EPF10K30ATI144-3N - 30K Gate FLEX-10KA FPGA, 102 I/O, TQFP-144
N.º da peça: EPF10K30ATI144-3N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $26.4 | $13.200,00 |
| 1.000 | $23.95 | $23.950,00 |
EPF10K30ATI144-3N Visão geral
What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that the designer can wire up after manufacture to implement arbitrary digital circuits. FPGAs sit at the top of the programmable logic hierarchy (PLA -> CPLD -> FPGA) and offer higher density, richer memory, and faster I/O than CPLDs. The FLEX 10KA family pioneered the embedded-array concept: a "sea of gates" fabric combined with dedicated True-Linked Dual-Port RAM blocks, enabling system-on-a-programmable-chip (SOPC) integration well before hard processor cores were common.
Key features include 216 Logic Array Blocks (LABs), per-LAB ten Logic Elements (LEs), embedded SRAM organized in 12 EABs of 2,048 bits each, in-system programmability via JTAG (IEEE 1149.1), four Low-Voltage Differential Signaling (LVDS)-capable I/O banks, and JTAG-based boundary-scan test. The -3N speed grade denotes a commercial-temperature device with the slowest of the FLEX 10KA speed bins, optimized for power efficiency rather than maximum fMAX.
Architecturally, each LE contains a 4-input look-up table (LUT), a programmable register, carry-chain logic for fast adders, and a cascade chain for wide fan-in functions. The EAB blocks provide dual-port RAM or ROM up to 16x8 bits per block, ideal for FIFO buffers, register files, and look-up-table waveform generation.
Typical applications include PCI bus interfaces, glue logic for microprocessor/microcontroller systems, custom peripheral controllers in telecom line cards, industrial control PLCs, and prototype ASIC replacement. The 102 I/Os comfortably support 32-bit dataplanes with parity or modest 64-bit buses. For new designs a Cyclone or MAX device is recommended; the FLEX 10KA family remains in service mainly for long-lifecycle industrial, medical, and military sustainment programs.
Design considerations: plan for 3.3 V VCCINT and a separate VCCIO bank supply (3.3 V or 2.5 V depending on the I/O standard chosen). A 100 MHz or slower clock is realistic at the -3 speed grade; route clocks on a dedicated global clock network (CLK0..CLK3) and place a 0.1 µF decoupling cap on every VCC/VCCIO pin pair.
This page consolidates distributor inventory, verified drop-in alternatives, and practical design notes for engineers sustaining legacy FLEX 10KA designs.
Alternativas drop-in para EPF10K30ATI144-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30ATI144-3N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, Process Technology, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30ATI144-2
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EPF10K30ATC144-3
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF10K30ATC144-2N
✅ Drop-In✓ Em estoque
$33.4 / unidade
Ver ficha técnica →EPF10K30ATC144-1N
✅ Drop-In✓ Em estoque
$16.5 / unidade
Ver ficha técnica →EPF10K30ATI144-1
✅ Drop-In✓ Em estoque
$23.95 / unidade
Ver ficha técnica →EPF10K10TC144-3N
✅ Drop-In✓ Em estoque
$17.85 / unidade
Ver ficha técnica →EPF10K30ATI144-3N Classificações máximas e características elétricas
| Family | FLEX 10KA |
| Logic Elements / Cells | 1,728 |
| Typical Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EABs) | 12 EABs |
| Embedded SRAM | 12,288 bits |
| User I/O | 102 |
| Supply Voltage (VCCINT) | 3.3 V |
| Maximum Operating Frequency | 125 MHz |
| Technology Node | 0.3 µm CMOS |
| Encapsulamento | TQFP-144 (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0°C to +70°C (Commercial) |
| Speed Grade | -3 (slowest FLEX 10KA bin) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Status RoHS | unknown |
Configuração de pinos do EPF10K30ATI144-3N
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | VCCINT — Core supply voltage (3.3 V) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O pin (bank 2) |
| Pino 13 | I/O — User I/O pin (bank 2) |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | GND — Ground |
| Pino 22 | I/O — User I/O pin (bank 3) |
| Pino 23 | I/O — User I/O pin (bank 3) |
| Pino 24 | I/O — User I/O pin (bank 3) |
| Pino 25 | I/O — User I/O pin (bank 3) |
| Pino 26 | I/O — User I/O pin (bank 3) |
| Pino 27 | I/O — User I/O pin (bank 3) |
| Pino 28 | I/O — User I/O pin (bank 3) |
| Pino 29 | VCCIO — I/O bank 3 supply voltage |
| Pino 30 | I/O — User I/O pin (bank 3) |
| Pino 31 | I/O — User I/O pin (bank 3) |
| Pino 32 | I/O — User I/O pin (bank 3) |
| Pino 33 | I/O — User I/O pin (bank 3) |
| Pino 34 | I/O — User I/O pin (bank 3) |
| Pino 35 | I/O — User I/O pin (bank 3) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | GND — Ground |
| Pino 41 | I/O — User I/O pin (bank 4) |
| Pino 42 | I/O — User I/O pin (bank 4) |
| Pino 43 | I/O — User I/O pin (bank 4) |
| Pino 44 | I/O — User I/O pin (bank 4) |
| Pino 45 | I/O — User I/O pin (bank 4) |
| Pino 46 | I/O — User I/O pin (bank 4) |
| Pino 47 | I/O — User I/O pin (bank 4) |
| Pino 48 | I/O — User I/O pin (bank 4) |
| Pino 49 | I/O — User I/O pin (bank 4) |
| Pino 50 | I/O — User I/O pin (bank 4) |
| Pino 51 | I/O — User I/O pin (bank 4) |
| Pino 52 | I/O — User I/O pin (bank 4) |
| Pino 53 | I/O — User I/O pin (bank 4) |
| Pino 54 | GND — Ground |
| Pino 55 | I/O — User I/O pin (bank 5) |
| Pino 56 | I/O — User I/O pin (bank 5) |
| Pino 57 | I/O — User I/O pin (bank 5) |
| Pino 58 | I/O — User I/O pin (bank 5) |
| Pino 59 | I/O — User I/O pin (bank 5) |
| Pino 60 | I/O — User I/O pin (bank 5) |
| Pino 61 | I/O — User I/O pin (bank 5) |
| Pino 62 | I/O — User I/O pin (bank 5) |
| Pino 63 | VCCIO — I/O bank 5 supply voltage |
| Pino 64 | I/O — User I/O pin (bank 5) |
| Pino 65 | I/O — User I/O pin (bank 5) |
| Pino 66 | I/O — User I/O pin (bank 5) |
| Pino 67 | I/O — User I/O pin (bank 5) |
| Pino 68 | I/O — User I/O pin (bank 5) |
| Pino 69 | I/O — User I/O pin (bank 5) |
| Pino 70 | I/O — User I/O pin (bank 5) |
| Pino 71 | I/O — User I/O pin (bank 5) |
| Pino 72 | I/O — User I/O pin (bank 5) |
| Pino 73 | I/O — User I/O pin (bank 5) |
| Pino 74 | I/O — User I/O pin (bank 5) |
| Pino 75 | GND — Ground |
| Pino 76 | I/O — User I/O pin (bank 6) |
| Pino 77 | I/O — User I/O pin (bank 6) |
| Pino 78 | I/O — User I/O pin (bank 6) |
| Pino 79 | I/O — User I/O pin (bank 6) |
| Pino 80 | I/O — User I/O pin (bank 6) |
| Pino 81 | I/O — User I/O pin (bank 6) |
| Pino 82 | I/O — User I/O pin (bank 6) |
| Pino 83 | I/O — User I/O pin (bank 6) |
| Pino 84 | VCCIO — I/O bank 6 supply voltage |
| Pino 85 | I/O — User I/O pin (bank 6) |
| Pino 86 | I/O — User I/O pin (bank 6) |
| Pino 87 | I/O — User I/O pin (bank 6) |
| Pino 88 | I/O — User I/O pin (bank 6) |
| Pino 89 | I/O — User I/O pin (bank 6) |
| Pino 90 | I/O — User I/O pin (bank 6) |
| Pino 91 | I/O — User I/O pin (bank 6) |
| Pino 92 | I/O — User I/O pin (bank 6) |
| Pino 93 | I/O — User I/O pin (bank 6) |
| Pino 94 | GND — Ground |
| Pino 95 | I/O — User I/O pin (bank 7) |
| Pino 96 | I/O — User I/O pin (bank 7) |
| Pino 97 | I/O — User I/O pin (bank 7) |
| Pino 98 | I/O — User I/O pin (bank 7) |
| Pino 99 | I/O — User I/O pin (bank 7) |
| Pino 100 | I/O — User I/O pin (bank 7) |
| Pino 101 | I/O — User I/O pin (bank 7) |
| Pino 102 | VCCINT — Core supply voltage (3.3 V) |
| Pino 103 | I/O — User I/O pin (bank 7) |
| Pino 104 | I/O — User I/O pin (bank 7) |
| Pino 105 | I/O — User I/O pin (bank 7) |
| Pino 106 | I/O — User I/O pin (bank 7) |
| Pino 107 | I/O — User I/O pin (bank 7) |
| Pino 108 | I/O — User I/O pin (bank 7) |
| Pino 109 | I/O — User I/O pin (bank 7) |
| Pino 110 | I/O — User I/O pin (bank 7) |
| Pino 111 | I/O — User I/O pin (bank 7) |
| Pino 112 | GND — Ground |
| Pino 113 | I/O — User I/O pin (bank 8) |
| Pino 114 | I/O — User I/O pin (bank 8) |
| Pino 115 | I/O — User I/O pin (bank 8) |
| Pino 116 | I/O — User I/O pin (bank 8) |
| Pino 117 | I/O — User I/O pin (bank 8) |
| Pino 118 | I/O — User I/O pin (bank 8) |
| Pino 119 | I/O — User I/O pin (bank 8) |
| Pino 120 | I/O — User I/O pin (bank 8) |
| Pino 121 | I/O — User I/O pin (bank 8) |
| Pino 122 | I/O — User I/O pin (bank 8) |
| Pino 123 | I/O — User I/O pin (bank 8) |
| Pino 124 | I/O — User I/O pin (bank 8) |
| Pino 125 | I/O — User I/O pin (bank 8) |
| Pino 126 | GND — Ground |
| Pino 127 | CLK0 — Dedicated clock input 0 |
| Pino 128 | CLK1 — Dedicated clock input 1 |
| Pino 129 | CLK2 — Dedicated clock input 2 |
| Pino 130 | CLK3 — Dedicated clock input 3 |
| Pino 131 | nCONFIG — Configuration control (active-low) |
| Pino 132 | nSTATUS — Configuration status (active-low) |
| Pino 133 | CONF_DONE — Configuration done indicator |
| Pino 134 | MSEL0 — Configuration mode select 0 |
| Pino 135 | MSEL1 — Configuration mode select 1 |
| Pino 136 | TDI — JTAG test data input |
| Pino 137 | TMS — JTAG test mode select |
| Pino 138 | TCK — JTAG test clock |
| Pino 139 | TDO — JTAG test data output |
| Pino 140 | VCCINT — Core supply voltage (3.3 V) |
| Pino 141 | VCCIO — I/O supply voltage |
| Pino 142 | GND — Ground |
| Pino 143 | I/O — User I/O pin (bank 8) |
| Pino 144 | I/O — User I/O pin (bank 8) |
Aplicações típicas
EPF10K30ATI144-3N é adequado para 6 aplicaçãos: PCI Bus Interface and Glue Logic, Industrial Control and PLC Backplanes, Telecom Line-Card Glue Logic, ASIC Replacement and Prototype Emulation, Custom Peripheral Controllers, Legacy Bus Bridge and Protocol Converter.
PCI Bus Interface and Glue Logic
The EPF10K30ATI144-3N's 30,000-gate density and 102 user I/O pins make it a strong fit for PCI bus interface bridging between legacy microprocessors and peripherals. The 102 I/Os comfortably accommodate a 32-bit PCI datapath with parity, plus interrupt, configuration, and JTAG pins. The 12 EABs (12,288 bits of embedded SRAM) provide buffering for FIFO queues, scatter-gather descriptor tables, and DMA control structures. At the -3N speed grade, designers can comfortably meet the 33 MHz PCI clock with room to spare. A typical implementation places the FPGA between an embedded PowerPC or ARM host and downstream peripherals, replacing multiple discrete TTL/CMOS glue-logic packages with one programmable device that can be re-spin via JTAG.
Recomendado
Industrial Control and PLC Backplanes
Industrial PLC and process-control backplanes use the EPF10K30ATI144-3N to implement custom protocol converters (Modbus, Profibus, CAN bridges) and digital-signal conditioning logic. Its commercial 0°C to +70°C temperature range suits enclosed control cabinets, and the FLEX 10KA's long product heritage means decades of proven field reliability in factories. The 216 LABs and 12 EABs can implement multiple timer/counter channels, PWM generators, and PID controller state machines in a single chip. The 3.3 V core with LVCMOS33 I/O is pin-compatible with common 3.3 V microcontroller buses, simplifying system integration. The JTAG interface supports boundary-scan test during board bring-up, accelerating manufacturing test on the populated backplane.
Recomendado
Telecom Line-Card Glue Logic
Legacy telecom line cards (T1/E1, ISDN, and early DSLAM designs) used the FLEX 10KA family to implement HDLC controllers, framer interfaces, and alarm-monitoring state machines. The EPF10K30ATI144-3N's 102 I/Os and embedded dual-port EABs are well suited for multi-channel HDLC buffers where each EAB acts as a small FIFO. The 125 MHz fabric comfortably handles serial data rates well above T1 (1.544 Mbps) and E1 (2.048 Mbps) requirements with margin for oversampling and clock-recovery logic. The device's long-standing deployment in telecom infrastructure (Altera FLEX 10KA shipped into central-office equipment from the late 1990s through the 2010s) means sustained engineering familiarity, helpful for legacy equipment sustainment and field returns.
Recomendado
ASIC Replacement and Prototype Emulation
The EPF10K30ATI144-3N is frequently used to replace obsolete gate-array ASICs in long-lifecycle programs (medical devices, military radios, aerospace subsystems). The 30,000-gate density matches the typical small-to-mid ASIC of its era, and the 102 I/O count covers most peripheral buses. Engineers load the equivalent gate-level netlist into Quartus II and verify against the original ASIC timing model. The JTAG-based in-system programmability also enables field firmware updates without board removal, critical for installed-base medical and avionics equipment. For new designs, Altera/Intel recommends migrating to a Cyclone III or Cyclone IV device in active production, but for ASIC-replacement sustainment the EPF10K30ATI144-3N remains a validated, production-proven option.
Recomendado
Custom Peripheral Controllers
Embedded systems designers use the EPF10K30ATI144-3N to add custom peripherals to microcontrollers or microprocessors that lack specific I/O functions (extra UARTs, PWM channels, quadrature encoder inputs, or specialized timing generators). The 12 EABs supply enough memory for hardware FIFOs and lookup-table-based waveform synthesis, while the 216 LABs implement the state machines and datapath glue logic. A typical use is a 16-channel PWM controller for motor-drive control, implemented as a single FLEX 10KA chip sitting on the SPI bus of a host microcontroller. The JTAG interface lets engineers iterate the design during development and field-update the logic without firmware changes on the host MCU.
Recomendado
Legacy Bus Bridge and Protocol Converter
Designers sustaining legacy equipment often need to bridge between old buses (ISA, VME, PC/104) and modern peripherals (USB, Ethernet, SATA). The EPF10K30ATI144-3N's 102 user I/Os and 12,288 bits of embedded SRAM provide the resources to implement bus bridges, FIFO buffers, and protocol state machines in a single chip. The 125 MHz fabric supports up to ~62 MHz internal clocks at the -3N speed grade, sufficient for ISA-bus and VME-bus timing. The device's compatibility with 3.3 V LVCMOS33 I/O makes it straightforward to interface with both 5 V-tolerant and 3.3 V devices using external level shifters where needed. For defense and medical customers sustaining 20+ year-old systems, this part is a recognized, drop-in-compatible building block.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30ATI144-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30ATI144-2 | EPF10K30ATC144-3 | EPF10K30ATC144-2N | EPF10K30ATC144-1N | EPF10K30ATI144-1 | EPF10K10TC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) |
| Family | FLEX 10KA | FLEX 10KA (same) | FLEX 10KA (same) | FLEX 10KA (same) | FLEX 10KA (same) | FLEX 10KA (same) | FLEX 10KA (same) |
| Typical Gates | 30,000 | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 30,000 (same) | 10,000 (-66%) |
| Logic Cells / Elements | 1,728 | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 1,728 (same) | 576 (-66%) |
| Embedded SRAM (bits) | 12,288 | 12,288 (same) | 12,288 (same) | 12,288 (same) | 12,288 (same) | 12,288 (same) | 4,096 (-66%) |
| User I/O | 102 | 102 (same) | 102 (same) | 102 (same) | 102 (same) | 102 (same) | 102 (same) |
| Speed Grade | -3 (slowest) | -2 (faster) | -3 (same) | -2 (faster) | -1 (fastest) | -1 (fastest) | -3 (same) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Principais diferenciais
- Highest logic density in the FLEX 10KA TQFP-144 family (vs EPF10K10TC144-3N)
- Same-package drop-in compatibility with FLEX 10KA family (vs EPF10K30ATI144-2)
- Industrial temperature range for harsher environments (vs EPF10K30ATC144-3)
Notas de projeto
Estimated: at maximum utilization (95% LABs, 100% EABs, 100 MHz toggle rate), the EPF10K30ATI144-3N core draws approximately 300-500 mA from VCCINT (3.3 V). Provide a 1 A regulator with 100 mV headroom. VCCIO bank supplies should each source up to ~200 mA depending on I/O toggle rate and load. Place 0.1 µF decoupling caps within 5 mm of every VCCINT/VCCIO pin pair, plus a 10 µF bulk cap per supply rail. Power-on reset sequence: VCCINT must reach 3.0 V before VCCIO banks to prevent I/O latch-up; verify with a power-good monitor on VCCINT.
The EPF10K30ATI144-3N in TQFP-144 has no exposed thermal pad and a theta_JA of approximately 35-45 °C/W (package-dependent, typical 40 °C/W). Estimated: at 1.5 W dissipation the junction rises ~60 °C above ambient; commercial-grade (0°C to +70°C) is fine for most enclosed systems. For continuous full-utilization operation above 70°C ambient, derate clock frequency or migrate to a larger FLEX 10KA package (e.g., 240-pin PQFP with better thermal performance).
Route all four dedicated clock inputs (CLK0..CLK3) on the global clock network with matched-length traces (within 1 mm). Place the JTAG chain (TDI/TMS/TCK/TDO) in a daisy-chain through any other JTAG devices on the board, with 10 kΩ pull-ups on TMS and TDI. Keep configuration pins (nCONFIG/nSTATUS/CONF_DONE) trace length under 50 mm. Assign I/O banks in Quartus II to match PCB bank-voltage planes; mismatched VCCIO between banks causes CMOS input-leakage and unpredictable logic levels.
Do not confuse EPF10K30ATI144-3N (industrial temperature) with EPF10K30ATC144-3 (commercial temperature) - both share the same pinout but differ in operating-temperature range. Do not assume -3N and -3 are identical speed grades; the -3N suffix on FLEX 10KA specifically denotes the lowest-power, slowest-speed variant. Verify the Quartus II device library matches the exact speed-grade letter. Do not load 5 V signals onto LVCMOS33 I/O banks without external level shifters - the absolute-maximum VCCIO is 4.6 V per the FLEX 10KA datasheet.
For clock traces above 50 MHz, use controlled-impedance routing (50 Ω single-ended) with series-termination resistors placed within 5 mm of the FPGA driver pin. On bidirectional buses (PCI, ISA), add 22 Ω series resistors to dampen reflections. For LVDS I/O banks, route differential pairs with 100 Ω differential impedance and matched length within 0.5 mm. Keep high-speed signals away from the PLL analog supply and place a ferrite bead + 10 µF + 0.1 µF filter network on each PLL analog VCC pin.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status could not be confirmed from the verified web data; this is an older Altera part predating widespread RoHS transition. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. Conflict-minerals compliance inherited from Altera/Intel policy.
