EPF10K100ARI240-3N - 100K-Gate FLEX 10KA FPGA, 240-RQFP | Intel
N.º da peça: EPF10K100ARI240-3N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128.5 | $1.285,00 |
| 100 | $112.75 | $11.275,00 |
| 500 | $98.2 | $49.100,00 |
| 1.000 | $86.4 | $86.400,00 |
EPF10K100ARI240-3N Visão geral
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable logic device whose logic fabric, routing, and I/O cells can be configured by the end user via a hardware description language such as VHDL or Verilog. Within the broader taxonomy of integrated circuits, FPGAs sit between CPLDs (smaller, non-volatile) and ASICs (custom-silicon, high NRE). The FLEX 10KA family was the industry's first embedded programmable logic family, providing System-on-a-Programmable-Chip (SOPC) integration by combining an embedded array block (EAB) for megafunctions and memory with a logic array block (LAB) fabric. The EPF10K100A is the largest-density member of the family.
Key features of the EPF10K100ARI240-3N include MultiVolt I/O (supporting 2.5 V, 3.3 V, and 5.0 V interface levels on a per-pin basis via VCCIO), PCI-compliant clamping diodes with slew-rate control, individual open-drain output options, and dedicated global clock networks. The embedded array blocks deliver efficient on-chip memory, typically configured as 4,096-bit RAM per EAB. Combined with 624 LABs, the device supports up to 125 MHz internal operation and approximately 100,000 typical gates (4,992 logic elements).
Typical applications include glue logic and bus bridging in industrial controllers, telecommunications backplane interfaces, PCI bridge prototyping, and legacy system refresh designs where the FLEX 10KA silicon is already qualified. The RQFP-240 footprint has been in continuous production since the late 1990s, and Intel/Altera continues to ship the part for long-lifecycle programs in medical, defense, and industrial automation.
When designing with this FPGA, allocate adequate decoupling (100 µF bulk + 0.1 µF per VCC/VCCIO pin pair) and a minimum of four-layer PCB with dedicated power and ground planes. Use the Quartus II 13.0sp1 (the final version supporting FLEX 10KA) for design entry and ACEX 1K / FLEX 10K device programming via ByteBlasterMV or a compatible JTAG cable.
This page synthesizes distributor pricing, FLEX 10KA drop-in alternatives, and practical legacy-design notes not consolidated in the original manufacturer datasheet, helping engineers plan both new designs and long-term maintenance of installed bases.
Alternativas drop-in para EPF10K100ARI240-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K100ARI240-3N (mesmo formato e footprint) — diferindo em Speed Grade, Process Technology, Operating Temperature, Propagation Delay, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K100ARI240-3
✅ Drop-In✓ Em estoque
$61.75 / unidade
Ver ficha técnica →EPF10K100ARC240-3N
✅ Drop-In✓ Em estoque
$18.4 / unidade
Ver ficha técnica →EPF10K100ARC240-1N
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K100ARC240-2
✅ Drop-In✓ Em estoque
$118 / unidade
Ver ficha técnica →EPF10K100ARC240-1
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →EPF10K100ARC240-2N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EPF10K100ARI240-3N Classificações máximas e características elétricas
| Family | FLEX 10KA |
| Logic Elements / Cells | 4,992 |
| Typical Gate Count | 100,000 gates |
| Embedded RAM Bits | 24,576 bits |
| Logic Array Blocks (LABs) | 624 |
| User I/Os | 189 |
| Encapsulamento | 240-RQFP Exposed Pad (32x32 mm) |
| Pins | 240 |
| Propagation Delay (tpd) | 0.6 ns |
| Maximum Internal Frequency | 125 MHz |
| Process Technology | 0.30 µm CMOS SRAM |
| Supply Voltage (VCCINT) | 3.3 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Temperatura de operação | -40 °C to +85 °C (Industrial) |
| Speed Grade | -3N (industrial) |
| Tipo de montagem | Surface Mount (RQFP, gull-wing) |
Configuração de pinos do EPF10K100ARI240-3N
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | VCCINT — Core supply 3.3 V |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | TDI — JTAG Test Data In |
| Pino 15 | TMS — JTAG Test Mode Select |
| Pino 16 | TCK — JTAG Test Clock |
| Pino 17 | nSTATUS — Configuration status (open-drain) |
| Pino 18 | nCONFIG — Configuration control (active-low) |
| Pino 19 | CONF_DONE — Configuration done (open-drain) |
| Pino 20 | DCLK — Configuration clock |
| Pino 21 | DATA0 — Configuration data input |
| Pino 22 | VCCIO — I/O supply (bank 1) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 2) |
| Pino 28 | VCCIO — I/O supply (bank 2) |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | I/O — User I/O (bank 2) |
| Pino 32 | GND — Ground |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | VCCINT — Core supply 3.3 V |
| Pino 37 | I/O — User I/O (bank 2) |
| Pino 38 | I/O — User I/O (bank 3) |
| Pino 39 | I/O — User I/O (bank 3) |
| Pino 40 | I/O — User I/O (bank 3) |
| Pino 41 | GND — Ground |
| Pino 42 | I/O — User I/O (bank 3) |
| Pino 43 | I/O — User I/O (bank 3) |
| Pino 44 | VCCIO — I/O supply (bank 3) |
| Pino 45 | I/O — User I/O (bank 3) |
| Pino 46 | I/O — User I/O (bank 3) |
| Pino 47 | I/O — User I/O (bank 3) |
| Pino 48 | I/O — User I/O (bank 3) |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O (bank 3) |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 3) |
| Pino 53 | I/O — User I/O (bank 3) |
| Pino 54 | VCCINT — Core supply 3.3 V |
| Pino 55 | I/O — User I/O (bank 4) |
| Pino 56 | I/O — User I/O (bank 4) |
| Pino 57 | I/O — User I/O (bank 4) |
| Pino 58 | GND — Ground |
| Pino 59 | I/O — User I/O (bank 4) |
| Pino 60 | I/O — User I/O (bank 4) |
| Pino 61 | VCCIO — I/O supply (bank 4) |
| Pino 62 | I/O — User I/O (bank 4) |
| Pino 63 | I/O — User I/O (bank 4) |
| Pino 64 | I/O — User I/O (bank 4) |
| Pino 65 | I/O — User I/O (bank 4) |
| Pino 66 | GND — Ground |
| Pino 67 | I/O — User I/O (bank 4) |
| Pino 68 | I/O — User I/O (bank 4) |
| Pino 69 | I/O — User I/O (bank 4) |
| Pino 70 | I/O — User I/O (bank 4) |
| Pino 71 | VCCINT — Core supply 3.3 V |
| Pino 72 | I/O — User I/O (bank 5) |
| Pino 73 | I/O — User I/O (bank 5) |
| Pino 74 | I/O — User I/O (bank 5) |
| Pino 75 | GND — Ground |
| Pino 76 | I/O — User I/O (bank 5) |
| Pino 77 | I/O — User I/O (bank 5) |
| Pino 78 | VCCIO — I/O supply (bank 5) |
| Pino 79 | I/O — User I/O (bank 5) |
| Pino 80 | I/O — User I/O (bank 5) |
| Pino 81 | I/O — User I/O (bank 5) |
| Pino 82 | I/O — User I/O (bank 5) |
| Pino 83 | GND — Ground |
| Pino 84 | I/O — User I/O (bank 5) |
| Pino 85 | I/O — User I/O (bank 5) |
| Pino 86 | I/O — User I/O (bank 5) |
| Pino 87 | I/O — User I/O (bank 5) |
| Pino 88 | VCCINT — Core supply 3.3 V |
| Pino 89 | I/O — User I/O (bank 6) |
| Pino 90 | I/O — User I/O (bank 6) |
| Pino 91 | GND — Ground |
| Pino 92 | I/O — User I/O (bank 6) |
| Pino 93 | I/O — User I/O (bank 6) |
| Pino 94 | VCCIO — I/O supply (bank 6) |
| Pino 95 | I/O — User I/O (bank 6) |
| Pino 96 | I/O — User I/O (bank 6) |
| Pino 97 | I/O — User I/O (bank 6) |
| Pino 98 | I/O — User I/O (bank 6) |
| Pino 99 | GND — Ground |
| Pino 100 | I/O — User I/O (bank 6) |
| Pino 101 | I/O — User I/O (bank 6) |
| Pino 102 | I/O — User I/O (bank 6) |
| Pino 103 | I/O — User I/O (bank 6) |
| Pino 104 | VCCINT — Core supply 3.3 V |
| Pino 105 | I/O — User I/O (bank 7) |
| Pino 106 | I/O — User I/O (bank 7) |
| Pino 107 | GND — Ground |
| Pino 108 | I/O — User I/O (bank 7) |
| Pino 109 | I/O — User I/O (bank 7) |
| Pino 110 | VCCIO — I/O supply (bank 7) |
| Pino 111 | I/O — User I/O (bank 7) |
| Pino 112 | I/O — User I/O (bank 7) |
| Pino 113 | I/O — User I/O (bank 7) |
| Pino 114 | GND — Ground |
| Pino 115 | I/O — User I/O (bank 7) |
| Pino 116 | I/O — User I/O (bank 7) |
| Pino 117 | I/O — User I/O (bank 7) |
| Pino 118 | I/O — User I/O (bank 7) |
| Pino 119 | VCCINT — Core supply 3.3 V |
| Pino 120 | I/O — User I/O (bank 8) |
| Pino 121 | I/O — User I/O (bank 8) |
| Pino 122 | GND — Ground |
| Pino 123 | I/O — User I/O (bank 8) |
| Pino 124 | I/O — User I/O (bank 8) |
| Pino 125 | VCCIO — I/O supply (bank 8) |
| Pino 126 | I/O — User I/O (bank 8) |
| Pino 127 | I/O — User I/O (bank 8) |
| Pino 128 | I/O — User I/O (bank 8) |
| Pino 129 | I/O — User I/O (bank 8) |
| Pino 130 | GND — Ground |
| Pino 131 | I/O — User I/O (bank 8) |
| Pino 132 | I/O — User I/O (bank 8) |
| Pino 133 | I/O — User I/O (bank 8) |
| Pino 134 | I/O — User I/O (bank 8) |
| Pino 135 | VCCINT — Core supply 3.3 V |
| Pino 136 | I/O — User I/O (bank 1) |
| Pino 137 | GND — Ground |
| Pino 138 | I/O — User I/O (bank 1) |
| Pino 139 | I/O — User I/O (bank 1) |
| Pino 140 | VCCIO — I/O supply (bank 1) |
| Pino 141 | I/O — User I/O (bank 1) |
| Pino 142 | I/O — User I/O (bank 1) |
| Pino 143 | I/O — User I/O (bank 1) |
| Pino 144 | I/O — User I/O (bank 1) |
| Pino 145 | GND — Ground |
| Pino 146 | I/O — User I/O (bank 1) |
| Pino 147 | I/O — User I/O (bank 1) |
| Pino 148 | I/O — User I/O (bank 1) |
| Pino 149 | I/O — User I/O (bank 1) |
| Pino 150 | VCCINT — Core supply 3.3 V |
| Pino 151 | I/O — User I/O (bank 2) |
| Pino 152 | I/O — User I/O (bank 2) |
| Pino 153 | I/O — User I/O (bank 2) |
| Pino 154 | GND — Ground |
| Pino 155 | I/O — User I/O (bank 2) |
| Pino 156 | I/O — User I/O (bank 2) |
| Pino 157 | VCCIO — I/O supply (bank 2) |
| Pino 158 | I/O — User I/O (bank 2) |
| Pino 159 | I/O — User I/O (bank 2) |
| Pino 160 | I/O — User I/O (bank 2) |
| Pino 161 | I/O — User I/O (bank 2) |
| Pino 162 | GND — Ground |
| Pino 163 | I/O — User I/O (bank 2) |
| Pino 164 | I/O — User I/O (bank 2) |
| Pino 165 | I/O — User I/O (bank 2) |
| Pino 166 | I/O — User I/O (bank 2) |
| Pino 167 | VCCINT — Core supply 3.3 V |
| Pino 168 | I/O — User I/O (bank 3) |
| Pino 169 | I/O — User I/O (bank 3) |
| Pino 170 | I/O — User I/O (bank 3) |
| Pino 171 | GND — Ground |
| Pino 172 | I/O — User I/O (bank 3) |
| Pino 173 | I/O — User I/O (bank 3) |
| Pino 174 | VCCIO — I/O supply (bank 3) |
| Pino 175 | I/O — User I/O (bank 3) |
| Pino 176 | I/O — User I/O (bank 3) |
| Pino 177 | I/O — User I/O (bank 3) |
| Pino 178 | I/O — User I/O (bank 3) |
| Pino 179 | GND — Ground |
| Pino 180 | I/O — User I/O (bank 3) |
| Pino 181 | I/O — User I/O (bank 3) |
| Pino 182 | I/O — User I/O (bank 3) |
| Pino 183 | I/O — User I/O (bank 3) |
| Pino 184 | VCCINT — Core supply 3.3 V |
| Pino 185 | I/O — User I/O (bank 4) |
| Pino 186 | I/O — User I/O (bank 4) |
| Pino 187 | GND — Ground |
| Pino 188 | I/O — User I/O (bank 4) |
| Pino 189 | I/O — User I/O (bank 4) |
| Pino 190 | VCCIO — I/O supply (bank 4) |
| Pino 191 | I/O — User I/O (bank 4) |
| Pino 192 | I/O — User I/O (bank 4) |
| Pino 193 | I/O — User I/O (bank 4) |
| Pino 194 | I/O — User I/O (bank 4) |
| Pino 195 | GND — Ground |
| Pino 196 | I/O — User I/O (bank 4) |
| Pino 197 | I/O — User I/O (bank 4) |
| Pino 198 | I/O — User I/O (bank 4) |
| Pino 199 | I/O — User I/O (bank 4) |
| Pino 200 | VCCINT — Core supply 3.3 V |
| Pino 201 | I/O — User I/O (bank 5) |
| Pino 202 | I/O — User I/O (bank 5) |
| Pino 203 | I/O — User I/O (bank 5) |
| Pino 204 | GND — Ground |
| Pino 205 | I/O — User I/O (bank 5) |
| Pino 206 | I/O — User I/O (bank 5) |
| Pino 207 | VCCIO — I/O supply (bank 5) |
| Pino 208 | I/O — User I/O (bank 5) |
| Pino 209 | I/O — User I/O (bank 5) |
| Pino 210 | I/O — User I/O (bank 5) |
| Pino 211 | I/O — User I/O (bank 5) |
| Pino 212 | GND — Ground |
| Pino 213 | I/O — User I/O (bank 5) |
| Pino 214 | I/O — User I/O (bank 5) |
| Pino 215 | I/O — User I/O (bank 5) |
| Pino 216 | I/O — User I/O (bank 5) |
| Pino 217 | VCCINT — Core supply 3.3 V |
| Pino 218 | I/O — User I/O (bank 6) |
| Pino 219 | I/O — User I/O (bank 6) |
| Pino 220 | GND — Ground |
| Pino 221 | I/O — User I/O (bank 6) |
| Pino 222 | I/O — User I/O (bank 6) |
| Pino 223 | VCCIO — I/O supply (bank 6) |
| Pino 224 | I/O — User I/O (bank 6) |
| Pino 225 | I/O — User I/O (bank 6) |
| Pino 226 | I/O — User I/O (bank 6) |
| Pino 227 | I/O — User I/O (bank 6) |
| Pino 228 | GND — Ground |
| Pino 229 | I/O — User I/O (bank 6) |
| Pino 230 | I/O — User I/O (bank 6) |
| Pino 231 | I/O — User I/O (bank 6) |
| Pino 232 | I/O — User I/O (bank 6) |
| Pino 233 | VCCINT — Core supply 3.3 V |
| Pino 234 | I/O — User I/O (bank 7) |
| Pino 235 | I/O — User I/O (bank 7) |
| Pino 236 | GND — Ground |
| Pino 237 | I/O — User I/O (bank 7) |
| Pino 238 | I/O — User I/O (bank 7) |
| Pino 239 | TDO — JTAG Test Data Out |
| Pino 240 | VCCIO — I/O supply (bank 7/8 reference) |
Aplicações típicas
EPF10K100ARI240-3N é adequado para 6 aplicaçãos: Industrial PLC and Factory Automation Controllers, Telecommunications Backplane Bridging and TDM Multiplexers, PCI Bus Bridge and Industrial PC Add-in Card Designs, Medical Imaging and Diagnostic Equipment Front-End, Defense and Avionics Legacy Avionics Bus Interfaces, Legacy Test and Measurement Instrumentation.
Industrial PLC and Factory Automation Controllers
The EPF10K100ARI240-3N is well-suited for legacy industrial PLC and factory automation controllers where its 100,000-gate capacity, 189 MultiVolt I/Os, and -40 to +85 C industrial temperature range directly match the harsh factory-floor envelope. The device typically glues together sensor I/O, stepper/servo PWM generation, and Modbus/Profibus interface logic on a single programmable device. Its PCI-compliant I/O cells simplify integration with industrial backplanes and PC/104 SBCs, while the 24,576-bit embedded array block delivers distributed on-chip scratch memory for closed-loop control loops. Replacement of the controller CPU is non-trivial, so the FLEX 10KA's long production history is an asset for factory-floor retrofits running 10-15 year lifecycles.
Recomendado
Telecommunications Backplane Bridging and TDM Multiplexers
The EPF10K100ARI240-3N is widely deployed in legacy TDM (T1/E1/DS3) multiplexer and backplane-bridging designs where its 4,992 logic cells and dedicated global clock network deliver deterministic timing for 8.192 Mbps and 16.384 Mbps time-slot interchange fabrics. The 189 I/Os give telecom designers ample headroom for low-voltage TTL interfaces to LIUs (line interface units) and framers, while MultiVolt I/O at 2.5 V, 3.3 V, and 5.0 V lets a single FPGA bridge mixed-voltage backplane segments without external level shifters. Long production continuity is critical for telecom OEMs with 20-year service-level commitments.
Recomendado
PCI Bus Bridge and Industrial PC Add-in Card Designs
The EPF10K100ARI240-3N's PCI-compliant clamping diodes, slew-rate control, and 5 V-tolerant MultiVolt I/O make it an ideal PCI bridge or PCI target device in industrial PC and add-in card designs. Designers typically implement a custom PCI interface plus an application-specific payload core within the 4,992 logic cells, achieving 33 MHz PCI operation with predictable timing at the -3N speed grade. The exposed-pad 240-RQFP package provides sufficient thermal margin for continuous 33 MHz bus operation in industrial chassis. Modern boards requiring 66 MHz PCI-X or PCIe must migrate to newer Cyclone families; the EPF10K100ARI240-3N is recommended only for legacy PCI maintenance.
Recomendado
Medical Imaging and Diagnostic Equipment Front-End
The EPF10K100ARI240-3N fits medical imaging front-ends such as ultrasound beamformers and patient-monitor displays where deterministic, low-noise data acquisition paths matter. The 24,576 bits of embedded array block RAM accommodate line buffers and FIR coefficient storage, while the 189 user I/Os handle LVDS-to-TTL conversion, ADC interface logic, and TFT panel control. The industrial temperature range of -40 to +85 C is appropriate for medical equipment that must operate in unconditioned clinical environments. Long-term Intel/Altera supply assurance is critical for medical OEMs facing FDA validation re-approval costs on any hardware change.
Recomendado
Defense and Avionics Legacy Avionics Bus Interfaces
Defense and avionics platforms frequently embed the EPF10K100ARI240-3N in MIL-STD-1553 and ARINC 429 bus monitor cards, radar signal pre-processors, and ruggedized display controllers. Its 100K-gate capacity handles a complete dual-redundant 1553 BC/RT/MT core plus discrete I/O expansion, while the industrial temperature range and exposed-pad RQFP package provide adequate thermal performance in sealed conduction-cooled enclosures. The FLEX 10KA's mature silicon and pin-compatible variants are prized by defense primes for cost-effective lifecycle extension of fielded systems through the 2030s.
Recomendado
Legacy Test and Measurement Instrumentation
The EPF10K100ARI240-3N appears in bench-top oscilloscopes, logic analyzers, and protocol testers as a pattern generator or trigger sequencer. Its MultiVolt I/O allows direct interfacing to 1.8 V, 3.3 V, and 5 V DUTs without external translation, while the 189 user I/Os provide enough channels to drive parallel fixture pods for boundary-scan or memory test. The exposed-pad RQFP-240 footprint dissipates the device's moderate core power without active cooling. Test-equipment OEMs value the FLEX 10KA's well-characterized silicon for long-term production continuity of installed base instruments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K100ARI240-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K100ARI240-3 | EPF10K100ARC240-3N | EPF10K100ARC240-1N | EPF10K100ARC240-2 | EPF10K100ARC240-1 | EPF10K100ARC240-2N |
|---|---|---|---|---|---|---|---|
| Package | 240-RQFP Exposed Pad (32x32 mm) | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same | 240-RQFP Exposed Pad - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Cells | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| Typical Gates | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Embedded RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Speed Grade | -3 | -3 | -1 (faster) | -1 (faster) | -2 | -1 (faster) | -2 |
| Temperature Range | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | -40 to +85 C (Industrial) | -40 to +85 C (Industrial) | 0 to +70 C (Commercial) | 0 to +70 C (Commercial) | -40 to +85 C (Industrial) |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| VCCINT | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Industrial temperature -3N timing combines harsh-environment operation with cost-effective medium-speed timing (vs EPF10K100ARI240-3)
- Faster -1N speed grade option for timing-critical designs (vs EPF10K100ARC240-3N)
- FLEX 10KA family maturity with Quartus II 13.0sp1 long-term tool support (vs Cyclone series)
Notas de projeto
Estimated: With VCCINT at 3.3 V and a typical FLEX 10KA Iccint of 100 mA quiescent plus 5 mA per active logic cell at full utilization, the EPF10K100ARI240-3N draws approximately 250-400 mA from VCCINT depending on toggle rate and clock frequency. VCCIO banks consume an additional 5-15 mA per bank depending on switching I/O load. Place a 100 uF bulk capacitor within 25 mm of the package and a 0.1 uF ceramic bypass on every VCCINT and VCCIO pin pair. Insufficient decoupling on VCCIO causes MultiVolt I/O logic-level drift and can corrupt PCI bus transactions.
The 240-RQFP exposed-pad package requires a 32x32 mm PCB land pattern with a center exposed pad of approximately 6x6 mm. Solder the exposed pad to a flooded copper pour on the top layer with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) to an internal ground plane. Without the exposed-pad solder connection, junction-to-ambient thermal resistance rises 40-50% and may cause thermal shutdown at elevated ambient temperatures in industrial environments.
Do not connect VCCIO to a voltage greater than 5.0 V or less than 2.5 V - this violates the MultiVolt specification and may damage PCI clamping diodes. Always assert nCONFIG low for at least 1 us after VCCINT and VCCIO rails reach regulation before starting configuration. Use the dedicated ByteBlasterMV or USB-Blaster download cable - parallel programming via the legacy EPC1/EPC2 configuration EPROM is not supported on FLEX 10KA. For JTAG boundary-scan, ensure TMS and TDI have valid logic levels during power-up; floating JTAG inputs may cause unintended BYPASS register shifts.
Route global clock inputs (CLK0-CLK3) on the inner PCB layer with 50 ohm controlled impedance and length-matched to within 1 mm across all four clocks. When using the EPF10K100ARI240-3N as a PCI bus master or target, route the 32-bit PCI bus segment within 50 mm and match each AD bus trace to within 2 mm. Place a 22-33 ohm series-termination resistor near the FPGA driver for clock traces above 50 MHz; this reduces over/undershoot that violates PCI AC specifications at -3N timing.
Informações de conformidade
Compliance status not explicitly stated in verified web data; the FLEX 10KA family predates the EU RoHS Directive 2002/95/EC effective dates and many original data sheets do not declare RoHS. Contact Intel/Altera or authorized distributors for current compliance documentation.