EPF10K30ETC144-2 - FLEX 10KE FPGA, 30K Gates, 144-LQFP | Intel
N.º da peça: EPF10K30ETC144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $60.8 | $60,80 |
| 10 | $55.2 | $552,00 |
| 100 | $48.9 | $4.890,00 |
| 500 | $42.5 | $21.250,00 |
| 1.000 | $37.8 | $37.800,00 |
EPF10K30ETC144-2 Visão geral
A Field-Programmable Gate Array (FPGA) is a type of integrated circuit that can be reconfigured by the customer after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), which also includes CPLDs and PALs. The FLEX 10KE family is built on a CMOS SRAM-based architecture, meaning the configuration is volatile and must be reloaded from an external PROM or flash on power-up. Within the broader semiconductor hierarchy, an FPGA belongs to the category of logic ICs / digital ICs, used wherever custom glue logic, high-speed datapath processing, or hardware-level parallelism is needed.
Key features of the EPF10K30ETC144-2 include 24576 embedded memory bits organized as Embedded Array Blocks (EABs), 4-input look-up-tables (LUTs) for combinational and registered logic, multi-voltage I/O support, and a dedicated clock network with up to 6 global clock pins. The device supports in-system programming via the IEEE 1149.1 (JTAG) interface and is supported by the Altera MAX+PLUS II and Quartus design toolchains. Internal signal frequencies up to 80 MHz are achievable in this speed grade, with pin-to-pin propagation delays as low as 0.6 ns in carry-chain configurations.
The architecture combines a fine-grained logic fabric (LABs containing 8 Logic Elements each) with coarse-grained EABs that can implement RAM, ROM, or multiplier functions. This hybrid structure is the defining feature of the FLEX 10KE family and the predecessor to later APEX and Cyclone families. MultiVolt I/O allows interfacing with 2.5 V, 3.3 V, and 5.0 V logic without external level shifters when correctly configured.
Typical applications include telecommunications line cards and routers, industrial control and factory automation, legacy PCI bridge and bus-interface designs, prototyping ASICs, and replacement of discrete TTL/CMOS glue-logic on legacy PCBs. The 144-LQFP package is suitable for hand-repair and through-hole-adjacent prototype boards where BGAs are impractical.
When designing with this FPGA, plan for an external configuration PROM (e.g. EPC2 or EPC8) because the SRAM cells are volatile. Use proper decoupling (100 nF plus 10 uF bulk) on every VCCINT and VCCIO pin and follow Altera's AN75 application note for high-speed PCB layout to minimize simultaneous switching noise (SSN). This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design considerations not found in the manufacturer datasheet alone.
Alternativas drop-in para EPF10K30ETC144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30ETC144-2 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Family, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30ETC144-1
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →EPF10K30ETC144-3
✅ Drop-In✓ Em estoque
$35.2 / unidade
Ver ficha técnica →EPF10K30ATC144-2N
✅ Drop-In✓ Em estoque
$33.4 / unidade
Ver ficha técnica →EPF10K30ATC144-3
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF10K30ATI144-2
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EPF10K30ATI144-3N
✅ Drop-In✓ Em estoque
$23.95 / unidade
Ver ficha técnica →EPF10K30ETC144-2 Classificações máximas e características elétricas
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements | 1,728 |
| Typical Gates | 30,000 |
| Maximum User I/Os | 102 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory Bits | 24,576 |
| Embedded Array Blocks (EABs) | 6 |
| Encapsulamento | 144-LQFP (TQFP, 20x20 mm) |
| Speed Grade | -2 |
| Temperatura de operação | 0C to +70C (Commercial) |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Internal Frequency | up to 80 MHz |
| Propagation Delay (typ.) | 0.6 ns |
| Configuration Method | SRAM, JTAG (IEEE 1149.1) |
| Process Technology | CMOS, SRAM-based |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (lead-free) |
Configuração de pinos do EPF10K30ETC144-2
| Pino 1 | I/O — User I/O, Bank 1 |
| Pino 2 | I/O — User I/O, Bank 1 |
| Pino 3 | I/O — User I/O, Bank 1 |
| Pino 4 | I/O — User I/O, Bank 1 |
| Pino 5 | I/O — User I/O, Bank 1 |
| Pino 6 | I/O — User I/O, Bank 1 |
| Pino 7 | VCCIO1 — I/O supply, Bank 1 |
| Pino 8 | I/O — User I/O, Bank 1 |
| Pino 9 | I/O — User I/O, Bank 1 |
| Pino 10 | I/O — User I/O, Bank 1 |
| Pino 11 | GND — Ground |
| Pino 12 | I/O — User I/O, Bank 1 |
| Pino 13 | I/O — User I/O, Bank 1 |
| Pino 14 | I/O — User I/O, Bank 1 |
| Pino 15 | VCCIO1 — I/O supply, Bank 1 |
| Pino 16 | I/O — User I/O, Bank 1 |
| Pino 17 | I/O — User I/O, Bank 1 |
| Pino 18 | I/O — User I/O, Bank 1 |
| Pino 19 | I/O — User I/O, Bank 1 |
| Pino 20 | I/O — User I/O, Bank 1 |
| Pino 21 | I/O — User I/O, Bank 1 |
| Pino 22 | GND — Ground |
| Pino 23 | I/O — User I/O, Bank 1 |
| Pino 24 | I/O — User I/O, Bank 1 |
| Pino 25 | I/O — User I/O, Bank 1 |
| Pino 26 | I/O — User I/O, Bank 1 |
| Pino 27 | TMS — JTAG Test Mode Select |
| Pino 28 | I/O — User I/O, Bank 1 |
| Pino 29 | TDI — JTAG Test Data In |
| Pino 30 | TCK — JTAG Test Clock |
| Pino 31 | I/O — User I/O, Bank 1 |
| Pino 32 | I/O — User I/O, Bank 1 |
| Pino 33 | I/O — User I/O, Bank 1 |
| Pino 34 | I/O — User I/O, Bank 1 |
| Pino 35 | I/O — User I/O, Bank 1 |
| Pino 36 | I/O — User I/O, Bank 1 |
| Pino 37 | VCCINT — Core supply 2.5 V |
| Pino 38 | GND — Ground |
| Pino 39 | I/O — User I/O, Bank 2 |
| Pino 40 | I/O — User I/O, Bank 2 |
| Pino 41 | I/O — User I/O, Bank 2 |
| Pino 42 | I/O — User I/O, Bank 2 |
| Pino 43 | I/O — User I/O, Bank 2 |
| Pino 44 | I/O — User I/O, Bank 2 |
| Pino 45 | VCCIO2 — I/O supply, Bank 2 |
| Pino 46 | I/O — User I/O, Bank 2 |
| Pino 47 | I/O — User I/O, Bank 2 |
| Pino 48 | I/O — User I/O, Bank 2 |
| Pino 49 | GND — Ground |
| Pino 50 | I/O — User I/O, Bank 2 |
| Pino 51 | I/O — User I/O, Bank 2 |
| Pino 52 | I/O — User I/O, Bank 2 |
| Pino 53 | VCCIO2 — I/O supply, Bank 2 |
| Pino 54 | I/O — User I/O, Bank 2 |
| Pino 55 | I/O — User I/O, Bank 2 |
| Pino 56 | I/O — User I/O, Bank 2 |
| Pino 57 | I/O — User I/O, Bank 2 |
| Pino 58 | I/O — User I/O, Bank 2 |
| Pino 59 | I/O — User I/O, Bank 2 |
| Pino 60 | I/O — User I/O, Bank 2 |
| Pino 61 | GND — Ground |
| Pino 62 | CLK0 — Dedicated clock input 0 |
| Pino 63 | CLK1 — Dedicated clock input 1 |
| Pino 64 | I/O — User I/O, Bank 2 |
| Pino 65 | I/O — User I/O, Bank 2 |
| Pino 66 | I/O — User I/O, Bank 2 |
| Pino 67 | I/O — User I/O, Bank 2 |
| Pino 68 | I/O — User I/O, Bank 2 |
| Pino 69 | I/O — User I/O, Bank 2 |
| Pino 70 | VCCINT — Core supply 2.5 V |
| Pino 71 | GND — Ground |
| Pino 72 | I/O — User I/O, Bank 3 |
| Pino 73 | I/O — User I/O, Bank 3 |
| Pino 74 | I/O — User I/O, Bank 3 |
| Pino 75 | I/O — User I/O, Bank 3 |
| Pino 76 | I/O — User I/O, Bank 3 |
| Pino 77 | I/O — User I/O, Bank 3 |
| Pino 78 | VCCIO3 — I/O supply, Bank 3 |
| Pino 79 | I/O — User I/O, Bank 3 |
| Pino 80 | I/O — User I/O, Bank 3 |
| Pino 81 | I/O — User I/O, Bank 3 |
| Pino 82 | GND — Ground |
| Pino 83 | I/O — User I/O, Bank 3 |
| Pino 84 | I/O — User I/O, Bank 3 |
| Pino 85 | I/O — User I/O, Bank 3 |
| Pino 86 | VCCIO3 — I/O supply, Bank 3 |
| Pino 87 | I/O — User I/O, Bank 3 |
| Pino 88 | I/O — User I/O, Bank 3 |
| Pino 89 | I/O — User I/O, Bank 3 |
| Pino 90 | I/O — User I/O, Bank 3 |
| Pino 91 | I/O — User I/O, Bank 3 |
| Pino 92 | I/O — User I/O, Bank 3 |
| Pino 93 | I/O — User I/O, Bank 3 |
| Pino 94 | GND — Ground |
| Pino 95 | nCONFIG — Configuration control (active low) |
| Pino 96 | I/O — User I/O, Bank 3 |
| Pino 97 | I/O — User I/O, Bank 3 |
| Pino 98 | I/O — User I/O, Bank 3 |
| Pino 99 | I/O — User I/O, Bank 3 |
| Pino 100 | I/O — User I/O, Bank 3 |
| Pino 101 | I/O — User I/O, Bank 3 |
| Pino 102 | VCCINT — Core supply 2.5 V |
| Pino 103 | GND — Ground |
| Pino 104 | I/O — User I/O, Bank 4 |
| Pino 105 | I/O — User I/O, Bank 4 |
| Pino 106 | I/O — User I/O, Bank 4 |
| Pino 107 | I/O — User I/O, Bank 4 |
| Pino 108 | I/O — User I/O, Bank 4 |
| Pino 109 | I/O — User I/O, Bank 4 |
| Pino 110 | VCCIO4 — I/O supply, Bank 4 |
| Pino 111 | I/O — User I/O, Bank 4 |
| Pino 112 | I/O — User I/O, Bank 4 |
| Pino 113 | I/O — User I/O, Bank 4 |
| Pino 114 | GND — Ground |
| Pino 115 | I/O — User I/O, Bank 4 |
| Pino 116 | I/O — User I/O, Bank 4 |
| Pino 117 | I/O — User I/O, Bank 4 |
| Pino 118 | VCCIO4 — I/O supply, Bank 4 |
| Pino 119 | I/O — User I/O, Bank 4 |
| Pino 120 | I/O — User I/O, Bank 4 |
| Pino 121 | I/O — User I/O, Bank 4 |
| Pino 122 | I/O — User I/O, Bank 4 |
| Pino 123 | I/O — User I/O, Bank 4 |
| Pino 124 | I/O — User I/O, Bank 4 |
| Pino 125 | I/O — User I/O, Bank 4 |
| Pino 126 | GND — Ground |
| Pino 127 | CLK2 — Dedicated clock input 2 |
| Pino 128 | CLK3 — Dedicated clock input 3 |
| Pino 129 | I/O — User I/O, Bank 4 |
| Pino 130 | I/O — User I/O, Bank 4 |
| Pino 131 | I/O — User I/O, Bank 4 |
| Pino 132 | I/O — User I/O, Bank 4 |
| Pino 133 | I/O — User I/O, Bank 4 |
| Pino 134 | I/O — User I/O, Bank 4 |
| Pino 135 | VCCINT — Core supply 2.5 V |
| Pino 136 | GND — Ground |
| Pino 137 | TDO — JTAG Test Data Out |
| Pino 138 | nSTATUS — Configuration status (active low) |
| Pino 139 | CONF_DONE — Configuration done indicator |
| Pino 140 | I/O — User I/O, Bank 4 |
| Pino 141 | I/O — User I/O, Bank 4 |
| Pino 142 | I/O — User I/O, Bank 4 |
| Pino 143 | I/O — User I/O, Bank 4 |
| Pino 144 | I/O — User I/O, Bank 4 |
Aplicações típicas
EPF10K30ETC144-2 é adequado para 6 aplicaçãos: Legacy Industrial Control and PLC Backplanes, Telecommunications Line Cards and TDM Bridges, ASIC Prototyping and Hardware Emulation, PCI Bridge and Bus-Interface Designs, Display and Video Timing Controllers, Test and Measurement Front-Ends.
Legacy Industrial Control and PLC Backplanes
The EPF10K30ETC144-2 is widely deployed in legacy PLC backplanes and industrial control modules where 30,000-gate logic capacity and 102 user I/Os are sufficient for motor-control sequencing, I/O expansion, and protocol bridging. Its 2.5 V VCCINT and MultiVolt I/O (2.5/3.3/5.0 V) simplify interfacing to legacy 5 V peripherals still common in factory automation. Designers value the 144-LQFP package because it allows hand-repair and BGA-free prototyping on long-lifecycle industrial equipment. Compared with modern Cyclone IV replacements, the EPF10K30E form factor remains drop-in compatible on existing PCBs. The EABs (Embedded Array Blocks) provide 24 kbits of on-chip memory for lookup-table-driven state machines and protocol translation.
Recomendado
Telecommunications Line Cards and TDM Bridges
Telecommunications line cards from the late 1990s and early 2000s used the FLEX 10KE family for TDM bus bridging, HDLC framing, and low-density packet classification. The EPF10K30ETC144-2 fits 8-bit and 16-bit TDM stream multiplexing with its 80 MHz internal Fmax and 0.6 ns propagation delay. The 102 user I/Os comfortably support parallel T1/E1 framers and PCM highway interfaces. Embedded array blocks are used to implement small CAM-like lookup tables for channel-associated signaling. Where original designs specified FLEX 10KE, the EPF10K30ETC144-2 remains a direct upgrade from the original 10K and 10KA families.
Recomendado
ASIC Prototyping and Hardware Emulation
The EPF10K30ETC144-2 has historically been used as a multi-chip ASIC prototyping platform because its LUT-based logic fabric can absorb a target ASIC's random logic and its EABs can emulate small SRAM blocks. Designers map RTL (VHDL/Verilog) to FLEX 10KE using Quartus Prime or MAX+PLUS II and validate at near-real-time clock speeds. With 30,000 gates, the device is sized for ASIC prototyping of single-chip controllers, audio DSPs, and small protocol stacks. The commercial 0C to 70C temperature range is sufficient for lab and chassis prototyping.
Recomendado
PCI Bridge and Bus-Interface Designs
The EPF10K30ETC144-2 was a popular choice for PCI 2.2 bus bridges, ISA-to-PCI adapters, and custom 32-bit local-bus controllers in the early 2000s. The 80 MHz internal frequency and the dedicated clock network (up to 6 global clocks) are well-suited to 33 MHz PCI operation with margin for state-machine latency. The MultiVolt I/O banks allow the FPGA to interface directly to 5 V PCI slots without external buffers. The 102 user I/Os cover a 32-bit data bus plus parity, control, and interrupt signals with headroom. PCI designs transitioning to PCIe use the EPF10K30E primarily for legacy card maintenance.
Recomendado
Display and Video Timing Controllers
The EPF10K30ETC144-2 serves in industrial flat-panel timing controllers and legacy CRT/LCD controllers where the user needs precise multi-clock synchronization. Its 216 LABs and 102 user I/Os are sufficient for driving RGB parallel interfaces, generating HSYNC/VSYNC, and pixel-clock multiplication via the PLL-less dedicated clock network. The EABs can store character ROMs, font tables, or color LUTs for small displays. Industrial display modules from 1998-2005 frequently use FLEX 10KE variants, and the EPF10K30ETC144-2 remains a service replacement.
Recomendado
Test and Measurement Front-Ends
Test and measurement front-ends use the EPF10K30ETC144-2 for pattern generation, programmable trigger logic, and protocol-aware stimulus synthesis. Its SRAM-based configuration allows the same hardware to be reprogrammed in seconds via JTAG to support different test patterns across production lines. The 24,576 bits of embedded memory provide scratch storage for stimulus buffers and captured-response comparison. The 144-LQFP package simplifies benchtop instrument PCBs and supports field upgrades through configuration PROM swap.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30ETC144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30ETC144-1 | EPF10K30ETC144-3 | EPF10K30ATC144-2N | EPF10K30ATC144-3 | EPF10K30ATI144-2 | EPF10K30ATI144-3N |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP, 20x20 mm) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-TQFP - same | 144-TQFP - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | -2 (medium) | -1 (slow) | -3 (fast) | -2 (medium) | -3 (fast) | -2 (medium) | -3 (fast) |
| Family | FLEX 10KE | FLEX 10KE | FLEX 10KE | FLEX 10KA (older) | FLEX 10KA (older) | FLEX 10KE | FLEX 10KE |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C | 0C to +70C | 0C to +70C | 0C to +70C | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 (10KA) | 1,728 (10KA) | 1,728 | 1,728 |
| User I/Os (144-LQFP) | 102 | 102 | 102 | 102 | 102 | 102 | 102 |
| Embedded Memory Bits | 24,576 (EABs) | 24,576 | 24,576 | None (10KA has no EAB) | None (10KA has no EAB) | 24,576 | 24,576 |
| VCCINT (Core) | 2.5 V | 2.5 V | 2.5 V | 3.3 V (10KA) | 3.3 V (10KA) | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Embedded Array Blocks (EABs) for on-chip memory (vs EPF10K30ATC144-2N (older FLEX 10KA family))
- Industrial temperature grade option in same package (vs EPF10K30ETC144-2 (commercial 0-70C))
- Drop-in same-family alternative for legacy designs (vs EPF10K30ETC144-1 (slower speed grade))
- SRAM-based configuration supports field upgrades (vs FLEX 10KA with one-time-programmable (OTP) configuration)
Notas de projeto
The EPF10K30ETC144-2 requires both a 2.5 V VCCINT rail (range 2.375 V to 2.625 V) and per-bank VCCIO rails at 2.5 V, 3.3 V, or 5.0 V. Use a low-dropout regulator such as an LT1764A-2.5 for VCCINT, rated for at least 500 mA peak during configuration. Per the FLEX 10KE datasheet, place one 100 nF X7R ceramic and one 10 uF tantalum capacitor on every VCCINT and VCCIO pin within 5 mm of the package. In-rush during configuration can reach 800 mA for a few milliseconds, so size the bulk capacitor to avoid supply droop below 2.375 V.
Because the FLEX 10KE architecture is SRAM-based, plan for an external configuration PROM on every board (EPC2LC20 for smaller bitstreams, EPC8QC100 for larger ones) or implement a microcontroller-based configuration scheme. Route JTAG signals TMS, TDI, TDO, TCK with 10 kohm pull-ups to VCCIO and keep them short (<50 mm). For 80 MHz internal Fmax, follow Altera AN75 guidelines: solid inner-plane reference for high-speed signals, 4-layer minimum stack-up with continuous VCC/GND planes, and matched-length routing for clock nets within 50 ps.
Three common pitfalls: (1) Driving 5 V signals into VCCIO=3.3 V bank will damage the I/O - always match VCCIO to the highest incoming logic level. (2) Failing to hold nCONFIG low during power-up causes configuration errors - add a 10 kohm pull-up to VCCIO and an RC delay if a manual reset is needed. (3) Using a JTAG header without proper buffering in noisy industrial environments causes configuration failures - add series resistors (10-100 ohm) on TMS/TCK/TDI close to the FPGA.
Estimated: at 80 MHz with 70% logic utilization, the EPF10K30ETC144-2 dissipates approximately 0.4 W. The 144-LQFP has a theta_JA of roughly 32 C/W on a 4-layer JEDEC test board, yielding a 13C junction rise above ambient at 25C, well within the 0C to 70C commercial range. Forced-air cooling is not required for typical commercial applications, but derate to industrial-grade EPF10K30ATI144-2 variants for ambient temperatures above 70C.
Informações de conformidade
RoHS compliant per Altera/Intel product page. Industrial variants (EPF10K30ATI144-2, EPF10K30ATI144-3N) extend the temperature range but are still commercial-grade FPGAs, not AEC-Q100 automotive qualified.
