EPF10K130EQC240-1 - 130K Gates FLEX 10KE FPGA 240-PQFP | Altera
N.º da peça: EPF10K130EQC240-1 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $92.5 | $92.500,00 |
EPF10K130EQC240-1 Visão geral
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs), embedded memory blocks, and programmable interconnect, allowing hardware designers to implement arbitrary digital logic that can be re-programmed in-system. Within the broader taxonomy, the FLEX 10KE sits at the intersection of SRAM-based FPGA and embedded programmable logic, integrating dedicated Embedded Array Blocks (EABs) that provide true dual-port RAM and ROM functions alongside standard LEs - positioning it as one of the first devices to combine ASIC-density gate arrays with FPGA-style programmable interconnect in a single fabric.
Key features of the EPF10K130EQC240-1 include 4 Embedded Array Blocks delivering up to 65536 RAM bits, JTAG-compliant IEEE 1149.1 boundary-scan test support, MultiVolt I/O for interfacing with 2.5 V, 3.3 V, and 5.0 V systems, and in-system programmability via the Altera EPC configuration devices. The PQFP-240 package uses a 32x32 mm body with gull-wing leads, suiting it for prototypes, industrial control cards, and legacy telecom infrastructure where surface-mount fine-pitch BGAs are not required.
Typical applications for this device include industrial machine control, telecommunications line cards, glue-logic integration, legacy ASIC replacement, and embedded DSP co-processing. Designers should pair it with Altera's MAX+PLUS II or Quartus design software for synthesis, place-and-route, and timing analysis. Note that this part is in lifecycle status considered Last Time Buy / Not Recommended for New Designs, so it is best suited for maintenance of existing production systems rather than new platforms.
Alternativas drop-in para EPF10K130EQC240-1 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K130EQC240-1 (mesmo formato e footprint) — diferindo em Total RAM Bits, Operating Temperature, Mounting Type, Family, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K130EQC240-1N
✅ Drop-In✓ Em estoque
$88.4 / unidade
Ver ficha técnica →EPF10K130EQC240-3
✅ Drop-In✓ Em estoque
$105 / unidade
Ver ficha técnica →EPF10K130EQC240-3N
✅ Drop-In✓ Em estoque
$19.8 / unidade
Ver ficha técnica →EPF10K130EQC240-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K100EQC240-1
✅ Drop-In✓ Em estoque
$18.5 / unidade
Ver ficha técnica →EPF10K130EQC240-1 Classificações máximas e características elétricas
| Series | FLEX 10KE |
| Typical Gates | 130,000 |
| Logic Elements (LEs) | 6,656 |
| Embedded Array Blocks (EABs) | 4 |
| Total RAM Bits | 65,536 |
| Maximum User I/O Pins | 186 |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| Maximum Internal Frequency | 333.33 MHz |
| Temperatura de operação | 0 C to +70 C (Commercial) |
| Encapsulamento | 240-pin PQFP / BFQFP (32x32 mm) |
| Tipo de montagem | Surface Mount (Gull-wing) |
| JTAG Support | Yes - IEEE 1149.1 boundary-scan |
| Configuration Method | Serial / Parallel via Altera EPC device |
| Status RoHS | unknown |
| Lead-Free | unknown |
Guia de Configuração de Pinos do EPF10K130EQC240-1 240-pin pqfp / bfqfp (32x32 mm)
Configuração de pinos para EPF10K130EQC240-1 (pacote 240-pin pqfp / bfqfp (32x32 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF10K130EQC240-1.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF10K130EQC240-1 é adequado para 6 aplicaçãos: Industrial Machine Control, Telecommunications Line Cards, Legacy ASIC Replacement, Embedded DSP Co-Processing, Test & Measurement Instrumentation, Aerospace & Defense Avionics (legacy hardware only).
Industrial Machine Control
The EPF10K130EQC240-1 is well suited to industrial machine controllers where the 130K-gate capacity and 186 user I/O pins accommodate multi-axis motion logic, encoder interfaces, and fieldbus glue logic. Its 2.5 V core with MultiVolt I/O (2.5/3.3/5 V) lets it sit directly on legacy 5 V PLC backplanes without external level shifters, simplifying retrofit designs. The 6,656 LEs paired with 65,536 bits of EAB memory provide ample headroom for state machines, look-up tables, and protocol handling (Modbus, CANopen) on a single fabric. Although the part is rated 0 C to +70 C, the industrial-temperature sibling EPF10K130EQC240-3N drops into the same footprint for factory-floor deployments.
Recomendado
Telecommunications Line Cards
In telecom line-card applications the EPF10K130EQC240-1 acts as a programmable glue layer between network processors, TDM framers, and SERDES devices, using its EAB RAM for elastic FIFOs and channel-lookup tables. The 333.33 MHz internal performance is adequate for 155 MHz Utopia / POS-PHY Level-2 interfacing and ATM segmentation-and-reassembly functions. MultiVolt I/O permits direct 3.3 V connection to contemporary framer ASICs without glue logic, while the JTAG 1149.1 boundary-scan interface supports in-system test on populated backplanes. The 240-PQFP package is favored over fine-pitch BGA in legacy systems that require through-hole-quality reworkability and AOI inspection.
Recomendado
Legacy ASIC Replacement
Engineers use the EPF10K130EQC240-1 to replace obsolete gate-array ASICs in existing products, since the FLEX 10KE architecture delivers 130K usable gates with deterministic timing closure. Each Embedded Array Block (EAB) can be configured as dual-port RAM with widths from 8 to 32 bits, providing memory primitives that previously required separate SRAM chips. Compared to an ASIC NRE, the FPGA approach eliminates mask charges and reduces prototype cycles from months to days - critical when a discontinued gate-array device threatens to halt production. The 240-PQFP footprint also fits common 32x32 mm land patterns used by legacy 240-pin ASICs.
Recomendado
Embedded DSP Co-Processing
The EPF10K130EQC240-1 serves as a co-processor alongside a microcontroller or DSP, offloading FIR/IIR filters, FFT butterfly operations, and video scaling from the host CPU. With 65,536 bits of block memory (organized as 2048x8 / 1024x16 / 512x32 EABs), the device can hold coefficient tables and windowing data on-chip, eliminating external memory accesses and improving throughput. The 333.33 MHz fabric comfortably implements 16-bit MAC engines and small Viterbi decoders, while the 186 user I/O pins provide ample parallel host-side and external data paths. This makes the FPGA well matched to legacy audio processing, baseband modem, and machine-vision front-end cards.
Recomendado
Test & Measurement Instrumentation
Test equipment manufacturers rely on the EPF10K130EQC240-1 for instrument-on-a-card designs where the FPGA implements custom trigger logic, protocol-aware pattern generation, and timing measurement. The 186 I/O pins provide direct fan-out to front-panel connectors, while 6,656 LEs implement deep counters and timing comparators that would otherwise require multiple PAL/GAL devices. JTAG 1149.1 boundary-scan simplifies board-level interconnect test, and the 240-PQFP gull-wing package is preferred for prototypes that need frequent socket swaps or hand rework. MultiVolt I/O lets the device directly interface with both 5 V analog front ends and 3.3 V digital sections of the same instrument.
Recomendado
Aerospace & Defense Avionics (legacy hardware only)
Although not formally qualified to MIL-STD-883 or MIL-PRF-38535, the EPF10K130EQC240-1 and its FLEX 10KE siblings have been deployed in long-life avionics and military systems designed in the late 1990s and early 2000s. The device's SRAM-based fabric is suitable for read-only mission data paths where the bitstream is loaded once from a configuration PROM at power-up, while the 240-PQFP ceramic-compatible package survives the thermal cycling of military electronics bays. For new aerospace designs a radiation-hardened FPGA such as Microsemi/Microchip RTG4 or Xilinx Virtex-5QV is preferred; the EPF10K130EQC240-1 is mentioned here only for support of legacy systems already in service.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K130EQC240-1 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K130EQC240-1N | EPF10K130EQC240-3 | EPF10K130EQC240-3N | EPF10K130EQC240-2 | EPF10K100EQC240-1 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 240-PQFP (32x32 mm) | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same | 240-PQFP (32x32 mm) - same |
| Speed Grade | -1 | -1 (same) | -3 (slower) | -3 (slower) | -2 (slower than -1) | -1 (same) |
| Operating Temperature | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
| Lead-Free | unknown | yes (Pb-free reflow) | unknown | yes (Pb-free) | unknown | unknown |
| Pin-to-Pin Compatible | n/a (reference part) | yes - drop-in | yes - drop-in | yes - drop-in | yes - drop-in | yes - drop-in (different bitstream) |
Principais diferenciais
- Drop-in compatibility with multiple speed/temperature grades (vs EPF10K130EQC240-1N)
- Industrial-temperature drop-in option (vs EPF10K130EQC240-3 / -3N)
- Higher gate density in same package than FLEX 10KE 100K family (vs EPF10K100EQC240-1)
Notas de projeto
The EPF10K130EQC240-1 core operates from a 2.5 V supply with tolerance 2.375 V to 2.625 V; generate this rail from a low-noise LDO such as the TPS7A4701 placed after a 3.3 V switching pre-regulator. MultiVolt I/O banks can be powered independently from 2.5 V, 3.3 V, or 5.0 V - add bulk decoupling of at least 10 uF plus a 0.1 uF high-frequency ceramic on each VCCINT and VCCIO pin, placed within 5 mm of the package lead. Estimate: ICCINT of a fully-utilized 130K-gate FLEX 10KE design ranges from 200 mA to 500 mA, depending on toggle rate, so a 1 A LDO headroom is recommended.
Although the EPF10K130EQC240-1 is commercial-grade (0 C to +70 C), the 240-pin PQFP package has limited thermal dissipation (theta-JA typically around 25 C/W for still air). For continuous operation above ~70% utilization, attach a small clip-on heatsink or provide forced-air cooling on the PQFP body. Estimated: at 0.5 W dissipation, junction-to-ambient rise is ~12.5 C - acceptable for office environments but warrants derating in enclosed cabinets.
PQFP-240 land patterns require gull-wing soldering with a recommended pad pitch of 0.5 mm (19.7 mil). Use a 4-layer PCB with a continuous ground plane on layer 2 directly under the FPGA to provide low-impedance return paths for the 186 I/O signals, and route all clocks (CLK0-CLK3, dedicated inputs) using length-matched traces with 50 ohm controlled impedance. Keep configuration pins (nCONFIG, nSTATUS, CONF_DONE, DCLK, DATA0) within 25 mm of the EPC configuration PROM to minimize skew during bitstream load.
Common pitfalls when using the EPF10K130EQC240-1 include: (1) driving JTAG pins from a controller that does not match the VCCIO bank voltage - the 2.5 V core TCK/TMS/TDI/TDO lines must be level-shifted if the JTAG host is 3.3 V; (2) failing to provide a proper POR delay on nCONFIG before CONF_DONE goes high, which can lock the FPGA into a failed configuration state; (3) confusing the EPF10K130EQC240-1 with the FLEX 10KA EPF10K130EQC240-2N - the bitstreams are not interchangeable. Always re-synthesize with Quartus or MAX+PLUS II when swapping speed grades.
Informações de conformidade
Compliance data not provided in the verified web snapshot. The -1N and -3N variants are explicitly lead-free per Altera-Micro and Arrow listings; the base -1 part is not annotated. AEC-Q100 qualification is not applicable because FPGAs are not qualified to that automotive standard.
