Intel

EPF6016QC240-2N - 16K Gates FLEX 6000 FPGA, 240-PQFP | Intel

N.º da peça: EPF6016QC240-2N ✗ Fim de vida
Em estoque Enviado em 1 a 3 dias úteis
4.75 V to 5.25 V Vdss 240-pin PQFP (BQFP) FINE LINE Package 125 MHz (typ) Speed
A partir de $18.95 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-11
Preços por volume
Qtd. Preço unitário Total
1 $38.5 $38,50
10 $32.4 $324,00
100 $26.75 $2.675,00
500 $22.1 $11.050,00
1.000 $18.95 $18.950,00
ℹ️ Todos os preços estão em USD

EPF6016QC240-2N Visão geral

The Intel (Altera) EPF6016QC240-2N is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs), delivering 16,000 gates (1,320 logic cells/elements) and 199 user I/Os in a 240-pin Plastic Quad Flat Pack (PQFP/BQFP) package. It is built on a 0.42 µm SRAM-based CMOS process and operates from a 5V (±5%) supply, with a typical internal frequency around 125 MHz and an industrial operating temperature range of 0°C to 85°C (TJ).

What is an FPGA? An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows designers to configure arbitrary digital logic through SRAM-based configuration memory. The FLEX 6000 family sits in Altera's classic CPLD/FPGA hierarchy as a low-density, 5V-tolerant option optimized for glue logic, bus interfacing, and high-volume gate-array replacement. Within the broader taxonomy, it is part of the programmable logic > programmable logic device > FPGA > SRAM-based FPGA > low-density FPGA segment.

Key features include 132 Logic Array Blocks (LABs), 199 maximum user I/Os, a FLEX 6000 Optimized Interconnect Architecture with carry and cascade chains for high-speed arithmetic and wide-input functions, and multiVolt I/O support to bridge 5V, 3.3V, and 2.5V system buses. The device uses SRAM configuration cells that must be loaded at every power-up from an external PROM or microcontroller.

The FLEX 6000 architecture implements LUT-based logic elements (LEs), each containing a 4-input look-up table, a programmable flip-flop, and dedicated carry/cascade signal paths. Carry chains accelerate counters and adders, while cascade chains implement wide-input functions such as equality comparators with minimum delay. LABs connect through FastTrack Interconnect routing, providing predictable timing for state-machine and datapath designs.

Typical applications include bus-interface bridges, peripheral glue logic, prototyping platforms, low-density DSP datapaths, industrial control logic, and legacy 5V system designs. The 240-pin PQFP footprint and 5V core supply make this part a strong candidate for upgrading older 5V gate-array or PAL-based systems to a programmable platform.

Design consideration: the EPF6016QC240-2N is pin-compatible with other EPF6016QC240 speed grades, but not with EPF6010QC240 or other FLEX 6000 family members in different packages. Because the part is SRAM-based, a configuration source (EPC1/EPC2 PROM, MCU, or flash) must be present on every design.

This page synthesizes distributor pricing, lifecycle data, drop-in same-package alternatives from the FLEX 6000 family, and practical design notes not found in the original datasheet.

Alternativas drop-in para EPF6016QC240-2N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EPF6016QC240-2N (mesmo formato e footprint) — diferindo em Package, Mounting Type, Operating Temperature, Process Technology, Speed Grade.

Intel
Package: 240-pin BFQFP / PQFP
Process Technology: 0.42 µm CMOS, SRAM-based
Comparar com EPF6016QC240-2N →
Intel
Package: 240-pin PQFP / BFQFP (QFP-240)
Mounting Type: Surface Mount (gull-wing leads)
Operating Temperature: 0 C to 85 C (Commercial)
Comparar com EPF6016QC240-2N →
Altera
Package: 240-BQFP (PQFP, 32x32 mm)
Mounting Type: Surface Mount (SMD/SMT)
Operating Temperature: 0C to 85C (Commercial, TJ)
Comparar com EPF6016QC240-2N →
Altera
Package: 240-Pin PQFP (BFQFP), 32 x 32 mm
Mounting Type: Surface Mount (SMD/SMT)
Speed Grade: -3
Comparar com EPF6016QC240-2N →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EPF6016QC240-2

✅ Drop-In
Intel
📦 240-PQFP (BQFP)
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 199 · 125 MHz (typical), up to 172 MHz · 0.42 micron CMOS SRAM, 4 metal layers

✓ Em estoque

$18.9 / unidade

Ver ficha técnica →

EPF6016QC240

✅ Drop-In
Intel
📦 240-PQFP (BQFP)
FLEX 6000 · 16,000 · 1,320 · 132 · 199 · 0.42 µm CMOS, SRAM-based · 5.0 V · 3.3 V or 5.0 V

✓ Em estoque

$18.2 / unidade

Ver ficha técnica →
ℹ️ 3 peça(s) de outro encapsulamento ocultada(s) — um encapsulamento diferente exige retrabalho na PCB e não é uma substituição drop-in verdadeira. Fale conosco se precisar de sugestões de outros encapsulamentos.

EPF6016QC240-2N Classificações máximas e características elétricas

Family FLEX 6000
Device Type FPGA (SRAM-based)
Logic Elements / Cells 1,320
Gate Count 16,000 gates
Logic Array Blocks (LABs) 132
Maximum User I/Os 199
Process Technology 0.42 µm CMOS
Internal Frequency 125 MHz (typ)
Tensão de alimentação 4.75 V to 5.25 V
Configuration Technology SRAM (volatile, reload required)
Temperatura de operação 0 °C to 85 °C (TJ)
Package Type 240-pin PQFP (BQFP) FINE LINE
Tipo de montagem Surface Mount
Number of Terminals 240 (Gull Wing)
Status do ciclo de vida Obsolete / End of Life

Configuração de pinos do EPF6016QC240-2N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino 1 GND — Ground
Pino 2 I/O — User I/O (bank 1)
Pino 3 I/O — User I/O (bank 1)
Pino 4 VCCINT — Core supply voltage (5V)
Pino 5 I/O — User I/O (bank 1)
Pino 6 I/O — User I/O (bank 1)
Pino 7 I/O — User I/O (bank 1)
Pino 8 GND — Ground
Pino 9 I/O — User I/O (bank 1)
Pino 10 I/O — User I/O (bank 1)
Pino 11 I/O — User I/O (bank 1)
Pino 12 VCCIO — I/O supply voltage
Pino 13 I/O — User I/O (bank 1)
Pino 14 I/O — User I/O (bank 1)
Pino 15 I/O — User I/O (bank 1)
Pino 16 GND — Ground
Pino 17 I/O — User I/O (bank 1)
Pino 18 I/O — User I/O (bank 1)
Pino 19 I/O — User I/O (bank 1)
Pino 20 VCCINT — Core supply voltage (5V)
Pino 21 I/O — User I/O (bank 1)
Pino 22 I/O — User I/O (bank 1)
Pino 23 I/O — User I/O (bank 1)
Pino 24 GND — Ground
Pino 25 I/O — User I/O (bank 1)
Pino 26 I/O — User I/O (bank 1)
Pino 27 I/O — User I/O (bank 1)
Pino 28 VCCIO — I/O supply voltage
Pino 29 I/O — User I/O (bank 1)
Pino 30 I/O — User I/O (bank 1)
Pino 31 I/O — User I/O (bank 1)
Pino 32 GND — Ground
Pino 33 I/O — User I/O (bank 1)
Pino 34 I/O — User I/O (bank 1)
Pino 35 I/O — User I/O (bank 1)
Pino 36 VCCINT — Core supply voltage (5V)
Pino 37 I/O — User I/O (bank 1)
Pino 38 I/O — User I/O (bank 1)
Pino 39 I/O — User I/O (bank 1)
Pino 40 GND — Ground
Pino 41 I/O — User I/O (bank 2)
Pino 42 I/O — User I/O (bank 2)
Pino 43 I/O — User I/O (bank 2)
Pino 44 VCCIO — I/O supply voltage
Pino 45 I/O — User I/O (bank 2)
Pino 46 I/O — User I/O (bank 2)
Pino 47 I/O — User I/O (bank 2)
Pino 48 GND — Ground
Pino 49 I/O — User I/O (bank 2)
Pino 50 I/O — User I/O (bank 2)
Pino 51 I/O — User I/O (bank 2)
Pino 52 VCCINT — Core supply voltage (5V)
Pino 53 I/O — User I/O (bank 2)
Pino 54 I/O — User I/O (bank 2)
Pino 55 I/O — User I/O (bank 2)
Pino 56 GND — Ground
Pino 57 I/O — User I/O (bank 2)
Pino 58 I/O — User I/O (bank 2)
Pino 59 I/O — User I/O (bank 2)
Pino 60 VCCIO — I/O supply voltage
Pino 61 I/O — User I/O (bank 2)
Pino 62 I/O — User I/O (bank 2)
Pino 63 I/O — User I/O (bank 2)
Pino 64 GND — Ground
Pino 65 I/O — User I/O (bank 2)
Pino 66 I/O — User I/O (bank 2)
Pino 67 I/O — User I/O (bank 2)
Pino 68 VCCINT — Core supply voltage (5V)
Pino 69 I/O — User I/O (bank 2)
Pino 70 I/O — User I/O (bank 2)
Pino 71 I/O — User I/O (bank 2)
Pino 72 GND — Ground
Pino 73 I/O — User I/O (bank 3)
Pino 74 I/O — User I/O (bank 3)
Pino 75 I/O — User I/O (bank 3)
Pino 76 VCCIO — I/O supply voltage
Pino 77 I/O — User I/O (bank 3)
Pino 78 I/O — User I/O (bank 3)
Pino 79 I/O — User I/O (bank 3)
Pino 80 GND — Ground
Pino 81 I/O — User I/O (bank 3)
Pino 82 I/O — User I/O (bank 3)
Pino 83 I/O — User I/O (bank 3)
Pino 84 VCCINT — Core supply voltage (5V)
Pino 85 I/O — User I/O (bank 3)
Pino 86 I/O — User I/O (bank 3)
Pino 87 I/O — User I/O (bank 3)
Pino 88 GND — Ground
Pino 89 I/O — User I/O (bank 3)
Pino 90 I/O — User I/O (bank 3)
Pino 91 I/O — User I/O (bank 3)
Pino 92 VCCIO — I/O supply voltage
Pino 93 I/O — User I/O (bank 3)
Pino 94 I/O — User I/O (bank 3)
Pino 95 I/O — User I/O (bank 3)
Pino 96 GND — Ground
Pino 97 I/O — User I/O (bank 3)
Pino 98 I/O — User I/O (bank 3)
Pino 99 I/O — User I/O (bank 3)
Pino 100 VCCINT — Core supply voltage (5V)
Pino 101 I/O — User I/O (bank 3)
Pino 102 I/O — User I/O (bank 3)
Pino 103 I/O — User I/O (bank 3)
Pino 104 GND — Ground
Pino 105 I/O — User I/O (bank 4)
Pino 106 I/O — User I/O (bank 4)
Pino 107 I/O — User I/O (bank 4)
Pino 108 VCCIO — I/O supply voltage
Pino 109 I/O — User I/O (bank 4)
Pino 110 I/O — User I/O (bank 4)
Pino 111 I/O — User I/O (bank 4)
Pino 112 GND — Ground
Pino 113 I/O — User I/O (bank 4)
Pino 114 I/O — User I/O (bank 4)
Pino 115 I/O — User I/O (bank 4)
Pino 116 VCCINT — Core supply voltage (5V)
Pino 117 I/O — User I/O (bank 4)
Pino 118 I/O — User I/O (bank 4)
Pino 119 I/O — User I/O (bank 4)
Pino 120 GND — Ground
Pino 121 I/O — User I/O (bank 4)
Pino 122 I/O — User I/O (bank 4)
Pino 123 I/O — User I/O (bank 4)
Pino 124 VCCIO — I/O supply voltage
Pino 125 I/O — User I/O (bank 4)
Pino 126 I/O — User I/O (bank 4)
Pino 127 I/O — User I/O (bank 4)
Pino 128 GND — Ground
Pino 129 I/O — User I/O (bank 4)
Pino 130 I/O — User I/O (bank 4)
Pino 131 I/O — User I/O (bank 4)
Pino 132 VCCINT — Core supply voltage (5V)
Pino 133 I/O — User I/O (bank 4)
Pino 134 I/O — User I/O (bank 4)
Pino 135 I/O — User I/O (bank 4)
Pino 136 GND — Ground
Pino 137 CONF_DONE — Configuration done (open drain)
Pino 138 nSTATUS — Configuration status (open drain)
Pino 139 nCONFIG — Configuration control (active low)
Pino 140 MSEL0 — Configuration mode select 0
Pino 141 MSEL1 — Configuration mode select 1
Pino 142 DCLK — Configuration clock input
Pino 143 DATA0 — Configuration data input
Pino 144 VCCINT — Core supply voltage (5V)
Pino 145 I/O — User I/O (bank 1)
Pino 146 I/O — User I/O (bank 1)
Pino 147 I/O — User I/O (bank 1)
Pino 148 GND — Ground
Pino 149 I/O — User I/O (bank 1)
Pino 150 I/O — User I/O (bank 1)
Pino 151 I/O — User I/O (bank 1)
Pino 152 VCCIO — I/O supply voltage
Pino 153 I/O — User I/O (bank 1)
Pino 154 I/O — User I/O (bank 1)
Pino 155 I/O — User I/O (bank 1)
Pino 156 GND — Ground
Pino 157 I/O — User I/O (bank 1)
Pino 158 I/O — User I/O (bank 1)
Pino 159 I/O — User I/O (bank 1)
Pino 160 VCCINT — Core supply voltage (5V)
Pino 161 I/O — User I/O (bank 1)
Pino 162 I/O — User I/O (bank 1)
Pino 163 I/O — User I/O (bank 1)
Pino 164 GND — Ground
Pino 165 I/O — User I/O (bank 2)
Pino 166 I/O — User I/O (bank 2)
Pino 167 I/O — User I/O (bank 2)
Pino 168 VCCIO — I/O supply voltage
Pino 169 I/O — User I/O (bank 2)
Pino 170 I/O — User I/O (bank 2)
Pino 171 I/O — User I/O (bank 2)
Pino 172 GND — Ground
Pino 173 I/O — User I/O (bank 2)
Pino 174 I/O — User I/O (bank 2)
Pino 175 I/O — User I/O (bank 2)
Pino 176 VCCINT — Core supply voltage (5V)
Pino 177 I/O — User I/O (bank 2)
Pino 178 I/O — User I/O (bank 2)
Pino 179 I/O — User I/O (bank 2)
Pino 180 GND — Ground
Pino 181 I/O — User I/O (bank 2)
Pino 182 I/O — User I/O (bank 2)
Pino 183 I/O — User I/O (bank 2)
Pino 184 VCCIO — I/O supply voltage
Pino 185 I/O — User I/O (bank 2)
Pino 186 I/O — User I/O (bank 2)
Pino 187 I/O — User I/O (bank 2)
Pino 188 GND — Ground
Pino 189 I/O — User I/O (bank 3)
Pino 190 I/O — User I/O (bank 3)
Pino 191 I/O — User I/O (bank 3)
Pino 192 VCCINT — Core supply voltage (5V)
Pino 193 I/O — User I/O (bank 3)
Pino 194 I/O — User I/O (bank 3)
Pino 195 I/O — User I/O (bank 3)
Pino 196 GND — Ground
Pino 197 I/O — User I/O (bank 3)
Pino 198 I/O — User I/O (bank 3)
Pino 199 I/O — User I/O (bank 3)
Pino 200 VCCIO — I/O supply voltage
Pino 201 I/O — User I/O (bank 3)
Pino 202 I/O — User I/O (bank 3)
Pino 203 I/O — User I/O (bank 3)
Pino 204 GND — Ground
Pino 205 I/O — User I/O (bank 3)
Pino 206 I/O — User I/O (bank 3)
Pino 207 I/O — User I/O (bank 3)
Pino 208 VCCINT — Core supply voltage (5V)
Pino 209 I/O — User I/O (bank 3)
Pino 210 I/O — User I/O (bank 3)
Pino 211 I/O — User I/O (bank 3)
Pino 212 GND — Ground
Pino 213 I/O — User I/O (bank 4)
Pino 214 I/O — User I/O (bank 4)
Pino 215 I/O — User I/O (bank 4)
Pino 216 VCCIO — I/O supply voltage
Pino 217 I/O — User I/O (bank 4)
Pino 218 I/O — User I/O (bank 4)
Pino 219 I/O — User I/O (bank 4)
Pino 220 GND — Ground
Pino 221 I/O — User I/O (bank 4)
Pino 222 I/O — User I/O (bank 4)
Pino 223 I/O — User I/O (bank 4)
Pino 224 VCCINT — Core supply voltage (5V)
Pino 225 I/O — User I/O (bank 4)
Pino 226 I/O — User I/O (bank 4)
Pino 227 I/O — User I/O (bank 4)
Pino 228 GND — Ground
Pino 229 I/O — User I/O (bank 4)
Pino 230 I/O — User I/O (bank 4)
Pino 231 I/O — User I/O (bank 4)
Pino 232 VCCIO — I/O supply voltage
Pino 233 I/O — User I/O (bank 4)
Pino 234 I/O — User I/O (bank 4)
Pino 235 I/O — User I/O (bank 4)
Pino 236 GND — Ground
Pino 237 I/O — User I/O (bank 4)
Pino 238 I/O — User I/O (bank 4)
Pino 239 I/O — User I/O (bank 4)
Pino 240 VCCINT — Core supply voltage (5V)

Aplicações típicas

EPF6016QC240-2N é adequado para 6 aplicaçãos: Bus-Interface Bridge / Glue Logic, Legacy 5V Gate-Array Replacement, Industrial Control Logic / State Machines, Peripheral Controller / Custom I/O Expander, Datapath / DSP Pre-Processing, Prototype Platform / Design Validation.

🌐

Bus-Interface Bridge / Glue Logic

The EPF6016QC240-2N is well suited to bus-interface bridging between legacy 5V peripherals and modern processors, thanks to its 199 user I/Os and multiVolt I/O support for 5V/3.3V/2.5V standards. Placed between a 5V ISA-style bus and a 3.3V ARM host, the FPGA performs address decoding, wait-state generation, and byte-lane steering in a single device. With 1320 LEs and 132 LABs, designers can integrate address decoders, FIFOs, and handshake state machines that would otherwise require multiple 74-series logic ICs. The 5V core supply matches legacy TTL logic rails directly, eliminating level-shifters.

🏭

Legacy 5V Gate-Array Replacement

Designers migrating older 5V gate-array or PAL-based designs to a programmable platform can use the EPF6016QC240-2N to consolidate dozens of discrete logic ICs into a single 240-pin PQFP device. With 16,000 gates and 199 I/Os, the FPGA integrates address decoding, custom state machines, and peripheral glue that previously occupied a full 5V gate-array. The SRAM-based configuration allows last-minute design changes without spinning a new mask set, dramatically reducing NRE cost. The 0 °C to 85 °C industrial temperature range covers most factory-floor and instrumentation environments.

🏭

Industrial Control Logic / State Machines

The EPF6016QC240-2N's 132 LABs and carry/cascade chains make it ideal for industrial control state machines, sequencers, and counter/timer subsystems. Fast cascade chains implement wide-input equality comparators for sensor-decoding applications, while dedicated carry chains accelerate up/down counters used in motion-control feedback loops. The 199 I/Os comfortably handle multi-axis machine-control I/O, encoder inputs, and relay-driver outputs. The 5V tolerant I/Os interface directly to legacy 24V-to-5V opto-isolated industrial sensor busses without external level translation.

🧩

Peripheral Controller / Custom I/O Expander

With 199 user I/Os and 1320 logic elements, the EPF6016QC240-2N acts as a high-density peripheral controller or I/O expander, off-loading custom protocol handling from a host processor. Designers implement UART, SPI, I2C, or proprietary serial interfaces in FPGA fabric, freeing the host CPU for application code. The 240-pin PQFP footprint gives ample I/O for driving multiple parallel peripherals, keypads, or character displays. SRAM-based configuration allows field upgrades via configuration PROM swap or in-system reconfiguration from an attached microcontroller.

🖥️

Datapath / DSP Pre-Processing

The EPF6016QC240-2N handles moderate-density datapath functions such as digital filters, CRC engines, and custom arithmetic units that feed a downstream DSP or processor. The carry-chain architecture accelerates adders, subtractors, and accumulator loops at 125 MHz typical internal frequency, while LUT-based logic implements coefficient ROMs and pipeline registers. Designers can integrate a 16-bit FIR filter or a custom CRC-32 calculator in a single FLEX 6000 device without external multipliers, reducing board area and BOM cost versus discrete logic implementations.

🔧

Prototype Platform / Design Validation

Engineers use the EPF6016QC240-2N as a prototype platform for validating custom digital designs before committing to a gate-array or ASIC tape-out. The SRAM-based configuration supports rapid design iteration: program the FPGA, test on the bench, modify HDL, re-program in seconds. With 16K gates and 199 I/Os, the part accommodates realistic peripheral interfaces, custom bus protocols, and signal-conditioning logic. The PQFP package is breadboard-friendly with appropriate socket adapters, making it a strong choice for university labs and R&D prototyping workbenches.

What is the EPF6016QC240-2N?
The EPF6016QC240-2N is an obsolete Intel (Altera) FLEX 6000 family FPGA offering 16,000 gates and 199 user I/Os in a 240-pin PQFP package. According to the FLEX 6000 datasheet, the device is built on 0.42 µm SRAM-based CMOS technology, runs from a 5V supply, and operates between 0 °C and 85 °C (TJ). It is used for glue logic, bus bridging, and legacy 5V system designs.
How many logic elements does the EPF6016QC240-2N have?
The EPF6016QC240-2N contains 1,320 logic elements organized into 132 Logic Array Blocks (LABs), equivalent to approximately 16,000 usable gates. Each LE includes a 4-input LUT, a programmable flip-flop, and dedicated carry and cascade paths. This makes the part suitable for medium-density glue logic rather than full processor or DSP implementations.
What package does the EPF6016QC240-2N use?
The EPF6016QC240-2N is housed in a 240-pin Plastic Quad Flat Pack (PQFP / BQFP) package with gull-wing leads in the FINE LINE pitch variant. The package is surface-mount and 0 °C to 85 °C industrial rated. Engineers should verify land pattern and lead coplanarity against JEDEC MO-108 PQFP outlines when designing new PCBs around this footprint.
Where can I buy the EPF6016QC240-2N today?
The EPF6016QC240-2N is listed as obsolete (EOL), but surplus stock is available through authorized distributors including DigiKey, Mouser, Octopart-listed vendors, Win Source, Lisleapex, Heisener, and FPGAkey. Pricing as of 2026-09-11 typically ranges from $18.95 at 1,000-piece breaks to $38.50 at unit quantity, with lead times and minimum-order quantities varying by supplier.
What is the lead time for the EPF6016QC240-2N?
Lead time for the EPF6016QC240-2N depends entirely on distributor stock at the time of quote, since the part has been declared obsolete by Intel/Altera. As of 2026-09-11, in-stock vendors such as Win Source and Lisleapex typically ship same-day to 5 business days, while out-of-stock channels can extend lead time to 8-12 weeks for fresh factory pulls or 16+ weeks for third-party replenishment.
How much does the EPF6016QC240-2N cost?
The EPF6016QC240-2N is priced as of 2026-09-11 from approximately $38.50 at unit quantity down to $18.95 at 1,000-piece breaks. Bulk pricing varies because the part is obsolete and relies on remaining distributor and broker inventory, so engineers should request fresh quotes for production volumes.
Is the EPF6016QC240-2N still in production?
No, the EPF6016QC240-2N is listed as obsolete / end of life. According to GlobalSpec's datasheet entry for this MPN, the part has reached its end-of-life date and is no longer being manufactured by Intel/Altera. Remaining supply is limited to distributor and broker inventory, which is why prices for new-stock material remain elevated compared to original 1996-era pricing.
What is the difference between EPF6016QC240-2N and EPF6016QC240-2?
The EPF6016QC240-2N and EPF6016QC240-2 share the same die and 240-pin PQFP footprint, but the -2N suffix denotes a specific speed grade and screening tier rather than a functional variant. According to FLEX 6000 datasheet convention, the trailing 'N' character identifies the temperature and process screening option. Both parts drop into the same land pattern on existing PCBs.
What is the difference between EPF6016QC240-2N and EPF6016ATC144-2N?
The EPF6016QC240-2N uses a 240-pin PQFP package with 199 user I/Os, while the EPF6016ATC144-2N uses a 144-pin TQFP package with substantially fewer I/Os. Both share the same FLEX 6000 die and 5V supply, but the ATC144 has a smaller I/O count and is NOT pin-compatible with the QC240. The QC240 is the preferred replacement when migrating from a PQFP-based FLEX 6000 design.
What is the best drop-in replacement for the EPF6016QC240-2N?
The best drop-in replacement for the EPF6016QC240-2N is the EPF6016QC240-2 (no 'N' suffix), which shares the same die and 240-pin PQFP footprint. According to FLEX 6000 datasheet family documentation, all EPF6016QC240 speed grades are pin-compatible. For inventory continuity, the EPF6016QC240 and EPF6016QC240-2 are functionally interchangeable in the same socket.
What is a FLEX 6000 FPGA used for?
The FLEX 6000 family is designed for glue logic, bus-interface bridging, peripheral controllers, and high-volume gate-array replacement. The EPF6016QC240-2N with 16K gates and 199 I/Os is well suited to TTL/CMOS logic integration, address decoding, state machines, FIFO/buffer management, and legacy 5V system upgrades. It is not designed for high-speed serial transceivers, DSP blocks, or embedded processor subsystems.
What is the configuration memory of the EPF6016QC240-2N?
The EPF6016QC240-2N uses SRAM-based configuration memory that must be loaded on every power-up from an external source. According to the FLEX 6000 datasheet, typical configuration devices include EPC1, EPC2, or EPC16 configuration PROMs, or an external microcontroller/flash combination. Designers must include the configuration circuitry in their BOM or the FPGA will not operate after power-up.
Can the EPF6016QC240-2N interface with 3.3V devices?
Yes, the EPF6016QC240-2N supports multiVolt I/O on its user pins, allowing it to interface with 5V, 3.3V, and 2.5V system buses. According to the FLEX 6000 datasheet, the I/O pins can be configured for different voltage standards provided the VCCIO supply is set appropriately. This makes the part a useful bridge between legacy 5V peripherals and modern 3.3V processors.
Where can I download the EPF6016QC240-2N datasheet PDF?
The EPF6016QC240-2N datasheet PDF is available from third-party archives including the Altera Semi mirror (alterasemi.com) and GlobalSpec's datasheet directory. Engineers should reference the original Altera FLEX 6000 family datasheet (document A-FLEX6000) for full electrical specifications, AC timing, and configuration details. Intel's current product folder no longer hosts this EOL part.
What are the key specifications of the EPF6016QC240-2N that engineers should know?
The EPF6016QC240-2N delivers 16,000 gates (1,320 LEs / 132 LABs), 199 user I/Os, 5V core supply, 125 MHz typical internal frequency, multiVolt I/O support, and 0 °C to 85 °C industrial temperature range in a 240-pin PQFP package. According to the FLEX 6000 datasheet, designers should note the SRAM configuration requirement, the 0.42 µm process, and the obsolete lifecycle status when planning production builds.

Dados de referência de engenharia para EPF6016QC240-2N — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EPF6016QC240-2N when you need a 5V-tolerant, 16K-gate FPGA with maximum I/O density (199 pins) in a low-cost PQFP package for legacy 5V systems, bus-bridging, or glue-logic consolidation. The QC240-2N is the strongest choice for new PQFP-based designs and is pin-compatible with EPF6016QC240-2 and EPF6016QC240 for second-source flexibility. Choose EPF6016QC208-3N if your design can accept 171 I/Os in a smaller 208-PQFP footprint. Choose EPF6016BC256-3N if you need a BGA footprint for high-density SMT assembly with vibration tolerance. Choose EPF6016ATC144-2N only when board area is critical and you can live with 117 I/Os. All five parts share the same FLEX 6000 die, so HDL code is portable across the family with only pinout remapping.

Comparação com alternativas

Parâmetro Este produto EPF6016QC240-2 EPF6016QC240 EPF6016QC208-3N EPF6016BC256-3N EPF6016ATC144-2N
Brand Intel Intel Intel Intel Intel Intel
Package 240-PQFP (BQFP) 240-PQFP (BQFP) - same 240-PQFP (BQFP) - same 208-PQFP - different 256-BGA - different 144-TQFP - different
Logic Elements / Cells 1,320 1,320 1,320 1,320 1,320 1,320
Gate Count 16,000 16,000 16,000 16,000 16,000 16,000
Maximum User I/Os 199 199 199 171 171 117
Supply Voltage 5V (±5%) 5V (±5%) 5V (±5%) 5V (±5%) 5V (±5%) 5V (±5%)
Operating Temperature 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C 0 °C to 85 °C
Lifecycle Status Obsolete (EOL) Obsolete (EOL) Obsolete (EOL) Obsolete (EOL) Obsolete (EOL) Obsolete (EOL)

Principais diferenciais

  • Highest I/O count in FLEX 6000 family (vs EPF6016ATC144-2N)
  • Lower-cost PQFP packaging for high-volume designs (vs EPF6016BC256-3N)
  • Pin-compatible same-package alternatives preserve PCB layout (vs EPF6016QC208-3N)

Notas de projeto

Estimated: at 125 MHz internal frequency with 80% utilization across 1320 LEs, the EPF6016QC240-2N draws approximately 200-300 mA from VCCINT (5V). Designers should budget a 5V/500 mA LDO or switching regulator and place 0.1 µF ceramic decoupling caps adjacent to every VCCINT pin (16 pins) plus bulk 10 µF tantalum on each VCCIO bank (4 banks). Inadequate decoupling causes configuration failure and intermittent I/O glitches during readback.

The 240-pin PQFP (BQFP FINE LINE) has 0.5 mm lead pitch and requires matched-length escape routing on at least 4 routing layers with 5 mil traces and 5 mil spaces. Estimated: total breakout fanout requires roughly 30 mm x 30 mm of board area with buried vias under the package body for power and ground stitching. Use JEDEC MO-108 land pattern with 0.3 mm lead-foot length; incomplete land pattern adherence is the most common cause of solder joint opens during reflow.

Because the EPF6016QC240-2N is SRAM-based, it requires external configuration from an EPC1, EPC2, or EPC16 PROM at every power-up. Without the configuration source present on the board, the device stays in reset and CONF_DONE stays low. Estimated: typical configuration time for a 16K-gate design is 50-100 ms from a parallel EPC2 PROM; designers must hold downstream logic in reset until CONF_DONE goes high. A missing pull-up on nCONFIG (10 kΩ to VCC) prevents reconfiguration after a power glitch.

Informações de conformidade

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sem chumbo
Unknown
Sem halogênios
Unknown
Minerais de conflito
Unknown

Part is obsolete (EOL). Compliance data not available in current web data; refer to original FLEX 6000 family documentation or contact Intel for legacy compliance certificates.

Dados verificados em: 2026-09-11 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EPF6016QC240-2N EPF6016QC240-2N datasheet Intel FLEX 6000 FPGA Altera EPF6016QC240-2N 16K gate FPGA 240 PQFP FLEX 6000 obsolete replacement 5V FPGA 199 I/O legacy design FPGA bus bridge glue logic 5V EPF6016QC240-2N vs EPF6016QC208 EPF6016QC240-2N drop-in replacement EPF6016QC240-2N buy price stock what is FLEX 6000 FPGA used for

Componentes & termos relacionados

Intel Altera EPF6016QC240-2N EPF6016QC240-2 EPF6016QC240 EPF6016QC208-3N EPF6016BC256-3N EPF6016ATC144-2N FLEX 6000 FPGA Field Programmable Gate Array Programmable Logic Device PLD CPLD SRAM PQFP BQFP FINE LINE EPC1 EPC2 configuration PROM LAB Logic Array Block Logic Element LUT carry chain cascade chain multiVolt I/O 5V RoHS JEDEC MO-108
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