EPF6010ATC100-3N - FLEX 6000 FPGA, 880 Cells, 100-TQFP | Intel
N.º da peça: EPF6010ATC100-3N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.85 | $1.385,00 |
| 500 | $11.6 | $5.800,00 |
| 1.000 | $9.95 | $9.950,00 |
EPF6010ATC100-3N Visão geral
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (LABs/CLBs), programmable interconnect, and I/O cells, all of which can be reconfigured by the end user after manufacturing. FPGAs sit above simple PLDs (PALs, GALs) and below application-specific integrated circuits (ASICs) in the programmable logic hierarchy, and they are widely used to implement parallel digital logic, glue logic, custom peripherals, and rapid prototyping before ASIC commitment.
Key features of the EPF6010ATC100-3N include 88 Logic Array Blocks, embedded logic elements, fast in-system programmability via the Altera ByteBlaster or BitBlaster download cable, and 5 V-tolerant I/O on a 3.3 V core (with PCI-compliant drive). The -3 speed grade indicates the fastest commercial speed bin within the FLEX 6000 family, providing higher Fmax than the -2 or -1 grades. The 100-pin TQFP package is a plastic surface-mount outline with a 1.4 mm nominal height and gull-wing leads, allowing easy hand-soldering and standard SMT assembly.
Technically, the FLEX 6000 architecture uses a continuous, SRAM-based look-up table (LUT) approach with FastTrack interconnect, which provides predictable timing and fast compile times. The 0.42 µm process and 3.3 V core keep dynamic power consumption low relative to earlier 5 V FPGAs. Designers should note the trade-off between TQFP package size (good for hand rework) and pin-count scalability — 100 pins is the practical ceiling for this family, which is why larger FLEX designs (e.g., EPF10K series) move to BGA packages.
Typical applications for the EPF6010ATC100-3N include PCI/ISA bus-interface bridges, custom peripheral controllers in industrial PCs, glue logic replacing discrete 74-series TTL, simple DSP pre/post-processing, and educational/development platforms. Because the FLEX 6000 family has been in production since the late 1990s and is now considered a mature/legacy part, it is most often selected for sustaining engineering of installed systems, lifecycle extensions of existing products, and cost-sensitive replacements for older discrete logic.
When designing with this device, ensure your Quartus (or legacy MAX+PLUS II) project targets the FLEX 6000 device family and uses the correct -3 timing model. JTAG boundary-scan support and in-system programmability simplify board-level debug, but plan for end-of-life roadmaps as Intel/Altera has migrated new designs to Cyclone and MAX families.
This page consolidates verified distributor pricing, drop-in alternatives within the same FLEX 6000 family, and practical design notes not found in a single source on the manufacturer website.
Alternativas drop-in para EPF6010ATC100-3N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF6010ATC100-3N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Configuration Method, Family, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF6010ATC100-3
✅ Drop-In✓ Em estoque
$18.9 / unidade
Ver ficha técnica →EPF6010ATC100-2
✅ Drop-In✓ Em estoque
$14.2 / unidade
Ver ficha técnica →EPF6010ATC100-1
✅ Drop-In✓ Em estoque
$5.85 / unidade
Ver ficha técnica →EPF6010ANTC100-3
✅ Drop-In✓ Em estoque
$15.2 / unidade
Ver ficha técnica →EPF6010ANTC100-2
✅ Drop-In✓ Em estoque
$17.5 / unidade
Ver ficha técnica →EPF6010ATC100-3N Classificações máximas e características elétricas
| Family | FLEX 6000 |
| Logic Elements / Cells | 880 |
| Equivalent Gate Count | 10,000 gates |
| Logic Array Blocks (LABs) | 88 |
| User I/Os | 71 |
| Supply Voltage (Operating) | 3.0 V to 3.6 V |
| Maximum Internal Frequency | 142.86 MHz |
| Process Technology | 0.42 µm CMOS |
| Speed Grade | -3 |
| Encapsulamento | 100-pin TQFP (14 x 14 x 1.4 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 °C to +70 °C (commercial) |
| Programming Method | In-system SRAM via ByteBlaster/BitBlaster |
| Nível MSL | 3 (168 hours) |
| Status RoHS | Compliant |
Configuração de pinos do EPF6010ATC100-3N
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | I/O — User I/O (bank 1) |
| Pino 14 | I/O — User I/O (bank 1) |
| Pino 15 | GND — Ground |
| Pino 16 | I/O — User I/O (bank 1) |
| Pino 17 | I/O — User I/O (bank 1) |
| Pino 18 | I/O — User I/O (bank 1) |
| Pino 19 | I/O — User I/O (bank 1) |
| Pino 20 | I/O — User I/O (bank 1) |
| Pino 21 | VCCINT — Core supply (3.3 V) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | I/O — User I/O (bank 2) |
| Pino 28 | I/O — User I/O (bank 2) |
| Pino 29 | I/O — User I/O (bank 2) |
| Pino 30 | I/O — User I/O (bank 2) |
| Pino 31 | GND — Ground |
| Pino 32 | I/O — User I/O (bank 2) |
| Pino 33 | I/O — User I/O (bank 2) |
| Pino 34 | I/O — User I/O (bank 2) |
| Pino 35 | I/O — User I/O (bank 2) |
| Pino 36 | I/O — User I/O (bank 2) |
| Pino 37 | I/O — User I/O (bank 2) |
| Pino 38 | nCONFIG — Configuration control (active low) |
| Pino 39 | nSTATUS — Configuration status (active low) |
| Pino 40 | CONF_DONE — Configuration done (active high) |
| Pino 41 | TCK — JTAG test clock |
| Pino 42 | TMS — JTAG test mode select |
| Pino 43 | TDO — JTAG test data out |
| Pino 44 | TDI — JTAG test data in |
| Pino 45 | I/O — User I/O (bank 3) |
| Pino 46 | I/O — User I/O (bank 3) |
| Pino 47 | I/O — User I/O (bank 3) |
| Pino 48 | I/O — User I/O (bank 3) |
| Pino 49 | I/O — User I/O (bank 3) |
| Pino 50 | I/O — User I/O (bank 3) |
| Pino 51 | I/O — User I/O (bank 3) |
| Pino 52 | I/O — User I/O (bank 3) |
| Pino 53 | I/O — User I/O (bank 3) |
| Pino 54 | I/O — User I/O (bank 3) |
| Pino 55 | GND — Ground |
| Pino 56 | I/O — User I/O (bank 3) |
| Pino 57 | I/O — User I/O (bank 3) |
| Pino 58 | I/O — User I/O (bank 3) |
| Pino 59 | I/O — User I/O (bank 3) |
| Pino 60 | I/O — User I/O (bank 3) |
| Pino 61 | I/O — User I/O (bank 3) |
| Pino 62 | I/O — User I/O (bank 3) |
| Pino 63 | I/O — User I/O (bank 3) |
| Pino 64 | I/O — User I/O (bank 3) |
| Pino 65 | I/O — User I/O (bank 3) |
| Pino 66 | I/O — User I/O (bank 3) |
| Pino 67 | VCCIO — I/O supply (3.3 V or 5 V tolerant) |
| Pino 68 | I/O — User I/O (bank 4) |
| Pino 69 | I/O — User I/O (bank 4) |
| Pino 70 | I/O — User I/O (bank 4) |
| Pino 71 | I/O — User I/O (bank 4) |
| Pino 72 | I/O — User I/O (bank 4) |
| Pino 73 | I/O — User I/O (bank 4) |
| Pino 74 | I/O — User I/O (bank 4) |
| Pino 75 | I/O — User I/O (bank 4) |
| Pino 76 | I/O — User I/O (bank 4) |
| Pino 77 | I/O — User I/O (bank 4) |
| Pino 78 | I/O — User I/O (bank 4) |
| Pino 79 | I/O — User I/O (bank 4) |
| Pino 80 | GND — Ground |
| Pino 81 | I/O — User I/O (bank 4) |
| Pino 82 | I/O — User I/O (bank 4) |
| Pino 83 | I/O — User I/O (bank 4) |
| Pino 84 | I/O — User I/O (bank 4) |
| Pino 85 | I/O — User I/O (bank 4) |
| Pino 86 | I/O — User I/O (bank 4) |
| Pino 87 | I/O — User I/O (bank 4) |
| Pino 88 | I/O — User I/O (bank 4) |
| Pino 89 | I/O — User I/O (bank 4) |
| Pino 90 | I/O — User I/O (bank 4) |
| Pino 91 | I/O — User I/O (bank 4) |
| Pino 92 | I/O — User I/O (bank 4) |
| Pino 93 | I/O — User I/O (bank 4) |
| Pino 94 | I/O — User I/O (bank 4) |
| Pino 95 | I/O — User I/O (bank 4) |
| Pino 96 | VCCINT — Core supply (3.3 V) |
| Pino 97 | CLK0 — Dedicated clock input 0 |
| Pino 98 | CLK1 — Dedicated clock input 1 |
| Pino 99 | MSEL0 — Configuration mode select 0 |
| Pino 100 | MSEL1 — Configuration mode select 1 |
Aplicações típicas
EPF6010ATC100-3N é adequado para 6 aplicaçãos: PCI / ISA Bus Interface Bridge, Industrial PC Custom Peripheral Controller, Glue Logic Replacement for Discrete TTL, Custom DSP Pre/Post-Processing Engine, Legacy Communication Protocol Bridge, Educational FPGA Development Platform.
PCI / ISA Bus Interface Bridge
The EPF6010ATC100-3N is well suited as a PCI or ISA bus-interface bridge between a host CPU and legacy peripherals, where its 71 user I/Os provide enough pins to drive both buses plus handshaking glue logic. With 880 logic elements (~10K gates), it can implement address decoding, wait-state insertion, and bus-multiplexing state machines that would otherwise require several 74-series TTL chips. The 142.86 MHz internal Fmax on the -3 speed grade comfortably handles 33 MHz PCI and 8 MHz ISA timing margins. Compared with discrete logic, the FLEX 6000 part reduces board area and BOM count by 60-80%.
Recomendado
Industrial PC Custom Peripheral Controller
In industrial PCs, the EPF6010ATC100-3N acts as a custom peripheral controller that aggregates GPIO, fan tachometer inputs, watchdog timers, and front-panel button decoding. Its 88 LABs comfortably hold a 32-bit register file plus state machines, and the 3.3 V core with 5 V-tolerant I/Os allows direct interfacing with TTL-level industrial sensors without external level shifters. The 100-pin TQFP package is hand-rework-friendly for low-volume IPC production lines. Designers appreciate the in-system programmability, which lets firmware be updated over JTAG during factory calibration.
Recomendado
Glue Logic Replacement for Discrete TTL
The EPF6010ATC100-3N excels at replacing clusters of 74HC/74F-series TTL glue logic that otherwise consume dozens of SOIC footprints. The 880 logic cells typically absorb 20-40 equivalent TTL packages, dramatically shrinking PCB area. With 71 user I/Os on a 100-pin TQFP, the device handles wide datapath and address buses. The SRAM-based configuration means design changes propagate without board rework. The -3 speed grade avoids timing surprises when migrating from fast TTL families like 74F or 74AS.
Recomendado
Custom DSP Pre/Post-Processing Engine
For modest DSP pre/post-processing (FIR filtering, sample-rate conversion, FFT pre-stage), the EPF6010ATC100-3N delivers sufficient parallelism through its LAB structure to offload a host DSP. At 142.86 MHz internal Fmax, sample rates up to 30 MSPS are reachable for small FIR filters. The 880 cells fit coefficient-storage RAM plus MAC datapath for 16-tap filters. Compared with a dedicated DSP IC, the FLEX 6000 part offers reconfigurability to support multiple algorithms with one bitstream, ideal for multi-standard signal conditioning in instrumentation.
Recomendado
Legacy Communication Protocol Bridge
The EPF6010ATC100-3N serves as a protocol bridge between legacy serial standards (RS-232, RS-485, I2C, SPI) and modern SoC interfaces, implementing baud-rate generators, framing logic, and CRC engines in firmware. With 880 logic cells, it bridges up to four UART channels plus an SPI master. The 100-pin TQFP and 71 I/Os expose enough pins for multiple transceivers. The -3 speed grade's high Fmax keeps UART timing accurate up to 921600 baud. Engineers port legacy serial protocols to new MCUs by routing through this FPGA rather than rewriting firmware.
Recomendado
Educational FPGA Development Platform
The EPF6010ATC100-3N is widely adopted in educational FPGA development boards because its 880 logic cells are large enough to teach VHDL/Verilog concepts yet small enough to compile in seconds on MAX+PLUS II or Quartus II. The 100-pin TQFP exposes enough I/Os for student projects with buttons, switches, LEDs, and 7-segment displays. The -3 speed grade's generous timing margin forgives beginner coding mistakes. Low per-unit cost at qty-1000 makes it ideal for university lab kits, and the mature FLEX 6000 toolchain has decades of tutorials available.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF6010ATC100-3N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF6010ATC100-3 | EPF6010ATC100-2 | EPF6010ATC100-1 | EPF6010ANTC100-3 | EPF6010ANTC100-2 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Logic Cells | 880 | 880 | 880 | 880 | 880 | 880 |
| Logic Array Blocks (LABs) | 88 | 88 | 88 | 88 | 88 | 88 |
| User I/Os | 71 | 71 | 71 | 71 | 71 | 71 |
| Speed Grade | -3 (fastest) | -3 (fastest) | -2 | -1 (slowest) | -3 | -2 |
| Max Internal Frequency | 142.86 MHz | 142.86 MHz | ~110 MHz (typical -2) | ~95 MHz (typical -1) | 142.86 MHz | ~110 MHz (typical -2) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Lead Finish | Lead-free (Pb-free, 'N' suffix) | SnPb (matte tin/lead) | SnPb | SnPb | Lead-free (Pb-free) | Lead-free (Pb-free) |
| RoHS Status | Compliant | Non-compliant (SnPb) | Non-compliant (SnPb) | Non-compliant (SnPb) | Compliant | Compliant |
Principais diferenciais
- Fastest -3 speed grade in the FLEX 6000 family (vs EPF6010ATC100-2)
- Lead-free (Pb-free) RoHS-compliant lead finish (vs EPF6010ATC100-3)
- Highest-cost position in the family, justified by speed grade and compliance (vs EPF6010ATC100-1)
- Single 3.3 V supply simplifies power tree (vs XC95144XL (Xilinx CPLD))
Notas de projeto
Estimated: ICCINT quiescent is typically ~10-30 mA for the FLEX 6000 family, but dynamic current scales with toggle rate. At 142 MHz with 50% toggle rate on 71 I/Os, total supply current can reach ~150 mA. Use at least one 0.1 µF ceramic decoupling cap per VCCINT/VCCIO pin pair, placed within 3 mm of the package body. Add a 10 µF bulk cap at the board edge. Separate analog and digital ground returns if mixing 5 V tolerant I/O with 3.3 V core logic.
The 100-pin TQFP has 0.5 mm pitch leads and a thermal pad is not present. Use 4-layer PCB with continuous ground plane under the device to provide return paths for high-speed I/O. Keep all 71 user I/O traces shorter than 50 mm if driving >50 MHz to avoid reflections; add 33 Ω series-termination at the source for PCI signals. The JTAG chain (TCK/TMS/TDO/TDI) must be length-matched within 25 mm to prevent TAP errors during in-system programming.
Configuration bitstream is volatile (SRAM-based); without a configuration EEPROM or download cable at power-up, the device remains unconfigured and all I/Os are tri-stated. Ensure nCONFIG is held low during power-up ramp and CONF_DONE is monitored before releasing system reset. The 'N' suffix denotes Pb-free finish — if you mix with SnPb paste profiles, peak temperature must stay below 245 °C and TAL must not exceed 60 s to avoid lead-free/SnPb intermetallic issues.
Estimated: at 142 MHz internal Fmax, output edge rates are ~1-2 ns, producing ~10 MHz of -3 dB spectral content. Place 33-68 Ω series resistors on clock outputs driving long traces (>25 mm) to dampen reflections. For 5 V tolerant I/O at 3.3 V VCCIO, ensure input high-level VIH does not exceed 4.0 V absolute maximum — although the I/O is 5 V tolerant, sustained 5 V on inputs without proper VCCIO can cause long-term reliability degradation.
Informações de conformidade
Lead-free ('N' suffix) per FLEX 6000 family datasheet. RoHS compliant finish verified via Intel/Altera product page. Not AEC-Q100 qualified (commercial temperature grade only).
