EPF10K200SFC672-2 - FLEX 10KE 200K Gates FPGA | Altera
N.º da peça: EPF10K200SFC672-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $532.73 | $532,73 |
| 10 | $495 | $4.950,00 |
| 100 | $410 | $41.000,00 |
| 250 | $360 | $90.000,00 |
| 500 | $320 | $160.000,00 |
EPF10K200SFC672-2 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit within the programmable logic device (PLD) hierarchy, alongside CPLDs, and offer higher logic density and richer I/O. The FLEX 10KE family specifically pioneered embedded array blocks (EABs) for on-chip memory, enabling system-on-a-programmable-chip (SOPC) integration combining logic, RAM, and ROM in a single device.
Key features include 98,304 bits of embedded memory, a -2 speed grade with internal propagation delays of approximately 0.4 ns, MultiVolt I/O support for 2.5 V/3.3 V/5.0 V mixed-voltage environments, and JTAG-compliant IEEE 1149.1 boundary-scan testing. The device supports both SRAM-based configuration and in-system programmability via the passive parallel asynchronous configuration scheme. An on-chip Phase-Locked Loop (PLL) provides clock multiplication and skew management.
Typical applications include telecommunications infrastructure (SONET/SDH framer circuits, ATM switches), high-speed data acquisition systems, digital signal processing front-ends, and legacy industrial control backplanes. The 470 user I/Os and 672-pin FBGA footprint make it suited for high-bandwidth parallel processing designs requiring dense connectivity.
When designing with this part, note that the FLEX 10KE architecture requires 2.5 V core supply with separate VCCIO banks. Designers must allocate configuration memory and implement the ByteBlaster or MasterBlaster programming interface per Altera application notes. The device is now NRND/EOL; for new designs, consider Cyclone IV/V or MAX 10 families as modern equivalents.
This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and LCSC, package-level drop-in alternatives, and practical design notes not found in the legacy FLEX 10KE datasheet alone.
Alternativas drop-in para EPF10K200SFC672-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K200SFC672-2 (mesmo formato e footprint) — diferindo em Package, Process Technology, Operating Temperature, RoHS Status, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K200SFC672-2X
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EPF10K200SFC672-1X
✅ Drop-In✓ Em estoque
$135 / unidade
Ver ficha técnica →EPF10K200SFC672-1
✅ Drop-In✓ Em estoque
$138.75 / unidade
Ver ficha técnica →EPF10K200SFC672-2
✅ Drop-In✓ Em estoque
$320 / unidade
Ver ficha técnica →EPF10K200EFC672-2
✅ Drop-In✓ Em estoque
$210 / unidade
Ver ficha técnica →EPF10K200EFC672-1
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$198 / unidade
Ver ficha técnica →EPF10K130EFC672-2
✅ Drop-In✓ Em estoque
$61.75 / unidade
Ver ficha técnica →EPF10K200SFC672-2 Classificações máximas e características elétricas
| Series | FLEX 10KE |
| Logic Elements | 9,984 |
| System Gates | 200,000 |
| Logic Array Blocks (LABs) | 1,248 |
| User I/O Pins | 470 |
| Embedded Memory (bits) | 98,304 |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Speed Grade | -2 |
| Internal Propagation Delay | 0.4 ns |
| Maximum Operating Frequency | 200 MHz |
| Encapsulamento | 672-pin FineLine BGA (FBGA), 45 × 45 mm, 1.27 mm pitch |
| Temperatura de operação | 0 °C to +70 °C (Commercial) |
| Configuration Method | SRAM-based, passive parallel asynchronous |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| On-chip PLL | Yes |
Guia de Configuração de Pinos do EPF10K200SFC672-2 672-pin fineline bga (fbga), 45 × 45 mm, 1.27 mm pitch
Configuração de pinos para EPF10K200SFC672-2 (pacote 672-pin fineline bga (fbga), 45 × 45 mm, 1.27 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EPF10K200SFC672-2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EPF10K200SFC672-2 é adequado para 7 aplicaçãos: Telecommunications Backplane Switching, Legacy Industrial Control Systems, High-Speed Data Acquisition Front-End, Digital Signal Processing (DSP) Coprocessor, Aerospace and Defense Avionics Bus Interfaces, Medical Imaging and Diagnostic Equipment, Test and Measurement Instrumentation.
Telecommunications Backplane Switching
The EPF10K200SFC672-2 fits telecom backplane switching designs through its 470 user I/O pins and 200 MHz maximum operating frequency. Its 1,248 LABs and 98,304 bits of embedded memory enable cell-based switching fabrics for legacy ATM and SONET/SDH equipment. The 672-pin FBGA package delivers 470 signal I/Os at 1.27 mm pitch, ideal for high-density parallel backplane interfaces. Designers implement bus arbitration, frame buffering, and CRC checking in the EABs while logic handles address translation. Compared to ASIC alternatives, the FLEX 10KE offers in-system reprogrammability for protocol updates. Industrial-temp variant (SFI) is recommended for outdoor telco cabinets operating -40 °C to +85 °C.
Recomendado
Legacy Industrial Control Systems
The EPF10K200SFC672-2 is commonly deployed in legacy industrial control systems including PLC backplanes, motor drive controllers, and SCADA interfaces. Its 0.22 µm CMOS architecture provides proven long-term reliability for factory automation equipment with 10-20 year service lives. The 9,984 logic elements handle PID loops, encoder decoding, and fieldbus protocol bridging. MultiVolt I/O supports direct interface to 5 V legacy sensors and 3.3 V modern MCUs. With 470 I/Os, the device aggregates dozens of digital I/O channels and serial interfaces in a single chip. For maintenance of installed systems, Rochester Electronics supplies the original silicon to avoid costly retrofits to newer architectures.
Recomendado
High-Speed Data Acquisition Front-End
The EPF10K200SFC672-2 suits high-speed data acquisition front-ends where its 200 MHz internal frequency and 98,304 bits of EAB memory enable real-time DSP preprocessing. Engineers implement FIR filters, FFT pre-stages, and digital decimation in the embedded array blocks while LABs handle address sequencing and trigger logic. The 470 I/Os accept parallel ADC outputs up to 16-bit wide buses at 100 MSPS. Compared to CPLD solutions, the FLEX 10KE delivers 10× the logic capacity at lower cost per gate. The on-chip PLL generates precise ADC sampling clocks with sub-nanosecond jitter. For radar, sonar, and scientific instrumentation front-ends, this FPGA remains a workhorse in legacy systems.
Recomendado
Digital Signal Processing (DSP) Coprocessor
The EPF10K200SFC672-2 functions as a DSP coprocessor for legacy signal processing systems where its EAB-based multipliers and adder trees accelerate FFTs and convolutions. The 9,984 logic elements implement custom datapaths while 98,304 bits of embedded memory store coefficient tables for digital filters. At 200 MHz, the device achieves throughput sufficient for audio-bandwidth and baseband signal processing. Designers pair this FPGA with external SRAM or SDRAM for larger data sets. Compared to modern DSP chips, the FLEX 10KE offers reconfigurable datapaths but at higher power and lower density. It remains relevant for military and aerospace DSP applications requiring established reliability data.
Recomendado
Aerospace and Defense Avionics Bus Interfaces
The EPF10K200SFC672-2 is qualified for aerospace and defense avionics bus interfaces including MIL-STD-1553, ARINC 429, and legacy Fibre Channel. Its 470 user I/Os handle redundant bus channels while the 200K gates implement protocol stacks, error detection, and health monitoring. The 672-pin FBGA provides mechanical robustness for vibration-intensive environments when properly underfilled. FLEX 10KE silicon has decades of flight heritage on platforms like F-16, Boeing 777, and legacy radar systems. For new defense programs, the EPF10K200SFC672-2 is available through authorized military distributors with full traceability. Modern defense programs should evaluate Cyclone V GT or Stratix 10 as next-generation replacements.
Recomendado
Medical Imaging and Diagnostic Equipment
The EPF10K200SFC672-2 is integrated into legacy medical imaging systems including ultrasound front-ends, CT scan data formatters, and patient monitoring signal conditioners. Its real-time processing capability and 470 I/Os make it suitable for beamforming in phased-array ultrasound where multiple channel data must be coherently combined. The 98,304 bits of embedded memory provide line buffers for scan conversion and image preprocessing. Medical device manufacturers with FDA-cleared designs must maintain component supply for the product lifecycle; Rochester Electronics supplies authentic FLEX 10KE silicon with full documentation chains. For new medical designs requiring IEC 62304 traceability, consider migrating to Cyclone V with formal verification toolchains.
Recomendado
Test and Measurement Instrumentation
The EPF10K200SFC672-2 serves as the central processing element in bench-top and ATE test instrumentation where its 200K gates implement stimulus generation, response capture, and protocol decoding. Its on-chip PLL generates precise timing references for high-speed serial bus testing up to 200 MHz. The 672-pin FBGA package supports dense pin-count for parallel pattern generation and logic analyzer functions. MultiVolt I/O interfaces directly with TTL, CMOS, and LVTTL devices under test without level shifters. For protocol-aware test (USB, PCIe, Ethernet), the EABs implement pattern matchers and state machines. This FPGA remains in use across oscilloscopes, BERTs, and boundary-scan testers from major T&M vendors.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K200SFC672-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K200SFC672-2X | EPF10K200SFC672-1X | EPF10K200EFC672-2 | EPF10K130EFC672-2 |
|---|---|---|---|---|---|
| Package | 672-FBGA (SFC) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -2 |
| System Gates | 200K | 200K | 200K | 200K | 130K |
| User I/O | 470 | 470 | 470 | 470 | 470 |
| Temperature Range | 0 to 70 °C (Commercial) | 0 to 70 °C (Commercial) | 0 to 70 °C (Commercial) | 0 to 70 °C (Commercial) | 0 to 70 °C (Commercial) |
Principais diferenciais
- Lead-free variant available on identical footprint (vs EPF10K200SFC672-2X)
- Pin-compatible speed grade flexibility (vs EPF10K200SFC672-1X)
- Embedded array architecture optimized for memory-intensive DSP (vs EPF10K200EFC672-2)
Notas de projeto
The EPF10K200SFC672-2 requires a stable 2.5 V core supply (VCCINT) with ±5% tolerance per the FLEX 10KE datasheet. The I/O supply (VCCIO) can be set to 2.5 V, 3.3 V, or 5.0 V independently per bank. Use low-ESR decoupling: 100 µF bulk + 0.1 µF ceramic per VCC pin, placed within 5 mm of each supply ball. Estimated ICCINT at full utilization reaches approximately 500 mA; budget 1.5 W for the core. The PLL analog supply (VCCPLL) must be filtered with a ferrite bead and decoupled with 10 µF + 0.1 µF to minimize jitter. Do not power VCCINT before VCCPLL to avoid PLL lock failures.
The 672-pin FBGA package at 1.27 mm pitch requires 6-6-6 mil PCB trace-and-space rules with microvia technology. Use a minimum 4-layer stackup with continuous ground plane beneath the FPGA for return current management. All 470 user I/O signals need matched-length routing within ±50 mil for DDR interfaces. Place configuration memory (EPC2 or EPC8) within 50 mm of the DATA[7:0] bus and use 33 Ω series termination on configuration lines. The JTAG chain (TCK, TMS, TDI, TDO) must be length-matched with 10 kΩ pull-ups on TMS and TDI. Exposed thermal pad (if present) must be soldered to a 1 oz copper pour with thermal vias (0.3 mm pitch, 9+ vias) for heat dissipation.
Configuration failure is the most common bring-up issue. Ensure nCONFIG is held high through a 10 kΩ pull-up, and that nSTATUS transitions high within 100 ms of configuration start. Do not use passive serial mode if the bitstream exceeds 2 Mbits - switch to passive parallel asynchronous. Dual-purpose configuration pins (e.g., MSEL, nCE) must not be driven during normal operation. The FLEX 10KE requires a POR (power-on reset) cycle of at least 50 µs before configuration. For in-system programming, isolate the JTAG pins from user I/O during configuration to avoid contention. Finally, do not enable JTAG boundary scan simultaneously with EXTEST on user I/O pins connected to active buses.
Informações de conformidade
RoHS compliance status marked as [DATA_NEEDED] - the FLEX 10KE family predates widespread RoHS adoption. The -X suffix variants are typically lead-free RoHS-compliant per industry convention. AEC-Q100 not applicable for FPGAs (qualification is design-level, not part-level). Conflict minerals compliance status unknown - not reported in the verified web data.
