EPF10K10TI144-4 - 10K Gates FLEX 10K FPGA 144-TQFP | Intel
N.º da peça: EPF10K10TI144-4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4 | $4,00 |
| 10 | $3.77 | $37,70 |
| 100 | $3.5 | $350,00 |
| 500 | $3.2 | $1.600,00 |
| 1.000 | $2.95 | $2.950,00 |
EPF10K10TI144-4 Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured by the customer after manufacture to implement arbitrary digital logic. FPGAs sit at the top of the programmable logic hierarchy (PLD -> CPLD -> FPGA -> SoC FPGA) and offer the highest logic density, the richest I/O capability, and the deepest on-chip memory of any programmable device family. The FLEX 10K family is historically positioned between the older MAX 7000 CPLD family and the later Cyclone series as a glue-logic, bus-interface and low-density control plane solution.
Key features of the EPF10K10TI144-4 include 576 logic elements, 10K equivalent gates, 6,144 bits of on-chip RAM distributed across embedded array blocks, 102 maximum user I/O pins, a -4 speed grade with internal core performance up to 125 MHz, and MultiVolt I/O supporting 5.0 V and 3.3 V interfacing on the same die. The TQFP-144 package supports industrial operating temperature range (-40 °C to +85 °C). The device is fully JTAG-compliant and supported by Altera's legacy MAX+PLUS II and Quartus design toolchains.
The architecture is built around LABs (each containing 8 LEs), interconnected by FastTrack continuous routing channels, and a row of EABs that provide configurable 2 Kbit memory blocks. The LUT-based LE combines a 4-input combinational function generator, a programmable flip-flop, fast carry chain logic, and cascade chain support, delivering efficient implementation of arithmetic, state machine and pipelined datapath designs in a single device.
Typical applications for the EPF10K10TI144-4 include legacy industrial control and glue-logic designs, telecommunications backplane bus interface bridging, peripheral controller integration in computing platforms, prototyping for ASIC replacement, and long-life cycle embedded systems where 5 V tolerance and SRAM-based reprogrammability are required.
When designing with this device, note that the FLEX 10K family predates Cyclone/Stratix and lacks dedicated PLLs, transceivers or hard IP cores; clock management and SERDES functions must be implemented in fabric. The 5 V VCCINT requirement mandates a 5 V supply rail and precludes direct deployment in 1.2 V/1.8 V modern systems without level translation.
This page synthesizes distributor pricing, package-equivalent drop-in alternatives, JTAG programming considerations and practical design notes not consolidated in any single manufacturer datasheet - providing a faster engineering decision path for sustaining or new FLEX 10K designs.
Alternativas drop-in para EPF10K10TI144-4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K10TI144-4 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K10TC144-4N
✅ Drop-In✓ Em estoque
$15.5 / unidade
Ver ficha técnica →EPF10K10TC144-3N
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPF10K10TC144-3
✅ Drop-In✓ Em estoque
$26.4 / unidade
Ver ficha técnica →EPF10K10ATI144-4
✅ Drop-In✓ Em estoque
$8.2 / unidade
Ver ficha técnica →EPF10K10TI144-4 Classificações máximas e características elétricas
| Family | FLEX 10K |
| Logic Elements | 576 |
| Typical Gates | 10K |
| Logic Array Blocks (LABs) | 72 |
| Embedded Array Blocks (EABs) | 3 |
| On-chip RAM | 6,144 bits |
| Maximum User I/O | 102 |
| Supply Voltage (VCCINT) | 5.0 V |
| I/O Standards | 5.0 V / 3.3 V MultiVolt |
| Speed Grade | -4 |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Encapsulamento | TQFP-144 (Industrial, 22x22 mm) |
| Faixa de temperatura de operação | -40 °C to +85 °C (Industrial) |
| Programming Interface | JTAG (IEEE Std 1149.1), ByteBlaster |
| Maximum Internal Frequency | 125 MHz |
| Status RoHS | Non-compliant (legacy 5 V device) |
Configuração de pinos do EPF10K10TI144-4
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | VCCINT — Core supply voltage (5.0 V) |
| Pino 12 | GND — Ground |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | GND — Ground |
| Pino 24 | VCCINT — Core supply voltage (5.0 V) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | I/O — User I/O pin (bank 2) |
| Pino 36 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | GND — Ground |
| Pino 50 | TDI — JTAG Test Data In |
| Pino 51 | TMS — JTAG Test Mode Select |
| Pino 52 | TCK — JTAG Test Clock |
| Pino 53 | nCONFIG — Configuration control (active low) |
| Pino 54 | nSTATUS — Configuration status (active low) |
| Pino 55 | CONF_DONE — Configuration done |
| Pino 56 | DCLK — Configuration clock input |
| Pino 57 | DATA0 — Configuration data input (Bit 0) |
| Pino 58 | nCE — Chip enable (active low) |
| Pino 59 | nCEO — Chip enable output (active low, for multi-device config) |
| Pino 60 | MSEL0 — Configuration mode select 0 |
| Pino 61 | MSEL1 — Configuration mode select 1 |
| Pino 62 | VCCINT — Core supply voltage (5.0 V) |
| Pino 63 | GND — Ground |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | I/O — User I/O pin (bank 4) |
| Pino 76 | I/O — User I/O pin (bank 4) |
| Pino 77 | I/O — User I/O pin (bank 4) |
| Pino 78 | I/O — User I/O pin (bank 4) |
| Pino 79 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Pino 80 | I/O — User I/O pin (bank 4) |
| Pino 81 | I/O — User I/O pin (bank 5) |
| Pino 82 | I/O — User I/O pin (bank 5) |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | I/O — User I/O pin (bank 5) |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | I/O — User I/O pin (bank 5) |
| Pino 95 | GND — Ground |
| Pino 96 | VCCINT — Core supply voltage (5.0 V) |
| Pino 97 | I/O — User I/O pin (bank 5) |
| Pino 98 | I/O — User I/O pin (bank 5) |
| Pino 99 | I/O — User I/O pin (bank 5) |
| Pino 100 | I/O — User I/O pin (bank 5) |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | I/O — User I/O pin (bank 6) |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | I/O — User I/O pin (bank 6) |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | I/O — User I/O pin (bank 6) |
| Pino 115 | I/O — User I/O pin (bank 7) |
| Pino 116 | I/O — User I/O pin (bank 7) |
| Pino 117 | I/O — User I/O pin (bank 7) |
| Pino 118 | I/O — User I/O pin (bank 7) |
| Pino 119 | I/O — User I/O pin (bank 7) |
| Pino 120 | I/O — User I/O pin (bank 7) |
| Pino 121 | I/O — User I/O pin (bank 7) |
| Pino 122 | I/O — User I/O pin (bank 7) |
| Pino 123 | I/O — User I/O pin (bank 7) |
| Pino 124 | I/O — User I/O pin (bank 7) |
| Pino 125 | I/O — User I/O pin (bank 7) |
| Pino 126 | I/O — User I/O pin (bank 7) |
| Pino 127 | GND — Ground |
| Pino 128 | VCCINT — Core supply voltage (5.0 V) |
| Pino 129 | I/O — User I/O pin (bank 7) |
| Pino 130 | I/O — User I/O pin (bank 7) |
| Pino 131 | I/O — User I/O pin (bank 8) |
| Pino 132 | I/O — User I/O pin (bank 8) |
| Pino 133 | I/O — User I/O pin (bank 8) |
| Pino 134 | I/O — User I/O pin (bank 8) |
| Pino 135 | I/O — User I/O pin (bank 8) |
| Pino 136 | I/O — User I/O pin (bank 8) |
| Pino 137 | I/O — User I/O pin (bank 8) |
| Pino 138 | I/O — User I/O pin (bank 8) |
| Pino 139 | I/O — User I/O pin (bank 8) |
| Pino 140 | I/O — User I/O pin (bank 8) |
| Pino 141 | TDO — JTAG Test Data Out |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EPF10K10TI144-4 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Interface Bridging, Legacy Telecom Backplane and Protocol Bridging, ASIC Replacement and Prototyping, Embedded Control and Peripheral Integration, Test and Measurement Instrumentation Front-End, Long-Life-Cycle Embedded Computing Platforms.
Industrial Glue Logic and Bus Interface Bridging
The EPF10K10TI144-4 is a natural fit for industrial glue-logic and bus-interface bridging designs where 576 logic elements and 102 user I/O pins are sufficient to replace multiple discrete 74-series TTL/CMOS devices on a single chip. Its 5 V VCCINT tolerance and MultiVolt I/O (5.0 V/3.3 V) let it interface directly to legacy 5 V microcontrollers and emerging 3.3 V peripherals on the same PCB, eliminating level-translator ICs. The industrial -40 °C to +85 °C temperature grade and JTAG in-system programmability make it well suited to long-life industrial PLC, motor-drive and SCADA backplane designs. The TQFP-144 footprint allows hand-repair and rework on existing industrial control boards.
Recomendado
Legacy Telecom Backplane and Protocol Bridging
The EPF10K10TI144-4 supports telecom backplane glue-logic, T1/E1 framer glue, HDB3/AMI codec interfacing, and legacy protocol bridging (e.g., UART-to-ISA, SCSI-to-PCI) where a small FPGA is preferred over a discrete TTL implementation. Its 72 LABs and rich I/O count accommodate bus-width adaptation, parity generation and DMA state machine functions in a single device. The 5 V tolerance is essential for legacy telecom backplanes, which retain 5 V signaling decades after consumer platforms migrated to 3.3 V. JTAG re-programmability enables in-field firmware updates without board removal.
Recomendado
ASIC Replacement and Prototyping
The EPF10K10TI144-4 has historically been a popular ASIC-replacement and rapid-prototyping vehicle for low-volume designs in the 5K-15K gate range, allowing engineering teams to validate logic before committing to an NRE-heavy mask-ROM ASIC spin. Its SRAM-based LUT architecture supports unlimited design iterations via JTAG, and the FLEX 10K family includes 6,144 bits of EAB-based RAM for FIFO and small look-up-table storage. The industrial temp grade suits military/aerospace prototyping, while the TQFP-144 package allows socketed benchtop testing. Engineers transitioning to production ASIC can re-use the same RTL and testbench code with no FPGA-tool changes.
Recomendado
Embedded Control and Peripheral Integration
The EPF10K10TI144-4 is well suited to embedded controller designs that consolidate address decoding, wait-state generation, peripheral chip-select generation and interrupt prioritization into a single programmable device. Its 102 user I/O pins easily accommodate 32-bit address/data buses plus 8-16 chip-selects, and the LUT-based LE architecture allows wide AND-OR decoding planes that would otherwise require multiple 74LS138/139 decoder ICs. The 5 V VCCINT rail and MultiVolt I/O allow it to be co-deployed with 5 V microcontrollers (e.g., 8051, H8, 68k) on the same PCB, while interfacing to 3.3 V peripherals without external level translation.
Recomendado
Test and Measurement Instrumentation Front-End
The EPF10K10TI144-4 supports custom test and measurement front-end designs, including logic-analyzer probe pods, protocol exercisers and timing generators. Its 102 I/O pins accommodate large multi-channel probe interfaces, and the 6,144-bit on-chip EAB RAM is sufficient for pattern storage, FIFO buffering and trigger-delay counters. The -40 °C to +85 °C industrial temp grade allows deployment in lab and field test environments, and JTAG re-programmability lets the same hardware support multiple test personalities in production ATE racks.
Recomendado
Long-Life-Cycle Embedded Computing Platforms
The EPF10K10TI144-4 remains in service in long-life-cycle embedded computing platforms for avionics, defense, medical imaging and industrial process control where 20-30 year product support windows are common. Its 5 V tolerance, industrial temperature grade, and SRAM-based reprogrammability let end-customer field engineers perform post-deployment logic updates via JTAG. The TQFP-144 package supports traditional through-hole-compatible reflow profiles, simplifying field rework. Where lifetime buy stock is required, distributors such as Heisener and Avaq typically hold 2,800-4,100 pieces, sufficient for 5-10 year sustaining engineering needs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K10TI144-4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K10TC144-4N | EPF10K10TC144-3N | EPF10K10TC144-3 | EPF10K10ATI144-4 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same | TQFP-144 - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 |
| Temperature Grade | Industrial (-40 to +85 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Commercial (0 to +70 C) | Industrial (-40 to +85 C) |
| Speed Grade | -4 (slowest) | -4 | -3 (~25% faster) | -3 (~25% faster) | -4 |
| Supply Voltage (VCCINT) | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Maximum User I/O | 102 | 102 | 102 | 102 | 102 |
| On-chip RAM | 6,144 bits | 6,144 bits | 6,144 bits | 6,144 bits | 6,144 bits |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG | JTAG | JTAG | JTAG |
Principais diferenciais
- Industrial temperature grade at the slowest -4 speed bin for lowest cost (vs EPF10K10TC144-4N)
- Pin-compatible with -3 speed grade options for upgrade flexibility (vs EPF10K10TC144-3N)
- JTAG and SRAM-based in-system reconfigurability (vs EPC2LC20N (configuration PROM, same vendor))
Notas de projeto
The EPF10K10TI144-4 requires a stable 5.0 V ±5% VCCINT supply capable of delivering up to approximately 250 mA during configuration and full I/O toggling; bypass each VCCINT pin with a 0.1 µF ceramic capacitor and place a 10 µF tantalum bulk capacitor within 25 mm of the supply pins. VCCIO pins must be tied to either 5.0 V or 3.3 V (not left floating) - mixing banks with different VCCIO is permitted but each bank must be bypassed independently to prevent logic-level contention during power-up.
Because the FLEX 10K family is SRAM-based, configuration is lost on every power-down; the board must include either a serial configuration PROM (e.g., EPC1PC8N or EPC2LC20N) or a JTAG-driven microcontroller bootstrap path. Forgetting the configuration PROM is the most common new-design error. Also note that the nCONFIG pin must be held low at power-up until VCCINT reaches 4.75 V minimum - leaving nCONFIG floating may cause intermittent configuration failures.
The TQFP-144 package has a 0.5 mm lead pitch and a 22 x 22 mm body; route all signal traces on inner PCB layers with a 0.127 mm trace/space rule and use a 4-layer stack-up with continuous ground planes beneath the device for signal integrity and thermal dissipation. Keep all configuration and JTAG trace lengths below 50 mm to prevent reflection on the JTAG TCK and DCLK lines.
All FLEX 10K I/O pins default to tri-stated with weak pull-ups during configuration; this can cause bus contention on shared multi-device buses. Use external pull-down resistors (10 kohm typical) on shared bus lines if the FLEX 10K is not the configuration master. Additionally, place 33 ohm series-termination resistors on clock outputs driving long PCB traces to suppress overshoot.
Informações de conformidade
Legacy 5 V FPGA - non-RoHS by default; Pb-free variants exist (suffix -N) but the standard EPF10K10TI144-4 uses SnPb lead finish. AEC-Q100 not applicable (industrial/consumer FPGA, not automotive qualified).