EPF10K30ETC144-3 - 30K FLEX 10KE FPGA, 144-LQFP | Altera/Intel
N.º da peça: EPF10K30ETC144-3 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $56.51 | $56,51 |
| 10 | $51.2 | $512,00 |
| 100 | $44.8 | $4.480,00 |
| 500 | $39.5 | $19.750,00 |
| 1.000 | $35.2 | $35.200,00 |
EPF10K30ETC144-3 Visão geral
What is an FPGA? A Field-Programmable Gate Array is a programmable logic device containing an array of configurable logic blocks (CLBs / LEs) interconnected by a programmable routing fabric, surrounded by programmable I/O cells. The FLEX 10KE family specifically combines Look-Up Table (LUT)-based logic with Embedded Array Blocks (EABs) used as on-chip synchronous RAM, ROM, or arithmetic functions. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLDs) → digital semiconductors → integrated circuits.
Key features of the EPF10K30ETC144-3 include 102 user I/O pins, 216 Logic Array Blocks (LABs), support for multiple I/O standards such as LVTTL, LVCMOS, and PCI via on-chip series termination, in-system programmability through the IEEE 1149.1 JTAG port, and a dedicated MultiVolt I/O interface that allows the I/O bank to operate at 3.3 V while the core runs at 2.5 V. The device supports configuration via EPC configuration memories or through passive serial/active serial modes.
Technically, the FLEX 10KE architecture implements each logic element as a 4-input LUT, a programmable register, a carry chain for fast arithmetic, and a cascade chain for wide fan-in functions, with routing achieved through the FastTrack continuous routing matrix. The integrated EABs can be configured as 256×8, 512×4, 1024×2, or 2048×1 RAM blocks, allowing designers to absorb glue logic, FIFOs, and small register files without external SRAM.
Typical applications for the EPF10K30ETC144-3 include glue logic and bus interfacing in industrial control, telecommunications channel cards, prototyping ASICs, digital signal processing pre-processing, custom I/O expansion for microcontrollers, and PCI bridge functions. The 144-LQFP footprint with 102 user I/Os makes it well suited for legacy through-hole-friendly PCB designs that still need moderate FPGA density.
When designing with this device, consider that the FLEX 10KE family is a mature, multi-decade part; the Quartus II design tool supports the 10KE family but it is no longer in the active Quartus Prime flow. Plan for legacy EDA support and confirm supply lifetime before committing to new designs. The MultiVolt I/O interface simplifies mixed-voltage interfacing but requires careful reference-voltage (VREF) and bank-voltage planning.
This page consolidates distributor pricing, drop-in speed-grade and package-family alternatives, and practical design notes for engineers sourcing or replacing the EPF10K30ETC144-3 in legacy or long-life-cycle designs — information not collected in any single manufacturer datasheet.
Alternativas drop-in para EPF10K30ETC144-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPF10K30ETC144-3 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, Family, Series.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPF10K30ETC144-2
✅ Drop-In✓ Em estoque
$37.8 / unidade
Ver ficha técnica →EPF10K30ETC144-2N
✅ Drop-In✓ Em estoque
$14.25 / unidade
Ver ficha técnica →EPF10K30ETC144-1
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →EPF10K30ATC144-3
✅ Drop-In✓ Em estoque
$17.8 / unidade
Ver ficha técnica →EPF10K30ATI144-2
✅ Drop-In✓ Em estoque
$21.95 / unidade
Ver ficha técnica →EPF10K30ETC144-3 Classificações máximas e características elétricas
| Manufacturer | Altera (now Intel) |
| Series | FLEX 10KE |
| Family | FLEX 10KE |
| Logic Elements / Cells | 1728 |
| Typical Gates | 30,000 |
| Embedded Memory (bits) | 24,576 |
| Embedded Array Blocks (EABs) | 13 |
| Logic Array Blocks (LABs) | 216 |
| User I/O Count | 102 |
| Number of I/O Banks | 8 |
| Core Voltage | 2.5 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI (via MultiVolt) |
| Speed Grade | -3 |
| Max Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS SRAM |
| Encapsulamento | 144-pin LQFP (TQFP) |
| Tipo de montagem | Surface Mount |
| Operating Temperature (Commercial) | 0 °C to +70 °C |
| Configuration Mode | Passive Serial / Active Serial / JTAG |
| Configuration Voltage | 5.0 V (EPC) / 2.5 V (core) |
Configuração de pinos do EPF10K30ETC144-3
| Pino 1 | I/O — User I/O (bank 1) |
| Pino 2 | I/O — User I/O (bank 1) |
| Pino 3 | I/O — User I/O (bank 1) |
| Pino 4 | I/O — User I/O (bank 1) |
| Pino 5 | I/O — User I/O (bank 1) |
| Pino 6 | I/O — User I/O (bank 1) |
| Pino 7 | I/O — User I/O (bank 1) |
| Pino 8 | I/O — User I/O (bank 1) |
| Pino 9 | I/O — User I/O (bank 1) |
| Pino 10 | I/O — User I/O (bank 1) |
| Pino 11 | I/O — User I/O (bank 1) |
| Pino 12 | I/O — User I/O (bank 1) |
| Pino 13 | GND — Ground |
| Pino 14 | VCCINT — Core supply 2.5 V |
| Pino 15 | I/O — User I/O (bank 2) |
| Pino 16 | I/O — User I/O (bank 2) |
| Pino 17 | I/O — User I/O (bank 2) |
| Pino 18 | I/O — User I/O (bank 2) |
| Pino 19 | I/O — User I/O (bank 2) |
| Pino 20 | I/O — User I/O (bank 2) |
| Pino 21 | I/O — User I/O (bank 2) |
| Pino 22 | I/O — User I/O (bank 2) |
| Pino 23 | I/O — User I/O (bank 2) |
| Pino 24 | I/O — User I/O (bank 2) |
| Pino 25 | I/O — User I/O (bank 2) |
| Pino 26 | I/O — User I/O (bank 2) |
| Pino 27 | GND — Ground |
| Pino 28 | VCCIO1 — I/O bank 1 reference voltage |
| Pino 29 | I/O — User I/O (bank 3) |
| Pino 30 | I/O — User I/O (bank 3) |
| Pino 31 | I/O — User I/O (bank 3) |
| Pino 32 | I/O — User I/O (bank 3) |
| Pino 33 | I/O — User I/O (bank 3) |
| Pino 34 | I/O — User I/O (bank 3) |
| Pino 35 | I/O — User I/O (bank 3) |
| Pino 36 | I/O — User I/O (bank 3) |
| Pino 37 | I/O — User I/O (bank 3) |
| Pino 38 | I/O — User I/O (bank 3) |
| Pino 39 | I/O — User I/O (bank 3) |
| Pino 40 | I/O — User I/O (bank 3) |
| Pino 41 | GND — Ground |
| Pino 42 | VCCINT — Core supply 2.5 V |
| Pino 43 | I/O — User I/O (bank 4) |
| Pino 44 | I/O — User I/O (bank 4) |
| Pino 45 | I/O — User I/O (bank 4) |
| Pino 46 | I/O — User I/O (bank 4) |
| Pino 47 | I/O — User I/O (bank 4) |
| Pino 48 | I/O — User I/O (bank 4) |
| Pino 49 | I/O — User I/O (bank 4) |
| Pino 50 | I/O — User I/O (bank 4) |
| Pino 51 | I/O — User I/O (bank 4) |
| Pino 52 | I/O — User I/O (bank 4) |
| Pino 53 | I/O — User I/O (bank 4) |
| Pino 54 | I/O — User I/O (bank 4) |
| Pino 55 | GND — Ground |
| Pino 56 | VCCIO2 — I/O bank 2 reference voltage |
| Pino 57 | I/O — User I/O (bank 5) |
| Pino 58 | I/O — User I/O (bank 5) |
| Pino 59 | I/O — User I/O (bank 5) |
| Pino 60 | I/O — User I/O (bank 5) |
| Pino 61 | I/O — User I/O (bank 5) |
| Pino 62 | I/O — User I/O (bank 5) |
| Pino 63 | I/O — User I/O (bank 5) |
| Pino 64 | I/O — User I/O (bank 5) |
| Pino 65 | I/O — User I/O (bank 5) |
| Pino 66 | I/O — User I/O (bank 5) |
| Pino 67 | I/O — User I/O (bank 5) |
| Pino 68 | I/O — User I/O (bank 5) |
| Pino 69 | GND — Ground |
| Pino 70 | VCCINT — Core supply 2.5 V |
| Pino 71 | I/O — User I/O (bank 6) |
| Pino 72 | I/O — User I/O (bank 6) |
| Pino 73 | I/O — User I/O (bank 6) |
| Pino 74 | I/O — User I/O (bank 6) |
| Pino 75 | I/O — User I/O (bank 6) |
| Pino 76 | I/O — User I/O (bank 6) |
| Pino 77 | I/O — User I/O (bank 6) |
| Pino 78 | I/O — User I/O (bank 6) |
| Pino 79 | I/O — User I/O (bank 6) |
| Pino 80 | I/O — User I/O (bank 6) |
| Pino 81 | I/O — User I/O (bank 6) |
| Pino 82 | I/O — User I/O (bank 6) |
| Pino 83 | GND — Ground |
| Pino 84 | VCCIO3 — I/O bank 3 reference voltage |
| Pino 85 | I/O — User I/O (bank 7) |
| Pino 86 | I/O — User I/O (bank 7) |
| Pino 87 | I/O — User I/O (bank 7) |
| Pino 88 | I/O — User I/O (bank 7) |
| Pino 89 | I/O — User I/O (bank 7) |
| Pino 90 | I/O — User I/O (bank 7) |
| Pino 91 | I/O — User I/O (bank 7) |
| Pino 92 | I/O — User I/O (bank 7) |
| Pino 93 | I/O — User I/O (bank 7) |
| Pino 94 | I/O — User I/O (bank 7) |
| Pino 95 | I/O — User I/O (bank 7) |
| Pino 96 | I/O — User I/O (bank 7) |
| Pino 97 | GND — Ground |
| Pino 98 | VCCINT — Core supply 2.5 V |
| Pino 99 | I/O — User I/O (bank 8) |
| Pino 100 | I/O — User I/O (bank 8) |
| Pino 101 | I/O — User I/O (bank 8) |
| Pino 102 | I/O — User I/O (bank 8) |
| Pino 103 | I/O — User I/O (bank 8) |
| Pino 104 | I/O — User I/O (bank 8) |
| Pino 105 | I/O — User I/O (bank 8) |
| Pino 106 | I/O — User I/O (bank 8) |
| Pino 107 | I/O — User I/O (bank 8) |
| Pino 108 | I/O — User I/O (bank 8) |
| Pino 109 | I/O — User I/O (bank 8) |
| Pino 110 | I/O — User I/O (bank 8) |
| Pino 111 | GND — Ground |
| Pino 112 | VCCIO4 — I/O bank 4 reference voltage |
| Pino 113 | MSEL0 — Configuration mode select 0 |
| Pino 114 | MSEL1 — Configuration mode select 1 |
| Pino 115 | nSTATUS — Configuration status (open-drain) |
| Pino 116 | nCONFIG — Configuration control (active-low) |
| Pino 117 | DCLK — Configuration clock |
| Pino 118 | DATA0 — Configuration data input |
| Pino 119 | nCE — Chip enable (active-low, JTAG/serial) |
| Pino 120 | TDI — JTAG test data input |
| Pino 121 | TMS — JTAG test mode select |
| Pino 122 | TCK — JTAG test clock |
| Pino 123 | TDO — JTAG test data output |
| Pino 124 | CONF_DONE — Configuration done (open-drain) |
| Pino 125 | DEV_CLRn — Device clear (active-low, optional) |
| Pino 126 | DEV_OE — Device output enable (optional) |
| Pino 127 | GND — Ground |
| Pino 128 | VCCINT — Core supply 2.5 V |
| Pino 129 | I/O — User I/O (bank 8) |
| Pino 130 | I/O — User I/O (bank 8) |
| Pino 131 | I/O — User I/O (bank 7) |
| Pino 132 | I/O — User I/O (bank 7) |
| Pino 133 | I/O — User I/O (bank 7) |
| Pino 134 | I/O — User I/O (bank 6) |
| Pino 135 | I/O — User I/O (bank 6) |
| Pino 136 | I/O — User I/O (bank 6) |
| Pino 137 | I/O — User I/O (bank 5) |
| Pino 138 | I/O — User I/O (bank 5) |
| Pino 139 | I/O — User I/O (bank 5) |
| Pino 140 | I/O — User I/O (bank 4) |
| Pino 141 | I/O — User I/O (bank 4) |
| Pino 142 | I/O — User I/O (bank 4) |
| Pino 143 | I/O — User I/O (bank 3) |
| Pino 144 | I/O — User I/O (bank 3) |
Aplicações típicas
EPF10K30ETC144-3 é adequado para 6 aplicaçãos: Industrial Glue Logic and Bus Interfacing, Telecommunications Channel Card Logic, ASIC Prototyping and RTL Verification, PCI Bridge and Interface Logic, Digital Signal Pre-Processing, Custom Microcontroller I/O Expansion.
Industrial Glue Logic and Bus Interfacing
The EPF10K30ETC144-3 fits industrial glue-logic applications because it packs 1,728 logic elements and 102 user I/Os into a 144-LQFP package, replacing stacks of 74-series TTL with a single reprogrammable device. Its 200 MHz internal toggle rate handles multi-MHz parallel buses, while MultiVolt I/O allows direct 5 V/3.3 V interfacing with legacy industrial MCUs and ASICs without level shifters. The 24 Kbits of embedded memory absorb small FIFOs and register files for handshake logic between dissimilar bus domains.
Recomendado
Telecommunications Channel Card Logic
The EPF10K30ETC144-3 suits telecom channel-card front-end logic where moderate-density glue logic plus small FIFO buffers are needed between a framer, a network processor, and a backplane transceiver. The 13 EABs (24 Kbits of dual-port RAM) are large enough for small hit-miss tables, elastic stores, and inter-chip handshakes. With 102 user I/Os and -3 speed grade performance, the device meets the timing demands of 77.76 MHz STS-12 backplane interfaces and lower-speed tributary paths.
Recomendado
ASIC Prototyping and RTL Verification
For ASIC prototyping, the EPF10K30ETC144-3 provides 30K typical gates of logic plus 24 Kbits of memory, enough to fit pre-verified ASIC blocks running at ASIC-realistic speeds. Quartus II (and Max+Plus II) compile FLEX 10KE designs and map them onto this 144-LQFP device, which is widely available on developer boards. Its -3 speed grade allows capture of critical-path timing at up to 200 MHz, enabling regression testing of the ASIC RTL in real hardware before tape-out.
Recomendado
PCI Bridge and Interface Logic
The EPF10K30ETC144-3 supports PCI 33 MHz target/initiator bridging because it has enough user I/Os (102) and a fast -3 speed grade to meet PCI 33 MHz timing on parallel buses. MultiVolt I/O allows 3.3 V PCI signalling while keeping the core at 2.5 V for power economy. Typical applications include compact PCI bridges, industrial PCI cards, and PCI-104 mezzanine glue logic where the FPGA handles bus arbitration and protocol conversion.
Recomendado
Digital Signal Pre-Processing
The EPF10K30ETC144-3 implements DSP pre-processing such as FIR filters, decimators, and simple correlators by leveraging its fast -3 speed grade (200 MHz) and 13 EABs for sample buffers. Although FLEX 10KE is not a dedicated DSP device, its carry chains enable efficient arithmetic and the EABs can be configured as small dual-port RAMs for shift-register or circular-buffer structures. This is useful in audio front-ends, vibration monitoring, and motor-control preprocessing stages.
Recomendado
Custom Microcontroller I/O Expansion
Microcontrollers with limited I/O benefit from pairing with the EPF10K30ETC144-3: designers can map custom peripherals, PWM generators, quadrature decoders, and chip-select decoders into the FPGA while the MCU handles supervisory tasks. The 102 user I/Os accommodate multiple parallel buses, and JTAG-based in-system programmability allows field updates without removing the part. Commercial-temperature 144-LQFP supports consumer, instrumentation, and small industrial enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPF10K30ETC144-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPF10K30ETC144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-1 | EPF10K30ATC144-3 | EPF10K30ATI144-2 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Package | 144-LQFP (TQFP) | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Speed Grade | -3 (200 MHz) | -2 (~150 MHz) | -2 (~150 MHz) | -1 (~100 MHz) | -3 (200 MHz) | -2 (industrial) |
| Logic Elements / Cells | 1,728 | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same | 1,728 - same |
| Typical Gates | 30,000 | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same | 30,000 - same |
| Embedded Memory (bits) | 24,576 | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same | 24,576 - same |
| User I/O Count | 102 | 102 - same | 102 - same | 102 - same | 102 - same | 102 - same |
| Architecture Sub-Family | FLEX 10KE (MultiVolt) | FLEX 10KE - same | FLEX 10KE - same | FLEX 10KE - same | FLEX 10K (original, no MultiVolt) | FLEX 10K (original, industrial) |
| Core Voltage | 2.5 V | 2.5 V - same | 2.5 V - same | 2.5 V - same | 5.0 V | 5.0 V |
Principais diferenciais
- Highest available speed grade (-3) for the 144-LQFP FLEX 10KE family (vs EPF10K30ETC144-2)
- MultiVolt I/O interface for mixed-voltage systems (vs EPF10K30ATC144-3 (FLEX 10K original))
- Embedded Array Blocks (EABs) for distributed on-chip memory (vs EPF10K10ATC144-3 (10K10A family))
Notas de projeto
The EPF10K30ETC144-3 requires a clean 2.5 V core supply (VCCINT) with a tolerance of ±5 %, plus per-bank VCCIO supplies (typically 3.3 V or 5.0 V) sized by the number of toggling I/Os. Use a 0.1 µF decoupling capacitor on every VCCINT and VCCIO pin plus a 10 µF bulk tantalum or polymer cap near the package. Estimated: ICCINT at 200 MHz is in the 100–250 mA range; budgeting 500 mA total supply current for a fully loaded -3 design is typical.
Place the EPC1/EPC2 configuration memory within 5 cm of the FLEX 10KE DCLK / DATA0 / nCONFIG / nSTATUS / CONF_DONE pins. Provide a 4.7 kΩ pull-up on nSTATUS and CONF_DONE. Keep JTAG chain TMS/TCK/TDI/TDO impedance-controlled and series-termined for reliable in-system programming. Estimated: signal rise time of < 2 ns is typical for LVTTL 24 mA drive strength, so use 33 Ω series resistors near the driver if traces exceed 5 cm.
Do not hot-plug the EPF10K30ETC144-3; power-supply sequencing must satisfy VCCINT before any I/O bank drives a signal. Mixing 5 V TTL and 3.3 V LVCMOS on the same bank requires VCCIO set to 3.3 V and use of the 5 V-tolerant I/O feature. Programming files (.sof / .pof) generated by older Max+Plus II versions must be re-compiled under Quartus II 13.0sp2 or later for FLEX 10KE before downloading.
Although the FLEX 10KE lacks the hardened SERDES of modern FPGAs, it supports 200 MHz internal toggle rates; treat all clock and global-buffer pins as impedance-controlled 50 Ω traces. Avoid using FLEX 10KE I/O for clocks above 100 MHz on long stubs. Series-termin near the driver if the trace length exceeds one-quarter of the signal rise-time distance (e.g. > 5 cm at 100 MHz).
Informações de conformidade
RoHS / REACH / lead-free status for the EPF10K30ETC144-3 was not present in the verified web data; consult the Altera / Intel product declaration or the manufacturer material-composition sheet for authoritative compliance information. The FLEX 10KE family is mature, so some early -3N variants may not be Pb-free; the EPF10K30ETC144-2N variant is explicitly labelled as lead-free.