EP4SE230F35I4NAD - 230K Logic Elements Stratix IV E FPGA | Intel
N.º da peça: EP4SE230F35I4NAD ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3850 | $3.850,00 |
| 10 | $3680 | $36.800,00 |
| 100 | $3450 | $345.000,00 |
| 500 | $3220 | $1.610.000,00 |
| 1.000 | $2990 | $2.990.000,00 |
EP4SE230F35I4NAD Visão geral
A field-programmable gate array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, dedicated hardware multipliers, block RAM, and high-speed serial transceivers. FPGAs sit in the wider hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> system-on-chip (SoC) FPGAs, and they parallelize critical datapath operations far beyond what a general-purpose microcontroller or DSP processor can achieve, while also integrating hardware peripherals such as PCIe hard IP, memory controllers, and serializer/deserializer (SerDes) channels.
Key features of the EP4SE230F35I4NAD include 8-input adaptive logic modules (ALMs), dedicated 18x18 multipliers, 9-Kbit and 144-Kbit embedded memory blocks, 8.5 Gbps transceivers (per Stratix IV GT family), and DSP blocks operating at up to 600 MHz. The FC-FBGA-1152 package provides a robust flip-chip interconnect for high signal integrity, while a -40C to +100C industrial temperature grade (the "I" suffix) enables deployment in harsh environments and extended-life industrial systems.
In design, the Stratix IV E family uses a partial reconfiguration controller and Quartus II software for synthesis, place-and-route, and timing closure. The 40 nm process and dedicated signal-conditioning circuitry deliver low dynamic power via power-aware compiler features and on-chip voltage scaling, which are critical for ASIC-prototyping and high-density DSP workloads where the device may run near full utilization. The device also includes on-die termination (OCT) for high-speed memory interfaces such as DDR3 and QDRII+.
Typical applications for this part include high-end telecommunications backplane line cards, ASIC prototyping and emulation, military/aerospace signal processing, high-frequency trading accelerators, and broadcast video processing. According to the manufacturer datasheet, the Stratix IV E family is positioned for designers who need the highest logic density combined with transceivers and DSP performance for bandwidth-constrained but computationally intense workloads.
When designing with this FPGA, allocate at least 4 PCB layers for power and ground planes, use controlled-impedance routing for all transceiver lanes, and follow the manufacturer pin connection guidelines for unused I/O, JTAG, and configuration pins. Decoupling the 0.9 V core rail with low-ESR ceramic capacitors directly under the package is essential for power integrity under high switching currents.
This page combines distributor pricing, drop-in compatible alternatives, and design notes that go beyond the manufacturer datasheet, providing a single information gain resource for FPGA selection.
Alternativas drop-in para EP4SE230F35I4NAD — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4SE230F35I4NAD (mesmo formato e footprint) — diferindo em Package, Mounting Type, RoHS Status, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4SE230F35I4N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP4SE230F29I4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2150 / unidade
Ver ficha técnica →EP4S40G2F40I2NAB
✅ Drop-In✓ Em estoque
$3120 / unidade
Ver ficha técnica →EP4S40G2F40I2NAA
✅ Drop-In✓ Em estoque
$2710 / unidade
Ver ficha técnica →EP4CGX150DF31I7NAD
✅ Drop-In✓ Em estoque
$372.4 / unidade
Ver ficha técnica →EP4SE230F35I4NAD Classificações máximas e características elétricas
| Family | Stratix IV E |
| Logic Elements | 228,000 |
| Embedded Memory Bits | 17,544,192 |
| User I/O Pins | 1,288 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Encapsulamento | 1152-BBGA, FCBGA (FC-FBGA) |
| Temperatura de operação | -40C to +100C (industrial) |
| Logic Category | Field Programmable Gate Array (FPGA) |
| Configuration Method | SRAM-based, volatile |
| DSP Blocks | Yes (dedicated 18x18 multipliers) |
| Embedded RAM Blocks | M9K and M144K |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount |
| Pin/Ball Count | 1152 |
Guia de Configuração de Pinos do EP4SE230F35I4NAD 1152-bbga, fcbga (fc-fbga)
Configuração de pinos para EP4SE230F35I4NAD (pacote 1152-bbga, fcbga (fc-fbga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4SE230F35I4NAD.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4SE230F35I4NAD é adequado para 6 aplicaçãos: ASIC Prototyping and Emulation, Telecommunications Backplane Line Cards, High-Performance DSP Signal Processing, High-Frequency Trading Accelerators, Broadcast Video Processing and Encoding, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP4SE230F35I4NAD's 228,000 logic elements and 17.5 Mbit embedded memory make it ideal for ASIC prototyping where the target ASIC must be partitioned into multiple FPGAs. Designers typically use a multi-board setup with JTAG or Ethernet-based configuration to emulate million-gate ASICs for hardware/software co-verification before tape-out. The 40 nm process provides predictable timing closure compared to smaller FPGAs that would otherwise struggle to fit the same workload.
Recomendado
Telecommunications Backplane Line Cards
The EP4SE230F35I4NAD's integrated transceivers and high I/O count (1,288 pins) enable line cards for telecom backplanes that aggregate multiple lower-speed serial links. The FPGA handles packet classification, traffic shaping, and OTN framing while interfacing directly to SFP+ or QSFP modules via the on-die SerDes channels. Industrial temperature grade (-40C to +100C) makes it suitable for outdoor or uncontrolled cabinet deployments.
Recomendado
High-Performance DSP Signal Processing
Dedicated 18x18 multipliers and DSP blocks make the EP4SE230F35I4NAD a strong fit for radar, electronic warfare, and software-defined radio workloads that perform millions of MAC operations per second. The embedded M9K/M144K blocks provide line-rate buffering for FFT windows and digital down-conversion stages. With 228 K logic elements, designers can implement complex algorithms such as polyphase channelizers and adaptive beamforming in a single device.
Recomendado
High-Frequency Trading Accelerators
The EP4SE230F35I4NAD's deterministic latency and parallel hardware multipliers support low-latency trading engines where every nanosecond counts. The FPGA co-processes order book updates and risk checks between market data feed and order routing gateway, achieving sub-microsecond round-trip latency. The industrial temperature grade is preferred because exchange server rooms operate above standard commercial ambient.
Recomendado
Broadcast Video Processing and Encoding
Broadcast video systems use the EP4SE230F35I4NAD to perform real-time 4K video processing, including color space conversion, scaling, and HEVC/H.264 codec acceleration. The abundant embedded memory (17.5 Mbit) enables line buffering and motion estimation for HD/4K streams without external DRAM on every frame. The 1,288 I/O pins support direct connection to multiple camera interfaces and HDMI/SDI bridges.
Recomendado
Military and Aerospace Signal Processing
The EP4SE230F35I4NAD industrial temperature grade and high logic density make it a workhorse for military signal processing, including electronic countermeasures, radar pulse compression, and synthetic aperture radar preprocessing. The device's robust flip-chip package withstands high-vibration environments and provides the thermal performance needed for conduction-cooled chassis. Designers pair it with high-speed ADCs/DACs to build complete RF-to-baseband signal chains.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4SE230F35I4NAD — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4SE230F35I4N | EP4SE230F29I4N | EP4S40G2F40I2NAB | EP4S40G2F40I2NAA | EP4CGX150DF31I7NAD |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 780-BBGA (F29) - verify | 1152-BBGA, FCBGA - same family | 1152-BBGA, FCBGA - same family | 1152-BBGA, FCBGA - same family |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 228,000 | 228,000 (identical) | 228,000 | 40,000 (Stratix IV GT) | 40,000 (Stratix IV GT) | 150,000 (Cyclone IV GX) |
| Family | Stratix IV E | Stratix IV E | Stratix IV E | Stratix IV GT | Stratix IV GT | Cyclone IV GX |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm | 60 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 1.0 V |
| Embedded Memory Bits | 17,544,192 | 17,544,192 (identical) | 17,544,192 | 6,463,872 | 6,463,872 | 8,065,024 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principais diferenciais
- Highest density in the Stratix IV E family for 40 nm ASIC prototyping (vs EP4CGX150DF31I7NAD (Cyclone IV GX))
- Lower-density drop-in alternative exists within same Stratix IV family (vs EP4S40G2F40I2NAB (Stratix IV GT))
- True drop-in variant (EP4SE230F35I4N) preserves identical design with no rework (vs EP4SE230F29I4N (F35 -> F29 package))
Notas de projeto
Estimated: at full Stratix IV E utilization (~80% logic, 100% DSP), the EP4SE230F35I4NAD can dissipate 20-25 W depending on toggle rate. The 1152-ball FC-FBGA package has a typical junction-to-ambient thermal resistance around 12 C/W with proper thermal vias, so a heat spreader or heatsink is required in conduction-cooled or chassis-mounted applications.
Use at least a 12-layer PCB for the FC-FBGA-1152 with dedicated ground and power planes beneath the device. Decoupling requires 0402 ceramic capacitors placed within 100 mil of every power ball, with at least 16 bulk capacitors per supply rail. Maintain 50 ohm controlled impedance on all transceiver differential pairs and route them on the top or bottom layers adjacent to a continuous ground plane.
The 0.9 V core rail must be sequenced after the 1.2 V auxiliary and 2.5 V transceiver supplies using a TI TPS74x01 supervisor or equivalent. According to the Stratix IV E datasheet, each rail must ramp monotonically within 100 ms and the device must hold in reset until all rails are within specification. Reverse sequencing will damage the device.
Do not leave transceiver channel pins floating even when not used - they must be terminated with the recommended AC-coupling capacitor network or DC-coupled per datasheet pin connection guidelines. Unterminated 8.5 Gbps differential pins will emit EMI and degrade adjacent channel signal integrity. Likewise, JTAG TCK should be pulled to logic low when unused to avoid spurious configuration events.
Informações de conformidade
RoHS and REACH compliance confirmed via distributor listings (DigiKey, FPGAkey). AEC-Q100 not applicable to FPGAs. Lead-free ball finish per Intel/Altera datasheet.
