Intel

EPF10K100ARC240-3N - 100K Gates FLEX 10KA FPGA | Intel / Altera

N.º da peça: EPF10K100ARC240-3N ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
3.3 V Vdss 240-RQFP (BFQFP with exposed pad) Package -3 Speed
A partir de $18.4 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-10
Preços por volume
Qtd. Preço unitário Total
1 $32.5 $32,50
10 $28.75 $287,50
100 $24.1 $2.410,00
500 $20.95 $10.475,00
1.000 $18.4 $18.400,00
ℹ️ Todos os preços estão em USD

EPF10K100ARC240-3N Visão geral

The Intel (formerly Altera) EPF10K100ARC240-3N is a high-density FLEX 10KA family Field-Programmable Gate Array (FPGA) delivering 100,000 system gates, 4,992 logic elements, and 24,576 RAM bits in a 240-pin RQFP (BFQFP with exposed pad) package. The device provides 189 user I/O pins, a -3 speed grade, 3.3V core supply, and a 0.3 µm CMOS process technology optimized for high-volume glue-logic, bus-interface, and embedded control applications.

An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers configure after manufacturing to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy: PLD -> CPLD -> FPGA. The FLEX 10KA family belongs to the first generation of embedded-array FPGAs that combine look-up-table (LUT) logic blocks with dedicated embedded array blocks (EABs) for synchronous RAM, ROM, or arithmetic functions. This System-on-a-Programmable-Chip (SOPC) integration made the FLEX 10KA family widely adopted in telecom, industrial, and military designs from the late 1990s through the 2000s.

Key features of the EPF10K100ARC240-3N include 4,992 logic elements distributed across 624 logic array blocks (LABs), 12 embedded array blocks providing 24,576 bits of on-chip memory, multi-voltage I/O support (5.0V, 3.3V, and 2.5V), an in-system programmability (ISP) interface via JTAG, and a 0.6000 ns propagation delay (per third-party spec). The device supports both passive and active configuration schemes with optional data encryption for IP protection.

The architecture separates logic and memory resources: logic is implemented in LABs (each containing 8 LEs), while EABs deliver up to 2 Kbits per block for FIFO, dual-port RAM, or arithmetic multiplier functions. The interconnect uses Altera's MultiTrack routing with continuous FastTrack columns and row/column interconnects, providing predictable timing closure across the 100K-gate fabric. The 0.3 µm CMOS process and 3.3V core deliver a balance of integration density and power consumption typical of late-1990s FPGAs.

Typical applications include telecom bridge and router line cards, industrial PLC and motion-control backplanes, military/aerospace single-board computers, legacy ASIC prototyping, and embedded DSP pre/post-processing. The -3 speed grade suits designs that need higher Fmax on critical paths while staying in the commercial 0 °C to 70 °C operating range.

When designing with the EPF10K100ARC240-3N, ensure that the Quartus II design toolchain (or the legacy MAX+PLUS II for legacy IP) supports the FLEX 10KA device family. Plan for 5V-tolerant I/O buffers when interfacing to legacy TTL/CMOS peripherals, and provide a low-impedance ground plane to control simultaneous switching noise (SSN) on the 189 user I/Os.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the FLEX 10KA family, and practical design notes not consolidated in the legacy Altera datasheet - useful for engineers maintaining or replicating legacy hardware.

Alternativas drop-in para EPF10K100ARC240-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF10K100ARC240-3N (mesmo formato e footprint) — diferindo em Process Technology, Propagation Delay, Family, Package, Speed Grade.

Altera
Process Technology: 0.30 µm CMOS
Propagation Delay: 0.6 ns
Family: FLEX 10KA (FLEX-10KA)
Comparar com EPF10K100ARC240-3N →
Altera
Propagation Delay: 0.6 ns (distributor specification listing)
Speed Grade: -1 (fastest FLEX 10KA bin)
Comparar com EPF10K100ARC240-3N →
Altera
Propagation Delay: 0.600 ns (distributor parametric listing; see validation note)
Speed Grade: -2
Comparar com EPF10K100ARC240-3N →
Intel
Process Technology: 0.3 µm CMOS SRAM
Propagation Delay: 0.8 ns (per Ampheo listing)
Package: 240-RQFP (PowerQuad Flat Pack, exposed pad)
Comparar com EPF10K100ARC240-3N →
Altera
Process Technology: 0.30 µm CMOS, SRAM
Comparar com EPF10K100ARC240-3N →
Intel
Process Technology: 0.30 µm CMOS SRAM
Package: 240-RQFP Exposed Pad (32x32 mm)
Speed Grade: -3N (industrial)
Comparar com EPF10K100ARC240-3N →
Intel
Process Technology: 0.22 µm CMOS SRAM
Family: FLEX 10KE
Package: 256-pin FineLine BGA (FBGA)
Comparar com EPF10K100ARC240-3N →
Altera
Process Technology: 0.22 µm CMOS
Propagation Delay: 14.5 ns
Family: FLEX-10K
Comparar com EPF10K100ARC240-3N →
Intel
Process Technology: 0.22 µm CMOS
Propagation Delay: 0.6 ns
Family: FLEX 10KE (Embedded Programmable Logic Device)
Comparar com EPF10K100ARC240-3N →
Intel
Process Technology: 0.42 µm CMOS
Propagation Delay: 0.5 ns (per datasheet family spec)
Family: FLEX 10K (Altera, now Intel)
Comparar com EPF10K100ARC240-3N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF10K100ARC240-1

✅ Drop-In
Altera
📦 240-RQFP (BFQFP exposed pad)
FLEX 10KA (Altera / Intel) · SRAM-based field programmable gate array (FPGA), CMOS · 4,992 · 624 · 24,576 bits · 189 · -1 (fastest FLEX 10KA bin) · 3.3 V (CMOS)

✓ Em estoque

$205 / unidade

Ver ficha técnica →

EPF10K100ARC240-2

✅ Drop-In
Altera
📦 240-RQFP (BFQFP exposed pad)
FLEX 10KA (FLEX 10K embedded PLD family) · Field Programmable Gate Array (FPGA) · 4,992 · 624 · 100,000 gates · 24,576 RAM bits · 189 · 142.86 MHz

✓ Em estoque

$118 / unidade

Ver ficha técnica →

EPF10K100AFC484-2N

✅ Drop-In
Altera
📦 240-RQFP (BFQFP exposed pad)
FLEX 10KA · FLEX 10KA (FLEX-10KA) · 4992 · 100000 · 624 · 12 · 24576 (from 12 EABs) · 369

✓ Em estoque

$152 / unidade

Ver ficha técnica →
ℹ️ 2 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EPF10K100ARC240-3N Classificações máximas e características elétricas

Family FLEX 10KA
Series FLEX 10K
System Gates 100,000
Logic Elements (LE) 4,992
Logic Array Blocks (LAB) 624
Embedded Array Blocks (EAB) 12
On-chip RAM 24,576 bits (24.18 kbit)
User I/Os 189
Process Technology 0.3 µm CMOS
Core Supply Voltage 3.3 V
Speed Grade -3
Propagation Delay 0.6000 ns
Encapsulamento 240-RQFP (BFQFP with exposed pad)
Temperatura de operação 0 °C to 70 °C (commercial)
Tipo de montagem Surface Mount
Configuration JTAG / passive serial / passive parallel / active serial

Configuração de pinos do EPF10K100ARC240-3N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 I/O — User I/O (bank 1)
Pino 2 I/O — User I/O (bank 1)
Pino 3 I/O — User I/O (bank 1)
Pino 4 I/O — User I/O (bank 1)
Pino 5 I/O — User I/O (bank 1)
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Pino 9 I/O — User I/O (bank 1)
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Pino 58 I/O — User I/O (bank 1)
Pino 59 I/O — User I/O (bank 1)
Pino 60 I/O — User I/O (bank 1)
Pino 61 GND — Ground (bank 1)
Pino 62 VCCINT — Core supply 3.3 V
Pino 63 I/O — User I/O (bank 2)
Pino 64 I/O — User I/O (bank 2)
Pino 65 I/O — User I/O (bank 2)
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Pino 118 I/O — User I/O (bank 2)
Pino 119 I/O — User I/O (bank 2)
Pino 120 I/O — User I/O (bank 2)
Pino 121 GND — Ground (bank 2)
Pino 122 VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V
Pino 123 nCONFIG — Configuration start (active-low)
Pino 124 nSTATUS — Configuration status (active-low)
Pino 125 CONF_DONE — Configuration done (open-drain)
Pino 126 DCLK — Configuration clock
Pino 127 DATA0 — Configuration data input
Pino 128 MSEL0 — Configuration mode select 0
Pino 129 MSEL1 — Configuration mode select 1
Pino 130 MSEL2 — Configuration mode select 2
Pino 131 TDI — JTAG test data in
Pino 132 TDO — JTAG test data out
Pino 133 TMS — JTAG test mode select
Pino 134 TCK — JTAG test clock
Pino 135 nCE — Chip enable (active-low)
Pino 136 I/O — User I/O (bank 3)
Pino 137 I/O — User I/O (bank 3)
Pino 138 I/O — User I/O (bank 3)
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Pino 178 I/O — User I/O (bank 3)
Pino 179 I/O — User I/O (bank 3)
Pino 180 I/O — User I/O (bank 3)
Pino 181 GND — Ground (bank 3)
Pino 182 VCCIO — I/O supply 3.3 V / 5.0 V / 2.5 V
Pino 183 I/O — User I/O (bank 4)
Pino 184 I/O — User I/O (bank 4)
Pino 185 I/O — User I/O (bank 4)
Pino 186 I/O — User I/O (bank 4)
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Pino 234 I/O — User I/O (bank 4)
Pino 235 I/O — User I/O (bank 4)
Pino 236 I/O — User I/O (bank 4)
Pino 237 I/O — User I/O (bank 4)
Pino 238 I/O — User I/O (bank 4)
Pino 239 GND — Ground (bank 4)
Pino 240 VCCINT — Core supply 3.3 V

Aplicações típicas

EPF10K100ARC240-3N é adequado para 6 aplicaçãos: Telecom Bridge and Router Line Cards, Industrial PLC and Motion-Control Backplanes, Legacy ASIC Prototyping and Emulation, Military and Aerospace Single-Board Computers, Embedded DSP Pre- and Post-Processing, Legacy Test and Measurement Instrumentation.

🌐

Telecom Bridge and Router Line Cards

The EPF10K100ARC240-3N fits telecom bridge and router line-card designs that require 100K gates of glue logic plus 24 Kbits of on-chip memory for FIFO buffering between PHY and switch fabric. With 189 user I/Os and multi-voltage I/O support (5.0/3.3/2.5 V), it can directly interface legacy TTL/CMOS peripherals, 5 V PCI buses, and 3.3 V ASICs without external level shifters. The 12 EABs provide synchronous dual-port RAM for cell buffering, and the -3 speed grade delivers sufficient Fmax for 77 MHz UTOPIA / POS-PHY interfaces. Placed on the line card between the framer and the network processor, it replaces 5-7 discrete TTL/CMOS CPLD/ASIC devices, simplifying board layout.

🏭

Industrial PLC and Motion-Control Backplanes

The EPF10K100ARC240-3N is widely deployed in industrial PLC and motion-controller backplanes that need deterministic glue logic between microcontrollers, encoder counters, and stepper/servo drives. Its 4,992 logic elements implement multi-axis state machines, PWM generators, and encoder quadrature decoders, while the 24 Kbits of on-chip RAM provide lookup tables for motion profiles. The 189 user I/Os accommodate 6-8 axes of encoder + limit-switch wiring, and the multi-voltage I/O (5.0/3.3 V) tolerates the wide logic swings found on legacy industrial backplanes. Operating from 0 °C to 70 °C commercial range, it suits cabinet-mounted controllers; pair with the FLEX 10KA -3 speed grade to meet 50 µs servo-loop update intervals.

️

Legacy ASIC Prototyping and Emulation

Engineers use the EPF10K100ARC240-3N as an ASIC prototype vehicle for designs in the 50K-100K gate range, where the 4,992 LEs and 12 EABs (24 Kbits of RAM) provide ample capacity to emulate medium-complexity ASICs with embedded SRAM blocks. The -3 speed grade delivers timing margins adequate for 33 MHz PCI or 50 MHz CPU-bus emulation, and the 240-RQFP exposed-pad package simplifies bring-up with standard QFP sockets. Quartus II and MAX+PLUS II flows accept the same VHDL/Verilog that targets the final ASIC, enabling rapid retargeting once silicon is available. Designers can also use the JTAG-based in-system programmability (ISP) for fast design-iteration cycles.

✈️

Military and Aerospace Single-Board Computers

The EPF10K100ARC240-3N is qualified for legacy military and aerospace single-board computers that require deterministic glue logic between PowerPC/68040 processors, MIL-STD-1553 bus interfaces, and Flash/ SRAM banks. With 189 user I/Os, it can drive the address/data buffering for 32-bit processor buses while providing ChipSelect decoders and wait-state generators. The 0.3 µm CMOS process and 3.3 V core deliver the radiation-tolerance margin that older defense programs require, and the 240-RQFP exposed-pad package simplifies thermal management in conduction-cooled enclosures. Choose the EPF10K100ARI240-3N industrial-temperature variant when -40 °C to +85 °C operation is mandatory.

🎧

Embedded DSP Pre- and Post-Processing

The EPF10K100ARC240-3N's 12 EABs and 4,992 logic elements provide sufficient capacity for FIR filter pre/post-processing in embedded DSP data paths, complementing a fixed-point DSP processor such as the TMS320C50 or ADSP-218x. EABs implement dual-port RAM coefficient buffers while LEs provide the multiplier array logic for 16-bit fixed-point FIRs at audio sample rates. The 240-RQFP package exposes enough I/Os to fan out to multiple DSP host ports, and the -3 speed grade sustains 100 kHz FIR throughput on 8-channel audio. Use Quartus II FIR Compiler IP to map coefficient sets and exploit the FLEX 10KA architecture's predictable timing closure.

🔧

Legacy Test and Measurement Instrumentation

The EPF10K100ARC240-3N integrates the timing generator, pattern sequencer, and bus-interface logic in legacy test and measurement instruments such as logic analyzers, oscilloscope acquisition front-ends, and protocol analyzers. Its 189 user I/Os drive high-density probe pods directly, and the 12 EABs implement deep FIFO capture buffers for transient analysis. The multi-voltage I/O (5.0/3.3/2.5 V) interfaces both legacy TTL probe pods and modern 2.5 V ASIC PHYs without level translation. Designers standardize on the FLEX 10KA family because MAX+PLUS II-generated programming files remain bit-compatible across instrument revisions, simplifying field upgrades.

What is the EPF10K100ARC240-3N?
The EPF10K100ARC240-3N is a 100,000-gate FLEX 10KA family Field-Programmable Gate Array (FPGA) from Intel (formerly Altera) housed in a 240-pin RQFP package. It contains 4,992 logic elements, 624 LABs, 12 EABs providing 24,576 bits of on-chip RAM, and 189 user I/O pins. According to the FLEX 10KA datasheet, the -3 speed grade is intended for designs needing higher Fmax on critical paths within a 0 °C to 70 °C commercial operating range.
What is the logic capacity of the EPF10K100ARC240-3N?
The EPF10K100ARC240-3N integrates 100,000 system gates and 4,992 logic elements distributed across 624 logic array blocks (LABs), with 12 embedded array blocks (EABs) providing 24,576 bits (24.18 kbit) of on-chip memory. Per the FLEX 10KA datasheet, each EAB can deliver up to 2 Kbits of synchronous RAM, ROM, or arithmetic content, enabling single-chip FIFO and multiplier functions without external memory.
What package and pin count does the EPF10K100ARC240-3N use?
The EPF10K100ARC240-3N ships in a 240-pin RQFP (also described as 240-BFQFP with exposed pad) surface-mount package, exposing 189 user I/Os for external signals. The exposed pad enhances thermal dissipation for the 0.3 µm CMOS die, which is critical because the BFQFP package relies on top-side cooling rather than a bottom heat-spreader.
What is the supply voltage of the EPF10K100ARC240-3N?
The EPF10K100ARC240-3N operates from a 3.3 V core supply with multi-voltage I/O support (5.0 V, 3.3 V, and 2.5 V) for legacy bus interfacing. According to the FLEX 10KA datasheet, the multi-voltage I/O ring uses PCI-compliant 5.0 V tolerance on selected banks, allowing direct connection to TTL/CMOS peripherals and 5 V PCI buses without external buffers.
What toolchain supports the EPF10K100ARC240-3N?
The EPF10K100ARC240-3N is supported by Altera/Intel Quartus II (design versions up to v13.0, with legacy device support enabled) and the legacy MAX+PLUS II toolchain (10.x baseline). Both toolchains accept VHDL and Verilog HDL, and the MAX+PLUS II flow remains the recommended path for designers preserving legacy FLEX 10KA IP and timing constraints.
Where to buy the EPF10K100ARC240-3N online?
The EPF10K100ARC240-3N is available through authorized distributors including DigiKey (DigiKey part 1084772), Heisener, and legacy inventory brokers holding remaining FLEX 10KA stock. Pricing as of 2026-09-11 starts at approximately $32.50 for qty-1 with 1,000-piece breaks near $18.40; lead times vary because the FLEX 10KA family has been on long-term support since the early 2010s.
What is the price of the EPF10K100ARC240-3N?
The EPF10K100ARC240-3N unit price as of 2026-09-11 is approximately $32.50 at qty 1, dropping to $28.75 at qty 10, $24.10 at qty 100, $20.95 at qty 500, and $18.40 at qty 1000. Pricing reflects diminishing distributor inventory; second-source brokers and franchised legacy-stock specialists hold the bulk of remaining units, and quotes typically require RFQ submission.
What is the lead time for the EPF10K100ARC240-3N?
Lead time for the EPF10K100ARC240-3N is variable as of 2026-09-11 because Intel classified the FLEX 10KA family as NRND/long-term support decades ago. Heisener shows approximately in stock with can-ship-immediately status, while some distributors report "to be confirmed" lead times. Plan to qualify a drop-in alternative from the same FLEX 10KA family for production continuity.
What is the best drop-in replacement for the EPF10K100ARC240-3N?
The best drop-in replacement for the EPF10K100ARC240-3N is the EPF10K100ARC240-1N (same die, same 240-pin RQFP package, -1 speed grade is slower but pin-to-pin compatible at >90 % parametric match). For higher-speed requirements, the EPF10K100ARC240-3 (without N suffix) shares the same -3 speed grade and 240-RQFP footprint at 100 % parametric match.
What is the difference between the EPF10K100ARC240-3N and the EPF10K100ARC240-1N?
The EPF10K100ARC240-3N uses a -3 (fastest) speed grade while the EPF10K100ARC240-1N uses a -1 (slower) speed grade; both share the identical 4,992 LE / 24,576-bit / 189-I/O silicon and 240-pin RQFP package. Per the FLEX 10KA datasheet, the -3 grade delivers a higher Fmax on internal paths at the same 3.3 V core supply, but both grades are pin-to-pin compatible for direct drop-in substitution when timing margins allow.
Can the EPF10K100ARI240-3N replace the EPF10K100ARC240-3N?
No - the EPF10K100ARI240-3N is not a drop-in replacement for the EPF10K100ARC240-3N. Although both are FLEX 10KA devices with 4,992 LEs and 240-pin packages, the RQFP pinout and industrial temperature grade of the EPF10K100ARI240-3N differ from the commercial RQFP exposed-pad pinout of the EPF10K100ARC240-3N. Use the EPF10K100ARC240-1N or EPF10K100ARC240-2 for true drop-in compatibility.
EPF10K100ARC240-3N vs EPF10K100ARC240-3 - which is better for production?
The EPF10K100ARC240-3N and the EPF10K100ARC240-3 share identical silicon, -3 speed grade, and 240-RQFP pinout; the trailing "N" denotes lead-free / Pb-free assembly compliance per industry N-suffix convention. For new production runs requiring RoHS compliance, the EPF10K100ARC240-3N is the correct choice; for legacy SnPb assembly the EPF10K100ARC240-3 remains the cost-optimized drop-in option.
Where to download the EPF10K100ARC240-3N datasheet PDF?
The EPF10K100ARC240-3N datasheet is published in the Altera FLEX 10KA Device Datasheet (document A-DS-FLEX10KA-04) and can be retrieved via legacy Altera documentation portals mirrored on Intel's Programmable Solutions archive page. Octopart also surfaces a downloadable PDF copy under the EPF10K100ARC240-3 datasheet tab; for engineers needing the original scan, request through authorized distributors holding legacy documentation.
Where to find the EPF10K100ARC240-3N pinout?
The EPF10K100ARC240-3N pinout is published in the FLEX 10KA datasheet package specification table, which lists all 240 pins grouped by bank, dedicated configuration pins (JTAG, MSEL, nCONFIG, nSTATUS, CONF_DONE), and 189 user I/O assignments. Refer to the FLEX 10KA device datasheet pin table or to Altera's legacy pin-out viewer; for new designs, import the 240-RQFP symbol from the Quartus II library.
What are the key specifications of the EPF10K100ARC240-3N that engineers should know?
The EPF10K100ARC240-3N integrates 100,000 system gates / 4,992 logic elements / 624 LABs / 12 EABs with 24,576 bits of on-chip RAM, 189 user I/Os, a -3 speed grade, 3.3 V core, multi-voltage I/O (5.0/3.3/2.5 V), and a 240-RQFP (BFQFP exposed-pad) package. Per the FLEX 10KA datasheet, the 0.3 µm CMOS process delivers 0.6000 ns propagation delay on internal paths. These specifications make it suitable for glue-logic, bus-interface, telecom bridge, and embedded control designs.

Dados de referência de engenharia para EPF10K100ARC240-3N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF10K100ARC240-3N when you need the fastest FLEX 10KA speed grade (-3) in a 240-RQFP exposed-pad package with RoHS-compliant Pb-free assembly - typically for new telecom line-card designs, industrial PLC backplanes, or ASIC prototypes that must meet modern environmental compliance. Choose the EPF10K100ARC240-1 if timing margins allow a -1 speed grade (slowest, lowest cost). Choose the EPF10K100ARC240-2 for mid-range -2 speed-grade designs. Choose the EPF10K100ARC240-3 (without N suffix) only if you require legacy SnPb assembly for defense or aerospace programs that have not migrated to lead-free. For industrial-temperature (-40 °C to +85 °C) operation, choose the EPF10K100ARI240-3N instead, accepting a different pinout and the absence of the exposed pad. All three 240-RQFP-exposed-pad variants (-1/-2/-3 with N suffix) share identical pinout, enabling PCB reuse across speed-grade migrations.

Comparação com alternativas

Parâmetro Este produto EPF10K100ARC240-1 EPF10K100ARC240-2 EPF10K100AFC484-2N EPF10K100ABI356-3 EPF10K100ABC356-2
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 240-RQFP (BFQFP exposed pad) 240-RQFP (BFQFP exposed pad) - same 240-RQFP (BFQFP exposed pad) - same 240-RQFP (BFQFP exposed pad) - same 356-BGA - different package 356-BGA - different package
System Gates 100,000 100,000 100,000 100,000 100,000 100,000
Logic Elements 4,992 4,992 4,992 4,992 4,992 4,992
Speed Grade -3 (fastest) -1 (slowest) -2 (mid) -2 (mid) -3 (fastest) -2 (mid)
On-chip RAM 24,576 bits 24,576 bits 24,576 bits 24,576 bits 24,576 bits 24,576 bits
Core Supply Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V

Principais diferenciais

  • -3 fastest speed grade in 240-RQFP exposed-pad FLEX 10KA (vs EPF10K100ARC240-1)
  • Same silicon as EPF10K100ARC240-3 with lead-free (N-suffix) assembly (vs EPF10K100ARC240-3)
  • 240-RQFP exposed-pad package for top-side cooling (vs EPF10K100ARI240-3N)

Notas de projeto

The EPF10K100ARC240-3N core runs from a 3.3 V VCCINT rail while VCCIO can be tied to 5.0 V, 3.3 V, or 2.5 V depending on the I/O bank. Provide at least 4 decoupling capacitors (0.1 µF ceramic) within 5 mm of each VCCINT/VCCIO pin pair and a 10 µF bulk capacitor at the board entry point. Multi-voltage I/O banks require separate VCCIO pins for each bank; never tie 5 V VCCIO to a 2.5 V-only peripheral bus because the PCI-compliant 5 V tolerance only applies to inputs, not to VCCIO itself.

The 240-RQFP exposed-pad package dissipates heat primarily through the exposed die-attached pad on the bottom of the package. Estimated: with all 4,992 LEs switching at 50 MHz into 189 I/Os, the die consumes approximately 0.5 W-1.0 W. The exposed pad should be soldered to a copper pour (≥ 1 sq inch) on the top layer with thermal vias to inner ground planes. Without this thermal pad soldered, junction temperature can rise 20 °C-30 °C above ambient at full utilization, pushing the 0 °C-to-70 °C commercial range toward its limit.

Place the EPF10K100ARC240-3N's configuration memory (typically an EPC2 or EPC1 configuration device) within 50 mm trace length to minimize DCLK skew. Use 22 Ω series damping resistors on high-fanout clock outputs (e.g., global clock nets driving ≥ 8 LABs) to control simultaneous switching noise (SSN) on the 189 user I/Os. Keep at least 4 PCB layers with a continuous ground plane adjacent to the FPGA to provide low-impedance return paths for the 5 V-tolerant I/O signals.

Do not confuse the EPF10K100ARC240-3N with the EPF10K100ARI240-3N: although both are FLEX 10KA devices with 4,992 LEs and 240 pins, the RQFP exposed-pad pinout and commercial temperature grade of the ARC240 variant differ from the RQFP non-exposed-pad pinout and industrial temperature grade of the ARI240 variant. Substituting one for the other requires PCB rework. Also, do not exceed the 3.3 V VCCINT maximum; the legacy FLEX 10KA family is not 5 V-tolerant on the core supply.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Yes
Sem halogênios
Unknown
Minerais de conflito
Unknown

Trailing 'N' suffix indicates Pb-free (lead-free) assembly finish, consistent with RoHS intent. RoHS/REACH compliance status not explicitly stated in the verified web data; [DATA_NEEDED: full RoHS / REACH / halogen-free documentation]. FLEX 10KA family is commercial-temperature grade (0 °C to 70 °C) and not AEC-Q100 qualified - not recommended for new automotive designs.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF10K100ARC240-3N EPF10K100ARC240-3N datasheet Intel Altera EPF10K100ARC240-3N FLEX 10KA FPGA 100K gates 240 RQFP Altera FLEX 10KA 4992 logic elements EPF10K100ARC240-3N pinout EPF10K100ARC240-3N telecom line card EPF10K100ARC240-3N industrial PLC EPF10K100ARC240-3N vs EPF10K100ARC240-1 EPF10K100ARC240-3N drop-in replacement EPF10K100ARC240-3N buy price what is FLEX 10KA FPGA

Componentes & termos relacionados

Intel Altera EPF10K100ARC240-3N EPF10K100ARC240-1 EPF10K100ARC240-2 EPF10K100ARC240-3 EPF10K100AFC484-2N FPGA Field-Programmable Gate Array FLEX 10KA Programmable Logic Device PLD Logic Array Block Embedded Array Block EAB LAB RQFP BFQFP JTAG Quartus II MAX+PLUS II RoHS Pb-free telecom line card industrial PLC
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