. Use a balanced ball escape routing pattern to avoid via congestion, and verify the PCB fabrication house supports 1.0 mm pitch BGA assembly with X-ray inspection for production volumes.
The EP4CE40F23C8N requires separate VCCINT (1.2 V core) and VCCPLL (PLL analog) supplies, plus per-bank VCCIO supplies programmable to 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Place 0.1 uF and 10 uF decoupling capacitors within 5 mm of each supply pin, and use a power-on-reset circuit to sequence VCCINT before VCCIO ramps. Inrush current during configuration can reach 1 A - size the regulator accordingly with bulk capacitance.
Configuration mode selection at MSEL pins (MSEL[2:0]) must match the selected boot mode (AS, PS, JTAG) - otherwise the device will fail to configure and remain in high-impedance. Verify the MSEL pull-up/pull-down resistor network matches the Cyclone IV Device Handbook reference for your chosen configuration mode. For AS mode, ensure the serial configuration flash is rated for the device's VCCIO voltage.
Estimated: at typical utilization of 60% logic and 50% I/O switching, the EP4CE40F23C8N dissipates approximately 1.0-1.5 W from the 1.2 V core supply alone. The 484-FBGA package provides adequate thermal dissipation via the ground balls and PCB thermal vias. For industrial applications above 70C ambient, provide a thermal pad or copper flood on inner layers. Do not rely on junction-temperature derating alone - design for worst-case ambient.
LVDS signaling on the EP4CE40F23C8N requires 100-ohm differential impedance matched traces, with the receiver inputs biased through the internal 100-ohm termination enabled via Quartus Prime assignments. Place LVDS traces on inner stripline layers with continuous ground reference for EMI control. For DDR/DDR2 memory interfaces, follow the Cyclone IV External Memory Interfaces Handbook for PCB layout, including read/write deskew calibration in Quartus Prime.
Informações de conformidade
RoHS compliant and lead-free per Intel/Altera product page. For automotive applications requiring AEC-Q100, choose the EP4CE40F23A7N variant. Cyclone IV E family is non-automotive qualified in the standard -C8N speed grade.
